TWI492684B - 用於處理待處理平面材料的方法與組件以及用於移除或延遲處理液的裝置 - Google Patents

用於處理待處理平面材料的方法與組件以及用於移除或延遲處理液的裝置 Download PDF

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Publication number
TWI492684B
TWI492684B TW099115101A TW99115101A TWI492684B TW I492684 B TWI492684 B TW I492684B TW 099115101 A TW099115101 A TW 099115101A TW 99115101 A TW99115101 A TW 99115101A TW I492684 B TWI492684 B TW I492684B
Authority
TW
Taiwan
Prior art keywords
treated
roller
gap
treatment liquid
conveying
Prior art date
Application number
TW099115101A
Other languages
English (en)
Chinese (zh)
Other versions
TW201110838A (en
Inventor
Henry Kunze
Ferdinand Wiener
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of TW201110838A publication Critical patent/TW201110838A/zh
Application granted granted Critical
Publication of TWI492684B publication Critical patent/TWI492684B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/06—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface with a blast of gas or vapour
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C3/00—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material
    • B05C3/02—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material
    • B05C3/09—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material for treating separate articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0642—Anodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coating Apparatus (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Rollers For Roller Conveyors For Transfer (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Treatment Of Fiber Materials (AREA)
  • Advancing Webs (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
TW099115101A 2009-05-13 2010-05-12 用於處理待處理平面材料的方法與組件以及用於移除或延遲處理液的裝置 TWI492684B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102009021042 2009-05-13

Publications (2)

Publication Number Publication Date
TW201110838A TW201110838A (en) 2011-03-16
TWI492684B true TWI492684B (zh) 2015-07-11

Family

ID=42289719

Family Applications (2)

Application Number Title Priority Date Filing Date
TW099115101A TWI492684B (zh) 2009-05-13 2010-05-12 用於處理待處理平面材料的方法與組件以及用於移除或延遲處理液的裝置
TW099115099A TWI487442B (zh) 2009-05-13 2010-05-12 用於處理待處理平面材料的方法、處理台與組件

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW099115099A TWI487442B (zh) 2009-05-13 2010-05-12 用於處理待處理平面材料的方法、處理台與組件

Country Status (9)

Country Link
US (2) US9016230B2 (enExample)
EP (2) EP2430890B1 (enExample)
JP (2) JP5410598B2 (enExample)
KR (2) KR101284197B1 (enExample)
CN (2) CN102422728B (enExample)
BR (2) BRPI1011372B1 (enExample)
MY (2) MY153831A (enExample)
TW (2) TWI492684B (enExample)
WO (2) WO2010130444A1 (enExample)

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US20140020723A1 (en) * 2012-07-12 2014-01-23 James Murphy Mat cleaning system
DE102013207343B3 (de) * 2013-04-23 2014-08-28 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum nasschemischen Behandeln von flächigem Behandlungsgut
EP2854490A1 (en) 2013-09-25 2015-04-01 ATOTECH Deutschland GmbH Method and apparatus for a wet-chemical or electrochemical treatment
EP2886685A1 (en) * 2013-12-20 2015-06-24 ATOTECH Deutschland GmbH Device for accumulating a treatment liquid inside of a treatment area of a horizontal processing apparatus for a galvanic or wet-chemical metal deposition
ES2948109T3 (es) 2015-06-30 2023-08-31 Saint Gobain Performance Plastics Corp Cojinete plano
JP6070804B2 (ja) * 2015-10-21 2017-02-01 Ｊｆｅスチール株式会社 基材へのスラリー塗布方法及び塗布装置
CN105543945B (zh) * 2015-12-09 2018-05-15 东莞市威力固电路板设备有限公司 挤水辊装置
CN105780096B (zh) * 2016-05-25 2018-06-22 南通汇丰电子科技有限公司 一种电镀传动装置
KR102731377B1 (ko) * 2016-11-28 2024-11-15 엘지디스플레이 주식회사 롤투롤 제조장치
TWI620905B (zh) * 2017-06-14 2018-04-11 住華科技股份有限公司 除液裝置
CN109323162B (zh) * 2018-06-27 2023-10-13 深圳市烨光璇电子科技有限公司 背光模组生产线
CN110834345B (zh) * 2018-08-17 2022-09-09 扬博科技股份有限公司 可操控夹具启闭的致动装置
WO2021030500A2 (en) * 2019-08-12 2021-02-18 Louisiana-Pacific Corporation Coating process for engineered fence panels or pickets

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JPH09326342A (ja) * 1996-04-01 1997-12-16 Dainippon Screen Mfg Co Ltd 基板処理装置

Also Published As

Publication number Publication date
KR20120010276A (ko) 2012-02-02
WO2010130444A1 (de) 2010-11-18
KR20120030414A (ko) 2012-03-28
EP2430890B1 (de) 2014-12-10
JP2012527103A (ja) 2012-11-01
EP2430889A1 (de) 2012-03-21
US20120111365A1 (en) 2012-05-10
KR101284197B1 (ko) 2013-07-09
TW201108890A (en) 2011-03-01
CN102422728B (zh) 2015-04-01
BRPI1011369A2 (pt) 2016-03-15
TW201110838A (en) 2011-03-16
JP5410598B2 (ja) 2014-02-05
EP2430889B1 (de) 2014-04-30
MY153831A (en) 2015-03-31
CN102422727B (zh) 2015-05-13
MY156875A (en) 2016-04-15
BRPI1011372B1 (pt) 2019-12-10
HK1167985A1 (en) 2012-12-14
US9016230B2 (en) 2015-04-28
BRPI1011372A2 (pt) 2016-03-15
KR101341146B1 (ko) 2013-12-11
CN102422728A (zh) 2012-04-18
JP5512799B2 (ja) 2014-06-04
WO2010130445A1 (de) 2010-11-18
EP2430890A1 (de) 2012-03-21
JP2012527104A (ja) 2012-11-01
US9713265B2 (en) 2017-07-18
CN102422727A (zh) 2012-04-18
US20120080322A1 (en) 2012-04-05
TWI487442B (zh) 2015-06-01

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