JP5485216B2 - Planar connector - Google Patents

Description

  The present invention relates to a planar connector having a lattice structure inside an outer frame such as a CPU socket.

Liquid crystalline polymers are known as materials that are excellent in dimensional accuracy, vibration damping properties, and fluidity among thermoplastic resins, and generate very little burrs during molding. Conventionally, taking advantage of such characteristics, liquid crystal polymers have been widely used as materials for various electronic components.
In particular, due to the recent high performance of electronic equipment, there are also demands of the times of higher heat resistance of connectors (improvement of productivity by mounting technology), higher density (multi-core), and miniaturization. A liquid crystalline polymer composition reinforced with glass fibers has been adopted as a connector by taking advantage of the characteristics (Non-patent Document 1, Patent Document 1). In a planar connector having a lattice structure inside an outer frame typified by a CPU socket, the tendency of high heat resistance, high density and miniaturization is remarkable, and a liquid crystalline polymer composition reinforced with glass fiber is used. Many have been adopted.
However, even with a glass fiber reinforced liquid crystal polymer composition having good fluidity to some extent, the recently required pitch interval of the lattice portion is 2 mm or less, and the width of the resin portion of the lattice portion holding the terminals is 0.5 mm or less. The performance was insufficient for use as a very thin planar connector. That is, in such a planar connector having a very thin grid portion, filling the lattice portion with resin increases the filling pressure due to insufficient fluidity, resulting in the resulting planar connector. There is a problem that the amount of warp deformation increases.
In order to solve this problem, it is conceivable to use a liquid crystalline polymer composition having good fluidity with a small amount of glass fiber added. However, such a composition is insufficient in strength and deforms due to reflow during mounting. The problem arises.
Thus, the present situation is that a planar connector made of a liquid crystalline polymer having an excellent performance balance has not yet been obtained.

Therefore, the present inventors have proposed a planar connector composed of a specific composite resin composition in which the weight average length of the fibrous filler to be blended and the blending amount have a certain relationship in Patent Document 2. According to Patent Document 2, a thin flat connector can be obtained that is excellent in performance such as moldability, flatness, warp deformation, and heat resistance. However, due to factors such as the shape change accompanying the increase in the integration rate in the recent planar connector, especially the increase in the number of connector pins and the further reduction in the width of the lattice portion, there are cases where the above-mentioned Patent Document 2 cannot cope with it. It turned out to be.
Therefore, the present inventors have proposed a planar connector composed of a specific composite resin composition in which a specific liquid crystalline polymer is combined with a plate-like filler and a fibrous filler in Patent Document 3. .

JP-A-9-204951 JP 2005-276758 A JP 2010-3661 A

"All Research Engineering Plastics '92 -'93", pages 182-194, published in 1992

  According to the above-mentioned Patent Document 3, a thin flat connector can be obtained that is excellent in performance such as moldability, flatness, warp deformation, heat resistance, and the like, and the increase in the integration rate in the recent flat connector, etc. Therefore, it is possible to cope with the shape change accompanying the increase in the number of connector pins, particularly the increase in the width of the lattice portion. However, in the technique of Patent Document 3, cracks (cracking) may occur in the lattice portion due to minute changes in manufacturing conditions such as polymer manufacturing variations and molding conditions, and customer satisfaction is obtained in crack resistance. It was not enough.

