TWI491451B - A substrate heating apparatus, a liquid material coating apparatus provided with the apparatus, and a substrate heating method - Google Patents
A substrate heating apparatus, a liquid material coating apparatus provided with the apparatus, and a substrate heating method Download PDFInfo
- Publication number
- TWI491451B TWI491451B TW098122529A TW98122529A TWI491451B TW I491451 B TWI491451 B TW I491451B TW 098122529 A TW098122529 A TW 098122529A TW 98122529 A TW98122529 A TW 98122529A TW I491451 B TWI491451 B TW I491451B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- heating
- opening
- contact
- gas
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims description 234
- 238000010438 heat treatment Methods 0.000 title claims description 230
- 239000011248 coating agent Substances 0.000 title claims description 66
- 238000000576 coating method Methods 0.000 title claims description 66
- 238000000034 method Methods 0.000 title claims description 21
- 239000011344 liquid material Substances 0.000 title claims description 17
- 230000007246 mechanism Effects 0.000 claims description 53
- 230000003028 elevating effect Effects 0.000 claims description 13
- 230000032258 transport Effects 0.000 claims description 13
- 230000007723 transport mechanism Effects 0.000 claims description 11
- 230000000630 rising effect Effects 0.000 claims description 8
- 238000007599 discharging Methods 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 50
- 235000012431 wafers Nutrition 0.000 description 23
- 239000004065 semiconductor Substances 0.000 description 21
- 239000011347 resin Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 230000008859 change Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 238000004891 communication Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Coating Apparatus (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008176071A JP5465846B2 (ja) | 2008-07-04 | 2008-07-04 | 基板加熱装置、それを備える液体材料塗布装置および基板加熱方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201006568A TW201006568A (en) | 2010-02-16 |
| TWI491451B true TWI491451B (zh) | 2015-07-11 |
Family
ID=41465715
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098122529A TWI491451B (zh) | 2008-07-04 | 2009-07-03 | A substrate heating apparatus, a liquid material coating apparatus provided with the apparatus, and a substrate heating method |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP5465846B2 (xx) |
| KR (1) | KR101568238B1 (xx) |
| CN (1) | CN102077333B (xx) |
| HK (1) | HK1154118A1 (xx) |
| TW (1) | TWI491451B (xx) |
| WO (1) | WO2010001608A1 (xx) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9029740B2 (en) * | 2013-01-15 | 2015-05-12 | Nordson Corporation | Air impingement heater |
| US11426750B2 (en) | 2016-10-07 | 2022-08-30 | Musashi Engineering, Inc. | Liquid material discharge device with temperature control device, application device for same, and application method |
| WO2023082170A1 (en) * | 2021-11-12 | 2023-05-19 | Illinois Tool Works Inc. | Multi-pattern tooling plate |
| CN116504686B (zh) * | 2023-06-28 | 2023-10-20 | 北京中科科美科技股份有限公司 | 一种基于液态均匀温控的半导体加热盘 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11224889A (ja) * | 1998-02-06 | 1999-08-17 | Matsushita Electric Ind Co Ltd | 電子部品共晶ボンディング用ヒートブロック |
| JP2001250835A (ja) * | 2000-03-07 | 2001-09-14 | Matsushita Electric Ind Co Ltd | 電子部品実装装置用の板状ワーク加熱装置 |
| JP2006314861A (ja) * | 2005-05-10 | 2006-11-24 | Matsushita Electric Ind Co Ltd | 基板加熱装置および基板加熱方法ならびに液状物質の塗布装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3399367B2 (ja) | 1998-06-26 | 2003-04-21 | 松下電器産業株式会社 | ワークの熱圧着装置 |
| JP3223283B2 (ja) * | 1999-09-14 | 2001-10-29 | カシオ計算機株式会社 | 半導体装置の製造方法 |
| JP3935303B2 (ja) | 2000-03-17 | 2007-06-20 | 東京エレクトロン株式会社 | 加熱処理装置 |
-
2008
- 2008-07-04 JP JP2008176071A patent/JP5465846B2/ja active Active
-
2009
- 2009-07-02 CN CN2009801251004A patent/CN102077333B/zh active Active
- 2009-07-02 WO PCT/JP2009/003064 patent/WO2010001608A1/ja active Application Filing
- 2009-07-02 KR KR1020117002267A patent/KR101568238B1/ko active IP Right Grant
- 2009-07-03 TW TW098122529A patent/TWI491451B/zh active
-
2011
- 2011-08-10 HK HK11108358.6A patent/HK1154118A1/xx unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11224889A (ja) * | 1998-02-06 | 1999-08-17 | Matsushita Electric Ind Co Ltd | 電子部品共晶ボンディング用ヒートブロック |
| JP2001250835A (ja) * | 2000-03-07 | 2001-09-14 | Matsushita Electric Ind Co Ltd | 電子部品実装装置用の板状ワーク加熱装置 |
| JP2006314861A (ja) * | 2005-05-10 | 2006-11-24 | Matsushita Electric Ind Co Ltd | 基板加熱装置および基板加熱方法ならびに液状物質の塗布装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010016252A (ja) | 2010-01-21 |
| WO2010001608A1 (ja) | 2010-01-07 |
| HK1154118A1 (en) | 2012-04-20 |
| TW201006568A (en) | 2010-02-16 |
| JP5465846B2 (ja) | 2014-04-09 |
| KR101568238B1 (ko) | 2015-11-20 |
| KR20110039300A (ko) | 2011-04-15 |
| CN102077333A (zh) | 2011-05-25 |
| CN102077333B (zh) | 2013-12-11 |
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