TWI500501B - Second layer double sided flexible metal laminated board and manufacturing method thereof - Google Patents
Second layer double sided flexible metal laminated board and manufacturing method thereof Download PDFInfo
- Publication number
- TWI500501B TWI500501B TW098137112A TW98137112A TWI500501B TW I500501 B TWI500501 B TW I500501B TW 098137112 A TW098137112 A TW 098137112A TW 98137112 A TW98137112 A TW 98137112A TW I500501 B TWI500501 B TW I500501B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- flexible metal
- sided flexible
- metal laminate
- resin
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 title claims description 194
- 239000002184 metal Substances 0.000 title claims description 194
- 238000004519 manufacturing process Methods 0.000 title claims description 25
- 239000010410 layer Substances 0.000 claims description 241
- 229920005989 resin Polymers 0.000 claims description 67
- 239000011347 resin Substances 0.000 claims description 67
- 229920001721 polyimide Polymers 0.000 claims description 64
- 239000004642 Polyimide Substances 0.000 claims description 55
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 45
- 239000009719 polyimide resin Substances 0.000 claims description 39
- 229920006259 thermoplastic polyimide Polymers 0.000 claims description 36
- 239000002243 precursor Substances 0.000 claims description 34
- 239000002253 acid Substances 0.000 claims description 32
- 150000004985 diamines Chemical class 0.000 claims description 29
- 239000002904 solvent Substances 0.000 claims description 26
- 230000009477 glass transition Effects 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 11
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 9
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 claims description 8
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 claims description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 8
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 claims description 7
- QYIMZXITLDTULQ-UHFFFAOYSA-N 4-(4-amino-2-methylphenyl)-3-methylaniline Chemical group CC1=CC(N)=CC=C1C1=CC=C(N)C=C1C QYIMZXITLDTULQ-UHFFFAOYSA-N 0.000 claims description 7
- 239000002356 single layer Substances 0.000 claims description 7
- DKKYOQYISDAQER-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 DKKYOQYISDAQER-UHFFFAOYSA-N 0.000 claims description 6
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- DOBFTMLCEYUAQC-UHFFFAOYSA-N naphthalene-2,3,6,7-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=C2C=C(C(O)=O)C(C(=O)O)=CC2=C1 DOBFTMLCEYUAQC-UHFFFAOYSA-N 0.000 claims description 6
- FYYYKXFEKMGYLZ-UHFFFAOYSA-N 4-(1,3-dioxo-2-benzofuran-5-yl)-2-benzofuran-1,3-dione Chemical compound C=1C=C2C(=O)OC(=O)C2=CC=1C1=CC=CC2=C1C(=O)OC2=O FYYYKXFEKMGYLZ-UHFFFAOYSA-N 0.000 claims description 5
- YTVNOVQHSGMMOV-UHFFFAOYSA-N naphthalenetetracarboxylic dianhydride Chemical compound C1=CC(C(=O)OC2=O)=C3C2=CC=C2C(=O)OC(=O)C1=C32 YTVNOVQHSGMMOV-UHFFFAOYSA-N 0.000 claims description 5
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 claims description 4
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 4
- -1 3,3'-diaminobiphenyl ether Chemical compound 0.000 claims description 3
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 claims description 3
- 229910052797 bismuth Inorganic materials 0.000 claims 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 1
- 229940105970 yttrium iodide Drugs 0.000 claims 1
- LFWQXIMAKJCMJL-UHFFFAOYSA-K yttrium(3+);triiodide Chemical compound I[Y](I)I LFWQXIMAKJCMJL-UHFFFAOYSA-K 0.000 claims 1
- 239000011888 foil Substances 0.000 description 22
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 20
