KR101749369B1 - 필름용 조성물, 및 그것에 의한 접착 필름 및 커버레이 필름 - Google Patents

필름용 조성물, 및 그것에 의한 접착 필름 및 커버레이 필름 Download PDF

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Publication number
KR101749369B1
KR101749369B1 KR1020127023040A KR20127023040A KR101749369B1 KR 101749369 B1 KR101749369 B1 KR 101749369B1 KR 1020127023040 A KR1020127023040 A KR 1020127023040A KR 20127023040 A KR20127023040 A KR 20127023040A KR 101749369 B1 KR101749369 B1 KR 101749369B1
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KR
South Korea
Prior art keywords
film
component
composition
phosphorus
present
Prior art date
Application number
KR1020127023040A
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English (en)
Korean (ko)
Other versions
KR20130031240A (ko
Inventor
신 데라키
마사키 요시다
사토코 다카하시
Original Assignee
나믹스 가부시끼가이샤
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Publication date
Application filed by 나믹스 가부시끼가이샤 filed Critical 나믹스 가부시끼가이샤
Publication of KR20130031240A publication Critical patent/KR20130031240A/ko
Application granted granted Critical
Publication of KR101749369B1 publication Critical patent/KR101749369B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Paints Or Removers (AREA)
KR1020127023040A 2010-03-11 2011-02-10 필름용 조성물, 및 그것에 의한 접착 필름 및 커버레이 필름 KR101749369B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010054125 2010-03-11
JPJP-P-2010-054125 2010-03-11
PCT/JP2011/052894 WO2011111471A1 (fr) 2010-03-11 2011-02-10 Composition pour film, et film adhésif et film de couche de fermeture formé par celle-ci

Publications (2)

Publication Number Publication Date
KR20130031240A KR20130031240A (ko) 2013-03-28
KR101749369B1 true KR101749369B1 (ko) 2017-06-20

Family

ID=44563297

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127023040A KR101749369B1 (ko) 2010-03-11 2011-02-10 필름용 조성물, 및 그것에 의한 접착 필름 및 커버레이 필름

Country Status (5)

Country Link
JP (1) JP5771186B2 (fr)
KR (1) KR101749369B1 (fr)
CN (1) CN102803384B (fr)
TW (1) TWI499633B (fr)
WO (1) WO2011111471A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013151638A (ja) * 2011-12-27 2013-08-08 Yamaichi Electronics Co Ltd カバーレイフィルム、フレキシブル配線板およびその製造方法
KR102237222B1 (ko) * 2013-09-26 2021-04-08 도요보 가부시키가이샤 폴리우레탄 수지 조성물 및 이것을 이용한 접착제 조성물, 적층체, 프린트 배선판
US9903982B2 (en) 2015-03-04 2018-02-27 Fujifilm Corporation Antireflection article, polarizing plate, cover glass and image display device, and manufacturing method of antireflection article
JP6442375B2 (ja) * 2015-03-04 2018-12-19 富士フイルム株式会社 反射防止物品、偏光板、カバーガラス、及び画像表示装置、並びに反射防止物品の製造方法
JP2015146469A (ja) * 2015-05-22 2015-08-13 株式会社クラレ Ｌｃｐ基板用カバー材およびそれを用いたｌｃｐ回路基板
CN113165367B (zh) * 2018-12-05 2023-08-22 阪东化学株式会社 可挠性显示器用表面保护膜及其制造方法
JP7332263B2 (ja) * 2019-12-05 2023-08-23 日本化薬株式会社 電子部品用接着剤

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005060489A (ja) 2003-08-11 2005-03-10 Toyobo Co Ltd ポリウレタン樹脂組成物、積層体およびフレキシブルプリント配線板
JP2005187810A (ja) 2003-12-03 2005-07-14 Arisawa Mfg Co Ltd 難燃性樹脂組成物、並びに該組成物を用いたフレキシブルプリント配線板用金属張積層板、カバーレイ、接着シート及びフレキシブルプリント配線板
JP2010039388A (ja) 2008-08-07 2010-02-18 Taiyo Ink Mfg Ltd 難燃性光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10237162A (ja) * 1997-02-25 1998-09-08 Nippon Kayaku Co Ltd エポキシ樹脂組成物及び硬化物
AU2003303860A1 (en) * 2003-02-06 2004-08-30 Matsushita Electric Works, Ltd. Epoxy resin composition, semiconductor devices having cured layers of the composition, and process for production of the devices
WO2005100435A1 (fr) * 2004-04-14 2005-10-27 Namics Corporation Composition de résine époxy
JP4735410B2 (ja) * 2006-05-15 2011-07-27 日立化成工業株式会社 硬化剤の製造法，及びこれを用いた熱硬化性樹脂組成物
KR100909169B1 (ko) * 2006-09-11 2009-07-23 제일모직주식회사 선 경화형 반도체 조립용 접착 필름 조성물
US7671170B2 (en) * 2007-02-08 2010-03-02 Basf Coatings Ag Film-forming material containing phosphorous

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005060489A (ja) 2003-08-11 2005-03-10 Toyobo Co Ltd ポリウレタン樹脂組成物、積層体およびフレキシブルプリント配線板
JP2005187810A (ja) 2003-12-03 2005-07-14 Arisawa Mfg Co Ltd 難燃性樹脂組成物、並びに該組成物を用いたフレキシブルプリント配線板用金属張積層板、カバーレイ、接着シート及びフレキシブルプリント配線板
JP2010039388A (ja) 2008-08-07 2010-02-18 Taiyo Ink Mfg Ltd 難燃性光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

Also Published As

Publication number Publication date
CN102803384B (zh) 2014-08-13
JPWO2011111471A1 (ja) 2013-06-27
KR20130031240A (ko) 2013-03-28
TWI499633B (zh) 2015-09-11
TW201137025A (en) 2011-11-01
WO2011111471A1 (fr) 2011-09-15
JP5771186B2 (ja) 2015-08-26
CN102803384A (zh) 2012-11-28

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