KR101967135B1 - 이동체 장치, 노광 장치, 및 디바이스 제조 방법 - Google Patents

이동체 장치, 노광 장치, 및 디바이스 제조 방법 Download PDF

Info

Publication number
KR101967135B1
KR101967135B1 KR1020177001942A KR20177001942A KR101967135B1 KR 101967135 B1 KR101967135 B1 KR 101967135B1 KR 1020177001942 A KR1020177001942 A KR 1020177001942A KR 20177001942 A KR20177001942 A KR 20177001942A KR 101967135 B1 KR101967135 B1 KR 101967135B1
Authority
KR
South Korea
Prior art keywords
stage
substrate
self
step board
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020177001942A
Other languages
English (en)
Korean (ko)
Other versions
KR20170012584A (ko
Inventor
야스오 아오키
Original Assignee
가부시키가이샤 니콘
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 니콘 filed Critical 가부시키가이샤 니콘
Publication of KR20170012584A publication Critical patent/KR20170012584A/ko
Application granted granted Critical
Publication of KR101967135B1 publication Critical patent/KR101967135B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020177001942A 2009-03-04 2010-03-02 이동체 장치, 노광 장치, 및 디바이스 제조 방법 Active KR101967135B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US15741509P 2009-03-04 2009-03-04
US61/157,415 2009-03-04
US12/714,733 2010-03-01
US12/714,733 US8659746B2 (en) 2009-03-04 2010-03-01 Movable body apparatus, exposure apparatus and device manufacturing method
PCT/JP2010/053715 WO2010101267A1 (en) 2009-03-04 2010-03-02 Movable body apparatus, exposure apparatus and device manufacturing method

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020117022426A Division KR101700929B1 (ko) 2009-03-04 2010-03-02 이동체 장치, 노광 장치, 및 디바이스 제조 방법

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020197009500A Division KR102108997B1 (ko) 2009-03-04 2010-03-02 이동체 장치, 노광 장치, 및 디바이스 제조 방법

Publications (2)

Publication Number Publication Date
KR20170012584A KR20170012584A (ko) 2017-02-02
KR101967135B1 true KR101967135B1 (ko) 2019-04-09

Family

ID=42678581

Family Applications (4)

Application Number Title Priority Date Filing Date
KR1020207012812A Ceased KR20200051842A (ko) 2009-03-04 2010-03-02 이동체 장치, 노광 장치, 및 디바이스 제조 방법
KR1020177001942A Active KR101967135B1 (ko) 2009-03-04 2010-03-02 이동체 장치, 노광 장치, 및 디바이스 제조 방법
KR1020117022426A Active KR101700929B1 (ko) 2009-03-04 2010-03-02 이동체 장치, 노광 장치, 및 디바이스 제조 방법
KR1020197009500A Active KR102108997B1 (ko) 2009-03-04 2010-03-02 이동체 장치, 노광 장치, 및 디바이스 제조 방법

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1020207012812A Ceased KR20200051842A (ko) 2009-03-04 2010-03-02 이동체 장치, 노광 장치, 및 디바이스 제조 방법

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020117022426A Active KR101700929B1 (ko) 2009-03-04 2010-03-02 이동체 장치, 노광 장치, 및 디바이스 제조 방법
KR1020197009500A Active KR102108997B1 (ko) 2009-03-04 2010-03-02 이동체 장치, 노광 장치, 및 디바이스 제조 방법

Country Status (5)

