JP6416442B1 - Liquid crystalline resin composition for surface mount relay and surface mount relay using the same - Google Patents

Abstract

A liquid crystalline resin composition for surface mount relays that provides a molded product that has excellent heat resistance, suppresses blister generation and filler detachment, and can be bonded with high adhesive strength by an adhesive, and surface mounting using the same Provide relay components and surface mount relays.
The liquid crystalline resin composition for a surface mount relay according to the present invention includes (A) a liquid crystalline polymer and (B) a fibrous filler, and the above (A) liquid crystalline polymer is an essential component. It is a wholly aromatic polyester amide comprising a predetermined amount of the following structural units (I) to (VI) and exhibiting optical anisotropy when melted, and the (B) fibrous filler has a weight average fiber length of 50 to 50. The content of the fraction having a length of 170 μm and a fiber length of 20 to 200 μm is 70% by mass or more, and the surface mount relay includes a base and a terminal protruding from the base, and the terminal is soldered to a printed board. A liquid crystalline resin composition which is a surface mount relay.

Description

  The present invention relates to a liquid crystalline resin composition for a surface-mount relay and a surface-mount relay using the same.

  With the development of the electronics industry, the production volume of relays has been growing steadily, and there are a wide variety of fields such as communication equipment, OA equipment, home appliances, and vending machines. 2. Description of the Related Art Conventionally, an insertion mounting type (through-hole type) relay is known as a relay used by being mounted on a printed circuit board. The insertion mounting relay includes a terminal protruding vertically from the relay body, and is first placed on one surface of the printed board by inserting the terminal into a hole of the printed board. Thereafter, by soldering the terminals on the other surface of the printed board, the insertion mounting relay is fixed to the printed board so as to be electrically conductive.

  In recent years, surface mount type relays have been developed as new relays that are used by being mounted on a printed circuit board (for example, Patent Document 1). In the surface mount relay, the terminal protruding vertically from the relay body is bent at a right angle so that the soldering surface is parallel to the relay body. For this reason, surface mount relays can be electrically connected by placing the above terminals on the solder pads provided on the conductor pattern on the surface of the printed circuit board and performing solder reflow processing without providing holes in the printed circuit board. Fixed to the printed circuit board.

Japanese Patent No. 3463310

  As described above, since the surface mount relay is fixed to the printed circuit board by the solder reflow process, the molded product constituting the surface mount relay, for example, the base, the case, the bobbin, etc. is excellent so that it can withstand the solder reflow process. Heat resistance is required. Further, the surface mount relay is also required to maintain airtightness even after the solder reflow process. For this purpose, the molded product, in particular, the base and the case are required to be bonded with high adhesive strength by an adhesive.

  By the way, a liquid crystalline polymer composition has attracted attention in terms of excellent heat resistance, dimensional accuracy, fluidity, and the like. However, the liquid crystal polymer composition may have a problem of blistering. That is, liquid crystalline polyesteramide, which is a liquid crystalline polymer, is often used as a material that requires heat treatment at a high temperature because it has good high-temperature thermal stability. However, when the molded product is left in high temperature air and liquid for a long time, there arises a problem that fine blisters called blisters are generated on the surface. This phenomenon is caused by the fact that the decomposition gas generated when the liquid crystalline polyesteramide is in a molten state is brought into the molded product, and then the gas expands when the high-temperature heat treatment is performed. This is because the pushed up part appears as a blister. The generation of blisters can be reduced by sufficiently degassing the vent hole during melt extrusion of the material, or by not allowing the material to stay in the molding machine for a long time during molding. However, the range of conditions is very narrow, and it is not sufficient to obtain a molded product in which generation of blisters is suppressed, that is, a molded product having blister resistance. The fundamental solution to blister generation requires improvement of the quality of the liquid crystalline polyester amide itself, and the known liquid crystalline polyester amide and methods using it are insufficient to solve the problem of blister generation. . In addition, the liquid crystalline polymer composition may have a problem that the filler protrudes from the surface of the molded article of the composition and further desorbs, thereby causing a functional disorder such as poor conduction of the product.

  The present invention has been made in view of such circumstances, and is surface mounted that provides a molded product that has excellent heat resistance, suppresses the generation of blisters and fillers, and can be bonded with high adhesive strength by an adhesive. It is an object of the present invention to provide a liquid crystalline resin composition for relay, a surface mount relay component comprising the composition, and a surface mount relay including the component.

  The inventors of the present invention combined a liquid crystalline polymer containing a predetermined amount of a specific structural unit and a fibrous filler so that the weight average fiber length of the fibrous filler is 50 to 170 μm. It has been found that the above problem can be solved by setting the content of a fraction having a length of 20 to 200 μm to 70% by mass or more. Specifically, the present invention provides the following.

(1) A liquid crystalline resin composition for a surface mount relay comprising (A) a liquid crystalline polymer and (B) a fibrous filler,
The (A) liquid crystalline polymer is composed of the following structural units (I) to (VI) as essential components:
Content of structural unit (I) is 50-70 mol% with respect to all the structural units,
The content of the structural unit (II) is 0.5 mol% or more and less than 4.5 mol% with respect to all the structural units,
Content of structural unit (III) is 10.25-22.25 mol% with respect to all the structural units,
The content of the structural unit (IV) is 0.5 mol% or more and less than 4.5 mol% with respect to all the structural units,
Content of a structural unit (V) is 5.75-23.75 mol% with respect to all the structural units,
Content of structural unit (VI) is 1-7 mol% with respect to all the structural units,
The total content of the structural unit (II) and the structural unit (IV) with respect to all the structural units is 1 mol% or more and less than 5 mol%,
The total content of the structural units (I) to (VI) with respect to all the structural units is 100 mol%,
A wholly aromatic polyester amide exhibiting optical anisotropy when melted, wherein the molar ratio of the structural unit (VI) to the total of the structural unit (V) and the structural unit (VI) is 0.04 to 0.37. ,
The (B) fibrous filler has a weight average fiber length of 50 to 170 μm,
In the (B) fibrous filler, the content of the fraction having a fiber length of 20 to 200 μm is 70% by mass or more,
Said (A) liquid crystalline polymer is 50-70 mass% with respect to the whole liquid crystalline resin composition,
Said (B) fibrous filler is 30-50 mass% with respect to the whole liquid crystalline resin composition,
The surface mount relay includes a base and a terminal protruding from the base, and is a liquid crystalline resin composition that is a surface mount relay in which the terminal is soldered to a printed board.

  (2) The total number of moles of the structural unit (III) and the structural unit (IV) is 1 to 1.1 times the total number of moles of the structural unit (V) and the structural unit (VI), or The total number of moles of the structural unit (V) and the structural unit (VI) is 1 to 1.1 times the total number of moles of the structural unit (III) and the structural unit (IV). Liquid crystalline resin composition.

  (3) The liquid crystalline resin composition according to (1) or (2), wherein the (B) fibrous filler is a milled fiber.

