JP2018095684A - Composite resin composition, and connector molded from the composite resin composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a composite resin composition which achieves manufacture of a connector which is excellent in heat resistance and suppresses warpage deformation and blister generation and has good flowability, and a connector molded from the composite resin composition.SOLUTION: A composite resin composition contains (A) a liquid crystal polymer, (B) a fibrous filler and (C) a plate-like filler, where (A) the liquid crystal polymer is wholly aromatic polyester amide which contains a predetermined amount of a liquid crystal polymer having a specific repeating unit containing a structural unit derived from 4-hydroxybenzoic acid, 1,4-phenylene dicarboxylic acid, 1,3-phenylene dicarboxylic acid, 4,4'-dihydroxy biphenyl and N-acetyl-p-aminophenol as essential components and exhibits optical anisotropy in melting, and a weight average fiber length of (B) the fibrous filler is 200 μm or more.SELECTED DRAWING: None

Description

  The present invention relates to a composite resin composition and a connector molded from the composite resin composition.

  The liquid crystalline polymer is a thermoplastic resin excellent in dimensional accuracy, fluidity, and the like. Due to these characteristics, liquid crystalline polymers have been conventionally employed as materials for various electronic components.

  In particular, with the recent downsizing and thinning of electronic equipment, there is a need for a reduction in height and narrowing of electronic components (connectors and the like) that constitute the electronic equipment. For example, Patent Document 1 discloses a connector formed from a liquid crystalline polymer composition reinforced with mica and glass fiber. Such connectors are used to connect board-to-board connectors, flexible printed boards (FPCs) and flexible flat cables (FFCs) that require heat resistance, warpage deformation suppression, fluidity, dimensional stability, etc. It is adopted as a connector for flexible printed circuit boards used in the industry.

JP 2006-37061 A

  However, when trying to mold a connector from a conventional liquid crystalline polymer composition, the heat resistance of the composition, suppression of warpage deformation, and fluidity are not sufficient, and the processability is poor, so it is difficult to reduce the height and pitch. It was difficult to manufacture low-profile narrow-pitch connectors that meet the needs.

  In addition, the liquid crystal polymer composition may have a problem of blistering. That is, liquid crystalline polyesteramide, which is a liquid crystalline polymer, is often used as a material that requires heat treatment at a high temperature because it has good high-temperature thermal stability. However, when the molded product is left in high temperature air and liquid for a long time, there arises a problem that fine blisters called blisters are generated on the surface. This phenomenon is caused by the fact that the decomposition gas generated when the liquid crystalline polyesteramide is in a molten state is brought into the molded product, and then the gas expands when the high-temperature heat treatment is performed. This is because the pushed up part appears as a blister. The generation of blisters can be reduced by sufficiently degassing the vent hole during melt extrusion of the material, or by not allowing the material to stay in the molding machine for a long time during molding. However, the range of conditions is very narrow, and it is not sufficient to obtain a molded product in which generation of blisters is suppressed, that is, a molded product having blister resistance. The fundamental solution to blister generation requires improvement of the quality of the liquid crystalline polyester amide itself, and the known liquid crystalline polyester amide and methods using it are insufficient to solve the problem of blister generation. .

  The present invention has been made in view of such circumstances, a composite resin composition having excellent fluidity, excellent in heat resistance, capable of producing a connector in which warpage deformation and blister generation are suppressed, and the composite resin It is an object to provide a connector molded from the composition.

  The inventors of the present invention combine a liquid crystalline polymer containing a predetermined amount of a specific structural unit, a fibrous filler, and a plate-like filler so that the weight average fiber length of the fibrous filler is 200 μm or less. It has been found that the above problems can be solved. Specifically, the present invention provides the following.

(1) A composite resin composition comprising (A) a liquid crystalline polymer, (B) a fibrous filler, and (C) a plate-like filler,
The (A) liquid crystalline polymer is composed of the following structural units (I) to (V) as essential components:
Content of structural unit (I) is 55-68 mol% with respect to all the structural units,
The content of the structural unit (II) is 6 to 16.1 mol% with respect to all the structural units,
Content of structural unit (III) is 6.4-10 mol% with respect to all the structural units,
Content of structural unit (IV) is 9-21.5 mol% with respect to all the structural units,
The content of the structural unit (V) is 1 to 7 mol% with respect to all the structural units,
The total content of the structural units (I) to (V) is 100 mol% with respect to the total structural units, and is a wholly aromatic polyester amide that exhibits optical anisotropy when melted.
The (B) fibrous filler has a weight average fiber length of 200 μm or less,
Said (A) liquid crystalline polymer is 62.5-15 mass% with respect to the whole composite resin composition,
The (B) fibrous filler is 1.5 to 15% by mass relative to the entire composite resin composition,
The (C) plate-like filler is 12.5 to 36% by mass with respect to the entire composite resin composition,
The total amount of the (B) fibrous filler and the (C) plate filler is 17.5 to 37.5% by mass with respect to the entire composite resin composition.
Composite resin composition.

  (2) The composite resin composition according to (1), wherein the (B) fibrous filler is a milled fiber.

  (3) The composite resin composition according to (1) or (2), wherein the (C) plate-like filler is one or more selected from the group consisting of talc and mica.

  (4) A connector molded from the composite resin composition according to any one of (1) to (3), having a total product length of less than 30 mm and a product height of less than 5 mm.

  (5) The connector according to (4), which is a low profile narrow pitch connector.

(6) The distance between pitches is 0.5 mm or less,
Product total length is 3.5mm or more,
The product height is 4.0 mm or less,
The connector according to (4) or (5), which is a low-profile narrow-pitch connector that is a board-to-board connector or a flexible printed circuit board connector.

  ADVANTAGE OF THE INVENTION According to this invention, the composite resin composition with favorable fluidity | liquidity which can implement | achieve manufacture of the connector excellent in heat resistance, and the curvature deformation and blister generation were suppressed, and the connector shape | molded from the said composite resin composition are provided. Is done.

It is a figure which shows the FPC connector shape | molded in the Example. In addition, the unit of the numerical value in a figure is mm. It is a figure which shows the measurement location in the measurement of the curvature of the FPC connector performed in the Example.

  Hereinafter, embodiments of the present invention will be specifically described.

[Composite resin composition]
The composite resin composition in the present invention contains a specific amount of a specific liquid crystalline polymer, a fibrous filler, and a plate-like filler, and the fibrous filler has a weight average fiber length of 200 μm or less. Hereinafter, the components constituting the composite resin composition in the present invention will be described.

(Liquid crystal polymer)
The composite resin composition in the present invention includes a liquid crystalline polymer that is the above-mentioned wholly aromatic polyester amide. Since the wholly aromatic polyester amide has a low melting point, the processing temperature can be lowered and the generation of decomposition gas during melting is suppressed. As a result, in the molded product obtained by molding the composite resin composition containing the wholly aromatic polyester amide, blister generation is suppressed and blister resistance is improved. A liquid crystalline polymer can be used individually by 1 type or in combination of 2 or more types.

  The wholly aromatic polyester amide in the present invention comprises the following structural unit (I), the following structural unit (II), the following structural unit (III), the following structural unit (IV), and the following structural unit (V).

  The structural unit (I) is derived from 4-hydroxybenzoic acid (hereinafter also referred to as “HBA”). The wholly aromatic polyester amide in the present invention contains 55 to 68 mol% of the structural unit (I) with respect to all the structural units. When the content of the structural unit (I) is less than 55 mol% or exceeds 68 mol%, at least one of heat resistance and manufacturability tends to be insufficient.

  The structural unit (II) is derived from 1,4-phenylenedicarboxylic acid (hereinafter also referred to as “TA”). The wholly aromatic polyester amide in the present invention contains 6 to 16.1 mol% of the structural unit (II) with respect to the total structural units. When the content of the structural unit (II) is less than 6 mol% or exceeds 16.1 mol%, at least one of heat resistance and manufacturability tends to be insufficient.

  The structural unit (III) is derived from 1,3-phenylenedicarboxylic acid (hereinafter also referred to as “IA”). The wholly aromatic polyester amide in the present invention contains 6.4 to 10 mol% of the structural unit (III) with respect to the total structural units. When the content of the structural unit (III) is less than 6.4 mol% or exceeds 10 mol%, at least one of heat resistance and manufacturability tends to be insufficient.

  The structural unit (IV) is derived from 4,4′-dihydroxybiphenyl (hereinafter also referred to as “BP”). The wholly aromatic polyester amide in the present invention contains 9 to 21.5 mol% of the structural unit (IV) with respect to the total structural unit. When the content of the structural unit (IV) is less than 9 mol% or exceeds 21.5 mol%, at least one of heat resistance and manufacturability tends to be insufficient.

  The structural unit (V) is derived from N-acetyl-p-aminophenol (hereinafter also referred to as “APAP”). The wholly aromatic polyester amide in the present invention contains 1 to 7 mol% of the structural unit (V) with respect to all structural units. When the content of the structural unit (V) is less than 1 mol%, the heat resistance is good, but the manufacturability tends to be insufficient. If the content of the structural unit (V) exceeds 7 mol%, at least one of heat resistance and manufacturability tends to be insufficient.

  From the viewpoint of achieving both heat resistance and manufacturability, the total number of moles of the structural unit (II) and the structural unit (III) is the total number of moles of the structural unit (IV) and the structural unit (V). 1 to 1.06 times, or the total number of moles of the structural unit (IV) and the structural unit (V) is 1 to 1 of the total number of moles of the structural unit (II) and the structural unit (III). It is preferably 1.06 times.

  As described above, the wholly aromatic polyester amide in the present invention contains a specific amount of each of the specific structural units (I) to (V) with respect to the total structural units. Excellent balance. In addition, the wholly aromatic polyester amide of the present invention contains 100 mol% of the structural units (I) to (V) in total with respect to the total structural units.

  As an index representing the heat resistance, a difference between a melting point and a deflection temperature under load (hereinafter also referred to as “DTUL”) can be given. If this difference is 120 ° C. or less, the heat resistance tends to increase, which is preferable. DTUL is obtained by melt-kneading 60% by mass of the wholly aromatic polyester amide and 40% by mass of milled fiber having an average fiber diameter of 11 μm and an average fiber length of 75 μm at the melting point of the wholly aromatic polyester amide + 20 ° C. It is a value measured in the state of the polyester resin composition, and can be measured according to ISO75-1,2.

  Subsequently, the manufacturing method of the wholly aromatic polyester amide in this invention is demonstrated. The wholly aromatic polyester amide in the present invention is polymerized using a direct polymerization method, a transesterification method or the like. In the polymerization, a melt polymerization method, a solution polymerization method, a slurry polymerization method, a solid phase polymerization method, or the like is used.

  In the present invention, at the time of polymerization, an acylating agent for the polymerization monomer or a monomer having terminal activated as an acid chloride derivative can be used. Examples of the acylating agent include fatty acid anhydrides such as acetic anhydride.

In the polymerization, various catalysts can be used. Typical examples include dialkyl tin oxide, diaryl tin oxide, titanium dioxide, alkoxy titanium silicates, titanium alcoholates, fatty acid metal salts, BF ₃ Lewis acid salts such as are mentioned, and fatty acid metal salts are preferred. The amount of the catalyst used is generally about 0.001 to 1% by weight, particularly about 0.003 to 0.2% by weight, based on the total weight of the monomers.

  Moreover, when performing solution polymerization or slurry polymerization, as a solvent, liquid paraffin, a high heat resistant synthetic oil, an inert mineral oil, etc. are used.

  The reaction conditions are, for example, a reaction temperature of 200 to 380 ° C. and a final ultimate pressure of 0.1 to 760 Torr (that is, 13 to 101,080 Pa). Particularly in the melt reaction, for example, the reaction temperature is 260 to 380 ° C., preferably 300 to 360 ° C., the final ultimate pressure is 1 to 100 Torr (that is, 133 to 13,300 Pa), preferably 1 to 50 Torr (that is, 133 to 6,670 Pa). ).

  In the reaction, all the raw material monomers (HBA, TA, IA, BP, and APAP), the acylating agent, and the catalyst can be charged into the same reaction vessel to start the reaction (one-stage system), or the raw material monomers HBA, BP , And the APAP hydroxyl group can be acylated with an acylating agent and then reacted with the carboxyl groups of TA and IA (two-stage system).

  The melt polymerization is performed after the inside of the reaction system has reached a predetermined temperature, and the pressure reduction is started to a predetermined pressure reduction degree. After the torque of the stirrer reaches a predetermined value, an inert gas is introduced, and the total aromatic polyester amide is discharged from the reaction system through a normal pressure from a reduced pressure state to a predetermined pressure state.

  The wholly aromatic polyester amide produced by the above polymerization method can be further increased in molecular weight by solid-phase polymerization that is heated in an inert gas at normal pressure or reduced pressure. The preferable conditions for the solid state polymerization reaction are a reaction temperature of 230 to 350 ° C., preferably 260 to 330 ° C., and a final ultimate pressure of 10 to 760 Torr (ie 1,330 to 101,080 Pa).

The process for producing a wholly aromatic polyester amide in the present invention comprises acylating 4-hydroxybenzoic acid, 4,4′-dihydroxybiphenyl, and N-acetyl-p-aminophenol with a fatty acid anhydride in the presence of a fatty acid metal salt. And preferably comprises a step of transesterification with 1,4-phenylenedicarboxylic acid and 1,3-phenylenedicarboxylic acid,
Consisting of 4-hydroxybenzoic acid, 1,4-phenylenedicarboxylic acid, 1,3-phenylenedicarboxylic acid, 4,4′-dihydroxybiphenyl, and N-acetyl-p-aminophenol, for all monomers used in the method ,
The amount of 4-hydroxybenzoic acid used is 55 to 68 mol%,
The amount of 1,4-phenylenedicarboxylic acid used is 6 to 16.1 mol%,
The amount of 1,3-phenylenedicarboxylic acid used is 6.4 to 10 mol%,
The amount of 4,4′-dihydroxybiphenyl used is 9 to 21.5 mol%,
The amount of N-acetyl-p-aminophenol used is 1 to 7 mol%,
The total amount of 4-hydroxybenzoic acid, 1,4-phenylenedicarboxylic acid, 1,3-phenylenedicarboxylic acid, 4,4′-dihydroxybiphenyl, and N-acetyl-p-aminophenol used is 100 mol%.
It is preferable that
The amount of the fatty acid anhydride used is 1.02 to 1.04 times the total hydroxyl equivalent of 4-hydroxybenzoic acid, 4,4′-dihydroxybiphenyl, and N-acetyl-p-aminophenol. preferable. More preferably, the fatty acid metal salt is an acetic acid metal salt and the fatty acid anhydride is acetic anhydride. The total number of moles of 1,4-phenylene dicarboxylic acid and 1,3-phenylene dicarboxylic acid is 1 to 1 of the total number of moles of 4,4′-dihydroxybiphenyl and N-acetyl-p-aminophenol. 1.06 times, or the total number of moles of 4,4′-dihydroxybiphenyl and N-acetyl-p-aminophenol is 1,4-phenylenedicarboxylic acid and 1,3-phenylenedicarboxylic acid. More preferably, it is 1-1.06 times the total number of moles.

  Next, the properties of wholly aromatic polyester amide will be described. The wholly aromatic polyester amide in the present invention exhibits optical anisotropy when melted. An optical anisotropy when melted means that the wholly aromatic polyester amide in the present invention is a liquid crystalline polymer.

  In the present invention, the fact that the wholly aromatic polyester amide is a liquid crystalline polymer is an indispensable element for the wholly aromatic polyester amide to have both heat stability and easy processability. The wholly aromatic polyester amide composed of the structural units (I) to (V) may not form an anisotropic molten phase depending on the constituent components and the sequence distribution in the polymer. Is limited to wholly aromatic polyester amides exhibiting optical anisotropy when melted.

  The property of melt anisotropy can be confirmed by a conventional polarization inspection method using an orthogonal polarizer. More specifically, the melting anisotropy can be confirmed by melting a sample placed on a hot stage manufactured by Linkham Co., Ltd. using a polarizing microscope manufactured by Olympus and observing it at a magnification of 150 times in a nitrogen atmosphere. The liquid crystalline polymer is optically anisotropic and transmits light when inserted between crossed polarizers. If the sample is optically anisotropic, for example, polarized light is transmitted even in a molten stationary liquid state.

  Since a nematic liquid crystalline polymer causes a significant decrease in viscosity at the melting point or higher, generally exhibiting liquid crystallinity at the melting point or higher is an index of workability. The melting point is preferably as high as possible from the viewpoint of heat resistance, but considering the thermal deterioration during the polymer melt processing, the heating ability of the molding machine, etc., a preferable standard is 300 to 340 ° C. In addition, More preferably, it is 305-335 degreeC.

  The composite resin composition in the present invention contains the liquid crystalline polymer in the composite resin composition in an amount of 62.5 to 82.5% by mass with respect to the entire composite resin composition. When the content of the liquid crystalline polymer is less than 62.5% by mass with respect to the entire composite resin composition, the fluidity of the composite resin composition is likely to deteriorate, and a connector obtained from the composite resin composition, etc. This is not preferable because warpage deformation of the molded product may increase. If the content of the liquid crystalline polymer is more than 82.5% by mass with respect to the entire composite resin composition, the bending elastic modulus and crack resistance of a molded article such as a connector obtained from the composite resin composition are lowered. It is not preferable. The composite resin composition in the present invention preferably contains the liquid crystalline polymer in the composite resin composition in an amount of 64 to 80% by mass, and 65 to 77.5% by mass with respect to the entire composite resin composition. Is more preferable.

(Fibrous filler)
The composite resin composition in the present invention contains the above liquid crystalline polymer and a fibrous filler, and the weight average fiber length of the fibrous filler is 200 μm or less. Therefore, the composite resin composition is molded. The obtained molded product is excellent in high-temperature rigidity and fluidity, and warpage deformation is suppressed. A fibrous filler can be used individually by 1 type or in combination of 2 or more types. The fibrous filler in the present invention is not particularly limited, and is glass fiber, milled fiber, carbon fiber, asbestos fiber, silica fiber, silica / alumina fiber, zirconia fiber, boron nitride fiber, silicon nitride fiber, boron fiber, titanium. A potassium acid fiber etc. are mentioned. Since the high temperature rigidity of the molded product obtained from the composite resin composition is likely to be improved, milled fiber is preferred as the fibrous filler in the present invention.

  In the composite resin composition of the present invention, the weight average fiber length of the fibrous filler is 200 μm or less, preferably 170 μm or less, and more preferably 150 μm or less. When the weight average fiber length is more than 200 μm, the fluidity of the composite resin composition is hardly sufficient, and warpage deformation of the molded product may be increased. The lower limit of the weight average fiber length is not particularly limited, but is preferably 50 μm or more, and more preferably 70 μm or more. The weight average fiber length is preferably 50 μm or more because the high-temperature rigidity of a molded product obtained from the composite resin composition is likely to be sufficient.

  Moreover, the fiber diameter of the fibrous filler in the present invention is not particularly limited, and generally about 5 to 15 μm is used.

  The composite resin composition in the present invention contains the fibrous filler in the composite resin composition in an amount of 1.5 to 15% by mass with respect to the entire composite resin composition. When the content of the fibrous filler is less than 1.5% by mass with respect to the entire composite resin composition, the deflection temperature under load of a molded product such as a connector obtained from the composite resin composition is low, and the high-temperature rigidity is sufficient. It is not preferable because it is not. If the content of the fibrous filler is more than 15% by mass with respect to the entire composite resin composition, the fluidity of the composition is deteriorated and the warpage deformation of the molded product may be increased, which is not preferable. The fibrous filler in the present invention is preferably contained in the composite resin composition in an amount of 2 to 15% by mass and more preferably 3 to 15% by mass with respect to the entire composite resin composition.

(Plate filler)
The composite resin composition in the present invention further contains a plate-like filler. By including a plate-like filler in the composite resin composition in the present invention, a molded product in which warpage deformation is suppressed can be obtained. A plate-shaped filler can be used individually by 1 type or in combination of 2 or more types.

  The plate-like filler is contained in an amount of 12.5 to 36% by mass with respect to the entire composite resin composition. If the content of the plate-like filler is less than 12.5% by mass with respect to the entire composite resin composition, it is not preferable because warpage deformation of a molded product obtained from the composite resin composition is not sufficient. When the content of the plate-like filler is more than 36% by mass with respect to the entire composite resin composition, the fluidity of the composite resin composition is deteriorated and it may be difficult to mold the composite resin composition. Therefore, it is not preferable. The plate-like filler in the present invention is preferably contained in the composite resin composition in an amount of 15 to 34% by mass, and more preferably 17.5 to 32% by mass with respect to the entire composite resin composition.

  Examples of the plate-like filler in the present invention include talc, mica, glass flakes, various metal foils, etc., but the molded product obtained from the composite resin composition without deteriorating the fluidity of the composite resin composition. One or more selected from talc and mica are preferable in that warpage deformation is suppressed, and mica is more preferable. Further, the average particle size of the plate-like filler is not particularly limited, and a smaller one is desirable in consideration of fluidity in the thin portion. On the other hand, in order to reduce warping deformation of a molded article such as a connector obtained from the composite resin composition, it is necessary to maintain a certain size. Specifically, 1-100 micrometers is preferable and 5-50 micrometers is more preferable.

〔talc〕
As the talc that can be used in the present invention, the total content of Fe ₂ O ₃ , Al ₂ O ₃ and CaO is 2.5% by mass or less based on the total solid content of the talc, Fe ₂ O ₃ and Al _It is preferable that the total content of ₂ O ₃ is more than 1.0 mass% and not more than 2.0 mass%, and the content of CaO is less than 0.5 mass%. That is, the talc that can be used in the present invention contains at least one of Fe ₂ O ₃ , Al ₂ O ₃ and CaO in addition to the main components SiO ₂ and MgO, and each component has the above content range. It may be contained.

In the talc, when the total content of Fe ₂ O ₃ , Al ₂ O ₃ and CaO is 2.5% by mass or less, the moldability of the composite resin composition, the connector molded from the composite resin composition, etc. The heat resistance of the molded product is difficult to deteriorate. Therefore, the total content of Fe ₂ O ₃ , Al ₂ O ₃ and CaO is preferably 1.0% by mass or more and 2.0% by mass or less.

Of the talc, talc having a total content of Fe ₂ O ₃ and Al ₂ O ₃ of more than 1.0% by mass is easily available. Further, in the talc, when the total content of Fe ₂ O ₃ and Al ₂ O ₃ is 2.0% by mass or less, the moldability of the composite resin composition, the connector molded from the composite resin composition, and the like The heat resistance of the molded product is difficult to deteriorate. Therefore, the total content of Fe ₂ O ₃ and Al ₂ O ₃ is preferably more than 1.0 mass% and not more than 1.7 mass%.

  Further, in the talc, when the CaO content is less than 0.5% by mass, the molding processability of the composite resin composition and the heat resistance of a molded article such as a connector molded from the composite resin composition are deteriorated. Hateful. Therefore, the content of CaO is preferably 0.01% by mass or more and 0.4% by mass or less.

The mass average or volume-based cumulative average particle diameter (D ₅₀ ) of talc in the present invention measured by laser diffraction method is 4 from the viewpoint of preventing warpage deformation of the molded product and maintaining fluidity of the composite resin composition. It is preferable that it is 0.0-20.0 micrometers, and it is more preferable that it is 10-18 micrometers.

[Mica]
Mica is a pulverized product of silicate mineral containing aluminum, potassium, magnesium, sodium, iron and the like. Examples of mica that can be used in the present invention include muscovite, phlogopite, biotite, and artificial mica. Of these, muscovite is preferable in terms of good hue and low price.

  In addition, in the production of mica, wet pulverization methods and dry pulverization methods are known as methods for pulverizing minerals. The wet pulverization method is a method in which raw mica is roughly pulverized with a dry pulverizer, then water is added and main pulverization is performed by wet pulverization in a slurry state, followed by dehydration and drying. Compared with the wet pulverization method, the dry pulverization method is a general method at a low cost. However, when the wet pulverization method is used, it is easier to pulverize the mineral thinly and finely. In the present invention, it is preferable to use a thin and fine pulverized product because mica having a preferable average particle diameter and thickness described later can be obtained. Therefore, in the present invention, it is preferable to use mica produced by a wet pulverization method.

In addition, since the wet pulverization method requires a step of dispersing the material to be pulverized in water, a coagulating sedimentation agent and / or settling aid is added to the material to be pulverized in order to increase the dispersion efficiency of the material to be pulverized. Is common. Examples of the coagulating sedimentation agent and sedimentation aid that can be used in the present invention include polyaluminum chloride, aluminum sulfate, ferrous sulfate, ferric sulfate, copper chloride, polyiron sulfate, polyferric chloride, iron-silica inorganic high Examples thereof include molecular flocculants, ferric chloride-silica inorganic polymer flocculants, slaked lime (Ca (OH) ₂ ), caustic soda (NaOH), and soda ash (Na ₂ CO ₃ ). These coagulating sedimentation agents and sedimentation aids are alkaline or acidic in pH. The mica used in the present invention is preferably one that does not use a coagulating sedimentation agent and / or a sedimentation aid when wet milling. When mica not treated with a coagulating sedimentation agent and / or sedimentation aid is used, the polymer in the composite resin composition is unlikely to decompose, and a large amount of gas generation or molecular weight reduction is unlikely to occur. It is easy to maintain the performance of a molded product such as the above better.

  The mica that can be used in the present invention preferably has an average particle diameter measured by a microtrack laser diffraction method of 10 to 100 μm, and particularly preferably has an average particle diameter of 20 to 80 μm. It is preferable that the average particle diameter of mica is 10 μm or more because the effect of improving the rigidity of the molded product is likely to be sufficient. It is preferable that the average particle diameter of mica is 100 μm or less because the rigidity of the molded product is likely to be sufficiently improved and the weld strength is likely to be sufficient. Furthermore, when the average particle diameter of mica is 100 μm or less, it is easy to ensure sufficient fluidity for molding the connector of the present invention.

  The thickness of mica that can be used in the present invention is preferably 0.01 to 1 μm, particularly preferably 0.03 to 0.3 μm, as measured by observation with an electron microscope. When the mica thickness is 0.01 μm or more, the mica is difficult to break during the melt processing of the composite resin composition, and therefore, the rigidity of the molded product may be easily improved. It is preferable that the mica thickness is 1 μm or less because the effect of improving the rigidity of the molded product tends to be sufficient.

  The mica that can be used in the present invention may be surface-treated with a silane coupling agent or the like, and / or granulated with a binder.

  In the composite resin composition of the present invention, the total amount of the fibrous filler and the plate-like filler is 17.5 to 37.5 mass% with respect to the entire composite resin composition. When the total amount is less than 17.5% by mass with respect to the entire composite resin composition, a molded article such as a connector obtained from the composite resin composition has a low deflection temperature under load and does not have sufficient high-temperature rigidity. This is not preferable because warpage may increase. If the total amount is more than 37.5% by mass with respect to the entire composite resin composition, the fluidity of the composite resin composition is deteriorated and the warpage deformation of the molded product may be increased. The total amount is preferably 20 to 36% by mass and more preferably 22.5 to 35% by mass with respect to the entire composite resin composition.

(Other ingredients)
In the composite resin composition of the present invention, in addition to the above-mentioned components, pigments such as nucleating agent, carbon black, inorganic calcined pigment, antioxidant, stabilizer, plasticizer, lubricant, mold release agent, flame retardant, and You may mix | blend 1 or more types in a well-known inorganic filler.

  The method for producing the composite resin composition in the present invention is not particularly limited as long as the components in the composite resin composition can be uniformly mixed and the weight average fiber length of the fibrous filler can be 200 μm or less, and is conventionally known. It can select suitably from the manufacturing method of a resin composition. For example, each component is melt-kneaded and extruded using a melt-kneader such as a single-screw or twin-screw extruder, and then the resulting composite resin composition is processed into a desired form such as powder, flakes, pellets, etc. A method is mentioned.

  Since the composite resin composition in the present invention is excellent in fluidity, the minimum filling pressure at the time of molding is hardly excessive, and preferably a connector, particularly a component having a small and complicated shape such as a low profile narrow pitch connector. Can be molded. The degree of fluidity is determined by the minimum filling pressure of the connector. That is, the minimum injection filling pressure that can obtain a good molded product when the FPC connector shown in FIG. 1 is injection-molded is specified as the minimum filling pressure. The lower the minimum filling pressure, the better the fluidity.

The melt viscosity of the composite resin composition measured in accordance with ISO 11443 at a temperature 10 to 20 ° C. higher than the melting point of the liquid crystalline polymer at a shear rate of 1000 / second is more preferably 1 × 10 ⁵ Pa · s or less (more preferably ⁵ Pa S to 1 × 10 ² Pa · s) in order to ensure fluidity of the composite resin composition and to prevent excessive filling pressure when molding a connector, particularly a low profile narrow pitch connector. preferable.

(connector)
The connector of the present invention can be obtained by molding the composite resin composition of the present invention. The connector of the present invention is not particularly limited, and examples thereof include a connector having a total product length of less than 30 mm and a product height of less than 5 mm. The connector having a total product length of less than 30 mm and a product height of less than 5 mm is not particularly limited, and examples thereof include a low profile narrow pitch connector, a coaxial connector, a micro SIM connector, and a micro SD connector. Among these, a low profile narrow pitch connector is preferable. The low-profile narrow-pitch connector is not particularly limited. For example, a board-to-board connector (also known as a “BtoB connector”), a connector for a flexible printed circuit board (a flexible printed circuit board (FPC) and a flexible flat cable (FFC)) For example, and is also known as an “FPC connector”). Among them, a low-profile narrow pitch connector that is a board-to-board connector or a connector for a flexible printed board having a pitch distance of 0.5 mm or less, a total product length of 3.5 mm or more, and a product height of 4.0 mm or less is suitable. is there.

  The molding method for obtaining the connector of the present invention is not particularly limited, and it is preferable to select molding conditions having no residual internal stress in order to prevent deformation or the like of the obtained connector. In order to lower the filling pressure and reduce the residual internal stress of the resulting connector, the cylinder temperature of the molding machine is preferably a temperature equal to or higher than the melting point of the liquid crystalline polymer.

  The mold temperature is preferably 70 to 100 ° C. If the mold temperature is low, the composite resin composition filled in the mold may cause flow failure, which is not preferable. If the mold temperature is high, problems such as the occurrence of burrs may occur, which is not preferable. The injection speed is preferably 150 mm / second or more. If the injection speed is low, there is a possibility that only an unfilled molded product can be obtained. Even if a completely filled molded product is obtained, it becomes a molded product with a high filling pressure and a large residual internal stress, resulting in a poor flatness. May only be obtained.

  In the connector of the present invention, warpage is suppressed. The degree of connector warping is determined as follows. That is, with the FPC connector shown in FIG. 1, the height is measured at a plurality of positions indicated by black circles in FIG. 2, and the difference between the maximum height and the minimum height from the least square plane is taken as a warp. In the connector of the present invention, the change in warpage is suppressed before and after performing the IR reflow.

  Moreover, the blister generation is suppressed in the connector of the present invention. The degree of blistering is determined by the blister temperature. That is, the presence or absence of blisters on the surface of a molded product sandwiched between hot presses at a predetermined temperature for 5 minutes is visually observed, and the highest temperature at which the number of blisters generated becomes zero is defined as the blister temperature. It is evaluated that the higher the blister temperature, the more blister generation is suppressed.

  Moreover, the connector obtained from the composite resin composition in the present invention is excellent in heat resistance, for example, heat resistance as evaluated by high temperature rigidity. The high-temperature rigidity is evaluated by measuring the deflection temperature under load in accordance with ISO75-1,2.

  EXAMPLES Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited thereto.

<Synthesis Example 1>
A polymerization vessel equipped with a stirrer, a reflux column, a monomer inlet, a nitrogen inlet, and a decompression / outflow line was charged with the following raw material monomers, fatty acid metal salt catalyst, and acylating agent, and nitrogen substitution was started.
(I) 4-hydroxybenzoic acid 10.6 mol (64 mol%) (HBA)
(II) 1.9 mol (11.2 mol%) terephthalic acid (TA)
(III) 1.1 mol (6.8 mol%) of isophthalic acid (IA)
(IV) 2.7 mol (16 mol%) of 4,4′-dihydroxybiphenyl (BP)
(V) 0.3 mol (2 mol%) of N-acetyl-p-aminophenol (APAP)
Potassium acetate catalyst 110mg
Acetic anhydride 1715 g (1.03 times the total hydroxyl equivalent of APAP of HBA and BP)
After charging the raw materials, the temperature of the reaction system was raised to 140 ° C. and reacted at 140 ° C. for 1 hour. Thereafter, the temperature is further increased to 360 ° C. over 5.5 hours, and then the pressure is reduced to 10 Torr (ie, 1330 Pa) over 20 minutes to melt while distilling acetic acid, excess acetic anhydride, and other low-boiling components. Polymerization was performed. After the stirring torque reached a predetermined value, nitrogen was introduced and the pressure was changed from a reduced pressure state to a normal pressure, and the polymer was discharged from the lower part of the polymerization vessel.

<Evaluation>
About the wholly aromatic polyester amide of the synthesis example 1, evaluation of melting | fusing point, DTUL, and manufacturability was performed with the following method. The evaluation results are shown in Table 1.

[Melting point]
After observing the endothermic peak temperature (Tm1) observed by DSC (manufactured by TA Instruments) at a temperature rising condition of 20 ° C./min from room temperature, the temperature is 2 at (Tm1 + 40) ° C. After being held for a minute, the sample was once cooled to room temperature under a temperature drop condition of 20 ° C./min, and then the temperature of the endothermic peak observed when measured under a temperature rise condition of 20 ° C./min was measured again.

[DTUL]
60% by mass of polymer and 40% by mass of glass fiber (Central Glass Co., Ltd. EFH75-01, milled fiber, average fiber diameter 11 μm, average fiber length 75 μm) twin screw extruder (TEX30α type, manufactured by Nippon Steel) Was melt kneaded at a cylinder temperature of the melting point of the polymer + 20 ° C. to obtain polyesteramide resin composition pellets.
The polyesteramide resin composition pellets were molded under the following molding conditions using a molding machine (“SE100DU” manufactured by Sumitomo Heavy Industries, Ltd.) to obtain test specimens (4 mm × 10 mm × 80 mm). . Using this test piece, the deflection temperature under load was measured by a method based on ISO75-1,2. Note that 1.8 MPa was used as the bending stress. The results are shown in Table 1.
〔Molding condition〕
Cylinder temperature: Polymer melting point + 20 ° C
Mold temperature: 80 ℃
Back pressure: 2MPa
Injection speed: 33mm / sec

[Manufacturability]
The behavior when the polymer was discharged from the lower part of the polymerization vessel was observed, and the manufacturability was evaluated according to the following criteria. The results are shown in Table 1.
○: The polymer was discharged as a strand without any problem, and when this strand could be cut into a pellet, it was evaluated that the manufacturability was good.
X: Manufacturability was evaluated to be poor when solidification or the like was caused in the container during polymerization and the polymer could not be discharged, or when the polymer could be discharged as a strand but the strand could not be cut.

<Synthesis Examples 2-25, Comparative Synthesis Examples 1-9>
A polymer was obtained in the same manner as in Synthesis Example 1 except that the types of raw material monomers and the charging ratio (mol%) were as shown in Tables 1 to 4. Further, the same evaluation as in Synthesis Example 1 was performed. The evaluation results are shown in Tables 1 to 4.

<Examples 1-5, Comparative Examples 1-5>
In the following Examples and Comparative Examples, the liquid crystalline polymer 1 is the liquid crystalline polymer obtained in Synthesis Example 1. Liquid crystalline polymers 2 and 3 were produced as follows.

  In this example, the melting point and melt viscosity of the pellet were measured under the following conditions.

[Measurement of melting point]
After observing the endothermic peak temperature (Tm1) observed when the liquid crystalline polymer was measured at room temperature from 20 ° C./min with a DSC manufactured by TA Instruments, 2 at a temperature of (Tm1 + 40) ° C. After being held for a minute, the sample was once cooled to room temperature under a temperature drop condition of 20 ° C./min, and then the temperature of the endothermic peak observed when measured under a temperature rise condition of 20 ° C./min was measured again.

[Measurement of melt viscosity]
Using Capillograph Type 1B manufactured by Toyo Seiki Seisakusho Co., Ltd., using an orifice with an inner diameter of 1 mm and a length of 20 mm at a temperature 10 to 20 ° C. higher than the melting point of the liquid crystalline polymer, and a shear rate of 1000 / sec. In conformity, the melt viscosity of the liquid crystalline polymer was measured. The measurement temperatures for liquid crystal polymer 1 were 360 ° C., liquid crystal polymer 2 was 350 ° C., and liquid crystal polymer 3 was 380 ° C.

