TWI499633B - 薄膜用組成物及使用其之接著薄膜與覆蓋薄膜 - Google Patents

薄膜用組成物及使用其之接著薄膜與覆蓋薄膜 Download PDF

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Publication number
TWI499633B
TWI499633B TW100107565A TW100107565A TWI499633B TW I499633 B TWI499633 B TW I499633B TW 100107565 A TW100107565 A TW 100107565A TW 100107565 A TW100107565 A TW 100107565A TW I499633 B TWI499633 B TW I499633B
Authority
TW
Taiwan
Prior art keywords
film
component
composition
phosphorus
present
Prior art date
Application number
TW100107565A
Other languages
English (en)
Chinese (zh)
Other versions
TW201137025A (en
Inventor
Shin Teraki
Masaki Yoshida
Satoko Takahashi
Original Assignee
Namics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Namics Corp filed Critical Namics Corp
Publication of TW201137025A publication Critical patent/TW201137025A/zh
Application granted granted Critical
Publication of TWI499633B publication Critical patent/TWI499633B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Paints Or Removers (AREA)
TW100107565A 2010-03-11 2011-03-07 薄膜用組成物及使用其之接著薄膜與覆蓋薄膜 TWI499633B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010054125 2010-03-11

Publications (2)

Publication Number Publication Date
TW201137025A TW201137025A (en) 2011-11-01
TWI499633B true TWI499633B (zh) 2015-09-11

Family

ID=44563297

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100107565A TWI499633B (zh) 2010-03-11 2011-03-07 薄膜用組成物及使用其之接著薄膜與覆蓋薄膜

Country Status (5)

Country Link
JP (1) JP5771186B2 (fr)
KR (1) KR101749369B1 (fr)
CN (1) CN102803384B (fr)
TW (1) TWI499633B (fr)
WO (1) WO2011111471A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013151638A (ja) * 2011-12-27 2013-08-08 Yamaichi Electronics Co Ltd カバーレイフィルム、フレキシブル配線板およびその製造方法
KR102237222B1 (ko) * 2013-09-26 2021-04-08 도요보 가부시키가이샤 폴리우레탄 수지 조성물 및 이것을 이용한 접착제 조성물, 적층체, 프린트 배선판
US9903982B2 (en) 2015-03-04 2018-02-27 Fujifilm Corporation Antireflection article, polarizing plate, cover glass and image display device, and manufacturing method of antireflection article
JP6442375B2 (ja) * 2015-03-04 2018-12-19 富士フイルム株式会社 反射防止物品、偏光板、カバーガラス、及び画像表示装置、並びに反射防止物品の製造方法
JP2015146469A (ja) * 2015-05-22 2015-08-13 株式会社クラレ Ｌｃｐ基板用カバー材およびそれを用いたｌｃｐ回路基板
CN113165367B (zh) * 2018-12-05 2023-08-22 阪东化学株式会社 可挠性显示器用表面保护膜及其制造方法
JP7332263B2 (ja) * 2019-12-05 2023-08-23 日本化薬株式会社 電子部品用接着剤

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007302843A (ja) * 2006-05-15 2007-11-22 Hitachi Chem Co Ltd 硬化剤の製造法，及びこれを用いた熱硬化性樹脂組成物
WO2010016256A1 (fr) * 2008-08-07 2010-02-11 太陽インキ製造株式会社 Composition de résine photodurcissable ignifuge, film sec et produit durci obtenus à partir de celle-ci, et carte de câblage imprimé utilisant la composition, le film sec ou le produit durci

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10237162A (ja) * 1997-02-25 1998-09-08 Nippon Kayaku Co Ltd エポキシ樹脂組成物及び硬化物
AU2003303860A1 (en) * 2003-02-06 2004-08-30 Matsushita Electric Works, Ltd. Epoxy resin composition, semiconductor devices having cured layers of the composition, and process for production of the devices
JP4470091B2 (ja) * 2003-08-11 2010-06-02 東洋紡績株式会社 ポリウレタン樹脂組成物、積層体およびフレキシブルプリント配線板
JP4425118B2 (ja) 2003-12-03 2010-03-03 株式会社有沢製作所 難燃性樹脂組成物、並びに該組成物を用いたフレキシブルプリント配線板用金属張積層板、カバーレイ、接着シート及びフレキシブルプリント配線板
WO2005100435A1 (fr) * 2004-04-14 2005-10-27 Namics Corporation Composition de résine époxy
KR100909169B1 (ko) * 2006-09-11 2009-07-23 제일모직주식회사 선 경화형 반도체 조립용 접착 필름 조성물
US7671170B2 (en) * 2007-02-08 2010-03-02 Basf Coatings Ag Film-forming material containing phosphorous

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007302843A (ja) * 2006-05-15 2007-11-22 Hitachi Chem Co Ltd 硬化剤の製造法，及びこれを用いた熱硬化性樹脂組成物
WO2010016256A1 (fr) * 2008-08-07 2010-02-11 太陽インキ製造株式会社 Composition de résine photodurcissable ignifuge, film sec et produit durci obtenus à partir de celle-ci, et carte de câblage imprimé utilisant la composition, le film sec ou le produit durci

Also Published As

Publication number Publication date
CN102803384B (zh) 2014-08-13
JPWO2011111471A1 (ja) 2013-06-27
KR20130031240A (ko) 2013-03-28
KR101749369B1 (ko) 2017-06-20
TW201137025A (en) 2011-11-01
WO2011111471A1 (fr) 2011-09-15
JP5771186B2 (ja) 2015-08-26
CN102803384A (zh) 2012-11-28

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