KR101399743B1 - Planar connector - Google Patents

Abstract

The present invention provides a planar connector made of a liquid crystalline polymer excellent in crack resistance that cracks do not occur in a lattice portion after molding. (I) which is introduced from 4-hydroxybenzoic acid (A), a constituent unit (II) which is introduced from 6-hydroxy-2-naphthoic acid, ), A constituent unit (IV) introduced from 1,3-phenylene dicarboxylic acid, and a constituent unit (V) introduced from 4,4'-dihydroxybiphenyl, and the optical anisotropy (B) an inorganic filler (B) and (C) a glass fiber, wherein the component (B) is present in an amount of 15 to 25% by weight based on the total weight of the composition, Wherein the total amount of the component (B) and the component (C) is in the range of 30 to 40% by weight with respect to the entire composition, and has a lattice structure in the inside of the outer frame, A planar connector characterized by a spacing of 1.5 mm or less.

Description

[0001] PLANAR CONNECTOR [0002]

The present invention relates to a planar connector having a lattice structure inside an outer frame such as a CPU socket or the like.

The liquid crystalline polymer is known as a material which is excellent in dimensional accuracy, vibration damping property and fluidity among thermoplastic resins and has a very low occurrence of burrs at the time of molding. Taking advantage of these features, a liquid crystalline polymer has been widely employed as a material for various electronic components.

Particularly, there is a demand for an era of high internal resistance (productivity improvement by mounting technology), high density (multi-core), and miniaturization of connectors in recent years due to high performance of electronic devices. And a liquid crystal polymer composition reinforced with glass fiber has been employed as a connector (" Preliminary Engineering Plastics' 92-'93 ", pp. 182-194, published in 1992, and JP-A-9-204951). In a planar connector having a lattice structure inside the outer frame typified by a CPU socket, the tendency of the intrinsic deterioration, high density and miniaturization is remarkable, and a liquid crystal polymer composition reinforced with glass fiber is widely used.

However, even in a glass fiber-reinforced liquid crystal polymer composition having good fluidity to some extent, a very thin plane-like connector in which a pitch interval of a lattice portion which is recently required is 2 mm or less and a width of a resin portion of a lattice portion holding a terminal is 0.5 mm or less Performance was inadequate to use. That is, in the case of such a planar connector in which the width of the lattice portion is extremely thin, there is a problem in that when the resin is filled in the lattice portion, the fluidity is not sufficient and the filling pressure becomes high and the resulting bending amount of the flat- have.

In order to solve this problem, it is considered to use a liquid crystalline polymer composition having a good flowability with a small amount of glass fiber added. However, such a composition is insufficient in strength and deformed due to reflow at the time of mounting.

As described above, a planar connector made of a liquid crystalline polymer having excellent performance balance has not yet been obtained.

Thus, the present inventors have proposed a planar connector comprising a specific composite resin composition in which the weight average length and the blending amount of the fibrous filler to be blended are constant in the Japanese Patent Laid-Open Publication No. 2005-276758. According to Japanese Patent Application Laid-Open No. 2005-276758, even thinned planar connectors are excellent in performances such as moldability, planarity (degree), flexural deformation, and heat resistance. However, due to factors such as the recent shape change accompanying the increase in the integration ratio in the planar connector, in particular the increase in the number of the connector pins and the further thinning of the width of the lattice portion, the above-mentioned Japanese Patent Application Laid-Open No. 2005-276758 It is found that there is no case.

Therefore, the present inventors further proposed a planar connector comprising a specific composite resin composition in which a plate-like filler and a fibrous filler are blended together with a specific liquid crystalline polymer in JP-A-2010-3661.

Japanese Patent Application Laid-Open No. 2005-276758 Japanese Patent Application Laid-Open No. 2010-3661

According to the above-mentioned Japanese Patent Application Laid-Open No. 2010-3661, even a thin planar connector is excellent in performances such as moldability, planarity, flexural deformation, and heat resistance, and the integration ratio It is possible to cope with a change in shape accompanied by an increase in the number of connector pins, an increase in the number of connector pins, and an additional reduction in the width of the lattice portion. However, in the technique disclosed in Japanese Patent Application Laid-Open No. 2010-3661, cracks (cracks) after molding are generated in the lattice portions due to a change in fine manufacturing conditions such as manufacturing variations and molding conditions of the polymer, It was not enough to gain customer satisfaction in sex.

SUMMARY OF THE INVENTION In view of the above problems, the present inventors have made intensive studies to provide a planar connector made of a liquid crystalline polymer which is excellent in the resistance to cracking, in particular, (B) an inorganic filler in a plate form and (C) a specific fibrous filler in a specific ratio in combination with (A) a total aromatic liquid-crystalline polymer having a specific structure The present inventors have found that a planar phase connector having excellent moldability and excellent performance such as flatness, flexural deformation, heat resistance and crack resistance is obtained, and the present invention has been accomplished.

(I), (II), (III), (IV) and (V) as essential constituent components, (III) is from 4.5 to 30.5 mol%, (IV) is from 2 to 8 mol%, and the constituent unit of (II) is from 35 to 75 mol%, the constituent unit of II is from 2 to 8 mol% (B) a linear polyester having an optical anisotropy at the time of melting, characterized in that the constituent units of the vinyl monomer (V) are from 12.5 to 32.5 mol% and the constituent units of (II) + (IV) (B) is contained in an amount of 15 to 25% by weight, the component (C) is contained in an amount of 10 to 25% by weight, the component (B) C) is 30 to 40% by weight based on the total weight of the composition. The composite resin composition has a lattice structure inside the outer frame, and the pitch interval of the lattice portions is 1.5 mm or less Lt; / RTI > is a planar connector characterized by its structure.

According to the present invention, it is possible to provide a planar-type connector which is excellent in both formability and flatness, bending deformation, heat resistance, crack resistance, and the like.

Fig. 1 is a view showing a planar connector molded in the embodiment. Fig. 1 (a) is a plan view and Fig. 1 (b) is a detailed view of part A. On the other hand, the unit of numerical value in the figure is mm.
Fig. 2 is a view showing a molded article used for evaluating crack resistance of a molded article in the embodiment, wherein Fig. 2 (a) is a plan view thereof, and Fig. 2 (b) is a view showing its dimensions. On the other hand, the unit of numerical value in the figure is mm.

Hereinafter, the present invention will be described in detail. First, the wholly aromatic liquid crystalline polymer (A) used in the present invention is composed of constitutional units (I) to (V). In order to realize the constitutional units of (I) to (V) ≪ / RTI > are used. Hereinafter, raw material compounds necessary for forming the wholly aromatic polyester constituting the present invention will be described in detail in order.

The constituent unit (I) is introduced from 4-hydroxybenzoic acid.

The constituent unit (II) is introduced from 6-hydroxy-2-naphthoic acid.

The constituent unit (III) is introduced from 1,4-phenylene dicarboxylic acid.

The constituent unit (IV) is introduced from 1,3-phenylene dicarboxylic acid.

Further, the constituent unit (V) is introduced from 4,4'-dihydroxybiphenyl.

In the present invention, the content of the structural units (I) to (V) is preferably 35 to 75 mol% (preferably 40 to 65 mol%) and the content of the structural unit (I) (Preferably 3 to 7 mol%), the constituent unit of (III) is 4.5 to 30.5 mol% (preferably 13 to 26 mol%), the constituent unit of (IV) is 2 (II) + (IV) is 4 to 8 mol% (preferably 3 to 7 mol%), the constituent unit of (V) is 12.5 to 32.5 mol% To 10 mol% (preferably 5 to 10 mol%).

When the content of the structural unit (I) is less than 35 mol% or more than 75 mol%, the melting point becomes remarkably high, and in some cases, the polymer solidifies in the reactor during production, It is not desirable.