(Method for producing liquid crystalline polymer 2)
A polymerization vessel equipped with a stirrer, a reflux column, a monomer inlet, a nitrogen inlet, and a pressure reduction / outflow line was charged with the following raw material monomers, a metal catalyst, and an acylating agent, and nitrogen substitution was started.
(I) 4-hydroxybenzoic acid: 1380 g (60 mol%) (HBA)
(II) 6-hydroxy-2-naphthoic acid: 157 g (5 mol%) (HNA)
(III) Terephthalic acid: 484 g (17.5 mol%) (TA)
(IV) 4,4′-dihydroxybiphenyl: 388 g (12.5 mol%) (BP)
(V) 4-acetoxyaminophenol: 17.2 g (5 mol%) (APAP)
Potassium acetate catalyst: 110 mg
Acetic anhydride: 1659g

  After the raw materials were charged into the polymerization vessel, the temperature of the reaction system was raised to 140 ° C. and reacted at 140 ° C. for 1 hour. Thereafter, the temperature is further raised to 340 ° C. over 4.5 hours, and then the pressure is reduced to 10 Torr (ie, 1330 Pa) over 15 minutes, while acetic acid, excess acetic anhydride, and other low-boiling components are distilled off. Melt polymerization was performed. After the stirring torque reached a predetermined value, nitrogen was introduced to change from a reduced pressure state to a normal pressure through a normal pressure, the polymer was discharged from the lower part of the polymerization vessel, and the strand was pelletized to pelletize. The obtained pellet had a melting point of 336 ° C. and a melt viscosity of 19 Pa · s.

(Method for producing liquid crystalline polymer 3)
A polymerization vessel equipped with a stirrer, a reflux column, a monomer inlet, a nitrogen inlet, and a pressure reduction / outflow line was charged with the following raw material monomers, a metal catalyst, and an acylating agent, and nitrogen substitution was started.
(I) 4-hydroxybenzoic acid: 1040 g (48 mol%) (HBA)
(II) 6-hydroxy-2-naphthoic acid: 89 g (3 mol%) (HNA)
(III) Terephthalic acid: 547 g (21 mol%) (TA)
(IV) Isophthalic acid: 91 g (3.5 mol%) (IA)
(V) 4,4′-dihydroxybiphenyl: 716 g (24.5 mol%) (BP)
Potassium acetate catalyst: 110 mg
Acetic anhydride: 1644 g

  After the raw materials were charged into the polymerization vessel, the temperature of the reaction system was raised to 140 ° C. and reacted at 140 ° C. for 1 hour. Thereafter, the temperature is further increased to 360 ° C. over 5.5 hours, and then the pressure is reduced to 5 Torr (ie, 667 Pa) over 20 minutes while distilling acetic acid, excess acetic anhydride, and other low-boiling components. Melt polymerization was performed. After the stirring torque reached a predetermined value, nitrogen was introduced to change from a reduced pressure state to a normal pressure through a normal pressure, the polymer was discharged from the lower part of the polymerization vessel, and the strand was pelletized to pelletize. The obtained pellet had a melting point of 355 ° C. and a melt viscosity of 10 Pa · s.

(Components other than liquid crystalline polymers)
Each liquid crystalline polymer obtained above and the following components were mixed using a twin screw extruder to obtain a composite resin composition. The amount of each component is as shown in Table 5. Hereinafter, “%” in the table represents mass%.
(B) Fiber filler Glass fiber: ECS03T-786H manufactured by Nippon Electric Glass Co., Ltd., fiber diameter 10 μm, chopped strand having a length of 3 mm Milled fiber: PF70E001 manufactured by Nittobo Co., Ltd., fiber diameter 10 μm, average fiber length 70μm (Manufacturer's notarized value)
In addition, said manufacturer's nominal value differs from 100 micrometers in Table 5 which is an actual measurement value in a composition.
(C) Plate-like filler Mica; AB-25S manufactured by Yamaguchi Mica Industry Co., Ltd., average particle size 25 μm

The extrusion conditions for obtaining the composite resin composition are as follows.
[Extrusion conditions]
[Examples 1 to 5 and Comparative Examples 1 to 3]
The temperature of the cylinder provided at the main feed port was 250 ° C., and the temperatures of the other cylinders were all 360 ° C. All liquid crystalline polymers were supplied from the main feed port. The filler was supplied from the side feed port.
[In the case of Comparative Example 4]
The temperature of the cylinder provided at the main feed port was 250 ° C., and the temperature of the other cylinders was all 350 ° C. All liquid crystalline polymers were supplied from the main feed port. The filler was supplied from the side feed port.
[In the case of Comparative Example 5]
The temperature of the cylinder provided at the main feed port was 250 ° C., and the temperatures of the other cylinders were all 370 ° C. All liquid crystalline polymers were supplied from the main feed port. The filler was supplied from the side feed port.

The weight average fiber length of the fibrous filler in the composite resin composition was measured by the following method.
[Measurement of weight average fiber length]
5 g of the composite resin composition pellets were heated and ashed at 600 ° C. for 2 hours. The ashing residue was sufficiently dispersed in a 5% by mass polyethylene glycol aqueous solution, then transferred to a petri dish with a dropper, and the fibrous filler was observed with a microscope. At the same time, the weight average fiber length of the fibrous filler was measured using an image measuring device (LUZEXFS manufactured by Nireco Corporation).

(Measurement of melt viscosity of composite resin composition)
Using Capillograph Type 1B manufactured by Toyo Seiki Seisakusho Co., Ltd., using an orifice with an inner diameter of 1 mm and a length of 20 mm at a temperature 10 to 20 ° C. higher than the melting point of the liquid crystalline polymer, and a shear rate of 1000 / sec. Based on this, the melt viscosity of the composite resin composition was measured and evaluated according to the following criteria. The measurement temperature is 360 ° C. for the composite resin composition using the liquid crystalline polymer 1, 350 ° C. for the composite resin composition using the liquid crystalline polymer 2, and the composite resin composition using the liquid crystalline polymer 3. Was 380 ° C. The results are shown in Table 5.
○ (Good): The melt viscosity was 25 Pa · s or less.
X (Poor): The melt viscosity was more than 25 Pa · s.

  Based on the following method, the physical properties of the connector molded from the composite resin composition were measured. Each evaluation result is shown in Table 5.