- 229920001169 thermoplastic Polymers 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 16
- 239000004416 thermosoftening plastic Substances 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 239000011889 copper foil Substances 0.000 description 14
- 238000001125 extrusion Methods 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 10
- 229920005992 thermoplastic resin Polymers 0.000 description 8
- 239000000203 mixture Substances 0.000 description 7
- 238000005530 etching Methods 0.000 description 6
- 238000006358 imidation reaction Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- GWHLJVMSZRKEAQ-UHFFFAOYSA-N 3-(2,3-dicarboxyphenyl)phthalic acid Chemical compound OC(=O)C1=CC=CC(C=2C(=C(C(O)=O)C=CC=2)C(O)=O)=C1C(O)=O GWHLJVMSZRKEAQ-UHFFFAOYSA-N 0.000 description 5
- 238000005266 casting Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 108010026466 polyproline Proteins 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- 229910052727 yttrium Inorganic materials 0.000 description 5
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 5
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 4
- LXJLFVRAWOOQDR-UHFFFAOYSA-N 3-(3-aminophenoxy)aniline Chemical compound NC1=CC=CC(OC=2C=C(N)C=CC=2)=C1 LXJLFVRAWOOQDR-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 4
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 230000000379 polymerizing effect Effects 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 229910052707 ruthenium Inorganic materials 0.000 description 4
- 238000004381 surface treatment Methods 0.000 description 4
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 3
- 108010039918 Polylysine Proteins 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000012776 electronic material Substances 0.000 description 3
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 150000002923 oximes Chemical class 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 229920005575 poly(amic acid) Polymers 0.000 description 3
- 229920000656 polylysine Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000005065 mining Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000002250 progressing effect Effects 0.000 description 2
- 150000004060 quinone imines Chemical class 0.000 description 2
- 239000013557 residual solvent Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- DVVGIUUJYPYENY-UHFFFAOYSA-N 1-methylpyridin-2-one Chemical compound CN1C=CC=CC1=O DVVGIUUJYPYENY-UHFFFAOYSA-N 0.000 description 1
- NBAUUNCGSMAPFM-UHFFFAOYSA-N 3-(3,4-dicarboxyphenyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C1=CC=CC(C(O)=O)=C1C(O)=O NBAUUNCGSMAPFM-UHFFFAOYSA-N 0.000 description 1
- QSPMTSAELLSLOQ-UHFFFAOYSA-N 3-(4-aminophenyl)aniline Chemical group C1=CC(N)=CC=C1C1=CC=CC(N)=C1 QSPMTSAELLSLOQ-UHFFFAOYSA-N 0.000 description 1
- LFBALUPVVFCEPA-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C(C(O)=O)=C1 LFBALUPVVFCEPA-UHFFFAOYSA-N 0.000 description 1
- 229920000037 Polyproline Polymers 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000005576 amination reaction Methods 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical group C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000006166 lysate Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 238000009931 pascalization Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 108010094020 polyglycine Proteins 0.000 description 1
- 229920000232 polyglycine polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Landscapes
- Laminated Bodies (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008305394A JP5524475B2 (ja) | 2008-11-28 | 2008-11-28 | ２層両面フレキシブル金属積層板及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201020106A TW201020106A (en) | 2010-06-01 |
| TWI500501B true TWI500501B (zh) | 2015-09-21 |
