TWI502019B - A composite resin composition for an electronic component, and an electronic component formed of the composite resin composition - Google Patents

A composite resin composition for an electronic component, and an electronic component formed of the composite resin composition Download PDF

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Publication number
TWI502019B
TWI502019B TW102130409A TW102130409A TWI502019B TW I502019 B TWI502019 B TW I502019B TW 102130409 A TW102130409 A TW 102130409A TW 102130409 A TW102130409 A TW 102130409A TW I502019 B TWI502019 B TW I502019B
Authority
TW
Taiwan
Prior art keywords
resin composition
composite resin
electronic component
constituent unit
content
Prior art date
Application number
TW102130409A
Other languages
English (en)
Chinese (zh)
Other versions
TW201431949A (zh
Inventor
Hiroki Fukatsu
Mineo Ohtake
Kazuhiro Ryu
Junichiro Sugiura
Yoshiaki Taguchi
Original Assignee
Polyplastics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyplastics Co filed Critical Polyplastics Co
Publication of TW201431949A publication Critical patent/TW201431949A/zh
Application granted granted Critical
Publication of TWI502019B publication Critical patent/TWI502019B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/346—Clay
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
    • C09K19/38—Polymers
    • C09K19/3804—Polymers with mesogenic groups in the main chain
    • C09K19/3809—Polyesters; Polyester derivatives, e.g. polyamides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/52—Liquid crystal materials characterised by components which are not liquid crystals, e.g. additives with special physical aspect: solvents, solid particles
    • C09K2019/521—Inorganic solid particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
TW102130409A 2012-09-26 2013-08-26 A composite resin composition for an electronic component, and an electronic component formed of the composite resin composition TWI502019B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012212180 2012-09-26
JP2012212179 2012-09-26

Publications (2)

Publication Number Publication Date
TW201431949A TW201431949A (zh) 2014-08-16
TWI502019B true TWI502019B (zh) 2015-10-01

Family

ID=50387781

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102130409A TWI502019B (zh) 2012-09-26 2013-08-26 A composite resin composition for an electronic component, and an electronic component formed of the composite resin composition

Country Status (7)

Country Link
JP (1) JP5769888B2 (ja)
KR (1) KR20150060829A (ja)
CN (1) CN104704049B (ja)
MY (1) MY174277A (ja)
SG (1) SG11201502394YA (ja)
TW (1) TWI502019B (ja)
WO (1) WO2014050371A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017068867A1 (ja) * 2015-10-21 2017-04-27 ポリプラスチックス株式会社 全芳香族ポリエステル及びその製造方法
WO2017110867A1 (ja) * 2015-12-25 2017-06-29 ポリプラスチックス株式会社 複合樹脂組成物、及び当該複合樹脂組成物から成形されたコネクター
WO2017110866A1 (ja) * 2015-12-25 2017-06-29 ポリプラスチックス株式会社 複合樹脂組成物、及び当該複合樹脂組成物から成形された電子部品
CN105837803B (zh) * 2016-02-01 2017-05-31 金发科技股份有限公司 一种液晶聚酯以及由其组成的模塑组合物和其应用
CN109790379B (zh) * 2016-10-07 2020-04-07 宝理塑料株式会社 复合树脂组合物、及由该复合树脂组合物成形而成的电子部件
KR102052662B1 (ko) * 2016-10-07 2019-12-05 포리프라스틱 가부시키가이샤 복합 수지 조성물, 및 당해 복합 수지 조성물로 성형된 커넥터
WO2018074155A1 (ja) * 2016-10-21 2018-04-26 ポリプラスチックス株式会社 複合樹脂組成物、及び当該複合樹脂組成物から成形された電子部品
WO2018074156A1 (ja) * 2016-10-21 2018-04-26 ポリプラスチックス株式会社 複合樹脂組成物、及び当該複合樹脂組成物から成形されたコネクター
KR102020634B1 (ko) * 2016-12-21 2019-09-10 포리프라스틱 가부시키가이샤 표면 실장 릴레이용 액정성 수지 조성물 및 이것을 이용한 표면 실장 릴레이
WO2022168706A1 (ja) * 2021-02-05 2022-08-11 ポリプラスチックス株式会社 ファンインペラ用液晶性樹脂組成物及びそれを用いたファンインペラ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW413697B (en) * 1995-12-15 2000-12-01 Toray Industries Liquid crystalline resin composition
TW201016784A (en) * 2008-07-31 2010-05-01 Polyplastics Co Connector

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0216120A (ja) * 1988-07-05 1990-01-19 Polyplastics Co 溶融時に光学的異方性を示すポリエステル樹脂及び樹脂組成物
JPH09221582A (ja) * 1995-12-15 1997-08-26 Toray Ind Inc 液晶性樹脂組成物および成形品
JP2000160030A (ja) * 1998-11-30 2000-06-13 Otsuka Chem Co Ltd 難燃性樹脂組成物
JP4488455B2 (ja) * 1999-03-30 2010-06-23 新日本石油株式会社 サーモトロピック液晶コポリエステルの製造方法、その組成物およびその成形体
JP4281377B2 (ja) * 2003-02-26 2009-06-17 東レ株式会社 液晶性ポリエステルおよびその組成物
TWI472574B (zh) * 2006-08-24 2015-02-11 Polyplastics Co 非對稱電子零件
JP2009221406A (ja) * 2008-03-18 2009-10-01 Ueno Fine Chem Ind Ltd 液晶ポリエステルの製造方法
JP5136719B2 (ja) * 2011-02-28 2013-02-06 東レ株式会社 液晶性ポリエステル樹脂組成物およびそれを用いた金属複合成形品
JP5485216B2 (ja) * 2011-04-01 2014-05-07 ポリプラスチックス株式会社 平面状コネクター
KR101413813B1 (ko) * 2011-04-01 2014-06-30 폴리플라스틱스 가부시키가이샤 전방향족 폴리에스터 및 폴리에스터 수지 조성물

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW413697B (en) * 1995-12-15 2000-12-01 Toray Industries Liquid crystalline resin composition
TW201016784A (en) * 2008-07-31 2010-05-01 Polyplastics Co Connector

Also Published As

Publication number Publication date
TW201431949A (zh) 2014-08-16
JPWO2014050371A1 (ja) 2016-08-22
CN104704049A (zh) 2015-06-10
CN104704049B (zh) 2016-10-12
SG11201502394YA (en) 2015-05-28
KR20150060829A (ko) 2015-06-03
WO2014050371A1 (ja) 2014-04-03
MY174277A (en) 2020-04-01
JP5769888B2 (ja) 2015-08-26

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