CN102200687B - 压印设备和制造物品的方法 - Google Patents

压印设备和制造物品的方法 Download PDF

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Publication number
CN102200687B
CN102200687B CN201110071162.0A CN201110071162A CN102200687B CN 102200687 B CN102200687 B CN 102200687B CN 201110071162 A CN201110071162 A CN 201110071162A CN 102200687 B CN102200687 B CN 102200687B
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CN
China
Prior art keywords
mould
gas
resin
porous part
porous
Prior art date
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Active
Application number
CN201110071162.0A
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English (en)
Chinese (zh)
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CN102200687A (zh
Inventor
佐藤浩司
稻秀树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
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Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of CN102200687A publication Critical patent/CN102200687A/zh
Application granted granted Critical
Publication of CN102200687B publication Critical patent/CN102200687B/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/0227—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould using pressure vessels, e.g. autoclaves, vulcanising pans
    • B29C35/0233—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould using pressure vessels, e.g. autoclaves, vulcanising pans the curing continuing after removal from the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
    • B29C33/3857—Manufacturing moulds, e.g. shaping the mould surface by machining by making impressions of one or more parts of models, e.g. shaped articles and including possible subsequent assembly of the parts
    • B29C33/3878—Manufacturing moulds, e.g. shaping the mould surface by machining by making impressions of one or more parts of models, e.g. shaped articles and including possible subsequent assembly of the parts used as masters for making successive impressions
    • B29C33/3885—Manufacturing moulds, e.g. shaping the mould surface by machining by making impressions of one or more parts of models, e.g. shaped articles and including possible subsequent assembly of the parts used as masters for making successive impressions the mould parts being co-operating impressions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN201110071162.0A 2010-03-24 2011-03-24 压印设备和制造物品的方法 Active CN102200687B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010068916A JP5618588B2 (ja) 2010-03-24 2010-03-24 インプリント方法
JP2010-068916 2010-03-24

Publications (2)

Publication Number Publication Date
CN102200687A CN102200687A (zh) 2011-09-28
CN102200687B true CN102200687B (zh) 2016-08-24

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110071162.0A Active CN102200687B (zh) 2010-03-24 2011-03-24 压印设备和制造物品的方法

Country Status (6)

Country Link
US (2) US9122149B2 (enExample)
EP (1) EP2369412B1 (enExample)
JP (1) JP5618588B2 (enExample)
KR (1) KR101374001B1 (enExample)
CN (1) CN102200687B (enExample)
TW (1) TWI499498B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5679850B2 (ja) * 2011-02-07 2015-03-04 キヤノン株式会社 インプリント装置、および、物品の製造方法
JP5787691B2 (ja) * 2011-09-21 2015-09-30 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
JP5868215B2 (ja) * 2012-02-27 2016-02-24 キヤノン株式会社 インプリント装置およびインプリント方法、それを用いた物品の製造方法
JP6230353B2 (ja) * 2013-09-25 2017-11-15 キヤノン株式会社 パターン形状を有する膜の製造方法、光学部品の製造方法、回路基板の製造方法、電子機器の製造方法
JP6341883B2 (ja) * 2014-06-27 2018-06-13 キヤノン株式会社 位置検出装置、位置検出方法、インプリント装置及び物品の製造方法
US10204780B2 (en) * 2015-09-08 2019-02-12 Canon Kabushiki Kaisha Imprint apparatus, and article manufacturing method
JP7058951B2 (ja) * 2017-05-24 2022-04-25 キヤノン株式会社 インプリント装置、および物品の製造方法
JP7118674B2 (ja) * 2018-03-12 2022-08-16 キヤノン株式会社 型を用いて基板上の組成物を成形する成形装置、成形方法、および物品の製造方法
WO2019188932A1 (ja) * 2018-03-30 2019-10-03 富士フイルム株式会社 経皮吸収シート製造用のモールド、針状凸部を有する経皮吸収シートの製造装置及び方法
US11951660B2 (en) * 2021-10-11 2024-04-09 Canon Kabushiki Kaisha Shaping system including an evaporation cover, shaping process, and method of manufacturing an article

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1665684A (zh) * 2002-05-27 2005-09-07 皇家飞利浦电子股份有限公司 从印模到衬底转移图形的方法和装置
US7611348B2 (en) * 2005-04-19 2009-11-03 Asml Netherlands B.V. Imprint lithography

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080164638A1 (en) * 2006-11-28 2008-07-10 Wei Zhang Method and apparatus for rapid imprint lithography
JP3856117B2 (ja) * 2002-01-28 2006-12-13 日本碍子株式会社 射出成形体の製造方法
KR100710851B1 (ko) 2006-03-22 2007-04-23 (주) 비앤피 사이언스 나노 임프린트 리소그래피 방법 및 장치
JP4185941B2 (ja) 2006-04-04 2008-11-26 キヤノン株式会社 ナノインプリント方法及びナノインプリント装置
JP4872052B2 (ja) * 2006-04-12 2012-02-08 独立行政法人産業技術総合研究所 微細金型コア部材
JP4996150B2 (ja) * 2006-07-07 2012-08-08 株式会社日立ハイテクノロジーズ 微細構造転写装置および微細構造転写方法
US8017183B2 (en) * 2007-09-26 2011-09-13 Eastman Kodak Company Organosiloxane materials for selective area deposition of inorganic materials
KR101610180B1 (ko) * 2007-11-21 2016-04-07 캐논 나노테크놀로지즈 인코퍼레이티드 나노-임프린트 리소그래피용 다공성 주형 및 임프린팅 스택
TWI353961B (en) * 2008-06-23 2011-12-11 Univ Nat Cheng Kung Micro-nano imprinting mould and imprinting process
WO2010005032A1 (ja) 2008-07-09 2010-01-14 東洋合成工業株式会社 パターン形成方法
CN102067039B (zh) * 2008-08-08 2014-04-09 Asml荷兰有限公司 光刻设备和器件制造方法
US20100104852A1 (en) 2008-10-23 2010-04-29 Molecular Imprints, Inc. Fabrication of High-Throughput Nano-Imprint Lithography Templates
NL2003600A (en) * 2008-12-04 2010-06-07 Asml Netherlands Bv Imprint lithography apparatus and method.
JP2010149482A (ja) * 2008-12-26 2010-07-08 Toshiba Corp インプリント用モールドおよびパターン形成方法
JP2011161727A (ja) * 2010-02-08 2011-08-25 Fujifilm Corp 光学成形体の成形型、光学成形体の成形方法、及び、レンズアレイ
US8541053B2 (en) * 2010-07-08 2013-09-24 Molecular Imprints, Inc. Enhanced densification of silicon oxide layers

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1665684A (zh) * 2002-05-27 2005-09-07 皇家飞利浦电子股份有限公司 从印模到衬底转移图形的方法和装置
US7611348B2 (en) * 2005-04-19 2009-11-03 Asml Netherlands B.V. Imprint lithography

Also Published As

Publication number Publication date
US9122149B2 (en) 2015-09-01
JP5618588B2 (ja) 2014-11-05
EP2369412B1 (en) 2017-05-10
KR101374001B1 (ko) 2014-03-12
US9280048B2 (en) 2016-03-08
CN102200687A (zh) 2011-09-28
EP2369412A2 (en) 2011-09-28
TW201139119A (en) 2011-11-16
US20140234467A1 (en) 2014-08-21
US20110236579A1 (en) 2011-09-29
JP2011201083A (ja) 2011-10-13
TWI499498B (zh) 2015-09-11
KR20110107288A (ko) 2011-09-30
EP2369412A3 (en) 2012-06-13

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