Country Link
US (6) US8659746B2 (enExample)
JP (2) JP5636696B2 (enExample)
KR (4) KR20200051842A (enExample)
TW (5) TWI694314B (enExample)
WO (1) WO2010101267A1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8659746B2 (en) 2009-03-04 2014-02-25 Nikon Corporation Movable body apparatus, exposure apparatus and device manufacturing method
US8988655B2 (en) * 2010-09-07 2015-03-24 Nikon Corporation Exposure apparatus, movable body apparatus, flat-panel display manufacturing method, and device manufacturing method
JP2012089537A (ja) * 2010-10-15 2012-05-10 Nikon Corp ステージ装置、基板貼り合せ装置、積層半導体装置の製造方法及び積層半導体装置
JP5910992B2 (ja) * 2012-04-04 2016-04-27 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP5958692B2 (ja) * 2012-04-04 2016-08-02 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び移動体の駆動方法並びに露光方法
NL2010679A (en) 2012-05-23 2013-11-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
CN103472678B (zh) * 2012-06-08 2015-07-22 上海微电子装备有限公司 光刻机及应用于光刻机中的工件台系统
JP6086299B2 (ja) * 2012-11-13 2017-03-01 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
DE102013011873B4 (de) * 2013-07-17 2015-10-08 Mecatronix Ag Positioniervorrichtung und Verfahren zum Bewegen eines Substrats
KR101907864B1 (ko) * 2014-03-28 2018-10-15 가부시키가이샤 니콘 이동체 장치, 노광 장치, 플랫 패널 디스플레이의 제조 방법, 디바이스 제조 방법, 및 이동체 구동 방법
KR101715785B1 (ko) * 2014-12-05 2017-03-13 프로미스 주식회사 Ｆｐｄ용 노광장치
CN104483815B (zh) * 2014-12-08 2016-05-11 上海核电装备焊接及检测工程技术研究中心（筹） 一种射线源对中支撑装置及其固定射线源装置的方法
JP6606479B2 (ja) * 2016-08-08 2019-11-13 株式会社ブイ・テクノロジー マスク保持装置
US10838312B2 (en) * 2017-02-27 2020-11-17 Asml Netherlands B.V. Lithographic apparatus, lithographic projection apparatus and device manufacturing method
JP6999155B2 (ja) * 2017-08-29 2022-01-18 株式会社ナチュラレーザ・ワン 原稿圧着板開閉装置およびこれを備えた事務機器
JP6917848B2 (ja) * 2017-09-26 2021-08-11 株式会社Ｓｃｒｅｅｎホールディングス ステージ駆動装置および描画装置
CN108161728A (zh) * 2017-12-26 2018-06-15 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 抛光回转工作台及抛光装置
CN109765753B (zh) * 2019-01-30 2024-07-12 广东华恒智能科技有限公司 一种全自动油墨曝光机
CN115803684A (zh) * 2020-06-15 2023-03-14 株式会社尼康 台装置、曝光装置、平板显示器的制造方法及元件制造方法
CN119658401B (zh) * 2025-01-10 2025-10-28 哈尔滨工业大学 一种垂向运动的短行程超精密定位平台

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6408045B1 (en) 1997-11-11 2002-06-18 Canon Kabushiki Kaisha Stage system and exposure apparatus with the same
JP2004260116A (ja) 2003-02-27 2004-09-16 Nikon Corp ステージ装置、露光装置、及びデバイス製造方法
JP2006012911A (ja) * 2004-06-22 2006-01-12 Dainippon Printing Co Ltd Ｘｙステージ装置
JP2006086442A (ja) * 2004-09-17 2006-03-30 Nikon Corp ステージ装置及び露光装置

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5684856A (en) * 1991-09-18 1997-11-04 Canon Kabushiki Kaisha Stage device and pattern transfer system using the same
JPH05329727A (ja) 1992-05-26 1993-12-14 Nikon Corp ステージ装置
JP3548353B2 (ja) * 1996-10-15 2004-07-28 キヤノン株式会社 ステージ装置およびこれを用いた露光装置ならびにデバイス製造方法
JP3745167B2 (ja) * 1998-07-29 2006-02-15 キヤノン株式会社 ステージ装置、露光装置およびデバイス製造方法ならびにステージ駆動方法
US6296734B1 (en) * 1999-07-08 2001-10-02 International Business Machines Corporation Concentrated UV light curing of adhesive for pivot applications
WO2001035168A1 (en) 1999-11-10 2001-05-17 Massachusetts Institute Of Technology Interference lithography utilizing phase-locked scanning beams
JP2001215718A (ja) 1999-11-26 2001-08-10 Nikon Corp 露光装置及び露光方法
US20020075467A1 (en) 2000-12-20 2002-06-20 Nikon Corporation Exposure apparatus and method
TW529172B (en) 2001-07-24 2003-04-21 Asml Netherlands Bv Imaging apparatus
US7271879B2 (en) * 2001-09-24 2007-09-18 Agency For Science, Technology And Research Decoupled planar positioning system
AU2003289239A1 (en) 2002-12-10 2004-06-30 Nikon Corporation Exposure system and device producing method
TWI338323B (en) * 2003-02-17 2011-03-01 Nikon Corp Stage device, exposure device and manufacguring method of devices
JP2005203567A (ja) * 2004-01-15 2005-07-28 Canon Inc 駆動装置、露光装置及びデバイス製造方法
US7221433B2 (en) * 2004-01-28 2007-05-22 Nikon Corporation Stage assembly including a reaction assembly having a connector assembly
WO2005122242A1 (ja) * 2004-06-07 2005-12-22 Nikon Corporation ステージ装置、露光装置及び露光方法
JP2006253572A (ja) * 2005-03-14 2006-09-21 Nikon Corp ステージ装置、露光装置、及びデバイス製造方法
WO2006098194A1 (ja) 2005-03-15 2006-09-21 Sharp Kabushiki Kaisha 表示装置の駆動方法、表示装置の駆動装置、そのプログラムおよび記録媒体、並びに、それを備える表示装置
EP1865381A4 (en) * 2005-03-29 2010-03-03 Nikon Corp EXPOSURE DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND METHOD FOR MANUFACTURING MICRODISPOSITIVE
JP2007073688A (ja) * 2005-09-06 2007-03-22 Shinko Electric Co Ltd Ｘｙステージ装置及びその製造方法
WO2008129762A1 (ja) 2007-03-05 2008-10-30 Nikon Corporation 移動体装置、パターン形成装置及びパターン形成方法、デバイス製造方法、移動体装置の製造方法、並びに移動体駆動方法
JP5505871B2 (ja) * 2008-03-07 2014-05-28 株式会社ニコン 移動体装置及び露光装置
US20100030384A1 (en) * 2008-07-29 2010-02-04 Technical Manufacturing Corporation Vibration Isolation System With Design For Offloading Payload Forces Acting on Actuator
US8659746B2 (en) * 2009-03-04 2014-02-25 Nikon Corporation Movable body apparatus, exposure apparatus and device manufacturing method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6408045B1 (en) 1997-11-11 2002-06-18 Canon Kabushiki Kaisha Stage system and exposure apparatus with the same
JP2004260116A (ja) 2003-02-27 2004-09-16 Nikon Corp ステージ装置、露光装置、及びデバイス製造方法
JP2006012911A (ja) * 2004-06-22 2006-01-12 Dainippon Printing Co Ltd Ｘｙステージ装置
JP2006086442A (ja) * 2004-09-17 2006-03-30 Nikon Corp ステージ装置及び露光装置

