TWI499498B - 壓印設備及製造物品的方法 - Google Patents
壓印設備及製造物品的方法 Download PDFInfo
- Publication number
- TWI499498B TWI499498B TW100109349A TW100109349A TWI499498B TW I499498 B TWI499498 B TW I499498B TW 100109349 A TW100109349 A TW 100109349A TW 100109349 A TW100109349 A TW 100109349A TW I499498 B TWI499498 B TW I499498B
- Authority
- TW
- Taiwan
- Prior art keywords
- mold
- resin
- gas
- pattern
- supply
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000011347 resin Substances 0.000 claims description 102
- 229920005989 resin Polymers 0.000 claims description 102
- 239000000758 substrate Substances 0.000 claims description 52
- 238000000034 method Methods 0.000 claims description 17
- 238000000926 separation method Methods 0.000 claims description 5
- 238000004049 embossing Methods 0.000 claims 1
- 239000007789 gas Substances 0.000 description 88
- 239000004793 Polystyrene Substances 0.000 description 15
- 238000010586 diagram Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 230000000994 depressogenic effect Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 238000007599 discharging Methods 0.000 description 3
- 229910052902 vermiculite Inorganic materials 0.000 description 3
- 235000019354 vermiculite Nutrition 0.000 description 3
- 239000010455 vermiculite Substances 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/0227—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould using pressure vessels, e.g. autoclaves, vulcanising pans
- B29C35/0233—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould using pressure vessels, e.g. autoclaves, vulcanising pans the curing continuing after removal from the mould
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
- B29C33/3857—Manufacturing moulds, e.g. shaping the mould surface by machining by making impressions of one or more parts of models, e.g. shaped articles and including possible subsequent assembly of the parts
- B29C33/3878—Manufacturing moulds, e.g. shaping the mould surface by machining by making impressions of one or more parts of models, e.g. shaped articles and including possible subsequent assembly of the parts used as masters for making successive impressions
- B29C33/3885—Manufacturing moulds, e.g. shaping the mould surface by machining by making impressions of one or more parts of models, e.g. shaped articles and including possible subsequent assembly of the parts used as masters for making successive impressions the mould parts being co-operating impressions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Thermal Sciences (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010068916A JP5618588B2 (ja) | 2010-03-24 | 2010-03-24 | インプリント方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201139119A TW201139119A (en) | 2011-11-16 |
| TWI499498B true TWI499498B (zh) | 2015-09-11 |
Family
ID=44202850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100109349A TWI499498B (zh) | 2010-03-24 | 2011-03-18 | 壓印設備及製造物品的方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US9122149B2 (enExample) |
| EP (1) | EP2369412B1 (enExample) |
| JP (1) | JP5618588B2 (enExample) |
| KR (1) | KR101374001B1 (enExample) |
| CN (1) | CN102200687B (enExample) |
| TW (1) | TWI499498B (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5679850B2 (ja) * | 2011-02-07 | 2015-03-04 | キヤノン株式会社 | インプリント装置、および、物品の製造方法 |
| JP5787691B2 (ja) * | 2011-09-21 | 2015-09-30 | キヤノン株式会社 | インプリント装置、それを用いた物品の製造方法 |
| JP5868215B2 (ja) * | 2012-02-27 | 2016-02-24 | キヤノン株式会社 | インプリント装置およびインプリント方法、それを用いた物品の製造方法 |
| JP6230353B2 (ja) * | 2013-09-25 | 2017-11-15 | キヤノン株式会社 | パターン形状を有する膜の製造方法、光学部品の製造方法、回路基板の製造方法、電子機器の製造方法 |
| JP6341883B2 (ja) * | 2014-06-27 | 2018-06-13 | キヤノン株式会社 | 位置検出装置、位置検出方法、インプリント装置及び物品の製造方法 |
| US10204780B2 (en) * | 2015-09-08 | 2019-02-12 | Canon Kabushiki Kaisha | Imprint apparatus, and article manufacturing method |
