TWI499498B - 壓印設備及製造物品的方法 - Google Patents

壓印設備及製造物品的方法 Download PDF

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Publication number
TWI499498B
TWI499498B TW100109349A TW100109349A TWI499498B TW I499498 B TWI499498 B TW I499498B TW 100109349 A TW100109349 A TW 100109349A TW 100109349 A TW100109349 A TW 100109349A TW I499498 B TWI499498 B TW I499498B
Authority
TW
Taiwan
Prior art keywords
mold
resin
gas
pattern
supply
Prior art date
Application number
TW100109349A
Other languages
English (en)
Chinese (zh)
Other versions
TW201139119A (en
Inventor
佐藤浩司
稻秀樹
Original Assignee
佳能股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 佳能股份有限公司 filed Critical 佳能股份有限公司
Publication of TW201139119A publication Critical patent/TW201139119A/zh
Application granted granted Critical
Publication of TWI499498B publication Critical patent/TWI499498B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/0227—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould using pressure vessels, e.g. autoclaves, vulcanising pans
    • B29C35/0233—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould using pressure vessels, e.g. autoclaves, vulcanising pans the curing continuing after removal from the mould
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
    • B29C33/3857—Manufacturing moulds, e.g. shaping the mould surface by machining by making impressions of one or more parts of models, e.g. shaped articles and including possible subsequent assembly of the parts
    • B29C33/3878—Manufacturing moulds, e.g. shaping the mould surface by machining by making impressions of one or more parts of models, e.g. shaped articles and including possible subsequent assembly of the parts used as masters for making successive impressions
    • B29C33/3885—Manufacturing moulds, e.g. shaping the mould surface by machining by making impressions of one or more parts of models, e.g. shaped articles and including possible subsequent assembly of the parts used as masters for making successive impressions the mould parts being co-operating impressions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • H10P76/2041—

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW100109349A 2010-03-24 2011-03-18 壓印設備及製造物品的方法 TWI499498B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010068916A JP5618588B2 (ja) 2010-03-24 2010-03-24 インプリント方法

Publications (2)

Publication Number Publication Date
TW201139119A TW201139119A (en) 2011-11-16
TWI499498B true TWI499498B (zh) 2015-09-11

Family

ID=44202850

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100109349A TWI499498B (zh) 2010-03-24 2011-03-18 壓印設備及製造物品的方法

Country Status (6)

Country Link
US (2) US9122149B2 (enExample)
EP (1) EP2369412B1 (enExample)
JP (1) JP5618588B2 (enExample)
KR (1) KR101374001B1 (enExample)
CN (1) CN102200687B (enExample)
TW (1) TWI499498B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5679850B2 (ja) * 2011-02-07 2015-03-04 キヤノン株式会社 インプリント装置、および、物品の製造方法
JP5787691B2 (ja) * 2011-09-21 2015-09-30 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
JP5868215B2 (ja) 2012-02-27 2016-02-24 キヤノン株式会社 インプリント装置およびインプリント方法、それを用いた物品の製造方法
JP6230353B2 (ja) * 2013-09-25 2017-11-15 キヤノン株式会社 パターン形状を有する膜の製造方法、光学部品の製造方法、回路基板の製造方法、電子機器の製造方法
JP6341883B2 (ja) 2014-06-27 2018-06-13 キヤノン株式会社 位置検出装置、位置検出方法、インプリント装置及び物品の製造方法
US10204780B2 (en) * 2015-09-08 2019-02-12 Canon Kabushiki Kaisha Imprint apparatus, and article manufacturing method
JP7058951B2 (ja) * 2017-05-24 2022-04-25 キヤノン株式会社 インプリント装置、および物品の製造方法
JP7118674B2 (ja) * 2018-03-12 2022-08-16 キヤノン株式会社 型を用いて基板上の組成物を成形する成形装置、成形方法、および物品の製造方法
JP7062049B2 (ja) * 2018-03-30 2022-05-02 富士フイルム株式会社 経皮吸収シート製造用のモールド、針状凸部を有する経皮吸収シートの製造装置及び方法
US11951660B2 (en) * 2021-10-11 2024-04-09 Canon Kabushiki Kaisha Shaping system including an evaporation cover, shaping process, and method of manufacturing an article

