TWI501044B - 移動體裝置、曝光裝置、以及元件製造方法 - Google Patents

移動體裝置、曝光裝置、以及元件製造方法 Download PDF

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Publication number
TWI501044B
TWI501044B TW099106064A TW99106064A TWI501044B TW I501044 B TWI501044 B TW I501044B TW 099106064 A TW099106064 A TW 099106064A TW 99106064 A TW99106064 A TW 99106064A TW I501044 B TWI501044 B TW I501044B
Authority
TW
Taiwan
Prior art keywords
axis
axis direction
stage
support
substrate
Prior art date
Application number
TW099106064A
Other languages
English (en)
Chinese (zh)
Other versions
TW201102764A (en
Inventor
青木保夫
Original Assignee
尼康股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 尼康股份有限公司 filed Critical 尼康股份有限公司
Publication of TW201102764A publication Critical patent/TW201102764A/zh
Application granted granted Critical
Publication of TWI501044B publication Critical patent/TWI501044B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW099106064A 2009-03-04 2010-03-03 移動體裝置、曝光裝置、以及元件製造方法 TWI501044B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15741509P 2009-03-04 2009-03-04
US12/714,733 US8659746B2 (en) 2009-03-04 2010-03-01 Movable body apparatus, exposure apparatus and device manufacturing method

Publications (2)

Publication Number Publication Date
TW201102764A TW201102764A (en) 2011-01-16
TWI501044B true TWI501044B (zh) 2015-09-21

Family

ID=42678581

Family Applications (5)

Application Number Title Priority Date Filing Date
TW099106064A TWI501044B (zh) 2009-03-04 2010-03-03 移動體裝置、曝光裝置、以及元件製造方法
TW106111116A TWI633397B (zh) 2009-03-04 2010-03-03 移動體裝置、曝光裝置、以及元件製造方法
TW109110285A TW202028889A (zh) 2009-03-04 2010-03-03 移動體裝置
TW107124972A TWI694314B (zh) 2009-03-04 2010-03-03 移動體裝置、曝光裝置、以及元件製造方法
TW104126514A TWI584079B (zh) 2009-03-04 2010-03-03 移動體裝置、曝光裝置、以及元件製造方法

Family Applications After (4)

Application Number Title Priority Date Filing Date
TW106111116A TWI633397B (zh) 2009-03-04 2010-03-03 移動體裝置、曝光裝置、以及元件製造方法
TW109110285A TW202028889A (zh) 2009-03-04 2010-03-03 移動體裝置
TW107124972A TWI694314B (zh) 2009-03-04 2010-03-03 移動體裝置、曝光裝置、以及元件製造方法
TW104126514A TWI584079B (zh) 2009-03-04 2010-03-03 移動體裝置、曝光裝置、以及元件製造方法

Country Status (5)

Country Link
US (6) US8659746B2 (enExample)
JP (2) JP5636696B2 (enExample)
KR (4) KR101967135B1 (enExample)
TW (5) TWI501044B (enExample)
WO (1) WO2010101267A1 (enExample)

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US8988655B2 (en) * 2010-09-07 2015-03-24 Nikon Corporation Exposure apparatus, movable body apparatus, flat-panel display manufacturing method, and device manufacturing method
JP2012089537A (ja) * 2010-10-15 2012-05-10 Nikon Corp ステージ装置、基板貼り合せ装置、積層半導体装置の製造方法及び積層半導体装置
JP5910992B2 (ja) * 2012-04-04 2016-04-27 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP5958692B2 (ja) * 2012-04-04 2016-08-02 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び移動体の駆動方法並びに露光方法
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CN103472678B (zh) * 2012-06-08 2015-07-22 上海微电子装备有限公司 光刻机及应用于光刻机中的工件台系统
JP6086299B2 (ja) * 2012-11-13 2017-03-01 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
DE102013011873B4 (de) * 2013-07-17 2015-10-08 Mecatronix Ag Positioniervorrichtung und Verfahren zum Bewegen eines Substrats
TWI701514B (zh) * 2014-03-28 2020-08-11 日商尼康股份有限公司 移動體裝置、曝光裝置、平板顯示器之製造方法、元件製造方法、及移動體驅動方法
KR101715785B1 (ko) * 2014-12-05 2017-03-13 프로미스 주식회사 Ｆｐｄ용 노광장치
CN104483815B (zh) * 2014-12-08 2016-05-11 上海核电装备焊接及检测工程技术研究中心（筹） 一种射线源对中支撑装置及其固定射线源装置的方法
JP6606479B2 (ja) * 2016-08-08 2019-11-13 株式会社ブイ・テクノロジー マスク保持装置
CN110366706B (zh) * 2017-02-27 2021-10-22 Asml荷兰有限公司 光刻设备、光刻投影设备和器件制造方法
JP6999155B2 (ja) * 2017-08-29 2022-01-18 株式会社ナチュラレーザ・ワン 原稿圧着板開閉装置およびこれを備えた事務機器
JP6917848B2 (ja) * 2017-09-26 2021-08-11 株式会社Ｓｃｒｅｅｎホールディングス ステージ駆動装置および描画装置
CN108161728A (zh) * 2017-12-26 2018-06-15 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 抛光回转工作台及抛光装置
CN109765753B (zh) * 2019-01-30 2024-07-12 广东华恒智能科技有限公司 一种全自动油墨曝光机
CN115803684A (zh) * 2020-06-15 2023-03-14 株式会社尼康 台装置、曝光装置、平板显示器的制造方法及元件制造方法
CN119658401B (zh) * 2025-01-10 2025-10-28 哈尔滨工业大学 一种垂向运动的短行程超精密定位平台

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Also Published As

Publication number Publication date
JP2010206205A (ja) 2010-09-16
TWI584079B (zh) 2017-05-21
TW201600938A (zh) 2016-01-01
US8659746B2 (en) 2014-02-25
US9977345B2 (en) 2018-05-22
TWI694314B (zh) 2020-05-21
US9170504B2 (en) 2015-10-27
KR20200051842A (ko) 2020-05-13
TW201102764A (en) 2011-01-16
US20180239264A1 (en) 2018-08-23
US10514616B2 (en) 2019-12-24
KR20110133570A (ko) 2011-12-13
WO2010101267A1 (en) 2010-09-10
US20200096878A1 (en) 2020-03-26
KR101700929B1 (ko) 2017-02-13
US20100227277A1 (en) 2010-09-09
JP5636696B2 (ja) 2014-12-10
US20160011524A1 (en) 2016-01-14
KR20190038956A (ko) 2019-04-09
JP6016198B2 (ja) 2016-10-26
US20170045829A1 (en) 2017-02-16
TW201727389A (zh) 2017-08-01
US20140125961A1 (en) 2014-05-08
TW202028889A (zh) 2020-08-01
KR20170012584A (ko) 2017-02-02
TW201841076A (zh) 2018-11-16
JP2014112247A (ja) 2014-06-19
TWI633397B (zh) 2018-08-21
KR102108997B1 (ko) 2020-05-11
KR101967135B1 (ko) 2019-04-09
US9500963B2 (en) 2016-11-22

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