SG11201502394YA - Composite resin composition for electronic component and electronic component molded from composite resin composition - Google Patents

Composite resin composition for electronic component and electronic component molded from composite resin composition

Info

Publication number
SG11201502394YA
SG11201502394YA SG11201502394YA SG11201502394YA SG11201502394YA SG 11201502394Y A SG11201502394Y A SG 11201502394YA SG 11201502394Y A SG11201502394Y A SG 11201502394YA SG 11201502394Y A SG11201502394Y A SG 11201502394YA SG 11201502394Y A SG11201502394Y A SG 11201502394YA
Authority
SG
Singapore
Prior art keywords
resin composition
electronic component
composite resin
molded
component molded
Prior art date
Application number
SG11201502394YA
Inventor
Hiroki Fukatsu
Mineo Ohtake
Kazuhiro Ryu
Junichiro Sugiura
Yoshiaki Taguchi
Original Assignee
Polyplastics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyplastics Co filed Critical Polyplastics Co
Publication of SG11201502394YA publication Critical patent/SG11201502394YA/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/346Clay
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00Liquid crystal materials
    • C09K19/04Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
    • C09K19/38Polymers
    • C09K19/3804Polymers with mesogenic groups in the main chain
    • C09K19/3809Polyesters; Polyester derivatives, e.g. polyamides
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00Liquid crystal materials
    • C09K19/52Liquid crystal materials characterised by components which are not liquid crystals, e.g. additives with special physical aspect: solvents, solid particles
    • C09K2019/521Inorganic solid particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
SG11201502394YA 2012-09-26 2013-08-20 Composite resin composition for electronic component and electronic component molded from composite resin composition SG11201502394YA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012212180 2012-09-26
JP2012212179 2012-09-26
PCT/JP2013/072226 WO2014050371A1 (en) 2012-09-26 2013-08-20 Composite resin composition for electronic component and electronic component molded from composite resin composition

Publications (1)

Publication Number Publication Date
SG11201502394YA true SG11201502394YA (en) 2015-05-28

Family

ID=50387781

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201502394YA SG11201502394YA (en) 2012-09-26 2013-08-20 Composite resin composition for electronic component and electronic component molded from composite resin composition

Country Status (7)

Country Link
JP (1) JP5769888B2 (en)
KR (1) KR20150060829A (en)
CN (1) CN104704049B (en)
MY (1) MY174277A (en)
SG (1) SG11201502394YA (en)
TW (1) TWI502019B (en)
WO (1) WO2014050371A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017068867A1 (en) * 2015-10-21 2017-04-27 ポリプラスチックス株式会社 Fully aromatic polyester, and production method therefor
WO2017110866A1 (en) * 2015-12-25 2017-06-29 ポリプラスチックス株式会社 Composite resin composition and electronic component formed from composite resin composition
WO2017110867A1 (en) * 2015-12-25 2017-06-29 ポリプラスチックス株式会社 Composite resin composition and connector formed from composite resin composition
CN105837803B (en) * 2016-02-01 2017-05-31 金发科技股份有限公司 A kind of liquid crystal polyester and the moulding compound being made from it and its application
CN109790378B (en) * 2016-10-07 2020-09-11 宝理塑料株式会社 Composite resin composition and connector molded from the same
JP6345376B1 (en) * 2016-10-07 2018-06-20 ポリプラスチックス株式会社 Composite resin composition and electronic component molded from the composite resin composition
WO2018074156A1 (en) * 2016-10-21 2018-04-26 ポリプラスチックス株式会社 Composite resin composition and connector molded from same
CN109790380B (en) * 2016-10-21 2020-08-25 宝理塑料株式会社 Composite resin composition and electronic component molded from same
JP6416442B1 (en) * 2016-12-21 2018-10-31 ポリプラスチックス株式会社 Liquid crystalline resin composition for surface mount relay and surface mount relay using the same
KR20230142763A (en) 2021-02-04 2023-10-11 티코나 엘엘씨 Polymer compositions for electrical circuit protection devices
CN116806239A (en) * 2021-02-05 2023-09-26 宝理塑料株式会社 Liquid crystal resin composition for fan impeller and fan impeller using same

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0216120A (en) * 1988-07-05 1990-01-19 Polyplastics Co Polyester resin exhibiting optical anisotropy when melted and resin composition
TW413697B (en) * 1995-12-15 2000-12-01 Toray Industries Liquid crystalline resin composition
JPH09221582A (en) * 1995-12-15 1997-08-26 Toray Ind Inc Liquid crystal resin composition and molded product
JP2000160030A (en) * 1998-11-30 2000-06-13 Otsuka Chem Co Ltd Flame retardant resin composition
JP4488455B2 (en) * 1999-03-30 2010-06-23 新日本石油株式会社 Method for producing thermotropic liquid crystal copolyester, composition thereof and molded product thereof
JP4281377B2 (en) * 2003-02-26 2009-06-17 東レ株式会社 Liquid crystalline polyester and composition thereof
TWI472574B (en) * 2006-08-24 2015-02-11 Polyplastics Co Asymmetric electronic device
JP2009221406A (en) * 2008-03-18 2009-10-01 Ueno Fine Chem Ind Ltd Method for producing liquid-crystalline polyester
JP2010037364A (en) * 2008-07-31 2010-02-18 Polyplastics Co Connector
US9045621B2 (en) * 2011-02-28 2015-06-02 Toray Industries, Inc. Liquid crystalline polyester composition and metal composite molded product using the same
EP2695905B1 (en) * 2011-04-01 2021-01-27 Polyplastics Co., Ltd. Fully aromatic polyester and polyester resin composition
JP5485216B2 (en) * 2011-04-01 2014-05-07 ポリプラスチックス株式会社 Planar connector

Also Published As

Publication number Publication date
CN104704049B (en) 2016-10-12
MY174277A (en) 2020-04-01
JP5769888B2 (en) 2015-08-26
WO2014050371A1 (en) 2014-04-03
JPWO2014050371A1 (en) 2016-08-22
TWI502019B (en) 2015-10-01
TW201431949A (en) 2014-08-16
KR20150060829A (en) 2015-06-03
CN104704049A (en) 2015-06-10

Similar Documents

Publication Publication Date Title
SG11201502394YA (en) Composite resin composition for electronic component and electronic component molded from composite resin composition
SG11201500481RA (en) Resin composition
EP2881430A4 (en) Resin composition and molded article
EP2857428A4 (en) Epoxy resin composition
ZA201503046B (en) Thermally conductive polymer and resin compositions for producing same
EP2837661A4 (en) Resin composition
SG11201403633QA (en) Resin composition for encapsulation and electronic device using thesame
EP2896656A4 (en) Polyamide resin composition and molded article
GB201312508D0 (en) Resin composition and composite structure containing resin
EP2832798A4 (en) Resin composite material
EP2692799A4 (en) Polyphenylene sulfide resin composition and molding comprising same
EP2921526A4 (en) Thermosetting resin composition
EP2832795A4 (en) Resin composition
ZA201301710B (en) Polyamide resin moldings
EP2881414A4 (en) Epoxy resin composition, epoxy resin, and cured article
EP2868699A4 (en) Resin composition
EP2829574A4 (en) Light-diffusible resin composition
EP2902445A4 (en) Polyamide resin composition
EP2930002A4 (en) Resin component fastener structure and molding device therefor
EP2752451A4 (en) Polyolefin resin composition and applications thereof
EP2915848A4 (en) Thermosetting resin composition and use thereof
EP2881436A4 (en) Resin composition and molded article formed from same
SG11201403635SA (en) Resin composition for encapsulation and electronic device using the same
EP2913352A4 (en) Non-photosensitive resin composition
EP2460851A4 (en) Thermoplastic resin composition