(II) is less than 2 mol%, cracks are generated in the lattice portions when the planar connector is molded even when considering the kind and amount of the filler, which is not preferable. If it is more than 8 mol%, the heat resistance of the polymer is lowered, which is not preferable.

(III) is less than 4.5 mol% or more than 30.5 mol%, the melting point becomes remarkably high, and in some cases, the polymer solidifies in the reactor during production and the polymer of the desired molecular weight can not be produced It is not desirable.

When the content of the constituent unit (IV) is less than 2 mol%, cracks are generated in the lattice portions when the connector is formed on the plane even in consideration of the kind and amount of the filler. If it is more than 8 mol%, the heat resistance of the polymer is lowered, which is not preferable.

If the constituent unit of (V) is less than 12.5 mol% or more than 32.5 mol%, the melting point becomes remarkably high, and in some cases, the polymer solidifies in the reactor during production, It is undesirable because it is built.

When the content of the constituent unit of (II) + (IV) is less than 4 mol%, the crystallization heat of the polymer obtained by the differential thermal calorimetric measurement indicating the crystallization state of the polymer is 2.5 J / g or more, It is not preferable because cracks are generated in the lattice portions when the planar connector is molded. The preferred value of the crystallization heat quantity is 2.3 J / g or less, more preferably 2.0 J / g or less. If it is more than 10 mol%, the heat resistance of the polymer is lowered, which is not preferable.

On the other hand, the heat of crystallization is obtained by observing the endothermic peak temperature (Tm1) observed when the polymer is measured from the room temperature under a temperature elevation condition of 20 deg. C / min in the differential calorimetric measurement and then maintaining it at a temperature of Tm1 + 40 deg. C for 2 minutes Quot; refers to the calorific value of the exothermic peak, which is obtained from the peak of the exothermic peak temperature observed when measured at a temperature of 20 DEG C / min.

On the other hand, in the wholly aromatic liquid-crystalline polymer of the present invention, a small amount of other known constituent units other than the above-mentioned (I) to (V) may be introduced in the range not hindering the object of the present invention.

JP-A-59-43021 and JP-A-2-16120 propose liquid crystal polymers having heat resistance and ease of processing. In the examples of JP-A-2-16120, There has been proposed a liquid crystal polymer comprising 64 mol% of (I), 1 mol% of (II), 15.5 mol% of (III), 2 mol% of (IV) and 17.5 mol% of (V) There is a problem that cracks are generated in the lattice portions when the planar connector is molded even when the composition of the kind and the amount of the filler such as the invention is molded.

On the other hand, in the present invention, by regulating the amount of the constituent unit (I) to (V) and the amount of the constituent unit (II) + (IV) within the above range, Cracks and the like, which are excellent in both of the properties.

The wholly aromatic liquid crystalline polymer of the present invention is polymerized by a direct polymerization method or an ester exchange method, and in polymerization, a melt polymerization method, a solution polymerization method, a slurry polymerization method, a solid phase polymerization method and the like are used.

In the present invention, at the time of polymerization, an acylating agent corresponding to the polymerized monomer or a monomer activated at the terminal thereof as the acid chloride derivative can be used. Examples of the acylating agent include acid anhydrides such as acetic anhydride.

In the polymerization, various catalysts can be used. Typical examples thereof include dialkyltin oxide, diaryl tin oxide, titanium dioxide, alkoxy titanium silicates, titanium alcoholates, alkali and alkaline earth metal salts of carboxylic acid, And Lewis acid salts such as BF ₃ . The amount of the catalyst to be used is generally about 0.001 to 1% by weight, particularly about 0.003 to 0.2% by weight, based on the total weight of the monomers.

When the solution polymerization or the slurry polymerization is carried out, liquid paraffin, high heat-resistant synthetic oil, inert mineral oil and the like are used as the solvent.

The reaction conditions include a reaction temperature of 200 to 380 DEG C and a final pressure of 0.1 to 760 Torr (i.e., 13 to 101,080 Pa). Particularly, in the melting reaction, the reaction temperature is in the range of 260 to 380 DEG C, preferably 300 to 360 DEG C, and the final pressure is 1 to 100 Torr (i.e., 133 to 13,300 Pa), preferably 1 to 50 Torr (i.e., 133 to 6,670 Pa) to be.

The reaction can be started by introducing the entire raw material monomer, the acylating agent and the catalyst into the same reaction vessel to initiate the reaction (one-stage system), and the hydroxyl groups of the raw material monomers (I), (II) Followed by reaction with the carboxyl groups of (III) and (IV) (two-stage mode).

After the reaction system reaches a predetermined temperature, the melt polymerization is started at a predetermined reduced pressure by starting decompression. After the torque of the stirrer reaches a predetermined value, an inert gas is introduced and the polymer is discharged from the reaction system by changing the pressure from a reduced pressure state to a predetermined pressure state via atmospheric pressure.

The polymer produced by the above polymerization method can further increase the molecular weight by solid-state polymerization in which heating is carried out at atmospheric pressure or reduced pressure or an inert gas. Preferable conditions for the solid phase polymerization reaction are a reaction temperature of 230 to 350 DEG C, preferably 260 to 330 DEG C, and a final pressure of 10 to 760 Torr (i.e., 1,330 to 101,080 Pa).

The liquid crystalline polymer exhibiting optical anisotropy at the time of melting is an indispensable element to have both thermal stability and ease of processing in the present invention. The wholly aromatic polyester composed of the constituent units (I) to (V) may not form an anisotropic molten phase depending on the constituent components and the sequence distribution in the polymer. However, Is defined as a wholly aromatic polyester exhibiting anisotropy.

The properties of the melt anisotropy can be confirmed by a conventional polarization inspection method using an orthogonal polarizer. More specifically, the confirmation of the melt anisotropy can be carried out by melting a sample placed on a hot stage made by LINCAMAS, using a polarizing microscope manufactured by Olympus, and observing the sample at a magnification of 150 times under a nitrogen atmosphere. The polymer is optically anisotropic and transmits light when inserted between orthogonal polarizers. If the sample is optically anisotropic, for example, the polarization is transmitted even in the state of the molten stop solution.

As an index of workability of the present invention, liquid crystal property and melting point (liquid crystal property temperature) are conceivable. Whether or not the polymer exhibits liquid crystallinity is deeply related to the fluidity at the time of melting, and it is indispensable that the polymer of the present invention exhibits liquid crystallinity in a molten state.

Since a nematic liquid crystalline polymer exhibits a markedly lowered viscosity at or above its melting point, it exhibits liquid crystallinity at a melting point or higher in general, which is an index of workability. The melting point (liquid crystallization temperature) is preferably as high as possible from the viewpoint of heat resistance, but it is preferable that the temperature is 390 占 폚 or less in consideration of heat deterioration during melt processing of the polymer and heating ability of the molding machine. On the other hand, it is more preferably 380 DEG C or less.

The melt viscosity at a shear rate of 1,000 sec ^-1 at a temperature higher than the melting point by 10 to 40 ° C is preferably 1 × 10 ⁵ Pa · s or less to ensure fluidity of the lattice portion. More preferably ⁵ Pa · s or more and 1 × 10 ² Pa · s or less. These melt viscosities are generally realized by having liquid crystallinity.

The composite resin composition used in the present invention is composed of (A) a wholly aromatic liquid-crystalline polymer, (B) a plate-like inorganic filler, and (C) glass fiber.

As the plate filler (B) used in the present invention, talc, mica, glass flake, various metal foils and the like can be mentioned, but it is preferable to use at least one selected from talc and mica. The average particle diameter of the filler (B) is not particularly limited, but it is preferable that the average particle size of the filler (B) is small considering the fluidity of the thin wall portion. However, in order to reduce the bending deformation, it is necessary to maintain a constant size. Specifically, it is preferably 1 to 100 탆, and more preferably 5 to 50 탆.

The glass fiber (C) used in the present invention preferably has a weight-average fiber length of 250 to 800 탆. If the weight average fiber length is more than 800 μm, the connector can not be formed as a result of deterioration of fluidity, or even if it can be molded, and if it has a weight average fiber length of less than 250 μm, There may be a case where a crack is generated in the lattice portion of the substrate.

The fiber diameter of the glass fiber (C) is not particularly limited, but generally about 5 to 15 탆 is used.

The composite resin composition for use in the present invention preferably contains 15 to 25% by weight of component (B), 10 to 25% by weight of component (C) ) Is required to be 30 to 40 wt% (preferably 30 to 35 wt%) with respect to the entire composition.

If the amount of the component (B) is less than 15% by weight, the amount of warpage increases, which is undesirable. If the amount of the component (B) is more than 25% by weight, cracking resistance is deteriorated and cracks are generated in the lattice portion of the molded article. If the amount of the component (C) is less than 10% by weight or more than 25% by weight, the crack resistance will be inferior and cracks will occur in the lattice portion of the molded article. If the total amount of the component (B) and the component (C) is less than 30 parts by weight based on the total composition, the heat resistance tends to deteriorate, and if it exceeds 40 parts by weight, crack resistance is lowered, It is not desirable.

Various types of planar connectors can be obtained by molding the composite resin composition of the present invention. However, conventionally, there is no industrially practicable one, and the pitch interval of the lattice portions is 1.5 mm or less, The width of the portion is 0.5 mm or less, and the height of the entire product is 5.0 mm or less.

The planar connector will be described in more detail. A connector as shown in Fig. 1 formed in the embodiment is composed of an outer base portion having a thickness of 4.0 mm or less and a lattice portion having a thickness of 4.0 mm or less. The lattice portion is 40 mm x 40 mm x It has several hundreds of pin holes in a product of about 1 mm. As shown in Fig. 1, the pitch interval of the lattice portions is 1.5 mm or less, and the width of the resin portion for holding the terminals is 0.5 mm or less. On the other hand, the planar connector according to the present invention includes an opening portion having an appropriate size in the lattice portion.

By using the composite resin composition of the present invention, as shown in Fig. 1, the pitch interval of the lattice portion is 1.5 mm or less (1.2 mm), and the width of the resin portion of the lattice portion holding the terminal is 0.5 mm or less (0.18 mm) It is possible to form the planar connector with a very thin thickness of the resin portion of the lattice portion in a good formability, and the flatness thereof is also excellent.

Numerically, this plan view is numerically defined so that the plan view before passing through the IR reflow process for surface mounting at a peak temperature of 230 to 280 캜 is 0.05 mm or less and the difference in plan view before and after reflow is 0.10 mm or less, It can be said to have an excellent flatness.

A molding method for obtaining a connector having such excellent flatness is not particularly limited, but an economical injection molding method is preferably used. In order to obtain a connector having such an excellent flatness in injection molding, it is important to use the above liquid crystalline polymer composition, but it is preferable to select molding conditions without residual internal stress. The cylinder temperature of the molding machine is preferably at a temperature not lower than the melting point T ° C of the liquid crystalline polymer and the cylinder temperature is too high to lower the charging pressure and the residual internal stress of the resulting connector, The cylinder temperature is in the range of T ° C to (T + 30) ° C, preferably in the range of T ° C to (T + 15) ° C. The mold temperature is preferably 70 to 100 占 폚. If the mold temperature is low, the filled resin composition causes a flow failure, which is undesirable. If the mold temperature is too high, problems such as burrs may occur, which is not preferable. The injection speed is preferably 150 mm / sec or more. If the injection speed is low, only a non-filled molded article can be obtained, or even if a completely filled molded article is obtained, a molded article having a high residual stress due to a high filling pressure may result in only a connector with poor flatness .

On the other hand, a composition obtained by adding additives such as pigments such as a nucleating agent, carbon black, and an inorganic plastic pigment, an antioxidant, a stabilizer, a plasticizer, a lubricant, a releasing agent and a flame retardant to the composite resin composition, And is included in the range of the resin composition.

Example

Hereinafter, the present invention will be described in detail by way of examples, but the present invention is not limited thereto. On the other hand, the measurement and the test of physical properties in the examples were carried out by the following methods.

(1) Apparent melt viscosity

A capillograph type 1B manufactured by Toyo Seiki Kogyo Co., Ltd., having L = 20 mm and d = 1 mm was used and the apparent melting (melting point) was measured according to ISO 11443 at a shear rate of 1000 / The viscosity was measured.

(2) Measurement of connector plan view

As shown in Fig. 1, the resin composition pellets were injection molded with a planar connector (pin number of 750 pins) having a total size of 39.82 mm x 41.82 mm x 1 mm and a lattice pitch pitch of 1.2 mm as shown in Fig.

On the other hand, the film gate was used from the long side (41.82 mm side) and the gate thickness was 0.3 mm.

The obtained connector was placed on a horizontal plane, and the height of the connector was measured by Quickvision 404 PROCNC image measuring instrument manufactured by Mitutoyo. At that time, a position of 0.5 mm from the end face of the connector was measured at intervals of 10 mm, and the difference between the maximum height and the minimum height was taken as a plan view.

Further, IR reflow under the following conditions was carried out, and the planarity was measured by the above-described method to obtain the difference in planarity before and after reflow.

[IR reflow condition]

Measuring device: Nippon Pulse Technology Research Laboratory large table top reflow soldering device RF-300 (using far infrared heater)

Sample transfer speed: 140mm / sec

Reflow furnace passing time: 5 min

Temperature condition Preheat zone: 150 ° C, Reflow zone: 225 ° C, Peak temperature: 287 ° C

[Molding conditions]

Molding machine: Sumitomo Heavy Industries Machinery SE30DUZ

Cylinder temperature;

(Nozzle) 360 占 폚 -365 占 폚 -340 占 폚 -330 占 폚 (Examples 1 to 6, Comparative Example 8)

370 캜 -370 캜 -370 캜 -380 캜 (Comparative Examples 1 and 2)

350 占 폚 -350 占 폚 -340 占 폚 -330 占 폚 (Comparative Examples 3 to 7)

Mold temperature: 80 ℃

Injection speed: 300mm / sec

Holding pressure: 50 MPa

Holding time: 2 sec

Cooling time: 10 sec

Number of screw revolutions: 120 rpm

Screw back pressure; 1.2 MPa

(3) Melting point of the liquid crystalline polymer

After observing the endothermic peak temperature (Tm1) observed when the polymer was measured at room temperature from a temperature elevation condition of 20 占 폚 / min with a DSC of Perkin Elmer, it was maintained at a temperature of (Tm1 + 40) 占 폚 for 2 minutes, / Min to room temperature, and then the temperature of the endothermic peak observed when the temperature was raised again at a rate of 20 ° C / min was measured.

(4) Minimum filling pressure

The minimum injection pressure was the minimum injection pressure at which a good molded article could be obtained when the planar connector of Fig. 1 was injection molded.

(5) Load deformation temperature

The liquid crystalline polymer composition including the plate filler and the glass fiber was subjected to injection molding under the following molding conditions and measured according to ISO 75-1 and 2, respectively.

[Molding conditions]

Molding machine: Sumitomo Heavy Industries Machinery SE100DU

Cylinder temperature:

(Nozzle) 360 캜 -370 캜 -370 캜 -360 캜 -340 캜 -330 캜 (Examples 1 to 6, Comparative Example 8)

370 캜 -370 캜 -370 캜 -370 캜 -370 캜 -380 캜 (Comparative Examples 1 and 2)

350 ° C -350 ° C -350 ° C -350 ° C -340 ° C -330 ° C (Comparative Examples 3 to 7)

Mold temperature: 80 ℃

Injection speed: 2m / min

Boom pressure: 50MPa

Holding time: 2 sec

Cooling time: 10 sec

Number of screw revolutions: 120 rpm

Screw back pressure: 1.2 MPa

(6) Crack resistance

The liquid crystalline polymer composition containing the plate-shaped filler and the glass fiber was injection-molded by the injection molding machine into the molded article shown in Fig. 2 under the following molding conditions. The injection molded article for evaluation shown in Fig. 2 has a diameter of 23.6 mm on the outer periphery, 31 holes of? 3.2 mm in the inside, and a minimum thickness of the hole-to-hole distance of 0.16 mm. The gate adopts the three-point gate of the arrow in Fig.

The molded articles after the injection molding were observed to show no cracks at the injection speeds of 50 mm / sec and 150 mm / sec. A: No cracks occurred at the injection speed of 150 mm / sec. &Quot; C "

[Molding conditions]

Molding machine: Sumitomo Heavy Industries Machinery SE30DUZ

Cylinder temperature:

(Nozzle) 370 캜 -375 캜 -360 캜 -350 캜 (Examples 1 to 6 and Comparative Example 8)

360 占 폚 -360 占 폚 -360 占 폚 -370 占 폚 (Comparative Examples 1 and 2)

350 占 폚 -350 占 폚 -340 占 폚 -330 占 폚 (Comparative Examples 3 to 7)

Mold temperature: 140 ℃

Injection speed: 50mm / sec or 150mm / sec

Boom pressure: 100MPa

Holding time: 2 sec

Cooling time: 10 sec

Number of screw revolutions: 120 rpm

Screw back pressure: 1.2 MPa

≪ Examples 1 to 6 and Comparative Examples 1 to 8 >

Under the following conditions, the test piece of the liquid crystalline polymer composition containing the plate filler and the glass fiber was produced and evaluated, and the results shown in Table 1 were obtained.

(Ingredient used)

Liquid crystalline polymer 1

[Manufacturing conditions]

The following raw material monomer, metal catalyst, and acylating agent were introduced into a polymerization vessel equipped with a stirrer, a refluxing column, a monomer inlet, a nitrogen inlet, and a pressure /

(I) 166 g (48 mol%) of 2-hydroxy-6-naphthoic acid (HNA)

(II) 76 g (25 mol%) of terephthalic acid (TA)

(III) 86 g (25 mol%) of 4,4'-dihydroxybiphenyl (BP)

(IV) 5 g (2 mol%) of 4-hydroxybenzoic acid (HBA)

Potassium acetate catalyst 22.5 mg

Acetic anhydride 191 g

After the feedstock was charged, the temperature of the reaction system was raised to 140 캜, and the reaction was carried out at 140 캜 for 1 hour. Thereafter, the temperature was further raised to 360 deg. C over 5.5 hours, and thereafter the pressure was reduced to 5 Torr (i.e., 667 Pa) over 30 minutes to remove the acetic acid, excess acetic anhydride and other low boiling portions, . After the stirring torque reached a predetermined value, nitrogen was introduced to bring the pressure from the reduced pressure state to the atmospheric pressure state, the polymer was discharged from the lower part of the polymerization vessel, and the strands were pelletized by pelletizing.

The obtained pellets were subjected to heat treatment at 300 DEG C for 8 hours under a nitrogen stream. The pellet had a melting point of 349 ° C, a crystallization calorie of 5.6 J / g, and a melt viscosity of 23 Pa · s.

Liquid crystal polymer 2

[Manufacturing conditions]

The following raw material monomer, metal catalyst, and acylating agent were introduced into a polymerization vessel equipped with a stirrer, a refluxing column, a monomer inlet, a nitrogen inlet, and a pressure /

(I) 4-Hydroxybenzoic acid: 188.4 g (60 mol%) (HBA)

(II): 21.4 g (5 mol%) of 6-hydroxy-2-naphthoic acid (HNA)

(III) terephthalic acid: 66.8 g (17.7 mol%) (TA)

(IV) 4,4'-dihydroxybiphenyl: 52.2 g (12.3 mol%) (BP)

(V) 17.2 g (5 mol%) of 4-acetoxyaminophenol (APAP)

Potassium acetate catalyst 15 mg

226.2 g of acetic anhydride

After the feedstock was charged, the temperature of the reaction system was raised to 140 캜, and the reaction was carried out at 140 캜 for 1 hour. Thereafter, the temperature was further raised to 340 캜 over 4.5 hours, and thereafter the pressure was reduced to 10 Torr (i.e., 1330 Pa) over 15 minutes to melt-polymerize while distilling off acetic acid, excess acetic anhydride and other low boiling points. After the stirring torque reached a predetermined value, nitrogen was introduced to bring the pressure from the reduced pressure state to the atmospheric pressure state, the polymer was discharged from the lower part of the polymerization vessel, and the strands were pelletized by pelletizing.

The liquid crystal polymer 2 had a melting point of 334 占 폚, a crystallization heat amount of 2.7 J / g and a melt viscosity of 18 Pa 占 퐏.

Liquid crystal polymer 3

[Manufacturing conditions]

The following raw material monomer, metal catalyst, and acylating agent were introduced into a polymerization vessel equipped with a stirrer, a refluxing column, a monomer inlet, a nitrogen inlet, and a pressure /

(I) 1041 g (48 mol%) of 4-hydroxybenzoic acid (HBA)

(II) 89 g (3 mol%) of 6-hydroxy-2-naphthoic acid (HNA)

(III) terephthalic acid 565 g (21.7 mol%) (TA)

(IV) 78 g (3 mol%) of isophthalic acid (IA)

(V) 4,4'-dihydroxybiphenyl 711g (24.3 mol%) (BP)

Potassium acetate catalyst 110 mg

Acetic anhydride 1645 g

After the feedstock was charged, the temperature of the reaction system was raised to 140 캜, and the reaction was carried out at 140 캜 for 1 hour. Thereafter, the temperature was further raised to 360 DEG C over 5.5 hours, and thereafter the pressure was reduced to 10 Torr (i.e., 1330 Pa) over 20 minutes to melt-polymerize while distilling out acetic acid, excess acetic anhydride and other low boiling points. After the stirring torque reached a predetermined value, nitrogen was introduced to bring the pressure from the reduced pressure state to the atmospheric pressure state, the polymer was discharged from the lower part of the polymerization vessel, and the strands were pelletized by pelletizing.

The obtained polymer had a melting point of 358 占 폚, a crystallization heat of 1.6 J / g and a melt viscosity of 9 Pa 占 퐏.

(B)

Mica: AB-25S manufactured by Yamaguchi Mica Co., Ltd., average particle diameter 25 m

Talc: crown talc PP, manufactured by Matsumura Industry Co., Ltd., average particle diameter 10 m

(C) glass fiber

Glass fiber: ECS03T-786H made by Nihon Denkimaras Co., Ltd., chopped strand having a fiber diameter of 10 mu m and a length of 3 mm

Milled fiber: PF70E001 (fiber diameter 10 占 퐉, fiber length 70 占 퐉) manufactured by Nitto Co., Ltd.

Claims (2)

(I), (II), (III), (IV) and (V) as the essential constituent component (A) (IV), 2 to 8 mol% of the constituent unit of (II), 2 to 8 mol% of the constituent unit of (III), 4.5 to 30.5 mol% of the constituent unit of (III) (B) an inorganic filler exhibiting optical anisotropy at the time of melting, characterized in that the content of the inorganic filler is in the range of 12.5 to 32.5 mol% and the constituent unit of (II) + (IV) is 4 to 10 mol% (B) is present in an amount of 15 to 25% by weight, the component (C) is contained in an amount of 10 to 25% by weight based on the whole composition, and the component (B) Is 30 to 40% by weight based on the total weight of the composition, has a lattice structure inside the outer frame, and has a pitch interval of 1.5 mm or less in the lattice portion The plane connector that.

The method according to claim 1,
(B) at least one inorganic filler selected from the group consisting of talc and mica.

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