(Bending test)
Under the following molding conditions, the composite resin composition was injection-molded to obtain a molded product having a thickness of 0.8 mm. The bending strength, breaking strain, and flexural modulus were measured according to ASTM D790, and evaluated according to the following criteria. .
Bending strength ○ (good): The bending strength was 140 MPa or more.
X (defect): The bending strength was less than 140 MPa.
-Breaking strain ○ (good): The above-mentioned breaking strain was 2.6% or more.
X (Bad): The breaking strain was less than 2.6%.
-Bending elastic modulus (circle) (good): The said bending elastic modulus was 12000 Mpa or more.
X (defect): The bending elastic modulus was less than 12000 MPa.
[Molding condition]
Molding machine: Sumitomo Heavy Industries, SE100DU
Cylinder temperature:
360 ° C. (Examples 1 to 5, Comparative Examples 1 to 4)
380 ° C. (Comparative Example 5)
Mold temperature: 80 ℃
Injection speed: 33mm / sec

(Load deflection temperature)
Under the following molding conditions, the composite resin composition was injection-molded to obtain a molded product, the deflection temperature under load was measured in accordance with ISO75-1, 2, and evaluated according to the following criteria.
○ (Good): The deflection temperature under load was 235 ° C. or higher.
X (Bad): The deflection temperature under load was less than 235 ° C.
[Molding condition]
Molding machine: Sumitomo Heavy Industries, SE100DU
Cylinder temperature:
360 ° C. (Examples 1 to 5, Comparative Examples 1 to 4)
380 ° C. (Comparative Example 5)
Mold temperature: 80 ℃
Injection speed: 33mm / sec

(Blister temperature)
The composite resin composition was injection molded under the following molding conditions to obtain a 12.5 mm × 120 mm × 0.8 mm molded product having a weld portion. A fragment obtained by dividing the molded product into two parts at the weld part was used as one specimen, and was sandwiched in a hot press at a predetermined temperature for 5 minutes. Thereafter, it was visually examined whether blisters were generated on the surface of the specimen. The blister temperature was the maximum temperature at which the number of blisters generated was zero, and was evaluated according to the following criteria.
○ (Good): The blister temperature was 260 ° C. or higher.
X (defect): The blister temperature was less than 260 ° C.
[Molding condition]
Molding machine: Sumitomo Heavy Industries, SE100DU
Cylinder temperature:
360 ° C. (Examples 1 to 5, Comparative Examples 1 to 4)
380 ° C. (Comparative Example 5)
Mold temperature: 90 ℃
Injection speed: 33mm / sec

(Connector sled)
The composite resin composition was injection-molded under the following molding conditions (gate: tunnel gate, gate size: φ0.4 mm), and the overall size as shown in FIG. 1 was 17.6 mm × 4.00 mm × 1.16 mm, An FPC connector having a pitch distance of 0.5 mm, a pin hole number of 30 × 2 pins, and a minimum wall thickness of 0.12 mm was obtained.
[Molding condition]
Molding machine: Sumitomo Heavy Industries, SE30DUZ
Cylinder temperature:
360 ° C. (Examples 1 to 5, Comparative Examples 1 to 4)
380 ° C. (Comparative Example 5)
Mold temperature: 80 ℃
Injection speed: 200mm / sec
Holding pressure: 50 MPa
Holding time: 0.5 seconds Cooling time: 10 seconds Screw rotation speed: 120 rpm
Screw back pressure: 1.2MPa

The obtained connector was placed on a horizontal desk, and the height of the connector was measured with Mitutoyo Quick Vision 404 PROCNC image measuring machine. At that time, the height was measured at a plurality of positions indicated by black circles in FIG. 2, and the difference between the maximum height and the minimum height from the least squares plane was taken as the warp of the FPC connector. The warpage was measured before and after IR reflow performed under the following conditions, and evaluated according to the following criteria.
Before IR reflow ○ (good): The warp was 0.03 mm or less.
X (defect): The warp was more than 0.03 mm.
-After IR reflow O (good): The warp was 0.07 mm or less.
X (defect): The warp was more than 0.07 mm.
[IR reflow conditions]
Measuring machine: RF-300 (using far infrared heater)
Sample feed rate: 140 mm / sec
Reflow furnace passage time: 5 minutes Preheating zone temperature condition: 150 ° C
Reflow zone temperature condition: 190 ° C
Peak temperature: 251 ° C

(Connector deformation amount)
The difference in warpage before and after reflow measured by the above method was determined as the FPC connector deformation amount and evaluated according to the following criteria.
○ (Good): The amount of deformation was 0.04 mm or less.
X (defect): The amount of deformation was more than 0.04 mm.

(Connector minimum filling pressure)
When the FPC connector of FIG. 1 was injection molded, the minimum injection filling pressure at which a good molded product was obtained was measured as the minimum filling pressure, and evaluated according to the following criteria.
○ (Good): The minimum filling pressure was 130 MPa or less.
X (Bad): The minimum filling pressure was more than 130 MPa.

  As shown in Table 5, the composite resin composition in the present invention was excellent in fluidity, and the connector molded from this composite resin composition was excellent in heat resistance, and warpage deformation and blister generation were suppressed.

Claims (6)

A composite resin composition comprising (A) a liquid crystalline polymer, (B) a fibrous filler, and (C) a plate-like filler,
The (A) liquid crystalline polymer is composed of the following structural units (I) to (V) as essential components:
Content of structural unit (I) is 55-68 mol% with respect to all the structural units,
The content of the structural unit (II) is 6 to 16.1 mol% with respect to all the structural units,
Content of structural unit (III) is 6.4-10 mol% with respect to all the structural units,
Content of structural unit (IV) is 9-21.5 mol% with respect to all the structural units,
The content of the structural unit (V) is 1 to 7 mol% with respect to all the structural units,
The total content of the structural units (I) to (V) is 100 mol% with respect to the total structural units, and is a wholly aromatic polyester amide that exhibits optical anisotropy when melted.
The (B) fibrous filler has a weight average fiber length of 200 μm or less,
Said (A) liquid crystalline polymer is 62.5-82.5 mass% with respect to the whole composite resin composition,
The (B) fibrous filler is 1.5 to 15% by mass relative to the entire composite resin composition,
The (C) plate-like filler is 12.5 to 36% by mass with respect to the entire composite resin composition,
The total amount of the (B) fibrous filler and the (C) plate filler is 17.5 to 37.5% by mass with respect to the entire composite resin composition.
Composite resin composition.

  The composite resin composition according to claim 1, wherein the (B) fibrous filler is a milled fiber.   The composite resin composition according to claim 1 or 2, wherein the (C) plate-like filler is at least one selected from the group consisting of talc and mica.   A connector molded from the composite resin composition according to any one of claims 1 to 3, having a total product length of less than 30 mm and a product height of less than 5 mm.   The connector according to claim 4, which is a low profile narrow pitch connector. The distance between pitches is 0.5 mm or less,
Product total length is 3.5mm or more,
The product height is 4.0 mm or less,
The connector according to claim 4 or 5, wherein the connector is a low profile narrow pitch connector which is a board-to-board connector or a flexible printed circuit board connector.

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