AU2003303860A1 - Epoxy resin composition, semiconductor devices having cured layers of the composition, and process for production of the devices - Google Patents

Epoxy resin composition, semiconductor devices having cured layers of the composition, and process for production of the devices

Info

Publication number
AU2003303860A1
AU2003303860A1 AU2003303860A AU2003303860A AU2003303860A1 AU 2003303860 A1 AU2003303860 A1 AU 2003303860A1 AU 2003303860 A AU2003303860 A AU 2003303860A AU 2003303860 A AU2003303860 A AU 2003303860A AU 2003303860 A1 AU2003303860 A1 AU 2003303860A1
Authority
AU
Australia
Prior art keywords
devices
composition
production
epoxy resin
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003303860A
Inventor
Naoki Kanagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Publication of AU2003303860A1 publication Critical patent/AU2003303860A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
AU2003303860A 2003-02-06 2003-02-06 Epoxy resin composition, semiconductor devices having cured layers of the composition, and process for production of the devices Abandoned AU2003303860A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2003/001221 WO2004069894A1 (en) 2003-02-06 2003-02-06 Epoxy resin composition, semiconductor devices having cured layers of the composition, and process for production of the devices

Publications (1)

Publication Number Publication Date
AU2003303860A1 true AU2003303860A1 (en) 2004-08-30

Family

ID=32843971

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003303860A Abandoned AU2003303860A1 (en) 2003-02-06 2003-02-06 Epoxy resin composition, semiconductor devices having cured layers of the composition, and process for production of the devices

Country Status (3)

Country Link
JP (1) JPWO2004069894A1 (en)
AU (1) AU2003303860A1 (en)
WO (1) WO2004069894A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007056070A (en) * 2005-08-22 2007-03-08 Fujitsu Ltd Under fill material for flip chip type semiconductor device, the flip chip type semiconductor device using the same and method for producing the device
JP2007169448A (en) * 2005-12-21 2007-07-05 Sekisui Chem Co Ltd Thermosetting resin composition and semiconductor device
JP5205722B2 (en) * 2006-07-31 2013-06-05 住友ベークライト株式会社 Liquid resin composition and semiconductor device produced using liquid resin composition
JP4816333B2 (en) * 2006-08-28 2011-11-16 パナソニック電工株式会社 Manufacturing method of semiconductor device
JP5102675B2 (en) * 2008-03-26 2012-12-19 パナソニック株式会社 Epoxy resin composition for manufacturing single-sided mold type semiconductor device and single-sided mold type semiconductor device
JP5771186B2 (en) * 2010-03-11 2015-08-26 ナミックス株式会社 Film composition, and adhesive film and coverlay film thereby

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5813623A (en) * 1981-07-18 1983-01-26 Asahi Chem Ind Co Ltd Solid curing agent composition for epoxy resin
JPS61268721A (en) * 1985-05-24 1986-11-28 Asahi Chem Ind Co Ltd Curing agent for epoxy resin
JP2825572B2 (en) * 1989-12-21 1998-11-18 三井化学株式会社 Resin composition for semiconductor encapsulation
JP3270774B2 (en) * 1992-01-22 2002-04-02 ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレイション Latent curing agent for spherical epoxy resin and method for producing the same
US5357008A (en) * 1992-01-22 1994-10-18 W. R. Grace & Co.-Conn. Latent curing agent for epoxy resin and its preparation
JPH0693051A (en) * 1992-09-14 1994-04-05 Sumitomo Chem Co Ltd Thermosetting resin composition and use thereof
JPH073238A (en) * 1993-06-17 1995-01-06 Matsushita Electric Ind Co Ltd Adhesive for electronic circuit formation and electronic circuit formation
JP3351060B2 (en) * 1993-11-09 2002-11-25 松下電器産業株式会社 Adhesive for forming electronic circuit and method of applying adhesive
JPH0855940A (en) * 1994-08-12 1996-02-27 Sumitomo Chem Co Ltd Thermosetting resin composition
JP3104589B2 (en) * 1995-10-02 2000-10-30 信越化学工業株式会社 Thermosetting resin composition and semiconductor device
JPH1050142A (en) * 1996-07-31 1998-02-20 Hitachi Chem Co Ltd Electrically conductive resin paste composition and semi-conductor device
JPH1129624A (en) * 1997-07-09 1999-02-02 Toshiba Corp Semiconductor sealing liquid epoxy resin composition
JP3562323B2 (en) * 1998-07-09 2004-09-08 株式会社スリーボンド Thermosetting conductive adhesive
JP4113978B2 (en) * 1998-11-17 2008-07-09 Ｄｉｃ株式会社 Active energy ray-curable resin composition containing maleimide derivative
JP2000239355A (en) * 1999-02-23 2000-09-05 Matsushita Electric Works Ltd Epoxy resin composition and semiconductor device
JP2001261939A (en) * 2000-03-21 2001-09-26 Sumitomo Bakelite Co Ltd Liquid resin composition and semiconductor device by using the same
JP2002100813A (en) * 2000-09-22 2002-04-05 Matsushita Electric Ind Co Ltd Wavelength-converting paste material, semiconductor light-emitting device and its manufacturing method
JP2002241586A (en) * 2001-02-19 2002-08-28 Matsushita Electric Ind Co Ltd Wavelength conversion paste material, composite light- emitting element, semiconductor light-emitting device, and method for producing the same
JP2004123891A (en) * 2002-10-02 2004-04-22 Sumitomo Bakelite Co Ltd One-pack liquid epoxy resin composition

Also Published As

Publication number Publication date
WO2004069894A1 (en) 2004-08-19
JPWO2004069894A1 (en) 2006-05-25

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase