TWI496834B - 用於電用層板之儲存穩定的環氧樹脂組成物 - Google Patents
用於電用層板之儲存穩定的環氧樹脂組成物 Download PDFInfo
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- TWI496834B TWI496834B TW099135049A TW99135049A TWI496834B TW I496834 B TWI496834 B TW I496834B TW 099135049 A TW099135049 A TW 099135049A TW 99135049 A TW99135049 A TW 99135049A TW I496834 B TWI496834 B TW I496834B
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- epoxy resin
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- weight
- epoxy
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- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- PCMORTLOPMLEFB-UHFFFAOYSA-N sinapinic acid Natural products COC1=CC(C=CC(O)=O)=CC(OC)=C1O PCMORTLOPMLEFB-UHFFFAOYSA-N 0.000 description 1
- 239000011949 solid catalyst Substances 0.000 description 1
- 239000008247 solid mixture Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000007655 standard test method Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920006029 tetra-polymer Polymers 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- UJJLJRQIPMGXEZ-UHFFFAOYSA-N tetrahydro-2-furoic acid Chemical compound OC(=O)C1CCCO1 UJJLJRQIPMGXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000002411 thermogravimetry Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000012745 toughening agent Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/08—Impregnating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/22—Cyclic ethers having at least one atom other than carbon and hydrogen outside the ring
- C08G65/223—Cyclic ethers having at least one atom other than carbon and hydrogen outside the ring containing halogens
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
- Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US25885809P | 2009-11-06 | 2009-11-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201116576A TW201116576A (en) | 2011-05-16 |
| TWI496834B true TWI496834B (zh) | 2015-08-21 |
Family
ID=43707754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099135049A TWI496834B (zh) | 2009-11-06 | 2010-10-14 | 用於電用層板之儲存穩定的環氧樹脂組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8980376B2 (OSRAM) |
| EP (1) | EP2496632B1 (OSRAM) |
| JP (1) | JP5798566B2 (OSRAM) |
| KR (1) | KR20120115247A (OSRAM) |
| CN (2) | CN106751517A (OSRAM) |
| TW (1) | TWI496834B (OSRAM) |
| WO (1) | WO2011056352A1 (OSRAM) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102892302A (zh) * | 2010-05-13 | 2013-01-23 | 农业基因遗传学有限公司 | 褐色中脉玉米青贮饲料在肉牛中替换玉米的用途 |
| CN103045043A (zh) * | 2012-12-11 | 2013-04-17 | 金继典 | 一种酒瓶透明光亮面油及其制备工艺 |
| JP6447557B2 (ja) * | 2016-03-24 | 2019-01-09 | 日亜化学工業株式会社 | 発光装置の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW503246B (en) * | 1997-01-21 | 2002-09-21 | Dow Chemical Co | An epoxy resin composition and a process of producing a coated article use thereof |
| TW200718748A (en) * | 2005-11-09 | 2007-05-16 | Taiwan Union Technology Corp | Application of electrical material in high frequency and manufacturing method of the same |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6038421A (ja) | 1983-08-11 | 1985-02-28 | Mitsubishi Petrochem Co Ltd | エポキシ樹脂組成物 |
| US4550128A (en) | 1984-04-16 | 1985-10-29 | International Business Machines Corporation | Epoxy composition |
| MY131084A (en) | 1991-04-03 | 2007-07-31 | Dow Chemical Co | Epoxy resin compositions for use in electrical laminates. |
| US5670250A (en) | 1995-02-24 | 1997-09-23 | Polyclad Laminates, Inc. | Circuit board prepreg with reduced dielectric constant |
| JPH10168287A (ja) | 1996-12-06 | 1998-06-23 | Dainippon Ink & Chem Inc | エポキシ樹脂組成物 |
| GB9817799D0 (en) | 1998-08-14 | 1998-10-14 | Dow Deutschland Inc | Viscosity modifier for thermosetting resin compositioning |
| WO2000076764A1 (en) * | 1999-06-10 | 2000-12-21 | Isola Laminate Systems Corp. | Epoxy resin, styrene-maleic anhydride copolymer and flexibilizer |
| US6245696B1 (en) * | 1999-06-25 | 2001-06-12 | Honeywell International Inc. | Lasable bond-ply materials for high density printed wiring boards |
| US6361923B1 (en) * | 1999-08-17 | 2002-03-26 | International Business Machines Corporation | Laser ablatable material and its use |
| WO2001042359A1 (en) | 1999-12-13 | 2001-06-14 | Dow Global Technologies Inc. | Flame retardant phosphorus element-containing epoxy resin compositions |
| DE50201326D1 (de) * | 2002-10-19 | 2004-11-18 | Leuna Harze Gmbh | Härtbare Epoxidharzzusammensetzung |
| US6855738B2 (en) | 2003-06-06 | 2005-02-15 | Dow Global Technologies Inc. | Nanoporous laminates |
| CN101341181B (zh) | 2005-12-22 | 2013-09-04 | 陶氏环球技术有限责任公司 | 可固化环氧树脂组合物及由其制造的层压材料 |
| EP2084206A2 (en) * | 2006-10-19 | 2009-08-05 | Dow Global Technologies Inc. | Curable epoxy resin compositions having improved adhesion to metal substrates and processes for making and using the same |
| US8313571B2 (en) | 2007-09-21 | 2012-11-20 | Microchem Corp. | Compositions and processes for manufacturing printed electronics |
| JP5235155B2 (ja) * | 2009-04-08 | 2013-07-10 | パナソニック株式会社 | 微細樹脂構造体及び光電回路基板の製造方法、微細樹脂構造体及び光電回路基板 |
-
2010
- 2010-10-08 EP EP20100766197 patent/EP2496632B1/en not_active Not-in-force
- 2010-10-08 KR KR20127014586A patent/KR20120115247A/ko not_active Ceased
- 2010-10-08 CN CN201611176356.6A patent/CN106751517A/zh active Pending
- 2010-10-08 JP JP2012537890A patent/JP5798566B2/ja not_active Expired - Fee Related
- 2010-10-08 CN CN2010800604266A patent/CN102695744A/zh active Pending
- 2010-10-08 US US13/505,126 patent/US8980376B2/en not_active Expired - Fee Related
- 2010-10-08 WO PCT/US2010/052023 patent/WO2011056352A1/en not_active Ceased
- 2010-10-14 TW TW099135049A patent/TWI496834B/zh not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW503246B (en) * | 1997-01-21 | 2002-09-21 | Dow Chemical Co | An epoxy resin composition and a process of producing a coated article use thereof |
| TW200718748A (en) * | 2005-11-09 | 2007-05-16 | Taiwan Union Technology Corp | Application of electrical material in high frequency and manufacturing method of the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013510224A (ja) | 2013-03-21 |
| US20120225212A1 (en) | 2012-09-06 |
| JP5798566B2 (ja) | 2015-10-21 |
| WO2011056352A1 (en) | 2011-05-12 |
| KR20120115247A (ko) | 2012-10-17 |
| TW201116576A (en) | 2011-05-16 |
| EP2496632A1 (en) | 2012-09-12 |
| CN102695744A (zh) | 2012-09-26 |
| CN106751517A (zh) | 2017-05-31 |
| EP2496632B1 (en) | 2015-04-29 |
| US8980376B2 (en) | 2015-03-17 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |