TWI498408B - Attached film with copper foil - Google Patents

Attached film with copper foil Download PDF

Info

Publication number
TWI498408B
TWI498408B TW099122977A TW99122977A TWI498408B TW I498408 B TWI498408 B TW I498408B TW 099122977 A TW099122977 A TW 099122977A TW 99122977 A TW99122977 A TW 99122977A TW I498408 B TWI498408 B TW I498408B
Authority
TW
Taiwan
Prior art keywords
layer
copper
copper foil
resin composition
wiring board
Prior art date
Application number
TW099122977A
Other languages
English (en)
Chinese (zh)
Other versions
TW201124502A (en
Inventor
Hirohisa Narahashi
Tadahiko Yokota
Shigeo Nakamura
Original Assignee
Ajinomoto Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Kk filed Critical Ajinomoto Kk
Publication of TW201124502A publication Critical patent/TW201124502A/zh
Application granted granted Critical
Publication of TWI498408B publication Critical patent/TWI498408B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW099122977A 2009-07-14 2010-07-13 Attached film with copper foil TWI498408B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009165781 2009-07-14

Publications (2)

Publication Number Publication Date
TW201124502A TW201124502A (en) 2011-07-16
TWI498408B true TWI498408B (zh) 2015-09-01

Family

ID=43613411

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099122977A TWI498408B (zh) 2009-07-14 2010-07-13 Attached film with copper foil

Country Status (3)

Country Link
JP (1) JP5625566B2 (ko)
KR (1) KR101682886B1 (ko)
TW (1) TWI498408B (ko)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
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JP5204908B1 (ja) * 2012-03-26 2013-06-05 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板
CN103379726A (zh) * 2012-04-17 2013-10-30 景硕科技股份有限公司 线路积层板的复层线路结构
TW201349976A (zh) * 2012-05-31 2013-12-01 Zhen Ding Technology Co Ltd 多層線路板之製作方法
KR20150086541A (ko) * 2012-11-20 2015-07-28 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 캐리어 부착 동박
JP6149440B2 (ja) * 2013-03-13 2017-06-21 味の素株式会社 多層プリント配線板の製造方法およびそれに用いるキャリア金属箔付きプリプレグ含有複合材
WO2015012327A1 (ja) * 2013-07-23 2015-01-29 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、基材、樹脂基材、プリント配線板、銅張積層板及びプリント配線板の製造方法
JP6166614B2 (ja) * 2013-07-23 2017-07-19 Ｊｘ金属株式会社 表面処理銅箔、キャリア付銅箔、基材、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法
EP3447081B1 (en) 2016-04-20 2021-03-31 JSR Corporation Polymer, composition, molded article, cured product, and laminate
US11582860B2 (en) 2017-09-15 2023-02-14 Jsr Corporation Circuit board
EP3683050A4 (en) * 2017-09-15 2021-06-23 JSR Corporation HIGH FREQUENCY CIRCUIT LAMINATE, ITS MANUFACTURING PROCESS, AND STATUS SHEET B
CN112088089A (zh) * 2018-05-11 2020-12-15 昭和电工材料株式会社 导体基板、配线基板、可伸缩元件和配线基板的制造方法
JP7491668B2 (ja) * 2019-02-13 2024-05-28 味の素株式会社 樹脂組成物
JP7306449B2 (ja) * 2019-03-01 2023-07-11 Jsr株式会社 高周波回路用積層体、フレキシブルプリント基板、及び積層体捲回体
JP7276199B2 (ja) * 2020-03-03 2023-05-18 味の素株式会社 プリント配線板の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001244639A (ja) * 2000-02-28 2001-09-07 Nippon Zeon Co Ltd 多層回路基板用材料および多層回路基板の製造方法
TW200840839A (en) * 2007-01-23 2008-10-16 Ajinomoto Kk Process for production of multilayer printed wiring boards
TW200924965A (en) * 2007-09-11 2009-06-16 Ajinomoto Kk Film for metal film transfer and adhesive film with metal film

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0328389A (ja) * 1989-06-23 1991-02-06 Meiko Denshi Kogyo Kk 銅張積層板用銅箔層、その製造方法およびそれに用いるめっき浴
JPH08330728A (ja) * 1995-05-26 1996-12-13 Toyo Metaraijingu Kk フレキシブルプリント配線用基板
JP3295308B2 (ja) * 1996-06-28 2002-06-24 株式会社日鉱マテリアルズ 電解銅箔
JP4359797B2 (ja) * 1999-10-19 2009-11-04 日立化成工業株式会社 多層プリント配線板の製造方法
JP2003249751A (ja) * 2002-02-22 2003-09-05 Mitsubishi Gas Chem Co Inc アディティブ法多層プリント配線板の製造方法
JP2004319887A (ja) * 2003-04-18 2004-11-11 Mitsubishi Gas Chem Co Inc アディティブ用樹脂組成物基板へのレーザーによる孔形成方法及びプリント配線板の製造方法。
JP2005023340A (ja) * 2003-06-30 2005-01-27 Nihon Kagaku Sangyo Co Ltd プリント配線板のエッチング方法及びエッチング液
JP4081052B2 (ja) * 2003-12-05 2008-04-23 三井金属鉱業株式会社 プリント配線基板の製造法
JP4531403B2 (ja) * 2004-01-07 2010-08-25 アルパイン株式会社 車載用ディスクプレーヤのアクセス待機方法
US7341796B2 (en) 2004-02-17 2008-03-11 Nippon Mining & Metals Co., Ltd Copper foil having blackened surface or layer
JP4316413B2 (ja) * 2004-04-05 2009-08-19 日鉱金属株式会社 粗化処理面を備えた銅合金箔及び銅合金箔の粗化処理方法
JP4740692B2 (ja) * 2004-12-14 2011-08-03 三菱瓦斯化学株式会社 プリント配線板の製造法
JP2006218855A (ja) * 2005-01-12 2006-08-24 Hitachi Chem Co Ltd 接着補助剤付き金属箔並びにこれを用いたプリント配線板及びその製造方法
JP2007098732A (ja) * 2005-10-03 2007-04-19 Mitsui Mining & Smelting Co Ltd 表面処理銅箔及びその表面処理銅箔の製造方法並びにその表面処理銅箔を用いた銅張積層板
JP5023732B2 (ja) * 2006-03-23 2012-09-12 日立化成工業株式会社 積層板
JP2008028150A (ja) * 2006-07-21 2008-02-07 Sumitomo Metal Mining Co Ltd プリント配線基板の製造方法及び得られるプリント配線基板
JP5018181B2 (ja) * 2007-03-30 2012-09-05 味の素株式会社 多層プリント配線板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001244639A (ja) * 2000-02-28 2001-09-07 Nippon Zeon Co Ltd 多層回路基板用材料および多層回路基板の製造方法
TW200840839A (en) * 2007-01-23 2008-10-16 Ajinomoto Kk Process for production of multilayer printed wiring boards
TW200924965A (en) * 2007-09-11 2009-06-16 Ajinomoto Kk Film for metal film transfer and adhesive film with metal film

Also Published As

Publication number Publication date
JP5625566B2 (ja) 2014-11-19
JP2011040727A (ja) 2011-02-24
KR101682886B1 (ko) 2016-12-06
TW201124502A (en) 2011-07-16
KR20110006626A (ko) 2011-01-20

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