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090140458A1 (en) * 2007-11-21 2009-06-04 Molecular Imprints, Inc. Porous template and imprinting stack for nano-imprint lithography
WO2010005032A1 (ja) * 2008-07-09 2010-01-14 東洋合成工業株式会社 パターン形成方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080164638A1 (en) * 2006-11-28 2008-07-10 Wei Zhang Method and apparatus for rapid imprint lithography
JP3856117B2 (ja) * 2002-01-28 2006-12-13 日本碍子株式会社 射出成形体の製造方法
WO2003099463A2 (en) * 2002-05-27 2003-12-04 Koninklijke Philips Electronics N.V. Method and device for transferring a pattern from a stamp to a substrate
US7611348B2 (en) * 2005-04-19 2009-11-03 Asml Netherlands B.V. Imprint lithography
KR100710851B1 (ko) 2006-03-22 2007-04-23 (주) 비앤피 사이언스 나노 임프린트 리소그래피 방법 및 장치
JP4185941B2 (ja) 2006-04-04 2008-11-26 キヤノン株式会社 ナノインプリント方法及びナノインプリント装置
JP4872052B2 (ja) * 2006-04-12 2012-02-08 独立行政法人産業技術総合研究所 微細金型コア部材
JP4996150B2 (ja) * 2006-07-07 2012-08-08 株式会社日立ハイテクノロジーズ 微細構造転写装置および微細構造転写方法
US8017183B2 (en) * 2007-09-26 2011-09-13 Eastman Kodak Company Organosiloxane materials for selective area deposition of inorganic materials
TWI353961B (en) * 2008-06-23 2011-12-11 Univ Nat Cheng Kung Micro-nano imprinting mould and imprinting process
US8994917B2 (en) * 2008-08-08 2015-03-31 Asml Netherlands B.V. Temperature stabilization system to stabilize a temperature of an article
US20100104852A1 (en) 2008-10-23 2010-04-29 Molecular Imprints, Inc. Fabrication of High-Throughput Nano-Imprint Lithography Templates
WO2010063504A2 (en) * 2008-12-04 2010-06-10 Asml Netherlands B.V. Imprint lithography apparatus and method
JP2010149482A (ja) * 2008-12-26 2010-07-08 Toshiba Corp インプリント用モールドおよびパターン形成方法
JP2011161727A (ja) * 2010-02-08 2011-08-25 Fujifilm Corp 光学成形体の成形型、光学成形体の成形方法、及び、レンズアレイ
US8541053B2 (en) * 2010-07-08 2013-09-24 Molecular Imprints, Inc. Enhanced densification of silicon oxide layers

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090140458A1 (en) * 2007-11-21 2009-06-04 Molecular Imprints, Inc. Porous template and imprinting stack for nano-imprint lithography
WO2010005032A1 (ja) * 2008-07-09 2010-01-14 東洋合成工業株式会社 パターン形成方法

Also Published As

Publication number Publication date
US9280048B2 (en) 2016-03-08
KR20110107288A (ko) 2011-09-30
CN102200687A (zh) 2011-09-28
JP2011201083A (ja) 2011-10-13
KR101374001B1 (ko) 2014-03-12
US20140234467A1 (en) 2014-08-21
US20110236579A1 (en) 2011-09-29
CN102200687B (zh) 2016-08-24
EP2369412A3 (en) 2012-06-13
EP2369412B1 (en) 2017-05-10
JP5618588B2 (ja) 2014-11-05
US9122149B2 (en) 2015-09-01
TW201139119A (en) 2011-11-16
EP2369412A2 (en) 2011-09-28

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