In view of the above problems, the present inventors are able to obtain stable and good performance with the shape of recent planar connectors, and in particular, made of a liquid crystalline polymer with excellent crack resistance that cracks do not occur in the lattice part after molding. As a result of diligent search and examination to provide a planar connector, (A) a wholly aromatic liquid crystalline polymer having a specific structure is combined with (B) a plate-like inorganic filler and (C) a specific fibrous filler. It has been found that by using a composite resin composition in which an agent is used in combination at a specific ratio, a planar connector having excellent moldability and excellent performance such as flatness, warpage deformation, heat resistance and crack resistance can be obtained. The present invention has been completed.
That is, the present invention comprises (A) structural units represented by the following general formulas (I), (II), (III), (IV) and (V) as essential structural components, The structural unit of (I) is 35 to 75 mol%, the structural unit of (II) is 2 to 8 mol%, the structural unit of (III) is 4.5 to 30.5 mol%, and the structural unit of (IV) is 2 to 8 mol% %, (V) is 12.5 to 32.5 mol%, and (II) + (IV) is 4 to 10 mol%. Total aromatics exhibiting optical anisotropy upon melting It consists of polyester, (B) a plate-like inorganic filler, and (C) glass fiber. The component (B) is 15 to 25% by weight based on the whole composition, and the component (C) is 10 to 25% based on the whole composition. %, And the total of component (B) and component (C) is formed from a composite resin composition of 30 to 40% by weight based on the entire composition,
It has a lattice structure inside the outer frame,
This planar connector is characterized by a structure in which the pitch interval of the lattice part is 1.5 mm or less.

  According to the present invention, it is possible to provide a planar connector with good moldability and excellent performance such as flatness, warpage deformation, heat resistance, and crack resistance.

It is a figure which shows the planar connector shape | molded in the Example, (a) is a top view, (b) is a detail drawing of the A section. The unit of the numerical values in the figure is mm. It is a figure which shows the molded article used for the crack-proof evaluation of a molded article in the Example, (a) is the top view, (b) is a figure which shows the dimension. The unit of the numerical values in the figure is mm.

  Hereinafter, the present invention will be described in detail. First, the (A) wholly aromatic liquid crystalline polymer used in the present invention is composed of the structural units (I) to (V) and embodies the structural units (I) to (V). Various compounds having ordinary ester forming ability are used. Hereinafter, the raw material compounds necessary for forming the wholly aromatic polyester constituting the present invention will be described in detail step by step.

  The structural unit (I) is introduced from 4-hydroxybenzoic acid.

  The structural unit (II) is introduced from 6-hydroxy-2-naphthoic acid.

  The structural unit (III) is introduced from 1,4-phenylenedicarboxylic acid.

  The structural unit (IV) is introduced from 1,3-phenylenedicarboxylic acid.

  The structural unit (V) is introduced from 4,4'-dihydroxybiphenyl.

In the present invention, the structural units (I) to (V) are included, and the structural unit (I) is 35 to 75 mol% (preferably 40 to 65 mol%) and (II) based on the total structural units. The unit is 2 to 8 mol% (preferably 3 to 7 mol%), the structural unit (III) is 4.5 to 30.5 mol% (preferably 13 to 26 mol%), and the structural unit (IV) is 2 to 8 mol% % (Preferably 3 to 7 mol%), the structural unit (V) is 12.5 to 32.5 mol% (preferably 15.5 to 29 mol%), and the structural unit (II) + (IV) is 4 to 10 mol% ( Preferably it is in the range of 5 to 10 mol%.
When the constituent unit of (I) is less than 35 mol% and more than 75 mol%, the melting point becomes remarkably high, and in some cases, the polymer solidifies in the reactor during production, making it impossible to produce a polymer having a desired molecular weight. Therefore, it is not preferable.
If the structural unit of (II) is less than 2 mol%, it is not preferable because cracks are generated in the lattice portion when a planar connector is formed even if the type and blending amount of the filler are taken into consideration. Moreover, since it will become low in the heat resistance of a polymer when it exceeds 8 mol%, it is unpreferable.
When the constituent unit of (III) is less than 4.5 mol% and more than 30.5 mol%, the melting point becomes remarkably high, and in some cases the polymer solidifies in the reactor during production, making it impossible to produce a polymer with a desired molecular weight. Therefore, it is not preferable.
If the structural unit of (IV) is less than 2 mol%, it is not preferable because cracks are generated in the lattice portion when a planar connector is formed even if the type and blending amount of the filler are taken into consideration. Moreover, since it will become low in the heat resistance of a polymer when it exceeds 8 mol%, it is unpreferable.
In addition, when the constituent unit of (V) is less than 12.5 mol% and more than 32.5 mol%, the melting point becomes remarkably high, and in some cases, the polymer is solidified in the reactor at the time of production to produce a polymer having a desired molecular weight. Since it becomes impossible, it is not preferable.
In addition, when the structural unit of (II) + (IV) is less than 4 mol%, the crystallization heat amount of the polymer determined by differential calorimetry indicating the crystallization state of the polymer is 2.5 J / g or more, and the type of filler, Considering the blending amount, it is not preferable because cracks occur in the lattice portion when the planar connector is formed. A preferable value for the amount of crystallization heat is 2.3 J / g or less, and more preferably 2.0 J / g or less. On the other hand, if it exceeds 10 mol%, the heat resistance of the polymer is lowered, which is not preferable.
Note that the heat of crystallization is a differential calorimetry. After observing the endothermic peak temperature (Tm1) observed when the polymer is measured from room temperature to 20 ° C / min, the temperature is maintained at Tm1 + 40 ° C for 2 minutes. Then, the calorific value of the exothermic peak obtained from the peak of the exothermic peak temperature observed when the temperature is measured at 20 ° C./min.

  In addition, in the wholly aromatic liquid crystalline polymer of the present invention, a small amount of other structural units other than the above-mentioned (I) to (V) can be introduced as long as the object of the present invention is not impaired.

  As described above, Japanese Patent Application Laid-Open No. 59-43021 (Patent Document 1) and Japanese Patent Application Laid-Open No. 2-16120 (Patent Document 3) propose liquid crystal polymers having both heat resistance and easy processability. In Examples of Kaihei 2-16120 (Patent Document 3), the structural unit (I) is 64 mol%, (II) is 1 mol%, (III) is 15.5 mol%, and (IV) is 2 mol%. A liquid crystalline polymer comprising 17.5 mol% of (V) has been proposed, and this liquid crystalline polymer is a lattice when a planar connector is molded as a composition having the same filler type and blending amount as the present invention. There is a problem that cracks occur in the part.

  On the other hand, in the present invention, by controlling the amount of the structural units (I) to (V) and the amount of the structural units (II) + (IV) to the above ranges, the moldability is improved, flatness, and warp deformation. Thus, a flat connector excellent in all of the performances such as heat resistance and crack resistance could be obtained.

The wholly aromatic liquid crystalline polymer of the present invention is polymerized using a direct polymerization method or a transesterification method, and a melt polymerization method, a solution polymerization method, a slurry polymerization method, a solid phase polymerization method or the like is used for the polymerization.
In the present invention, at the time of polymerization, an acylating agent for the polymerization monomer or a monomer having terminal activated as an acid chloride derivative can be used. Examples of the acylating agent include acid anhydrides such as acetic anhydride.
Various catalysts can be used for these polymerizations, and typical ones include dialkyl tin oxide, diaryl tin oxide, titanium dioxide, alkoxy titanium silicates, titanium alcoholates, alkali and alkaline earth of carboxylic acids. Metal salts, Lewis acid salts such as BF _{3 and} the like. The amount of catalyst used is generally about 0.001 to 1% by weight, particularly about 0.003 to 0.2% by weight, based on the total weight of the monomers.

  Moreover, when performing solution polymerization or slurry polymerization, as a solvent, liquid paraffin, a high heat resistant synthetic oil, an inert mineral oil, etc. are used.

  The reaction conditions are a reaction temperature of 200 to 380 ° C. and a final ultimate pressure of 0.1 to 760 Torr (that is, 13 to 101,080 Pa). Particularly in the melt reaction, the reaction temperature is 260 to 380 ° C., preferably 300 to 360 ° C., and the final ultimate pressure is 1 to 100 Torr (ie 133 to 13,300 Pa), preferably 1 to 50 Torr (ie 133 to 6,670 Pa).

