TWI503401B - Etching composition - Google Patents

Etching composition Download PDF

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Publication number
TWI503401B
TWI503401B TW100144791A TW100144791A TWI503401B TW I503401 B TWI503401 B TW I503401B TW 100144791 A TW100144791 A TW 100144791A TW 100144791 A TW100144791 A TW 100144791A TW I503401 B TWI503401 B TW I503401B
Authority
TW
Taiwan
Prior art keywords
etching
film
etching liquid
acid
present
Prior art date
Application number
TW100144791A
Other languages
English (en)
Chinese (zh)
Other versions
TW201231625A (en
Inventor
Kenta Inoue
Original Assignee
Adeka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adeka Corp filed Critical Adeka Corp
Publication of TW201231625A publication Critical patent/TW201231625A/zh
Application granted granted Critical
Publication of TWI503401B publication Critical patent/TWI503401B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/08—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW100144791A 2010-12-15 2011-12-06 Etching composition TWI503401B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010279129A JP5700784B2 (ja) 2010-12-15 2010-12-15 エッチング液組成物

Publications (2)

Publication Number Publication Date
TW201231625A TW201231625A (en) 2012-08-01
TWI503401B true TWI503401B (zh) 2015-10-11

Family

ID=46646081

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100144791A TWI503401B (zh) 2010-12-15 2011-12-06 Etching composition

Country Status (3)

Country Link
JP (1) JP5700784B2 (ko)
KR (1) KR20120067293A (ko)
TW (1) TWI503401B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6044337B2 (ja) * 2012-12-28 2016-12-14 三菱瓦斯化学株式会社 インジウムとガリウムおよび酸素、またはインジウムとガリウムと亜鉛および酸素からなる酸化物のエッチング液およびエッチング方法
TWI488943B (zh) * 2013-04-29 2015-06-21 Chi Mei Corp 蝕刻膏組成物及其應用
JP6261926B2 (ja) 2013-09-18 2018-01-17 関東化學株式会社 金属酸化物エッチング液組成物およびエッチング方法
JP6350008B2 (ja) * 2014-06-20 2018-07-04 三菱瓦斯化学株式会社 少なくともインジウム、ガリウム、亜鉛およびシリコンを含む酸化物のエッチング液およびエッチング方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101223632A (zh) * 2005-05-13 2008-07-16 塞克姆公司 氧化物的选择性湿蚀刻

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100248113B1 (ko) * 1997-01-21 2000-03-15 이기원 전자 표시 장치 및 기판용 세정 및 식각 조성물
KR101619380B1 (ko) * 2009-05-14 2016-05-11 삼성디스플레이 주식회사 식각액 조성물 및 이를 이용한 어레이 기판의 제조방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101223632A (zh) * 2005-05-13 2008-07-16 塞克姆公司 氧化物的选择性湿蚀刻

Also Published As

Publication number Publication date
JP5700784B2 (ja) 2015-04-15
TW201231625A (en) 2012-08-01
JP2012129346A (ja) 2012-07-05
KR20120067293A (ko) 2012-06-25

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