Also Published As

Publication number Publication date
TW202028889A (zh) 2020-08-01
US20180239264A1 (en) 2018-08-23
US20200096878A1 (en) 2020-03-26
US10514616B2 (en) 2019-12-24
US9170504B2 (en) 2015-10-27
US8659746B2 (en) 2014-02-25
KR102108997B1 (ko) 2020-05-11
TW201727389A (zh) 2017-08-01
JP6016198B2 (ja) 2016-10-26
TWI633397B (zh) 2018-08-21
US20160011524A1 (en) 2016-01-14
WO2010101267A1 (en) 2010-09-10
TWI694314B (zh) 2020-05-21
KR20200051842A (ko) 2020-05-13
TW201102764A (en) 2011-01-16
KR101700929B1 (ko) 2017-02-13
JP2014112247A (ja) 2014-06-19
KR20110133570A (ko) 2011-12-13
KR20170012584A (ko) 2017-02-02
TW201600938A (zh) 2016-01-01
KR20190038956A (ko) 2019-04-09
US20100227277A1 (en) 2010-09-09
US9500963B2 (en) 2016-11-22
JP2010206205A (ja) 2010-09-16
US20170045829A1 (en) 2017-02-16
TW201841076A (zh) 2018-11-16
US9977345B2 (en) 2018-05-22
JP5636696B2 (ja) 2014-12-10
US20140125961A1 (en) 2014-05-08
TWI501044B (zh) 2015-09-21
TWI584079B (zh) 2017-05-21

Similar Documents

Publication Publication Date Title
KR101967135B1 (ko) 이동체 장치, 노광 장치, 및 디바이스 제조 방법
KR101547784B1 (ko) 이동체 장치, 패턴 형성 장치 및 패턴 형성 방법, 디바이스 제조 방법, 이동체 장치의 제조 방법, 및 이동체 구동 방법
KR102072076B1 (ko) 이동체 장치, 물체 처리 디바이스, 노광 장치, 플랫 패널 디스플레이 제조 방법, 및 디바이스 제조 방법
KR20120023597A (ko) 이동체 장치, 노광 장치, 노광 방법, 및 디바이스 제조 방법
KR102228708B1 (ko) 이동체 장치, 노광 장치, 플랫 패널 디스플레이의 제조 방법, 및 디바이스 제조 방법
JP2011244608A (ja) リニアモータ、移動体装置、露光装置、デバイス製造方法、及びフラットパネルディスプレイの製造方法
HK1136388B (en) Moving body apparatus, apparatus for forming pattern, method of forming pattern, method of producing device, method of producing moving body apparatus, and method of driving moving body

Legal Events

Date Code Title Description
A107 Divisional application of patent
PA0104 Divisional application for international application

Comment text: Divisional Application for International Patent

Patent event code: PA01041R01D

Patent event date: 20170123

Application number text: 1020117022426

Filing date: 20110923

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20170222

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20170518

Patent event code: PE09021S01D

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20180326

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20190102

A107 Divisional application of patent
PA0104 Divisional application for international application

Comment text: Divisional Application for International Patent

Patent event code: PA01041R01D

Patent event date: 20190402

Application number text: 1020117022426

Filing date: 20110923

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20190403

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20190403

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20220323

Start annual number: 4

End annual number: 4

PR1001 Payment of annual fee

Payment date: 20230306

Start annual number: 5

End annual number: 5

PR1001 Payment of annual fee

Payment date: 20240320

Start annual number: 6

End annual number: 6