BRPI1011372B1 - método e montagem para tratar um material plano a ser tratado, e dispositivo para remover ou reter líquido de tratamento e método para produzir uma placa de circuito - Google Patents
método e montagem para tratar um material plano a ser tratado, e dispositivo para remover ou reter líquido de tratamento e método para produzir uma placa de circuito Download PDFInfo
- Publication number
- BRPI1011372B1 BRPI1011372B1 BRPI1011372A BRPI1011372B1 BR PI1011372 B1 BRPI1011372 B1 BR PI1011372B1 BR PI1011372 A BRPI1011372 A BR PI1011372A BR PI1011372 B1 BRPI1011372 B1 BR PI1011372B1
- Authority
- BR
- Brazil
- Prior art keywords
- treated
- treatment liquid
- transport
- cylinder
- retaining
- Prior art date
Links
- 239000000463 material Substances 0.000 title claims abstract description 372
- 239000007788 liquid Substances 0.000 title claims abstract description 260
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 239000000126 substance Substances 0.000 claims abstract description 12
- 239000012530 fluid Substances 0.000 claims description 41
- 230000014759 maintenance of location Effects 0.000 claims description 22
- 230000002093 peripheral effect Effects 0.000 abstract description 9
- 230000004888 barrier function Effects 0.000 description 22
- 230000006835 compression Effects 0.000 description 14
- 238000007906 compression Methods 0.000 description 14
- 238000013461 design Methods 0.000 description 13
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 230000000717 retained effect Effects 0.000 description 6
- 238000000429 assembly Methods 0.000 description 5
- 230000000712 assembly Effects 0.000 description 5
- 238000009825 accumulation Methods 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000000109 continuous material Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000008093 supporting effect Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 238000007704 wet chemistry method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/06—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface with a blast of gas or vapour
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C3/00—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material
- B05C3/02—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material
- B05C3/09—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material for treating separate articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0621—In horizontal cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0642—Anodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
- H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1509—Horizontally held PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coating Apparatus (AREA)
- Electroplating Methods And Accessories (AREA)
- Rollers For Roller Conveyors For Transfer (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Treatment Of Fiber Materials (AREA)
- Advancing Webs (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009021042 | 2009-05-13 | ||
| PCT/EP2010/002939 WO2010130445A1 (de) | 2009-05-13 | 2010-05-12 | Verfahren und anlage zum behandeln von flächigem behandlungsgut und vorrichtung zum entfernen oder abhalten von behandlungsflüssigkeit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| BRPI1011372A2 BRPI1011372A2 (pt) | 2016-03-15 |
| BRPI1011372B1 true BRPI1011372B1 (pt) | 2019-12-10 |
Family
ID=42289719
