JP5636696B2 - 移動体装置、露光装置、及びデバイス製造方法 - Google Patents

移動体装置、露光装置、及びデバイス製造方法 Download PDF

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Publication number
JP5636696B2
JP5636696B2 JP2010045208A JP2010045208A JP5636696B2 JP 5636696 B2 JP5636696 B2 JP 5636696B2 JP 2010045208 A JP2010045208 A JP 2010045208A JP 2010045208 A JP2010045208 A JP 2010045208A JP 5636696 B2 JP5636696 B2 JP 5636696B2
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Japan
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support member
axis
direction parallel
moving body
axis direction
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JP2010045208A
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Japanese (ja)
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JP2010206205A (ja
JP2010206205A5 (enExample
Inventor
青木　保夫
保夫 青木
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Nikon Corp
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Nikon Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2010045208A 2009-03-04 2010-03-02 移動体装置、露光装置、及びデバイス製造方法 Active JP5636696B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US15741509P 2009-03-04 2009-03-04
US61/157,415 2009-03-04
US12/714,733 US8659746B2 (en) 2009-03-04 2010-03-01 Movable body apparatus, exposure apparatus and device manufacturing method
US12/714,733 2010-03-01

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014011949A Division JP6016198B2 (ja) 2009-03-04 2014-01-27 移動体装置、露光装置、及び移動方法

Publications (3)

Publication Number Publication Date
JP2010206205A JP2010206205A (ja) 2010-09-16
JP2010206205A5 JP2010206205A5 (enExample) 2013-04-11
JP5636696B2 true JP5636696B2 (ja) 2014-12-10

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Family Applications (2)

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JP2010045208A Active JP5636696B2 (ja) 2009-03-04 2010-03-02 移動体装置、露光装置、及びデバイス製造方法
JP2014011949A Active JP6016198B2 (ja) 2009-03-04 2014-01-27 移動体装置、露光装置、及び移動方法

Family Applications After (1)

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JP2014011949A Active JP6016198B2 (ja) 2009-03-04 2014-01-27 移動体装置、露光装置、及び移動方法

Country Status (5)

Country Link
US (6) US8659746B2 (enExample)
JP (2) JP5636696B2 (enExample)
KR (4) KR101967135B1 (enExample)
TW (5) TWI501044B (enExample)
WO (1) WO2010101267A1 (enExample)

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US8988655B2 (en) * 2010-09-07 2015-03-24 Nikon Corporation Exposure apparatus, movable body apparatus, flat-panel display manufacturing method, and device manufacturing method
JP2012089537A (ja) * 2010-10-15 2012-05-10 Nikon Corp ステージ装置、基板貼り合せ装置、積層半導体装置の製造方法及び積層半導体装置
JP5910992B2 (ja) * 2012-04-04 2016-04-27 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP5958692B2 (ja) * 2012-04-04 2016-08-02 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び移動体の駆動方法並びに露光方法
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CN103472678B (zh) * 2012-06-08 2015-07-22 上海微电子装备有限公司 光刻机及应用于光刻机中的工件台系统
JP6086299B2 (ja) * 2012-11-13 2017-03-01 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
DE102013011873B4 (de) * 2013-07-17 2015-10-08 Mecatronix Ag Positioniervorrichtung und Verfahren zum Bewegen eines Substrats
TWI701514B (zh) * 2014-03-28 2020-08-11 日商尼康股份有限公司 移動體裝置、曝光裝置、平板顯示器之製造方法、元件製造方法、及移動體驅動方法
KR101715785B1 (ko) * 2014-12-05 2017-03-13 프로미스 주식회사 Ｆｐｄ용 노광장치
CN104483815B (zh) * 2014-12-08 2016-05-11 上海核电装备焊接及检测工程技术研究中心（筹） 一种射线源对中支撑装置及其固定射线源装置的方法
JP6606479B2 (ja) * 2016-08-08 2019-11-13 株式会社ブイ・テクノロジー マスク保持装置
CN110366706B (zh) * 2017-02-27 2021-10-22 Asml荷兰有限公司 光刻设备、光刻投影设备和器件制造方法
JP6999155B2 (ja) * 2017-08-29 2022-01-18 株式会社ナチュラレーザ・ワン 原稿圧着板開閉装置およびこれを備えた事務機器
JP6917848B2 (ja) * 2017-09-26 2021-08-11 株式会社Ｓｃｒｅｅｎホールディングス ステージ駆動装置および描画装置
CN108161728A (zh) * 2017-12-26 2018-06-15 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 抛光回转工作台及抛光装置
CN109765753B (zh) * 2019-01-30 2024-07-12 广东华恒智能科技有限公司 一种全自动油墨曝光机
CN115803684A (zh) * 2020-06-15 2023-03-14 株式会社尼康 台装置、曝光装置、平板显示器的制造方法及元件制造方法
CN119658401B (zh) * 2025-01-10 2025-10-28 哈尔滨工业大学 一种垂向运动的短行程超精密定位平台

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Also Published As

Publication number Publication date
JP2010206205A (ja) 2010-09-16
TWI584079B (zh) 2017-05-21
TW201600938A (zh) 2016-01-01
US8659746B2 (en) 2014-02-25
US9977345B2 (en) 2018-05-22
TWI694314B (zh) 2020-05-21
US9170504B2 (en) 2015-10-27
KR20200051842A (ko) 2020-05-13
TW201102764A (en) 2011-01-16
US20180239264A1 (en) 2018-08-23
US10514616B2 (en) 2019-12-24
KR20110133570A (ko) 2011-12-13
WO2010101267A1 (en) 2010-09-10
US20200096878A1 (en) 2020-03-26
KR101700929B1 (ko) 2017-02-13
US20100227277A1 (en) 2010-09-09
US20160011524A1 (en) 2016-01-14
KR20190038956A (ko) 2019-04-09
JP6016198B2 (ja) 2016-10-26
US20170045829A1 (en) 2017-02-16
TW201727389A (zh) 2017-08-01
US20140125961A1 (en) 2014-05-08
TWI501044B (zh) 2015-09-21
TW202028889A (zh) 2020-08-01
KR20170012584A (ko) 2017-02-02
TW201841076A (zh) 2018-11-16
JP2014112247A (ja) 2014-06-19
TWI633397B (zh) 2018-08-21
KR102108997B1 (ko) 2020-05-11
KR101967135B1 (ko) 2019-04-09
US9500963B2 (en) 2016-11-22

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