| JP7058951B2 (ja) * | 2017-05-24 | 2022-04-25 | キヤノン株式会社 | インプリント装置、および物品の製造方法 |
| JP7118674B2 (ja) * | 2018-03-12 | 2022-08-16 | キヤノン株式会社 | 型を用いて基板上の組成物を成形する成形装置、成形方法、および物品の製造方法 |
| WO2019188932A1 (ja) * | 2018-03-30 | 2019-10-03 | 富士フイルム株式会社 | 経皮吸収シート製造用のモールド、針状凸部を有する経皮吸収シートの製造装置及び方法 |
| US11951660B2 (en) * | 2021-10-11 | 2024-04-09 | Canon Kabushiki Kaisha | Shaping system including an evaporation cover, shaping process, and method of manufacturing an article |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090140458A1 (en) * | 2007-11-21 | 2009-06-04 | Molecular Imprints, Inc. | Porous template and imprinting stack for nano-imprint lithography |
| WO2010005032A1 (ja) * | 2008-07-09 | 2010-01-14 | 東洋合成工業株式会社 | パターン形成方法 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080164638A1 (en) * | 2006-11-28 | 2008-07-10 | Wei Zhang | Method and apparatus for rapid imprint lithography |
| JP3856117B2 (ja) * | 2002-01-28 | 2006-12-13 | 日本碍子株式会社 | 射出成形体の製造方法 |
| US7296519B2 (en) * | 2002-05-27 | 2007-11-20 | Koninklijke Philips Electronics N.V. | Method and device for transferring a pattern from stamp to a substrate |
| US7611348B2 (en) * | 2005-04-19 | 2009-11-03 | Asml Netherlands B.V. | Imprint lithography |
| KR100710851B1 (ko) | 2006-03-22 | 2007-04-23 | (주) 비앤피 사이언스 | 나노 임프린트 리소그래피 방법 및 장치 |
| JP4185941B2 (ja) | 2006-04-04 | 2008-11-26 | キヤノン株式会社 | ナノインプリント方法及びナノインプリント装置 |
| JP4872052B2 (ja) * | 2006-04-12 | 2012-02-08 | 独立行政法人産業技術総合研究所 | 微細金型コア部材 |
| JP4996150B2 (ja) * | 2006-07-07 | 2012-08-08 | 株式会社日立ハイテクノロジーズ | 微細構造転写装置および微細構造転写方法 |
| US8017183B2 (en) * | 2007-09-26 | 2011-09-13 | Eastman Kodak Company | Organosiloxane materials for selective area deposition of inorganic materials |
| TWI353961B (en) * | 2008-06-23 | 2011-12-11 | Univ Nat Cheng Kung | Micro-nano imprinting mould and imprinting process |
| CN102067039B (zh) * | 2008-08-08 | 2014-04-09 | Asml荷兰有限公司 | 光刻设备和器件制造方法 |
| US20100104852A1 (en) | 2008-10-23 | 2010-04-29 | Molecular Imprints, Inc. | Fabrication of High-Throughput Nano-Imprint Lithography Templates |
| NL2003600A (en) * | 2008-12-04 | 2010-06-07 | Asml Netherlands Bv | Imprint lithography apparatus and method. |
| JP2010149482A (ja) * | 2008-12-26 | 2010-07-08 | Toshiba Corp | インプリント用モールドおよびパターン形成方法 |
| JP2011161727A (ja) * | 2010-02-08 | 2011-08-25 | Fujifilm Corp | 光学成形体の成形型、光学成形体の成形方法、及び、レンズアレイ |
| US8541053B2 (en) * | 2010-07-08 | 2013-09-24 | Molecular Imprints, Inc. | Enhanced densification of silicon oxide layers |
-
2010
- 2010-03-24 JP JP2010068916A patent/JP5618588B2/ja active Active
-
2011
- 2011-03-16 US US13/049,207 patent/US9122149B2/en active Active
- 2011-03-16 EP EP11158403.3A patent/EP2369412B1/en active Active
- 2011-03-18 TW TW100109349A patent/TWI499498B/zh active
- 2011-03-23 KR KR1020110025774A patent/KR101374001B1/ko active Active
- 2011-03-24 CN CN201110071162.0A patent/CN102200687B/zh active Active
-
2014
- 2014-04-25 US US14/261,889 patent/US9280048B2/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090140458A1 (en) * | 2007-11-21 | 2009-06-04 | Molecular Imprints, Inc. | Porous template and imprinting stack for nano-imprint lithography |
| WO2010005032A1 (ja) * | 2008-07-09 | 2010-01-14 | 東洋合成工業株式会社 | パターン形成方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US9122149B2 (en) | 2015-09-01 |
| JP5618588B2 (ja) | 2014-11-05 |
| EP2369412B1 (en) | 2017-05-10 |
| KR101374001B1 (ko) | 2014-03-12 |
| US9280048B2 (en) | 2016-03-08 |
| CN102200687A (zh) | 2011-09-28 |
| EP2369412A2 (en) | 2011-09-28 |
| TW201139119A (en) | 2011-11-16 |
| US20140234467A1 (en) | 2014-08-21 |
| US20110236579A1 (en) | 2011-09-29 |
| JP2011201083A (ja) | 2011-10-13 |
| CN102200687B (zh) | 2016-08-24 |
| KR20110107288A (ko) | 2011-09-30 |
| EP2369412A3 (en) | 2012-06-13 |
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