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI1011372 BRPI1011372B1 (pt) | 2009-05-13 | 2010-05-12 | método e montagem para tratar um material plano a ser tratado, e dispositivo para remover ou reter líquido de tratamento e método para produzir uma placa de circuito |
| BRPI1011369A BRPI1011369A2 (pt) | 2009-05-13 | 2010-05-12 | método, estação de tratamento e montagem para tratar um material plano a ser tratado |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI1011369A BRPI1011369A2 (pt) | 2009-05-13 | 2010-05-12 | método, estação de tratamento e montagem para tratar um material plano a ser tratado |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US9016230B2 (enExample) |
| EP (2) | EP2430890B1 (enExample) |
| JP (2) | JP5410598B2 (enExample) |
| KR (2) | KR101284197B1 (enExample) |
| CN (2) | CN102422728B (enExample) |
| BR (2) | BRPI1011372B1 (enExample) |
| MY (2) | MY153831A (enExample) |
| TW (2) | TWI492684B (enExample) |
| WO (2) | WO2010130444A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140020723A1 (en) * | 2012-07-12 | 2014-01-23 | James Murphy | Mat cleaning system |
| DE102013207343B3 (de) * | 2013-04-23 | 2014-08-28 | Atotech Deutschland Gmbh | Vorrichtung und Verfahren zum nasschemischen Behandeln von flächigem Behandlungsgut |
| EP2854490A1 (en) | 2013-09-25 | 2015-04-01 | ATOTECH Deutschland GmbH | Method and apparatus for a wet-chemical or electrochemical treatment |
| EP2886685A1 (en) * | 2013-12-20 | 2015-06-24 | ATOTECH Deutschland GmbH | Device for accumulating a treatment liquid inside of a treatment area of a horizontal processing apparatus for a galvanic or wet-chemical metal deposition |
| ES2948109T3 (es) | 2015-06-30 | 2023-08-31 | Saint Gobain Performance Plastics Corp | Cojinete plano |
| JP6070804B2 (ja) * | 2015-10-21 | 2017-02-01 | Ｊｆｅスチール株式会社 | 基材へのスラリー塗布方法及び塗布装置 |
| CN105543945B (zh) * | 2015-12-09 | 2018-05-15 | 东莞市威力固电路板设备有限公司 | 挤水辊装置 |
| CN105780096B (zh) * | 2016-05-25 | 2018-06-22 | 南通汇丰电子科技有限公司 | 一种电镀传动装置 |
| KR102731377B1 (ko) * | 2016-11-28 | 2024-11-15 | 엘지디스플레이 주식회사 | 롤투롤 제조장치 |
| TWI620905B (zh) * | 2017-06-14 | 2018-04-11 | 住華科技股份有限公司 | 除液裝置 |
| CN109323162B (zh) * | 2018-06-27 | 2023-10-13 | 深圳市烨光璇电子科技有限公司 | 背光模组生产线 |
| CN110834345B (zh) * | 2018-08-17 | 2022-09-09 | 扬博科技股份有限公司 | 可操控夹具启闭的致动装置 |
| WO2021030500A2 (en) * | 2019-08-12 | 2021-02-18 | Louisiana-Pacific Corporation | Coating process for engineered fence panels or pickets |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1816645B2 (de) * | 1968-12-23 | 1971-03-11 | Verfahren und vorrichtung zum kontinuierlichen selektiven galvanisieren von baendern | |
| GB1359418A (en) | 1971-01-20 | 1974-07-10 | Fuji Photo Film Co Ltd | Apparatus for squeegeeing liquid off sheet material |
| JPS5845399A (ja) * | 1981-09-10 | 1983-03-16 | Electroplating Eng Of Japan Co | メツキ装置 |
| DE3603856C2 (de) | 1986-02-07 | 1994-05-05 | Bosch Gmbh Robert | Verfahren und Vorrichtung zur Galvanisierung von ebenen Werkstücken wie Leiterplatten |
| DE3645319C3 (de) | 1986-07-19 | 2000-07-27 | Atotech Deutschland Gmbh | Anordnung und Verfahren zum elektrolytischen Behandeln von plattenförmigen Gegenständen |
| US4859298A (en) * | 1988-12-07 | 1989-08-22 | Chemcut Corporation | Process and apparatus for electrolytically removing protective layers from sheet metal substrate |
| US5007445A (en) * | 1990-02-26 | 1991-04-16 | Advanced Systems Incorporated | Dynamic flood conveyor with weir |
| EP0513632B1 (de) | 1991-05-17 | 1995-07-19 | SUNDWIGER EISENHÜTTE MASCHINENFABRIK GmbH & CO. | Vorrichtung zum Entfernen von Flüssigkeit von der Oberfläche eines bewegten Bandes |
| EP0652982B1 (de) | 1992-08-01 | 1996-09-25 | ATOTECH Deutschland GmbH | Verfahren zum elektrolytischen behandeln von insbesondere flachem behandlungsgut, sowie anordnung, insbesondere zur durchführung dieses verfahrens |
| DE4337811A1 (de) | 1993-11-05 | 1995-05-11 | Philips Patentverwaltung | Anordnung zum Transportieren von gedruckten Schaltungsplatten |
| DE4337988A1 (de) | 1993-11-06 | 1995-05-11 | Hoellmueller Maschbau H | Verfahren zur Herstellung von Multilayern sowie Vorrichtung zur Durchführung dieses Verfahrens |
| DE4402596C2 (de) | 1994-01-28 | 1997-03-27 | Atotech Deutschland Gmbh | Elektrolytisches Verfahren in horizontalen Durchlaufanlagen und Vorrichtung zur Durchführung desselben |
| JP3571074B2 (ja) * | 1994-03-08 | 2004-09-29 | 三菱製紙株式会社 | プリント配線板の現像方法 |
| GB2288381A (en) | 1994-04-08 | 1995-10-18 | Finishing Services Ltd | Conveying apparatus for printed circuit boards |
| JP3441559B2 (ja) * | 1995-04-25 | 2003-09-02 | 大日本スクリーン製造株式会社 | 基板の液切り装置 |
| DE19519211B4 (de) * | 1995-05-25 | 2010-05-12 | Höllmüller Maschinenbau GmbH | Verfahren zur Behandlung von Gegenständen, insbesondere von Leiterplatten, sowie Vorrichtung zur Durchführung dieses Verfahrens |
| DE19522733A1 (de) | 1995-06-22 | 1997-01-02 | Schmid Gmbh & Co Geb | Verfahren zum Transport plattenförmiger Gegenstände, insbesondere Leiterplatten |
| US5741361A (en) | 1995-07-06 | 1998-04-21 | Allan H. McKinnon | Method for fluid transport |
| DE19539606A1 (de) | 1995-10-25 | 1997-05-28 | Hoellmueller Maschbau H | Verfahren und Vorrichtung zum Behandeln plattenförmiger Gegenstände, insbesondere von elektronischen Leiterplatten oder dergleichen |
| JP3394649B2 (ja) * | 1996-04-01 | 2003-04-07 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JPH09331135A (ja) * | 1996-06-12 | 1997-12-22 | Wako Denshi Kk | プリント基板のスルーホールの穴埋め方法及びその装置 |
| DE19717512C3 (de) | 1997-04-25 | 2003-06-18 | Atotech Deutschland Gmbh | Vorrichtung zum Galvanisieren von Leiterplatten unter konstanten Bedingungen in Durchlaufanlagen |
| DE19802755A1 (de) | 1998-01-26 | 1999-07-29 | Hoellmueller Maschbau H | Vorrichtung zum Behandeln plattenförmiger Gegenstände, insbesondere elektronischer Leiterplatten, mit einer Behandlungsflüssigkeit |
| TW438906B (en) * | 1998-06-11 | 2001-06-07 | Kazuo Ohba | Continuous plating apparatus |
| DE19939740A1 (de) | 1999-03-13 | 2000-09-14 | Schaefer Hans Juergen | Vorrichtung zur Beschichtung von Leiterplatten unterschiedlicher Breite mit thermisch und mittels Strahlen härtbaren Beschichtungsmitteln in variablen Beschichtungsdicken |
| GB9912773D0 (en) * | 1999-06-02 | 1999-08-04 | Lymn Peter P A | Fluid knife |
| DE10019713C2 (de) | 2000-04-20 | 2003-11-13 | Atotech Deutschland Gmbh | Vorrichtung und Verfahren zur elektrischen Kontaktierung von elektrolytisch zu behandelndem Gut in Durchlaufanlagen |
| JP4838929B2 (ja) | 2000-09-25 | 2011-12-14 | 芝浦メカトロニクス株式会社 | 基板の処理装置 |
| DE10206660C1 (de) * | 2002-02-12 | 2003-07-24 | Atotech Deutschland Gmbh | Vorrichtung und Verfahren zum Transport von flachem Behandlungsgut in Durchlaufanlagen |
| JP3906998B2 (ja) | 2003-09-30 | 2007-04-18 | コンドーセイコー株式会社 | 歯形部品の製造方法 |
| DE10358149B3 (de) * | 2003-12-10 | 2005-05-12 | Höllmüller Maschinenbau GmbH | Verfahren und Vorrichtung zum berührungslosen Behandeln von ebenem Gut in Durchlaufanlagen |