  In the reaction, all the raw material monomers, the acylating agent and the catalyst can be charged in the same reaction vessel to start the reaction (one-step system), or the hydroxyl groups of the raw material monomers (I), (II) and (V) are acylated. After acylating with an agent, it can also be reacted with the carboxyl groups of (III) and (IV) (two-stage system).

  The melt polymerization is performed after the inside of the reaction system has reached a predetermined temperature, and the pressure reduction is started to a predetermined pressure reduction degree. After the torque of the stirrer reaches a predetermined value, an inert gas is introduced, and the polymer is discharged from the reaction system through a normal pressure from a reduced pressure state to a predetermined pressure state.

  The polymer produced by the above-described polymerization method can be further increased in molecular weight by solid-phase polymerization which is heated at normal pressure or reduced pressure and in an inert gas. Preferred conditions for the solid state polymerization reaction are a reaction temperature of 230 to 350 ° C., preferably 260 to 330 ° C., and a final ultimate pressure of 10 to 760 Torr (ie, 1,330 to 10,080 Pa).

  The liquid crystalline polymer exhibiting optical anisotropy when melted is an indispensable element in the present invention in order to have both thermal stability and easy processability. The wholly aromatic polyesters comprising the structural units (I) to (V) may not form an anisotropic melt phase depending on the constituent components and the sequence distribution in the polymer, but the polymer according to the present invention is melted. Limited to wholly aromatic polyesters that sometimes exhibit optical anisotropy.

  The property of melt anisotropy can be confirmed by a conventional polarization inspection method using an orthogonal polarizer. More specifically, the melting anisotropy can be confirmed by melting a sample placed on a hot stage manufactured by Linkham using an Olympus polarizing microscope and observing it at a magnification of 150 times in a nitrogen atmosphere. The polymer is optically anisotropic and transmits light when inserted between crossed polarizers. If the sample is optically anisotropic, for example, polarized light is transmitted even in a molten stationary liquid state.

  As an index of processability of the present invention, liquid crystallinity and melting point (liquid crystallinity expression temperature) can be considered. Whether or not it exhibits liquid crystallinity is deeply related to the fluidity at the time of melting, and it is essential that the polymer of the present application exhibit liquid crystallinity in a molten state.

  Since a nematic liquid crystalline polymer causes a significant decrease in viscosity at a melting point or higher, generally exhibiting liquid crystallinity at a melting point or higher is an index of workability. The melting point (liquid crystallinity expression temperature) is preferably as high as possible from the viewpoint of heat resistance, but in view of thermal degradation during polymer melt processing, heating capability of the molding machine, etc., it may be 390 ° C. or lower. This is a desirable and desirable standard. In addition, More preferably, it is 380 degrees C or less.

Furthermore, the melt viscosity at a shear rate of 1000 sec ⁻¹ at a temperature 10 to 40 ° C. higher than the melting point is preferably 1 × 10 ⁵ Pa · s or less in order to ensure the fluidity of the lattice part. More preferably, it is 5 Pa · s or more and 1 × 10 ² Pa · s or less. These melt viscosities are generally realized by having liquid crystallinity.

The composite resin composition used in the present invention is composed of (A) wholly aromatic liquid crystalline polymer, (B) plate-like inorganic filler, and (C) glass fiber.
Examples of the (B) plate-like filler used in the present invention include talc, mica, glass flakes, various metal foils, and the like, and preferably one or more selected from talc and mica. In addition, the average particle diameter of the (B) plate-like filler is not particularly limited, but it is desirable to be small in consideration of the fluidity of the thin-walled portion, but in order to reduce warpage deformation, a certain size is maintained. Need to be. Specifically, 1 to 100 μm, desirably 5 to 50 μm is preferable.

The (C) glass fiber used in the present invention preferably has a weight average fiber length of 250 to 800 μm. If the weight average fiber length exceeds 800μm, the fluidity deteriorates and molding is impossible, or even if it can be molded, it will not be an excellent flatness connector, or if the weight average fiber length is less than 250μm, it will be crack resistant. In some cases, the properties are inferior and cracks occur in the lattice portion of the molded product.
Further, the fiber diameter of the (C) glass fiber is not particularly limited, but generally a fiber diameter of about 5 to 15 μm is used.

In addition, the composite resin composition used in the present invention, the component (B) is 15 to 25% by weight with respect to the whole composition, the component (C) is 10 to 25% by weight with respect to the whole composition, and the component (B) And the sum of the components (C) is required to be 30 to 40% by weight (preferably 30 to 35% by weight) based on the entire composition.
When the component (B) is less than 15% by weight, the amount of warpage deformation is increased, which is not preferable. When the component is more than 25% by weight, crack resistance is inferior and cracks occur in the lattice portion of the molded product. When the component (C) is less than 10% by weight or more than 25% by weight, the crack resistance is inferior and cracks occur in the lattice portion of the molded product. Further, if the total of the component (B) and the component (C) is less than 30 parts by weight with respect to the whole composition, the heat resistance is undesirably lowered, and if it exceeds 40 parts by weight, the crack resistance is poor and the lattice part of the molded product is inferior. Cracking is not preferable.

By molding the composite resin composition of the present invention, it is possible to obtain various planar connectors, but conventionally, the industrially practical one has not been provided, the pitch interval of the lattice portion is 1.5 mm or less This is particularly effective for a very thin planar connector in which the width of the resin portion of the lattice portion holding the terminals is 0.5 mm or less and the total height of the product is 5.0 mm or less.
If explaining such a planar connector in more detail, it is a connector as shown in FIG. 1 formed in the embodiment, and comprises an outer frame portion having a thickness of 4.0 mm or less and a lattice portion having a thickness of 4.0 mm or less. The lattice part has a number of pin holes of several hundreds in a product of about 40 mm × 40 mm × 1 mm. As shown in FIG. 1, injection molding is extremely difficult, with the pitch interval of the lattice portions being 1.5 mm or less and the width of the resin portion holding the terminals being 0.5 mm or less. The planar connector referred to in the present invention includes one having an opening of an appropriate size in the lattice portion.

By using the composite resin composition of the present invention, as shown in FIG. 1, the pitch interval of the lattice portion is 1.5 mm or less (1.2 mm), and the width of the resin portion of the lattice portion holding the terminals is 0.5 mm or less (0.18). mm), a flat connector having a very thin resin portion in the lattice portion can be molded with good moldability, and its flatness is also excellent.
If this flatness is defined numerically, the flatness before the IR reflow process for surface mounting at a peak temperature of 230 to 280 ° C. is 0.05 mm or less, and the difference in flatness before and after reflow is 0.10. It can be said that what is mm or less has excellent flatness in practical use.

  A molding method for obtaining a connector having such excellent flatness is not particularly limited, but an economical injection molding method is preferably used. In order to obtain a connector having such excellent flatness by injection molding, it is important to use the liquid crystalline polymer composition, but it is preferable to select molding conditions without residual internal stress. In order to lower the filling pressure and reduce the residual internal stress of the resulting connector, the cylinder temperature of the molding machine is preferably a temperature above the melting point T ° C. of the liquid crystalline polymer. In order to cause problems such as nasal sagging from the cylinder nozzle, the cylinder temperature is T ° C to (T + 30) ° C, preferably T ° C to (T + 15) ° C. The mold temperature is preferably 70 to 100 ° C. When the mold temperature is low, the filled resin composition is unfavorably caused by flow failure, and when the mold temperature is too high, problems such as generation of burrs are not preferable. The injection speed is preferably 150 mm / sec or more. If the injection speed is low, only unfilled molded products can be obtained, or even if a completely filled molded product is obtained, the molded product has a high filling pressure and a large residual internal stress, and only a connector with poor flatness can be obtained. It may not be possible.

  In addition, additives such as nucleating agents, carbon black, pigments such as inorganic fired pigments, antioxidants, stabilizers, plasticizers, lubricants, mold release agents, flame retardants, and the like are added to the composite resin composition. The composition imparted with the above characteristics is also included in the range of the composite resin composition referred to in the present invention.

EXAMPLES Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited thereto. In addition, the measurement and test of the physical property in an Example were performed with the following method.
(1) Apparent melt viscosity L = 20mm, d = 1mm Co., Ltd. Capillograph Type 1B manufactured by Toyo Seiki Co., Ltd., at a temperature 10 to 20 ° C. higher than the melting point, at a shear rate of 1000 / s, according to ISO 11443, The apparent melt viscosity was measured.
(2) Measurement of connector flatness A flat connector (pin) with an overall size of 39.82mm x 41.82mm x 1mmt and a lattice pitch interval of 1.2mm as shown in Fig. 1 from the resin composition pellets under the following molding conditions. 750 pins) was injection molded.
The gate was a film gate from a long side (side of 41.82 mm), and the gate thickness was 0.3 mm.
The obtained connector was allowed to stand on a horizontal desk, and the height of the connector was measured with Mitutoyo Quick Vision 404PROCNC image measuring machine. At that time, 0.5 mm positions were measured at 10 mm intervals from the connector end face, and the difference between the maximum height and the minimum height was defined as flatness.
Furthermore, IR reflow was performed under the following conditions, and the flatness was measured by the above-described method to determine the difference in flatness before and after reflow.
[IR reflow conditions]
Measuring machine: RF-300 (using far-infrared heater)
Sample feed rate: 140mm / sec
Reflow furnace transit time: 5 min
Temperature conditions Preheat zone: 150 ° C, reflow zone: 225 ° C, peak temperature: 287 ° C
[Molding condition]
Molding machine; Sumitomo Heavy Industries SE30DUZ
Cylinder temperature;
(Nozzle) 360 ° C-365 ° C-340 ° C-330 ° C (Examples 1-6, Comparative Example 8)
370 ° C-370 ° C-370 ° C-380 ° C (Comparative Examples 1-2)
350 ° C-350 ° C-340 ° C-330 ° C (Comparative Examples 3-7)
Mold temperature: 80 ℃
Injection speed: 300mm / sec
Holding pressure: 50MPa
Holding pressure time: 2 sec
Cooling time: 10 sec
Screw rotation speed: 120rpm
Screw back pressure: 1.2MPa

(3) Melting point of liquid crystalline polymer
After observing the endothermic peak temperature (Tm1) observed when the polymer was measured at room temperature from 20 ° C / min on a Perkin Elmer DSC, it was held for 2 minutes at a temperature of (Tm1 + 40) ° C. The sample was once cooled to room temperature under a temperature drop condition of 20 ° C./min, and then the temperature of an endothermic peak observed when measured under a temperature rise condition of 20 ° C./min was measured again.
(4) Minimum Filling Pressure The minimum filling pressure at which a good molded product can be obtained when the planar connector of FIG.

(5) Deflection temperature under load Each liquid crystalline polymer composition containing a plate-like filler and glass fiber was injection molded under the following molding conditions, and measured according to ISO 75-1 and 2.
[Molding condition]
Molding machine: Sumitomo Heavy Industries SE100DU
Cylinder temperature;
(Nozzle) 360 ° C-370 ° C-370 ° C-360 ° C-340 ° C-330 ° C (Examples 1-6, Comparative Example 8)
370 ° C-370 ° C-370 ° C-370 ° C-370 ° C-380 ° C (Comparative Examples 1-2)
350 ° C-350 ° C-350 ° C-350 ° C-340 ° C-330 ° C (Comparative Examples 3-7)
Mold temperature: 80 ℃
Injection speed: 2m / min
Holding pressure: 50MPa
Holding pressure time: 2 sec
Cooling time: 10 sec
Screw rotation speed: 120rpm
Screw back pressure: 1.2MPa