  (4) A surface-mounting relay component comprising the composition according to any one of (1) to (3).

  (5) A surface mount relay comprising the component according to (4).

  According to the present invention, the liquid crystalline resin composition for surface-mounting relays, which has excellent heat resistance, suppresses generation of blisters and detachment of filler, and gives a molded product that can be bonded with high adhesive strength by an adhesive, It is possible to provide a surface mount relay component made of the composition, and a surface mount relay including the component.

FIG. 1A is a perspective view schematically showing an embodiment of a surface mount relay according to the present invention, and FIG. 1B is a partial cross-sectional view showing an AA cross section of FIG. FIG. 2A and FIG. 2B are side views schematically showing a state where the embodiment of the surface mount relay according to the present invention is mounted on a printed board. FIG. 3A is a diagram for explaining a method for producing a sample for evaluating the adhesive strength, and FIG. 3B is a diagram for explaining a method for evaluating the adhesive strength.

  Hereinafter, embodiments of the present invention will be specifically described.

[Liquid crystalline resin composition for surface mount relay]
The liquid crystalline resin composition for surface mount relay according to the present invention contains a specific amount of a specific liquid crystalline polymer and a fibrous filler, and the fibrous filler has a weight average fiber length of 50 to 170 μm. In the filler, the content of the fraction having a fiber length of 20 to 200 μm is 70% by mass or more, and the surface mount relay includes a base and a terminal protruding from the base, and the terminal is attached to the printed circuit board. This is a surface mount relay that is soldered. Hereinafter, the component which comprises the liquid crystalline resin composition which concerns on this invention is demonstrated.

(Liquid crystal polymer)
The liquid crystalline resin composition according to the present invention includes a liquid crystalline polymer that is the above-mentioned wholly aromatic polyester amide. Since the wholly aromatic polyester amide has a low melting point, the processing temperature can be lowered and the generation of decomposition gas during melting is suppressed. As a result, in the molded product obtained by molding the liquid crystalline resin composition containing the wholly aromatic polyester amide, blistering is suppressed and blister resistance is improved. A liquid crystalline polymer can be used individually by 1 type or in combination of 2 or more types.

  The wholly aromatic polyester amide in the present invention comprises the following structural unit (I), the following structural unit (II), the following structural unit (III), the following structural unit (IV), the following structural unit (V), and the following structural unit ( VI).

  The structural unit (I) is derived from 4-hydroxybenzoic acid (hereinafter also referred to as “HBA”). The wholly aromatic polyester amide in the present invention contains 50 to 70 mol% of the structural unit (I) with respect to all the structural units. When the content of the structural unit (I) is less than 50 mol% or exceeds 70 mol%, at least one of lowering the melting point and heat resistance tends to be insufficient. From the viewpoint of achieving both low melting point and heat resistance, the content of the structural unit (I) is preferably 54 to 67 mol%, more preferably 58 to 64 mol%.

  The structural unit (II) is derived from 6-hydroxy-2-naphthoic acid (hereinafter also referred to as “HNA”). The wholly aromatic polyester amide in the present invention contains 0.5 to 4.5 mol% of the structural unit (II) with respect to all the structural units. When the content of the structural unit (II) is less than 0.5 mol% or 4.5 mol% or more, at least one of lowering the melting point and heat resistance tends to be insufficient. From the viewpoint of achieving both low melting point and heat resistance, the content of the structural unit (II) is preferably 0.75 to 3.75 mol%, more preferably 1 to 3 mol%.

  The structural unit (III) is derived from 1,4-phenylenedicarboxylic acid (hereinafter also referred to as “TA”). The wholly aromatic polyester amide in the present invention contains 10.25 to 22.25 mol% of the structural unit (III) with respect to all the structural units. When the content of the structural unit (III) is less than 10.25 mol% or exceeds 22.25 mol%, at least one of lowering the melting point and heat resistance tends to be insufficient. From the viewpoint of achieving both low melting point and heat resistance, the content of the structural unit (III) is preferably 12.963 to 20.75 mol%, more preferably 15.675 to 19.25 mol%.

  The structural unit (IV) is derived from 1,3-phenylenedicarboxylic acid (hereinafter also referred to as “IA”). The wholly aromatic polyester amide in the present invention contains 0.5 mol% or more and less than 4.5 mol% of the structural unit (IV) with respect to all the structural units. When the content of the structural unit (IV) is less than 0.5 mol% or 4.5 mol% or more, at least one of low melting point and heat resistance tends to be insufficient. From the viewpoint of achieving both a low melting point and heat resistance, the content of the structural unit (IV) is preferably 0.5 to 3.75 mol%, more preferably 0.5 to 3 mol%.

  The structural unit (V) is derived from 4,4′-dihydroxybiphenyl (hereinafter also referred to as “BP”). The wholly aromatic polyester amide in the present invention contains 5.75 to 23.75 mol% of the structural unit (V) with respect to all the structural units. When the content of the structural unit (V) is less than 5.75 mol% or exceeds 23.75 mol%, at least one of the low melting point and the heat resistance tends to be insufficient. From the viewpoint of achieving both low melting point and heat resistance, the content of the structural unit (V) is preferably 8.5 to 20.375 mol%, more preferably 11.25 to 17 mol% (for example, 11. 675 to 17 mol%).

  The structural unit (VI) is derived from N-acetyl-p-aminophenol (hereinafter also referred to as “APAP”). The wholly aromatic polyester amide in the present invention contains 1 to 7 mol% of the structural unit (VI) with respect to the total structural units. When the content of the structural unit (VI) is less than 1 mol% or exceeds 7 mol%, at least one of lowering the melting point and heat resistance tends to be insufficient. From the viewpoint of achieving both a low melting point and heat resistance, the content of the structural unit (VI) is preferably 1.5 to 7 mol%, more preferably 2 to 7 mol%.

  The wholly aromatic polyester amide in the present invention contains 1 mol% or more and less than 5 mol% of the total of the structural unit (II) and the structural unit (IV) with respect to all the structural units. In the wholly aromatic polyester amide, the lower melting point can be obtained by coexisting the flexible structural unit (II) having a naphthalene skeleton and the flexible structural unit (IV) having a benzene skeleton in a total amount within the above range. Coexistence with heat resistance is likely to be sufficient. If the total content is less than 1 mol%, the proportion of the flexural constituent unit is too small, and the lowering of the melting point tends to be insufficient. When the total content is 5 mol% or more, the proportion of the flexible structural unit is excessively increased, and thus the heat resistance tends to be insufficient. From the viewpoint of achieving both low melting point and heat resistance, the total content is preferably 1.75 to 4.75 mol%, more preferably 2.5 to 4.5 mol%.

  In the wholly aromatic polyester amide in the present invention, the molar ratio of the structural unit (VI) to the total of the structural unit (V) and the structural unit (VI) is 0.04 to 0.37. If the molar ratio is less than 0.04, the proportion of structural units having a biphenyl skeleton increases, so that the crystallinity of the wholly aromatic polyester amide is lowered, and it is insufficient to achieve both low melting point and heat resistance. Cheap. Further, when the molar ratio exceeds 0.37, heterogeneous bonds other than ester bonds increase, so that the crystallinity of the wholly aromatic polyester amide is lowered, and the compatibility between the low melting point and the heat resistance tends to be insufficient. . From the viewpoint of achieving both low melting point and heat resistance, the molar ratio is preferably 0.07 to 0.36, more preferably 0.11 to 0.35.

  From the viewpoint of achieving both low melting point and heat resistance, the total number of moles of the structural unit (III) and the structural unit (IV) (hereinafter also referred to as “number of moles 1A”) is the same as the structural unit (V). It is 1 to 1.1 times the total number of moles with the structural unit (VI) (hereinafter also referred to as “number of moles 2A”), or the number of moles 2A is 1 to 1.1 times the number of moles 1A. It is preferable that The number of moles 1A is 1.02 to 1.06 times the number of moles 2A, or the number of moles 2A is more preferably 1.02 to 1.06 times the number of moles 1A. More preferably, the mole number 1A is 1.024 to 1.056 times the mole number 2A, or the mole number 2A is 1.024 to 1.056 times the mole number 1A.

  As described above, the wholly aromatic polyester amide according to the present invention includes the specific structural units (I) to (VI) and the total of the structural unit (II) and the structural unit (IV) as total structural units. In contrast, it has a specific amount, and the molar ratio of the structural unit (VI) to the total of the structural unit (V) and the structural unit (VI) is in a specific range. Is enough. In addition, the wholly aromatic polyester amide of the present invention contains 100 mol% of the structural units (I) to (VI) in total with respect to all the structural units.

  As an index indicating the heat resistance, there is a deflection temperature under load (hereinafter also referred to as “DTUL”). When DTUL is 260 ° C. or higher, heat resistance tends to be high, which is preferable. DTUL is obtained by melt-kneading 60% by mass of the wholly aromatic polyester amide and 40% by mass of milled fiber having an average fiber diameter of 11 μm and an average fiber length of 75 μm at the melting point of the wholly aromatic polyester amide + 20 ° C. It is a value measured in the state of the liquid crystalline resin composition, and can be measured according to ISO75-1,2. From the viewpoint of achieving both low melting point and heat resistance, DTUL is preferably 265 ° C. or higher and 310 ° C. or lower, more preferably 267 to 300 ° C.

  Subsequently, the manufacturing method of the wholly aromatic polyester amide in this invention is demonstrated. The wholly aromatic polyester amide in the present invention is polymerized using a direct polymerization method, a transesterification method or the like. In the polymerization, a melt polymerization method, a solution polymerization method, a slurry polymerization method, a solid phase polymerization method, etc., or a combination of two or more of these are used, and a melt polymerization method or a combination of a melt polymerization method and a solid phase polymerization method is used. Is preferably used.

  In the present invention, at the time of polymerization, an acylating agent for the polymerization monomer or a monomer having terminal activated as an acid chloride derivative can be used. Examples of the acylating agent include fatty acid anhydrides such as acetic anhydride.

In the polymerization, various catalysts can be used. Typical examples include dialkyl tin oxide, diaryl tin oxide, titanium dioxide, alkoxy titanium silicates, titanium alcoholates, fatty acid metal salts, BF ₃ Lewis acid salts such as are mentioned, and fatty acid metal salts are preferred. The amount of the catalyst used is generally about 0.001 to 1% by weight, particularly about 0.003 to 0.2% by weight, based on the total weight of the monomers.

  Moreover, when performing solution polymerization or slurry polymerization, as a solvent, liquid paraffin, a high heat resistant synthetic oil, an inert mineral oil, etc. are used.

  The reaction conditions are, for example, a reaction temperature of 200 to 380 ° C. and a final ultimate pressure of 0.1 to 760 Torr (that is, 13 to 101,080 Pa). Particularly in the melt reaction, for example, the reaction temperature is 260 to 380 ° C., preferably 300 to 360 ° C., the final ultimate pressure is 1 to 100 Torr (that is, 133 to 13,300 Pa), preferably 1 to 50 Torr (that is, 133 to 6,670 Pa). ).

  In the reaction, all the raw material monomers (HBA, HNA, TA, IA, BP, and APAP), the acylating agent, and the catalyst can be charged into the same reaction vessel to start the reaction (one-stage system), or the raw material monomer HBA. , HNA, BP, and APAP hydroxyl groups can be acylated with an acylating agent and then reacted with TA and IA carboxyl groups (two-stage system).

  The melt polymerization is performed after the inside of the reaction system has reached a predetermined temperature, and the pressure reduction is started to a predetermined pressure reduction degree. After the torque of the stirrer reaches a predetermined value, an inert gas is introduced, and the total aromatic polyester amide is discharged from the reaction system through a normal pressure from a reduced pressure state to a predetermined pressure state.

  The wholly aromatic polyester amide produced by the above polymerization method can be further increased in molecular weight by solid-phase polymerization that is heated in an inert gas at normal pressure or reduced pressure. The preferable conditions for the solid state polymerization reaction are a reaction temperature of 230 to 350 ° C., preferably 260 to 330 ° C., and a final ultimate pressure of 10 to 760 Torr (ie 1,330 to 101,080 Pa).