| DE102005038450A1 (de) * | 2005-08-03 | 2007-02-08 | Gebr. Schmid Gmbh & Co. | Einrichtung zur Behandlung von Substraten, insbesondere zur Galvanisierung von Substraten |
| DE102005039100A1 (de) | 2005-08-09 | 2007-02-15 | Gebr. Schmid Gmbh & Co. | Einrichtung zur Aufnahme bzw. Halterung mehrerer Substrate und Galvanisiereinrichtung |
| JP2008085119A (ja) * | 2006-09-28 | 2008-04-10 | Tokyo Kakoki Kk | 薬液処理装置 |
| JP2008137733A (ja) * | 2006-11-30 | 2008-06-19 | Tokyo Kakoki Kk | 表面処理装置のコンベア |
| DE102007035086B3 (de) | 2007-07-26 | 2008-10-30 | Rena Sondermaschinen Gmbh | Vorrichtung und Verfahren zur Oberflächenbehandlung von Gut in Durchlaufanlagen |
| DE102007038116A1 (de) | 2007-07-30 | 2009-02-05 | Gebr. Schmid Gmbh & Co. | Haltemittel, Vorrichtung und Verfahren zum Transport von Substraten, insbesondere Leiterplatten |
| JP2009221580A (ja) | 2008-03-18 | 2009-10-01 | Fuji Yuatsu Seiki Kk | 電解銅箔めっき処理装置のボトムローラーの回転方法と軸封装置 |
-
2010
- 2010-05-12 JP JP2012510167A patent/JP5410598B2/ja not_active Expired - Fee Related
- 2010-05-12 MY MYPI2011005365A patent/MY153831A/en unknown
- 2010-05-12 CN CN201080021231.0A patent/CN102422728B/zh active Active
- 2010-05-12 US US13/320,504 patent/US9016230B2/en active Active
- 2010-05-12 WO PCT/EP2010/002938 patent/WO2010130444A1/de not_active Ceased
- 2010-05-12 BR BRPI1011372 patent/BRPI1011372B1/pt active IP Right Grant
- 2010-05-12 US US13/320,522 patent/US9713265B2/en not_active Expired - Fee Related
- 2010-05-12 MY MYPI2011005364A patent/MY156875A/en unknown
- 2010-05-12 TW TW099115101A patent/TWI492684B/zh not_active IP Right Cessation
- 2010-05-12 EP EP10721985.9A patent/EP2430890B1/de not_active Not-in-force
- 2010-05-12 CN CN201080021230.6A patent/CN102422727B/zh active Active
- 2010-05-12 KR KR1020117029494A patent/KR101284197B1/ko not_active Expired - Fee Related
- 2010-05-12 JP JP2012510166A patent/JP5512799B2/ja active Active
- 2010-05-12 KR KR1020117029497A patent/KR101341146B1/ko not_active Expired - Fee Related
- 2010-05-12 BR BRPI1011369A patent/BRPI1011369A2/pt active IP Right Grant
- 2010-05-12 EP EP10721984.2A patent/EP2430889B1/de not_active Not-in-force
- 2010-05-12 WO PCT/EP2010/002939 patent/WO2010130445A1/de not_active Ceased
- 2010-05-12 TW TW099115099A patent/TWI487442B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20120010276A (ko) | 2012-02-02 |
| TWI492684B (zh) | 2015-07-11 |
| WO2010130444A1 (de) | 2010-11-18 |
| KR20120030414A (ko) | 2012-03-28 |
| EP2430890B1 (de) | 2014-12-10 |
| JP2012527103A (ja) | 2012-11-01 |
| EP2430889A1 (de) | 2012-03-21 |
| US20120111365A1 (en) | 2012-05-10 |
| KR101284197B1 (ko) | 2013-07-09 |
| TW201108890A (en) | 2011-03-01 |
| CN102422728B (zh) | 2015-04-01 |
| BRPI1011369A2 (pt) | 2016-03-15 |
| TW201110838A (en) | 2011-03-16 |
| JP5410598B2 (ja) | 2014-02-05 |
| EP2430889B1 (de) | 2014-04-30 |
| MY153831A (en) | 2015-03-31 |
| CN102422727B (zh) | 2015-05-13 |
| MY156875A (en) | 2016-04-15 |
| HK1167985A1 (en) | 2012-12-14 |
| US9016230B2 (en) | 2015-04-28 |
| BRPI1011372A2 (pt) | 2016-03-15 |
| KR101341146B1 (ko) | 2013-12-11 |
| CN102422728A (zh) | 2012-04-18 |
| JP5512799B2 (ja) | 2014-06-04 |
| WO2010130445A1 (de) | 2010-11-18 |
| EP2430890A1 (de) | 2012-03-21 |
| JP2012527104A (ja) | 2012-11-01 |
| US9713265B2 (en) | 2017-07-18 |
| CN102422727A (zh) | 2012-04-18 |
| US20120080322A1 (en) | 2012-04-05 |
| TWI487442B (zh) | 2015-06-01 |
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