(6) Crack resistance Each of the liquid crystalline polymer compositions containing a plate-like filler and glass fibers was injection molded under the following molding conditions using an injection molding machine. The evaluation injection-molded product shown in FIG. 2 has an outer diameter of 23.6 mm, 31 holes of φ3.2 mm inside, and a minimum wall thickness of 0.16 mm. A three-point gate indicated by an arrow in FIG.
Observe the molded product after injection molding, where the injection speed is 50 mm / sec and 150 mm / sec, the molded product will not crack ◎, and when the injection speed is 150 mm / sec, the molded product will not crack ○: In all cases, when the molded product was cracked, it was marked as x.
[Molding condition]
Molding machine; Sumitomo Heavy Industries SE30DUZ
Cylinder temperature;
(Nozzle) 370 ° C-375 ° C-360 ° C-350 ° C (Examples 1-6, Comparative Example 8)
360 ° C-360 ° C-360 ° C-370 ° C (Comparative Examples 1-2)
350 ° C-350 ° C-340 ° C-330 ° C (Comparative Examples 3-7)
Mold temperature: 140 ℃
Injection speed: 50mm / sec or 150mm / sec
Holding pressure: 100MPa
Holding pressure time: 2 sec
Cooling time: 10 sec
Screw rotation speed: 120rpm
Screw back pressure: 1.2MPa

Examples 1-6 and Comparative Examples 1-8
When the said test piece of the liquid crystalline polymer composition containing a plate-shaped filler and glass fiber was produced and evaluated on condition of the following, the result shown in Table 1 was obtained.

(Used ingredients)
Liquid crystalline polymer 1
[Production conditions]
A polymerization vessel equipped with a stirrer, a reflux column, a monomer inlet, a nitrogen inlet, and a pressure reduction / outflow line was charged with the following raw material monomer, metal catalyst, and acylating agent, and nitrogen substitution was started.
(I) 2-hydroxy-6-naphthoic acid 166 g (48 mol%) (HNA)
(II) 76 g (25 mol%) terephthalic acid (TA)
(III) 4,4′-dihydroxybiphenyl 86 g (25 mol%) (BP)
(IV) 4-hydroxybenzoic acid 5 g (2 mol%) (HBA)
Potassium acetate catalyst 22.5mg
Acetic anhydride 191 g
After charging the raw materials, the temperature of the reaction system was raised to 140 ° C. and reacted at 140 ° C. for 1 hour. Thereafter, the temperature is further raised to 360 ° C. over 5.5 hours, and then the pressure is reduced to 5 Torr (ie, 667 Pa) over 30 minutes to melt polymerize while distilling acetic acid, excess acetic anhydride, and other low-boiling components. Went. After the stirring torque reached a predetermined value, nitrogen was introduced to change from a reduced pressure state to a normal pressure through a normal pressure, the polymer was discharged from the lower part of the polymerization vessel, and the strand was pelletized to pelletize.
The obtained pellets were heat-treated at 300 ° C. for 8 hours under a nitrogen stream. The pellet had a melting point of 349 ° C., a heat of crystallization of 5.6 J / g, and a melt viscosity of 23 Pa · s.

Liquid crystal polymer 2
[Production conditions]
A polymerization vessel equipped with a stirrer, a reflux column, a monomer inlet, a nitrogen inlet, and a pressure reduction / outflow line was charged with the following raw material monomer, metal catalyst, and acylating agent, and nitrogen substitution was started.
(I) 4-hydroxybenzoic acid: 188.4 g (60 mol%) (HBA)
(II) 6-hydroxy-2-naphthoic acid: 21.4 g (5 mol%) (HNA)
(III) Terephthalic acid: 66.8 g (17.7 mol%) (TA)
(IV) 4,4′-Dihydroxybiphenyl: 52.2 g (12.3 mol%) (BP)
(V) 4-acetoxyaminophenol 17.2 g (5 mol%) (APAP)
Potassium acetate catalyst 15mg
Acetic anhydride 226.2 g
After charging the raw materials, the temperature of the reaction system was raised to 140 ° C. and reacted at 140 ° C. for 1 hour. Thereafter, the temperature is further raised to 340 ° C. over 4.5 hours, and then the pressure is reduced to 10 Torr (ie, 667 Pa) over 15 minutes, and melt polymerization is performed while distilling off acetic acid, excess acetic anhydride, and other low-boiling components. Went. After the stirring torque reached a predetermined value, nitrogen was introduced to change from a reduced pressure state to a normal pressure through a normal pressure, the polymer was discharged from the lower part of the polymerization vessel, and the strand was pelletized to pelletize.
The melting point of the liquid crystal polymer 2 was 334 ° C., the heat of crystallization was 2.7 J / g, and the melt viscosity was 18 Pa · s.