In the present invention, the process for producing a wholly aromatic polyester amide comprises 4-hydroxybenzoic acid, 6-hydroxy-2-naphthoic acid, 4,4′-dihydroxybiphenyl, and N-acetyl-p- in the presence of a fatty acid metal salt. Preferably, the method comprises acylating aminophenol with a fatty acid anhydride and transesterifying with 1,4-phenylenedicarboxylic acid and 1,3-phenylenedicarboxylic acid,
Consists of 4-hydroxybenzoic acid, 6-hydroxy-2-naphthoic acid, 1,4-phenylenedicarboxylic acid, 1,3-phenylenedicarboxylic acid, 4,4'-dihydroxybiphenyl, and N-acetyl-p-aminophenol For all monomers,
The amount of 4-hydroxybenzoic acid used is 50 to 70 mol%, preferably 54 to 67 mol%, more preferably 58 to 64 mol%, from the viewpoint of achieving both low melting point and heat resistance.
The amount of 6-hydroxy-2-naphthoic acid used is 0.5 mol% or more and less than 4.5 mol%, preferably from 0.75 to 3.75 mol% from the viewpoint of achieving both low melting point and heat resistance. More preferably, 1 to 3 mol%,
The amount of 1,4-phenylenedicarboxylic acid used is 10.25 to 22.25 mol%, and from the viewpoint of achieving both low melting point and heat resistance, it is preferably 12.963 to 20.75 mol%, more preferably 15 675 to 19.25 mol%,
The amount of 1,3-phenylenedicarboxylic acid used is 0.5 mol% or more and less than 4.5 mol%, and preferably 0.5 to 3.75 mol% from the viewpoint of achieving both low melting point and heat resistance. Preferably 0.5-3 mol%,
The amount of 4,4′-dihydroxybiphenyl used is 5.75 to 23.75 mol%, and from the viewpoint of achieving both low melting point and heat resistance, preferably 8.5 to 20.375 mol%, more preferably 11 25-17 mol% (eg, 11.675-17 mol%),
The amount of N-acetyl-p-aminophenol used is 1 to 7 mol%, preferably from 1.5 to 7 mol%, more preferably 2 to 7 mol%, from the viewpoint of achieving both low melting point and heat resistance.
The total amount of 6-hydroxy-2-naphthoic acid and 1,3-phenylenedicarboxylic acid is 1 mol% or more and less than 5 mol%, and preferably 1.75 from the viewpoint of achieving both low melting point and heat resistance. ˜4.75 mol%, more preferably 2.5 to 4.5 mol%,
Sum of 4-hydroxybenzoic acid, 6-hydroxy-2-naphthoic acid, 1,4-phenylenedicarboxylic acid, 1,3-phenylenedicarboxylic acid, 4,4′-dihydroxybiphenyl, and N-acetyl-p-aminophenol Is 100 mol%
It is preferable that
The molar ratio of the used amount of N-acetyl-p-aminophenol to the total used amount of 4,4′-dihydroxybiphenyl and N-acetyl-p-aminophenol is 0.04 to 0.37, and the melting point is lowered. From the viewpoint of coexistence with heat resistance, it is preferably 0.07 to 0.36, more preferably 0.11 to 0.35,
The amount of the fatty acid anhydride used is 1.02 of the total hydroxyl equivalent of 4-hydroxybenzoic acid, 6-hydroxy-2-naphthoic acid, 4,4′-dihydroxybiphenyl, and N-acetyl-p-aminophenol. It is preferably ˜1.04 times. More preferably, the fatty acid metal salt is an acetic acid metal salt and the fatty acid anhydride is acetic anhydride. The total number of moles of 1,4-phenylene dicarboxylic acid and 1,3-phenylene dicarboxylic acid (hereinafter also referred to as “number of moles 1B”) is 4,4′-dihydroxybiphenyl and N-acetyl-p. -1 to 1.1 times the total number of moles with aminophenol (hereinafter also referred to as "number of moles 2B"), or the number of moles 2B is 1 to 1.1 times the number of moles 1B. It is more preferable. The number of moles 1B is 1.02 to 1.06 times the number of moles 2B, or the number of moles 2B is still more preferably 1.02 to 1.06 times the number of moles 1B. The number of moles 1B is 1.024 to 1.056 times the number of moles 2B, or the number of moles 2B is particularly preferably 1.024 to 1.056 times the number of moles 1B.

  Next, the properties of wholly aromatic polyester amide will be described. The wholly aromatic polyester amide in the present invention exhibits optical anisotropy when melted. An optical anisotropy when melted means that the wholly aromatic polyester amide in the present invention is a liquid crystalline polymer.

  In the present invention, the fact that the wholly aromatic polyester amide is a liquid crystalline polymer is an indispensable element for the wholly aromatic polyester amide to have both heat stability and easy processability. The wholly aromatic polyester amide composed of the structural units (I) to (VI) may not form an anisotropic molten phase depending on the constituent components and the sequence distribution in the polymer. Is limited to wholly aromatic polyester amides exhibiting optical anisotropy when melted.

  The property of melt anisotropy can be confirmed by a conventional polarization inspection method using an orthogonal polarizer. More specifically, the melting anisotropy can be confirmed by melting a sample placed on a hot stage manufactured by Linkham Co., Ltd. using a polarizing microscope manufactured by Olympus and observing it at a magnification of 150 times in a nitrogen atmosphere. The liquid crystalline polymer is optically anisotropic and transmits light when inserted between crossed polarizers. If the sample is optically anisotropic, for example, polarized light is transmitted even in a molten stationary liquid state.

  Since a nematic liquid crystalline polymer causes a significant decrease in viscosity at the melting point or higher, generally exhibiting liquid crystallinity at the melting point or higher is an index of workability. The melting point is preferably as high as possible from the viewpoint of heat resistance, but is preferably 360 ° C. or lower in consideration of heat deterioration during the melt processing of the polymer, the heating ability of the molding machine, and the like. In addition, More preferably, it is 300-360 degreeC, More preferably, it is 340-358 degreeC.

  The melt viscosity of the wholly aromatic polyester amide at a temperature 10 to 30 ° C. higher than the melting point of the wholly aromatic polyester amide in the present invention and a shear rate of 1000 / sec is preferably 500 Pa · s or less, more preferably 0. 0.5 to 300 Pa · s, and even more preferably 1 to 100 Pa · s. When the melt viscosity is within the above range, the wholly aromatic polyester amide itself or the composition containing the wholly aromatic polyester amide is easy to ensure fluidity at the time of molding, and the filling pressure is excessive. It is hard to become. In addition, in this specification, melt viscosity means the melt viscosity measured based on ISO11443.

  As an index representing the above heat resistance, the difference between the melting point and DTUL can also be mentioned. If this difference is 90 ° C. or less, the heat resistance tends to increase, which is preferable. From the viewpoint of achieving both low melting point and heat resistance, the difference is preferably more than 0 ° C and not more than 85 ° C (for example, not less than 50 ° C and not more than 85 ° C), more preferably 55 to 79 ° C.

  The liquid crystalline resin composition according to the present invention contains the liquid crystalline polymer in the liquid crystalline resin composition in an amount of 50 to 70% by mass with respect to the entire liquid crystalline resin composition. When the content of the liquid crystalline polymer is less than 50% by mass with respect to the entire liquid crystalline resin composition, the fluidity of the liquid crystalline resin composition is likely to deteriorate, and the surface mount relay obtained from the liquid crystalline resin composition This is not preferable because warpage deformation of a molded product such as an automotive part may increase. When the content of the liquid crystalline polymer is more than 70% by mass with respect to the entire liquid crystalline resin composition, the flexural modulus and crack resistance of molded products such as surface mount relay parts obtained from the liquid crystalline resin composition Is unfavorable because of lowering. The liquid crystalline resin composition according to the present invention preferably contains 55 to 65 mass% of the above liquid crystalline polymer in the liquid crystalline resin composition with respect to the entire liquid crystalline resin composition, and is preferably 58 to 62 mass%. More preferably.

