TWI494981B - 改進的微研磨方法 - Google Patents

改進的微研磨方法 Download PDF

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Publication number
TWI494981B
TWI494981B TW102134178A TW102134178A TWI494981B TW I494981 B TWI494981 B TW I494981B TW 102134178 A TW102134178 A TW 102134178A TW 102134178 A TW102134178 A TW 102134178A TW I494981 B TWI494981 B TW I494981B
Authority
TW
Taiwan
Prior art keywords
abrasive
wafer
grinding
substrate
plate
Prior art date
Application number
TW102134178A
Other languages
English (en)
Chinese (zh)
Other versions
TW201413809A (zh
Inventor
Robert A Rizzuto
Ajay Krishnan
Christopher Arcona
Anand Tanikella
Original Assignee
Saint Gobain Ceramics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint Gobain Ceramics filed Critical Saint Gobain Ceramics
Publication of TW201413809A publication Critical patent/TW201413809A/zh
Application granted granted Critical
Publication of TWI494981B publication Critical patent/TWI494981B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
TW102134178A 2012-09-28 2013-09-23 改進的微研磨方法 TWI494981B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201261707528P 2012-09-28 2012-09-28

Publications (2)

Publication Number Publication Date
TW201413809A TW201413809A (zh) 2014-04-01
TWI494981B true TWI494981B (zh) 2015-08-01

Family

ID=50385635

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102134178A TWI494981B (zh) 2012-09-28 2013-09-23 改進的微研磨方法

Country Status (8)

Country Link
US (1) US20140094094A1 (ja)
JP (1) JP6120974B2 (ja)
KR (1) KR20150056633A (ja)
CN (1) CN104813448A (ja)
IN (1) IN2015DN03023A (ja)
RU (1) RU2015114097A (ja)
TW (1) TWI494981B (ja)
WO (1) WO2014052130A1 (ja)

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JP2019141974A (ja) * 2018-02-22 2019-08-29 株式会社ミズホ 両面ラップ盤とそれを用いた薄肉ファインセラミックスの研削方法
CN109012918B (zh) * 2018-10-12 2024-01-12 河南先导机械力化学研究院有限公司 行星球磨机
CN111098224B (zh) * 2018-10-26 2022-08-26 东莞新科技术研究开发有限公司 半导体基板及其表面研磨方法
US11342256B2 (en) 2019-01-24 2022-05-24 Applied Materials, Inc. Method of fine redistribution interconnect formation for advanced packaging applications
CN110018028B (zh) * 2019-04-17 2023-01-13 宸鸿科技(厦门)有限公司 一种蓝宝石基材电子组件的金相切片样品制备方法
IT201900006736A1 (it) 2019-05-10 2020-11-10 Applied Materials Inc Procedimenti di fabbricazione di package
IT201900006740A1 (it) 2019-05-10 2020-11-10 Applied Materials Inc Procedimenti di strutturazione di substrati
US11931855B2 (en) 2019-06-17 2024-03-19 Applied Materials, Inc. Planarization methods for packaging substrates
JP7236970B2 (ja) * 2019-09-23 2023-03-10 日本特殊陶業株式会社 セラミックヒータ及びグロープラグ
US11862546B2 (en) 2019-11-27 2024-01-02 Applied Materials, Inc. Package core assembly and fabrication methods
CN110900342B (zh) * 2019-11-29 2020-12-08 上海磐盟电子材料有限公司 一种磨片机
US11257790B2 (en) 2020-03-10 2022-02-22 Applied Materials, Inc. High connectivity device stacking
US11454884B2 (en) 2020-04-15 2022-09-27 Applied Materials, Inc. Fluoropolymer stamp fabrication method
US11400545B2 (en) 2020-05-11 2022-08-02 Applied Materials, Inc. Laser ablation for package fabrication
CN111761505B (zh) * 2020-07-10 2021-07-27 浙江中晶科技股份有限公司 一种硅片双面磨削设备及其生产工艺
US11232951B1 (en) 2020-07-14 2022-01-25 Applied Materials, Inc. Method and apparatus for laser drilling blind vias
US11676832B2 (en) 2020-07-24 2023-06-13 Applied Materials, Inc. Laser ablation system for package fabrication
US11521937B2 (en) 2020-11-16 2022-12-06 Applied Materials, Inc. Package structures with built-in EMI shielding
US11404318B2 (en) 2020-11-20 2022-08-02 Applied Materials, Inc. Methods of forming through-silicon vias in substrates for advanced packaging
JP7240013B2 (ja) * 2021-03-19 2023-03-15 大昌精機株式会社 立型研削盤
US11705365B2 (en) 2021-05-18 2023-07-18 Applied Materials, Inc. Methods of micro-via formation for advanced packaging
CN115070512B (zh) * 2022-03-11 2024-04-26 北京爱瑞思光学仪器有限公司 一种锗晶片的双抛工艺、装置及锗晶片
CN114800109A (zh) * 2022-06-27 2022-07-29 苏州博宏源机械制造有限公司 双面抛光机及其抛光方法

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Also Published As

Publication number Publication date
KR20150056633A (ko) 2015-05-26
WO2014052130A1 (en) 2014-04-03
US20140094094A1 (en) 2014-04-03
JP6120974B2 (ja) 2017-04-26
IN2015DN03023A (ja) 2015-10-02
TW201413809A (zh) 2014-04-01
RU2015114097A (ru) 2016-11-20
JP2015531318A (ja) 2015-11-02
CN104813448A (zh) 2015-07-29

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