Liquid crystal polymer 3
[Production conditions]
A polymerization vessel equipped with a stirrer, a reflux column, a monomer inlet, a nitrogen inlet, and a pressure reduction / outflow line was charged with the following raw material monomer, metal catalyst, and acylating agent, and nitrogen substitution was started.
(I) 1041 g (48 mol%) of 4-hydroxybenzoic acid (HBA)
(II) 6-hydroxy-2-naphthoic acid 89 g (3 mol%) (HNA)
(III) Terephthalic acid 565g (21.7 mol%) (TA)
(IV) Isophthalic acid 78 g (3 mol%) (IA)
(V) 711 g (24.3 mol%) of 4,4′-dihydroxybiphenyl (BP)
110 mg potassium acetate catalyst
Acetic anhydride 1645g
After charging the raw materials, the temperature of the reaction system was raised to 140 ° C. and reacted at 140 ° C. for 1 hour. Thereafter, the temperature is further raised to 360 ° C. over 5.5 hours, and then the pressure is reduced to 10 Torr (ie, 1330 Pa) over 20 minutes, and melt polymerization is performed while distilling off acetic acid, excess acetic anhydride, and other low-boiling components. went. After the stirring torque reached a predetermined value, nitrogen was introduced to change from a reduced pressure state to a normal pressure through a normal pressure, the polymer was discharged from the lower part of the polymerization vessel, and the strand was pelletized to pelletize.
The obtained polymer had a melting point of 358 ° C., a heat of crystallization of 1.6 J / g, and a melt viscosity of 9 Pa · s.

(B) Plate-like filler, mica; AB-25S manufactured by Yamaguchi Mica Industry Co., Ltd., average particle size 25 μm
・ Talc: Crown Talc PP manufactured by Matsumura Sangyo Co., Ltd., average particle size 10μm
(C) Glass fiber / glass fiber: ECS03T-786H manufactured by Nippon Electric Glass Co., Ltd., fiber diameter 10 μm, chopped strand milled fiber with a length of 3 mm; PF70E001 manufactured by Nittobo Co., Ltd. (fiber diameter 10 μm, fiber length 70 μm) )

Claims (2)

(A) Consists of structural units represented by the following general formulas (I), (II), (III), (IV) and (V) as essential constituents, and the constituent of (I) with respect to all structural units 35 to 75 mol% of units, 2 to 8 mol% of structural units of (II), 4.5 to 30.5 mol% of structural units of (III), 2 to 8 mol% of structural units of (IV), (V) A wholly aromatic polyester exhibiting optical anisotropy when melted, wherein the structural unit is 12.5-32.5 mol% and the structural unit (II) + (IV) is 4-10 mol%, (B) It consists of a plate-like inorganic filler and (C) glass fiber, the component (B) is 15 to 25% by weight with respect to the whole composition, the component (C) is 10 to 25% by weight with respect to the whole composition, and (B ) Component and (C) component is formed from a composite resin composition that is 30 to 40% by weight based on the total composition,
It has a lattice structure inside the outer frame,
A flat connector characterized by a structure with a pitch interval of 1.5mm or less in the lattice section.

The planar connector according to claim 1, wherein the (B) plate-like inorganic filler is at least one selected from talc and mica.

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