(Fibrous filler)
The liquid crystalline resin composition according to the present invention includes the above liquid crystalline polymer and a fibrous filler, and the fibrous filler has a weight average fiber length of 50 to 170 μm. Since the content of the fraction having a length of 20 to 200 μm is 70% by mass or more, the molded product obtained by molding the liquid crystalline resin composition has excellent heat resistance, generation of blisters, and elimination of fillers. Is suppressed, and the adhesive can be bonded with high adhesive strength. A fibrous filler can be used individually by 1 type or in combination of 2 or more types. The fibrous filler in the present invention is not particularly limited, and is glass fiber, milled fiber, carbon fiber, asbestos fiber, silica fiber, silica / alumina fiber, zirconia fiber, boron nitride fiber, silicon nitride fiber, boron fiber, titanium. A potassium acid fiber etc. are mentioned. Milled fiber is preferred as the fibrous filler in the present invention because it is easy to suppress the detachment of the filler from the molded product while maintaining a high adhesive strength between the molded products obtained from the liquid crystalline resin composition.

  In the liquid crystalline resin composition of the present invention, the weight average fiber length of the fibrous filler is 50 to 170 μm, preferably 70 to 150 μm, more preferably 80 to 140 μm, and more preferably 100 to 140 μm. Even more preferably. When the weight average fiber length is less than 50 μm, the molded article obtained from the liquid crystalline resin composition is not sufficiently high in rigidity at high temperatures, and warpage deformation of the molded article may be increased. When the weight average fiber length is more than 170 μm, it is difficult to suppress the detachment of the filler from the molded product of the obtained liquid crystalline resin composition, which is not preferable. When the weight average fiber length is in the range of 50 to 170 μm, the surface roughness (Ra) of the molded product of the obtained liquid crystalline resin composition is appropriately improved, and the adhesive strength between the molded products is appropriately set. Easy to keep high in range. In this specification, the weight average fiber length of the fibrous filler means that the liquid crystalline resin composition is heated and ashed at 600 ° C. for 2 hours to obtain an ashing residue, and the ashing residue is converted to 5% by mass of polyethylene. A dispersion liquid is obtained by dispersing in an aqueous glycol solution, and the weight average fiber length measured with an image measuring device is used for this dispersion liquid.

  In order to suppress the detachment of the filler from the molded product of the liquid crystalline resin composition and to balance the mechanical strength such as weld strength and high-temperature rigidity of the molded product at a high level, in the fibrous filler, the fiber length 20 The content of the fraction having ˜200 μm is 70% by mass or more, preferably 75% by mass or more, more preferably 80% by mass or more. The upper limit of the said content rate is not specifically limited, It is 100 mass% or less, and 95 mass% or less may be sufficient. In the present specification, the content is determined by heating the liquid crystalline resin composition at 600 ° C. for 2 hours to ash to obtain an ash residue, and dispersing the ash residue in a 5% by mass polyethylene glycol aqueous solution. A liquid is obtained, and this dispersion is measured from the fiber length distribution measured using an image measuring device.

  Moreover, the fiber diameter of the fibrous filler in the present invention is not particularly limited, and generally about 5 to 15 μm is used.

  The liquid crystalline resin composition according to the present invention contains a fibrous filler in the liquid crystalline resin composition in an amount of 30 to 50% by mass with respect to the entire liquid crystalline resin composition. When the content of the fibrous filler is less than 30% by mass with respect to the entire liquid crystalline resin composition, the molded article such as a surface mount relay component obtained from the liquid crystalline resin composition has a low deflection temperature under load. This is not preferable because the high-temperature rigidity is not sufficient. If the content of the fibrous filler is more than 50% by mass with respect to the entire liquid crystalline resin composition, the fluidity of the liquid crystalline resin composition is deteriorated, and warpage deformation of the molded product may be increased. It is not preferable. The fibrous filler in the present invention is preferably contained in the liquid crystalline resin composition in an amount of 35 to 45% by mass, more preferably 38 to 42% by mass with respect to the entire liquid crystalline resin composition.

(Other ingredients)
In addition to the above components, the liquid crystalline resin composition according to the present invention includes a plate-like filler, a nucleating agent, carbon black, a pigment such as an inorganic fired pigment, an antioxidant, a stabilizer, a plasticizer, a lubricant, a release agent. You may mix | blend 1 or more types of a mold agent, a flame retardant, and a well-known inorganic filler.

  In the method for producing a liquid crystalline resin composition according to the present invention, the components in the liquid crystalline resin composition can be uniformly mixed, the weight average fiber length of the fibrous filler is 50 to 170 μm, It will not specifically limit if the content rate of the fraction which has 20-200 micrometers in length can be 70 mass% or more, It can select suitably from the manufacturing method of a resin composition known conventionally. For example, each component is melt-kneaded and extruded using a melt-kneader such as a single-screw or twin-screw extruder, and then the obtained liquid crystalline resin composition is processed into a desired form such as powder, flakes, pellets, etc. The method of doing is mentioned.

  Since the liquid crystalline resin composition according to the present invention is excellent in fluidity, the minimum filling pressure at the time of molding is unlikely to be excessive, and surface mount relay parts and the like can be preferably molded.

At 10 to 30 ° C. above the melting point of the liquid crystalline polymer, at a shear rate of 1000 / sec, the melt viscosity of the liquid resin composition was measured according to ISO11443 is 1 × ¹⁰ 5 Pa · s or less (more preferably, 5 Pa · s or more and 1 × 10 ² Pa · s or less) is preferable in terms of ensuring the fluidity of the liquid crystalline resin composition and preventing the filling pressure from becoming excessive at the time of molding of the surface mount relay component.

(Surface mount relay components and surface mount relays)
By molding the liquid crystalline resin composition according to the present invention, the surface mount relay component according to the present invention can be obtained. The surface mount relay component according to the present invention is excellent in heat resistance, suppresses generation of blisters and detachment of filler, and can be bonded with high adhesive strength by an adhesive. Since the surface mount relay according to the present invention includes the above components, (1) it has excellent heat resistance and can withstand solder reflow processing, and (2) it can bond the base and the case with high adhesive strength, particularly with an adhesive. It is possible to maintain the properties even after the solder reflow treatment, and (3) the occurrence of blisters and the detachment of fillers are suppressed, and functional failures such as poor conduction are unlikely to occur.

  The surface mount relay component according to the present invention and the surface mount relay according to the present invention will be described. FIG. 1A is a perspective view schematically showing an embodiment of a surface mount relay according to the present invention, and FIG. 1B is a partial cross-sectional view showing an AA cross section of FIG. The surface mount relay 1 includes a base 2, a case 3, a coil block 4, an armature block 5, and a terminal 6.

  The base 2 includes a terminal 6 protruding from the base 2. A case 3 is disposed on the outer peripheral portion of the upper surface of the base 2. A coil block 4 and an armature block 5 are arranged in this order at the center of the upper surface of the base 2.

  The case 3 is arranged so as to cover the outer peripheral portion of the upper surface of the base 2 and the coil block 4 and the armature block 5. A coil block 4 and an armature block 5 are accommodated in a hollow container-like space formed by the base 2 and the case 3.

  The coil block 4 includes a bobbin 41, a coil 42, and an iron core 43, and is arranged at the center of the upper surface of the base 2. The bobbin 41 has a cylindrical portion penetrating in the long axis direction. A coil 42 electrically connected to one end of a part of the terminal 6 is wound around the outer periphery of the bobbin 41, and the cylindrical portion of the bobbin 41 The iron core 43 is inserted into the.

  The armature block 5 includes an armature connecting portion 51 and an armature 52 extending from the armature connecting portion 51 in opposite directions along the major axis direction of the bobbin 41, and is disposed on the coil block 4. The armature 52 is electrically connected to one end of another part of the terminal 6. When the electromagnet is formed by conduction to the coil 42, the tip of the armature 52 moves to the coil block 4 side due to the magnetic force. As a result, a signal from the input side including the coil 42 is transmitted to the output side including the armature 52.

  One end of the terminal 6 is electrically connected to the coil 42 or the armature 52, and the other end is connected to a printed circuit board 7 described later so as to be electrically conductive. The terminal 6 protrudes from the base 2 and is soldered to the printed circuit board 7 as will be described later.

  Among the above-mentioned components, the base 2, the case 3, and the bobbin 41 are excellent in heat resistance, can be formed as a molded product that is prevented from generating blisters and detaching filler, and can be bonded with an adhesive with high adhesive strength. In consideration of the points and the like, the liquid crystalline resin composition according to the present invention is preferably used. That is, examples of the surface mount relay component according to the present invention include a base, a case, and a bobbin.

  In the surface-mount relay 1, for example, the coil block 4 and the armature block 5 are arranged in this order at the center of the upper surface of the base 2, and then the case 3 is arranged on the outer peripheral portion of the upper surface of the base 2. 3 can be manufactured by bonding them with an adhesive.

  A method for mounting the surface mount relay 1 on the printed circuit board 7 will be described. As shown in FIG. 2A, in the surface mount relay 1, the terminal 6 protruding perpendicularly from the surface mount relay 1 is bent at a right angle so that the soldering surface is parallel to the surface mount relay 1. Therefore, the surface mount relay 1 places the terminal 6 on a solder pad (not shown) provided on the conductor pattern 8 on the surface of the printed circuit board 7 without providing a hole in the printed circuit board 7, and performs solder reflow processing. By performing, it is fixed to the printed circuit board 7 so as to be electrically conductive.

  In the above description, as shown in FIG. 2A, the case where the tip of the terminal 6 protruding perpendicularly from the surface mount relay 1 is bent at right angles to the outside of the surface mount relay 1 has been shown. On the other hand, as shown in FIG. 2B, the tip of the terminal 6 protruding perpendicularly from the surface mount relay 1 may be bent at a right angle toward the inside of the surface mount relay 1.

  EXAMPLES Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited thereto.

<Synthesis Example 1>
A polymerization vessel equipped with a stirrer, a reflux column, a monomer inlet, a nitrogen inlet, and a decompression / outflow line was charged with the following raw material monomers, fatty acid metal salt catalyst, and acylating agent, and nitrogen substitution was started.
(I) 9.7 mol (58 mol%) 4-Hydroxybenzoic acid (HBA)
(II) 6-hydroxy-2-naphthoic acid 0.17 mol (1 mol%) (HNA)
(III) Terephthalic acid 3.2 mol (19.25 mol%) (TA)
(IV) 0.25 mol (1.5 mol%) isophthalic acid (IA)
(V) 2.5 mol of 4,4′-dihydroxybiphenyl (15.25 mol%) (BP)
(VI) N-acetyl-p-aminophenol 0.83 mol (5 mol%) (APAP)
Potassium acetate catalyst 110mg
1734 g of acetic anhydride (1.03 times the total hydroxyl equivalent of HBA, HNA, BP and APAP)
After charging the raw materials, the temperature of the reaction system was raised to 140 ° C. and reacted at 140 ° C. for 1 hour. Thereafter, the temperature is further raised to 360 ° C. over 5.5 hours, and then the pressure is reduced to 10 Torr (ie, 1330 Pa) over 20 minutes to melt while distilling acetic acid, excess acetic anhydride, and other low-boiling components. Polymerization was performed. After the stirring torque reached a predetermined value, nitrogen was introduced and the pressure was changed from a reduced pressure state to a normal pressure, and the polymer was discharged from the lower part of the polymerization vessel.

<Evaluation>
About the wholly aromatic polyester amide of the synthesis example 1, evaluation of melting | fusing point, melt viscosity, and DTUL was performed with the following method. The evaluation results are shown in Table 1.

[Melting point]
After observing the endothermic peak temperature (Tm1) observed by DSC (manufactured by TA Instruments) at a temperature rising condition of 20 ° C./min from room temperature, the temperature is 2 at (Tm1 + 40) ° C. After being held for a minute, the sample was once cooled to room temperature under a temperature drop condition of 20 ° C./min, and then the temperature of the endothermic peak observed when measured under a temperature rise condition of 20 ° C./min was measured again.

[DTUL]
60% by mass of polymer and 40% by mass of glass fiber (Central Glass Co., Ltd. EFH75-01, milled fiber, average fiber diameter 11 μm, average fiber length 75 μm) twin screw extruder (TEX30α type, manufactured by Nippon Steel) Was melt-kneaded at a cylinder temperature of polymer melting point + 20 ° C. to obtain liquid crystalline resin composition pellets.
The liquid crystalline resin composition pellets were molded under the following molding conditions using a molding machine (“SE100DU” manufactured by Sumitomo Heavy Industries, Ltd.) to obtain test specimens (4 mm × 10 mm × 80 mm). . Using this test piece, the deflection temperature under load was measured by a method based on ISO75-1,2. Note that 1.8 MPa was used as the bending stress. The results are shown in Table 1.
〔Molding condition〕
Cylinder temperature: Polymer melting point + 15 ° C
Mold temperature: 80 ℃
Back pressure: 2MPa
Injection speed: 33mm / sec

[Melt viscosity]
Using a Capillograph manufactured by Toyo Seiki Seisakusho Co., Ltd., using an orifice with an inner diameter of 1 mm and a length of 20 mm at a temperature 10 to 30 ° C. higher than the melting point of the liquid crystalline polymer, and a shear rate of 1000 / sec. The melt viscosity of the liquid crystalline polymer was measured. The measured temperatures were as shown in Table 1.

<Synthesis Examples 2-18, Comparative Synthesis Examples 1-10>
A polymer was obtained in the same manner as in Synthesis Example 1 except that the type of raw material monomer and the charging ratio (mol%) were as shown in Tables 1 to 3. Further, the same evaluation as in Synthesis Example 1 was performed. The evaluation results are shown in Tables 1-3.

<Examples 1 and 2, Comparative Examples 1-3>
In the following Examples and Comparative Examples, the liquid crystalline polymer 1 is the liquid crystalline polymer obtained in Synthesis Example 16. Moreover, the liquid crystalline polymer 2 was manufactured as follows.