Family
ID=42326489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098137112A TWI500501B (zh) | 2008-11-28 | 2009-11-02 | Second layer double sided flexible metal laminated board and manufacturing method thereof |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5524475B2 (enExample) |
| KR (1) | KR101219065B1 (enExample) |
| TW (1) | TWI500501B (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0678519B2 (ja) | 1988-03-30 | 1994-10-05 | 日本ゼオン株式会社 | 感圧記録紙セット用糊組成物 |
| KR101064816B1 (ko) * | 2009-04-03 | 2011-09-14 | 주식회사 두산 | 폴리아믹산 용액, 폴리이미드 수지 및 이를 이용한 연성 금속박 적층판 |
| JP6094044B2 (ja) | 2011-03-23 | 2017-03-15 | 大日本印刷株式会社 | 放熱基板およびそれを用いた素子 |
| CN103764731A (zh) * | 2011-08-25 | 2014-04-30 | 宇部兴产株式会社 | 一种热融着性聚酰亚胺膜及其制备方法、使用热融着性聚酰亚胺膜的聚酰亚胺金属层积体 |
| KR101396817B1 (ko) * | 2012-02-14 | 2014-05-21 | 한화엘앤씨 주식회사 | 금속 베이스 배선층 적층판 제조방법 |
| WO2013157565A1 (ja) * | 2012-04-19 | 2013-10-24 | 宇部興産株式会社 | 熱融着性ポリイミドフィルム、熱融着性ポリイミドフィルムの製造方法及び熱融着性ポリイミドフィルムを用いたポリイミド金属積層体 |
| JP6105724B2 (ja) * | 2012-06-22 | 2017-03-29 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ | ポリイミド金属張積層体 |
| JP6476469B2 (ja) | 2015-04-17 | 2019-03-06 | Ｊｆｅケミカル株式会社 | ポリアミド酸組成物およびポリイミド組成物 |
| KR102374975B1 (ko) | 2016-03-17 | 2022-03-16 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | 폴리아미드산, 열가소성 폴리이미드, 수지 필름, 금속장 적층판 및 회로 기판 |
| KR102268762B1 (ko) * | 2016-06-03 | 2021-06-25 | 가부시키가이샤 아리사와 세이사쿠쇼 | 플렉시블 금속 피복 적층판의 제조 방법 |
| JP7053208B2 (ja) * | 2017-09-29 | 2022-04-12 | 日鉄ケミカル＆マテリアル株式会社 | ポリイミドフィルム、金属張積層板及び回路基板 |
| JP7247037B2 (ja) * | 2019-06-28 | 2023-03-28 | 日鉄ケミカル＆マテリアル株式会社 | 金属張積層板及びパターン化金属張積層板 |
| CN110849492A (zh) * | 2019-10-16 | 2020-02-28 | 贵州电网有限责任公司 | 蝶形双金属片及采用该双金属片的越限指示装置和线夹 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007118477A (ja) * | 2005-10-31 | 2007-05-17 | Toray Ind Inc | 両面金属箔積層板およびその製造方法 |
| JP2007203505A (ja) * | 2006-01-31 | 2007-08-16 | Nippon Steel Chem Co Ltd | 両面金属張積層板の製造方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005166828A (ja) * | 2003-12-01 | 2005-06-23 | Nitto Denko Corp | 両面配線基板用積層体及びその製造方法 |
| JP4684601B2 (ja) * | 2004-08-26 | 2011-05-18 | 新日鐵化学株式会社 | フレキシブル積層基板の製造法 |
| JP4564336B2 (ja) * | 2004-11-04 | 2010-10-20 | 新日鐵化学株式会社 | Ｃｏｆ用銅張積層板及びｃｏｆ用キャリアテープ |
| JP4652020B2 (ja) * | 2004-11-16 | 2011-03-16 | 新日鐵化学株式会社 | 銅張り積層板 |
| JP4987733B2 (ja) * | 2006-01-17 | 2012-07-25 | 旭化成イーマテリアルズ株式会社 | ポリイミド樹脂組成物及び金属ポリイミド積層体 |
| JP2007192985A (ja) * | 2006-01-18 | 2007-08-02 | Ist Corp | 定着ベルト及びその製造方法 |
| KR101451264B1 (ko) * | 2006-07-04 | 2014-10-15 | 신닛테츠 수미킨 가가쿠 가부시키가이샤 | 폴리이미드수지층의 표면개질방법 및 금속장 적층판의 제조방법 |
| WO2008004496A1 (fr) * | 2006-07-06 | 2008-01-10 | Toray Industries, Inc. | Polyimide thermoplastique, film de polyimide laminé et film de polyimide laminé sur feuille métallique utilisant ledit polyimide thermoplastique |
| JP2008106139A (ja) * | 2006-10-25 | 2008-05-08 | Du Pont Toray Co Ltd | ポリイミドフィルムおよびその製造方法 |
| JP5180517B2 (ja) * | 2007-05-22 | 2013-04-10 | 新日鉄住金化学株式会社 | ポリイミド樹脂の表面処理方法及び金属張積層体の製造方法 |
-
2008
- 2008-11-28 JP JP2008305394A patent/JP5524475B2/ja active Active
-
2009
- 2009-10-28 KR KR1020090102890A patent/KR101219065B1/ko active Active
- 2009-11-02 TW TW098137112A patent/TWI500501B/zh active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007118477A (ja) * | 2005-10-31 | 2007-05-17 | Toray Ind Inc | 両面金属箔積層板およびその製造方法 |
| JP2007203505A (ja) * | 2006-01-31 | 2007-08-16 | Nippon Steel Chem Co Ltd | 両面金属張積層板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010125793A (ja) | 2010-06-10 |
| TW201020106A (en) | 2010-06-01 |
| KR20100061329A (ko) | 2010-06-07 |
| JP5524475B2 (ja) | 2014-06-18 |
| KR101219065B1 (ko) | 2013-01-08 |
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