  In this example, the melting point and melt viscosity of the pellet were measured under the following conditions.

[Measurement of melting point]
After observing the endothermic peak temperature (Tm1) observed when the liquid crystalline polymer was measured at room temperature from 20 ° C./min with a DSC manufactured by TA Instruments, 2 at a temperature of (Tm1 + 40) ° C. After being held for a minute, the sample was once cooled to room temperature under a temperature drop condition of 20 ° C./min, and then the temperature of the endothermic peak observed when measured under a temperature rise condition of 20 ° C./min was measured again.

[Measurement of melt viscosity]
Using Capillograph Type 1B manufactured by Toyo Seiki Seisakusho Co., Ltd., using an orifice with an inner diameter of 1 mm and a length of 20 mm at a temperature 10 to 30 ° C. higher than the melting point of the liquid crystalline polymer, with a shear rate of 1000 / sec, In conformity, the melt viscosity of the liquid crystalline polymer was measured. The measurement temperature was 360 ° C. for liquid crystal polymer 1 and 380 ° C. for liquid crystal polymer 2.

(Method for producing liquid crystalline polymer 2)
A polymerization vessel equipped with a stirrer, a reflux column, a monomer inlet, a nitrogen inlet, and a pressure reduction / outflow line was charged with the following raw material monomers, a metal catalyst, and an acylating agent, and nitrogen substitution was started.
(I) 4-hydroxybenzoic acid: 1040 g (48 mol%) (HBA)
(II) 6-hydroxy-2-naphthoic acid: 89 g (3 mol%) (HNA)
(III) Terephthalic acid: 547 g (21 mol%) (TA)
(IV) Isophthalic acid: 91 g (3.5 mol%) (IA)
(V) 4,4′-dihydroxybiphenyl: 716 g (24.5 mol%) (BP)
Potassium acetate catalyst: 110 mg
Acetic anhydride: 1644 g

  After the raw materials were charged into the polymerization vessel, the temperature of the reaction system was raised to 140 ° C. and reacted at 140 ° C. for 1 hour. Thereafter, the temperature is further increased to 360 ° C. over 5.5 hours, and then the pressure is reduced to 5 Torr (ie, 667 Pa) over 20 minutes while distilling acetic acid, excess acetic anhydride, and other low-boiling components. Melt polymerization was performed. After the stirring torque reached a predetermined value, nitrogen was introduced to change from a reduced pressure state to a normal pressure through a normal pressure, the polymer was discharged from the lower part of the polymerization vessel, and the strand was pelletized to pelletize. The obtained pellet had a melting point of 355 ° C. and a melt viscosity of 10 Pa · s.

(Components other than liquid crystalline polymers)
Each liquid crystalline polymer obtained above and the following components were mixed using a twin screw extruder to obtain a liquid crystalline resin composition. The amount of each component is as shown in Table 4. Hereinafter, “%” in the table represents mass%.
(B) Fibrous filler Glass fiber: ECS03T-786H manufactured by Nippon Electric Glass Co., Ltd., fiber diameter 10 μm, length of 3 mm chopped strand Milled fiber 1: Nittobo Co., Ltd. PF70E001, fiber diameter 10 μm, average fiber Length 70μm (Manufacturer nominal value)
Milled fiber 2: EPH-80M manufactured by Nippon Electric Glass Co., Ltd., fiber diameter 10.5 μm, average fiber length 80 μm (manufacturer nominal value)
In addition, said manufacturer's nominal value differs from the value in Table 4 which is an actual measurement value in a composition.

Moreover, the extrusion conditions at the time of obtaining a liquid crystalline resin composition are as follows.
[Extrusion conditions]
[Examples 1 and 2, Comparative Examples 1 and 3]
The temperature of the cylinder provided at the main feed port was 250 ° C., and the temperatures of the other cylinders were all 360 ° C. All liquid crystalline polymers were supplied from the main feed port. The filler was supplied from the side feed port.
[Comparative Example 2]
The temperature of the cylinder provided at the main feed port was 250 ° C., and the temperatures of the other cylinders were all 380 ° C. All liquid crystalline polymers were supplied from the main feed port. The filler was supplied from the side feed port.

The weight average fiber length of the fibrous filler in the liquid crystalline resin composition was measured by the following method.
[Measurement of weight average fiber length]
5 g of liquid crystal resin composition pellets were heated at 600 ° C. for 2 hours to be incinerated. The ashing residue was sufficiently dispersed in a 5% by mass polyethylene glycol aqueous solution, then transferred to a petri dish with a dropper, and the fibrous filler was observed with a microscope. At the same time, the weight average fiber length of the fibrous filler was measured using an image measuring device (LUZEXFS manufactured by Nireco Corporation).

Moreover, the content rate of the fraction which has fiber length 20-200 micrometers in the fibrous filler in a liquid crystalline resin composition was measured with the following method.
[Measurement of content of fraction having fiber length of 20 to 200 μm]
5 g of liquid crystal resin composition pellets were heated at 600 ° C. for 2 hours to be incinerated. The ashing residue was sufficiently dispersed in a 5% by mass polyethylene glycol aqueous solution, transferred to a petri dish with a dropper, and the fiber length distribution of the fibrous filler was measured using an image measuring device (LUZEXFS manufactured by Nireco Corporation). In the fiber length distribution, the ratio of the fraction having a fiber length of 20 to 200 μm was read and used as the content.

(Measurement of melt viscosity of liquid crystalline resin composition)
Using Capillograph Type 1B manufactured by Toyo Seiki Seisakusho Co., Ltd., using an orifice with an inner diameter of 1 mm and a length of 20 mm at a temperature 10 to 30 ° C. higher than the melting point of the liquid crystalline polymer, and a shear rate of 1000 / sec, Based on this, the melt viscosity of the liquid crystalline resin composition was measured. The measurement temperature was 360 ° C. for the liquid crystalline resin composition using the liquid crystalline polymer 1 and 380 ° C. for the liquid crystalline resin composition using the liquid crystalline polymer 2. The results are shown in Table 4.

  Based on the following method, the physical property of the molded article shape | molded from the liquid crystalline resin composition was measured. Each evaluation result is shown in Table 4.

(Bending test)
Under the following molding conditions, the liquid crystalline resin composition was injection-molded to obtain a molded product having a thickness of 0.8 mm, and bending strength, breaking strain, and bending elastic modulus were measured according to ASTM D790.
[Molding condition]
Molding machine: Sumitomo Heavy Industries, SE100DU
Cylinder temperature:
360 ° C. (Examples 1 and 2, Comparative Examples 1 and 3)
370 ° C. (Comparative Example 2)
Mold temperature: 80 ℃
Injection speed: 33mm / sec

(Load deflection temperature)
Under the following molding conditions, the liquid crystalline resin composition was injection-molded to obtain a molded product, and the deflection temperature under load was measured in accordance with ISO75-1,2.
[Molding condition]
Molding machine: Sumitomo Heavy Industries, SE100DU
Cylinder temperature:
360 ° C. (Examples 1 and 2, Comparative Examples 1 and 3)
370 ° C. (Comparative Example 2)
Mold temperature: 80 ℃
Injection speed: 33mm / sec

(Blister temperature)
The liquid crystalline resin composition was injection molded under the following molding conditions to obtain a molded product of 12.5 mm × 120 mm × 0.8 mm having a weld portion. A fragment obtained by dividing the molded product into two parts at the weld part was used as one specimen, and was sandwiched in a hot press at a predetermined temperature for 5 minutes. Thereafter, it was visually examined whether blisters were generated on the surface of the specimen. The blister temperature was the maximum temperature at which the number of blisters generated was zero. The predetermined temperature was set in increments of 10 ° C. in the range of 250 to 300 ° C.
[Molding condition]
Molding machine: Sumitomo Heavy Industries, SE100DU
Cylinder temperature:
360 ° C. (Examples 1 and 2, Comparative Examples 1 and 3)
370 ° C. (Comparative Example 2)
Mold temperature: 90 ℃
Injection speed: 33mm / sec

(Filler detachability)
The liquid crystalline resin composition was injection molded under the following molding conditions to obtain a molded product of 12.5 mm × 120 mm × 0.8 mm having a weld portion. The molded product obtained by dividing the molded product in two at the weld part was subjected to IR reflow under the following conditions, and then the detachment state of the fibrous filler was observed and evaluated according to the following criteria.
○ (Good): There was no change, and detachment of the fibrous filler was suppressed.
X (defect): The fibrous filler was detached.
[Molding condition]
Molding machine: Sumitomo Heavy Industries, SE100DU
Cylinder temperature:
360 ° C. (Examples 1 and 2, Comparative Examples 1 and 3)
370 ° C. (Comparative Example 2)
Mold temperature: 90 ℃
Injection speed: 33mm / sec
[IR reflow conditions]
Measuring machine: RF-300 (using far infrared heater)
Sample feed rate: 140 mm / sec
Reflow furnace passage time: 5 minutes Preheating zone temperature condition: 150 ° C
Reflow zone temperature condition: 190 ° C
Peak temperature: 251 ° C

(Surface roughness (Ra))
The liquid crystalline resin composition was injection molded under the following molding conditions to obtain a test piece (ISO test piece Type 1A, thickness 4 mm). About the center part of this molded article, surface roughness Ra was measured using the ultra-deep color 3D shape measurement microscope VK-9500 (made by Keyence Corporation).
[Molding condition]
Molding machine: Sumitomo Heavy Industries, SE100DU
Cylinder temperature:
360 ° C. (Examples 1 and 2, Comparative Examples 1 and 3)
370 ° C. (Comparative Example 2)
Mold temperature: 90 ℃
Injection speed: 33mm / sec

(Adhesive strength)
The liquid crystalline resin composition was injection molded under the following molding conditions to obtain a test piece (ISO test piece Type 1A, thickness 4 mm). This test piece was divided into two parts and bonded together with an epoxy adhesive (Loctite 3128NH manufactured by Henkel) as shown in FIG. 3A (curing conditions: 80 ° C. × 30 minutes). Then, as shown in FIG.3 (b), the bonded test piece was installed, the load was applied in the arrow direction using the tensile tester, and adhesive strength was evaluated from the load when it peeled off.
[Molding condition]
Molding machine: Sumitomo Heavy Industries, SE100DU
Cylinder temperature:
360 ° C. (Examples 1 and 2, Comparative Examples 1 and 3)
370 ° C. (Comparative Example 2)
Mold temperature: 90 ℃
Injection speed: 33mm / sec
[Tensile test conditions]
Testing machine: Orientec, Tensilon RTC-1325A
Test speed: 10 mm / min

※特定画分：繊維状充填剤において、繊維長２０〜２００μｍを有する画分

* Specific fraction: In the fibrous filler, the fraction having a fiber length of 20 to 200 μm

  As shown in Table 4, the molded product molded from the liquid crystalline resin composition for surface mount relay according to the present invention is excellent in heat resistance, the generation of blister and the detachment of filler are suppressed, and the adhesive is highly bonded. We were able to bond with strength. Therefore, the liquid crystalline resin composition can be suitably used for the production of surface mount relay components and surface mount relays.

DESCRIPTION OF SYMBOLS 1 Surface mount relay 2 Base 3 Case 4 Coil block 41 Bobbin 42 Coil 43 Iron core 5 Armature block 51 Armature connection part 52 Armature 6 Terminal 7 Printed circuit board 8 Conductor pattern

Claims (5)

A liquid crystalline resin composition for a surface mount relay, comprising (A) a liquid crystalline polymer and (B) a fibrous filler,
The (A) liquid crystalline polymer consists of only the following structural units (I) to (VI) as essential structural components,
Content of structural unit (I) is 50-70 mol% with respect to all the structural units,
The content of the structural unit (II) is 0.5 mol% or more and less than 4.5 mol% with respect to all the structural units,
Content of structural unit (III) is 10.25-22.25 mol% with respect to all the structural units,
The content of the structural unit (IV) is 0.5 mol% or more and less than 4.5 mol% with respect to all the structural units,
Content of a structural unit (V) is 5.75-23.75 mol% with respect to all the structural units,
Content of structural unit (VI) is 1-7 mol% with respect to all the structural units,
The total content of the structural unit (II) and the structural unit (IV) with respect to all the structural units is 1 mol% or more and less than 5 mol%,
The total content of the structural units (I) to (VI) with respect to all the structural units is 100 mol%,
A wholly aromatic polyester amide exhibiting optical anisotropy when melted, wherein the molar ratio of the structural unit (VI) to the total of the structural unit (V) and the structural unit (VI) is 0.04 to 0.37. ,
The (B) fibrous filler has a weight average fiber length of 50 to 170 μm,
In the (B) fibrous filler, the content of the fraction having a fiber length of 20 to 200 μm is 70% by mass or more,
Said (A) liquid crystalline polymer is 50-70 mass% with respect to the whole liquid crystalline resin composition,
Said (B) fibrous filler is 30-50 mass% with respect to the whole liquid crystalline resin composition,
The surface mount relay includes a base and a terminal protruding from the base, and is a liquid crystalline resin composition that is a surface mount relay in which the terminal is soldered to a printed board.

  The total number of moles of the structural unit (III) and the structural unit (IV) is 1 to 1.1 times the total number of moles of the structural unit (V) and the structural unit (VI), or the structural unit ( The liquid crystalline resin according to claim 1, wherein the total number of moles of V) and the structural unit (VI) is 1 to 1.1 times the total number of moles of the structural unit (III) and the structural unit (IV). Composition.   The liquid crystalline resin composition according to claim 1, wherein the (B) fibrous filler is a milled fiber.   A component for surface mount relay comprising the composition according to claim 1.   A surface-mount relay comprising the component according to claim 4.

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