HK1154118A1 - Substrate heating apparatus, liquid material applying apparatus provided with substrate heating apparatus, and substrate heating method - Google Patents

Substrate heating apparatus, liquid material applying apparatus provided with substrate heating apparatus, and substrate heating method

Info

Publication number
HK1154118A1
HK1154118A1 HK11108358.6A HK11108358A HK1154118A1 HK 1154118 A1 HK1154118 A1 HK 1154118A1 HK 11108358 A HK11108358 A HK 11108358A HK 1154118 A1 HK1154118 A1 HK 1154118A1
Authority
HK
Hong Kong
Prior art keywords
substrate heating
heating apparatus
liquid material
material applying
apparatus provided
Prior art date
Application number
HK11108358.6A
Other languages
English (en)
Inventor
Kazumasa Ikushima
Original Assignee
Musashi Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Musashi Engineering Inc filed Critical Musashi Engineering Inc
Publication of HK1154118A1 publication Critical patent/HK1154118A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Coating Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
HK11108358.6A 2008-07-04 2011-08-10 Substrate heating apparatus, liquid material applying apparatus provided with substrate heating apparatus, and substrate heating method HK1154118A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008176071A JP5465846B2 (ja) 2008-07-04 2008-07-04 基板加熱装置、それを備える液体材料塗布装置および基板加熱方法
PCT/JP2009/003064 WO2010001608A1 (ja) 2008-07-04 2009-07-02 基板加熱装置、それを備える液体材料塗布装置および基板加熱方法

Publications (1)

Publication Number Publication Date
HK1154118A1 true HK1154118A1 (en) 2012-04-20

Family

ID=41465715

Family Applications (1)

Application Number Title Priority Date Filing Date
HK11108358.6A HK1154118A1 (en) 2008-07-04 2011-08-10 Substrate heating apparatus, liquid material applying apparatus provided with substrate heating apparatus, and substrate heating method

Country Status (6)

Country Link
JP (1) JP5465846B2 (xx)
KR (1) KR101568238B1 (xx)
CN (1) CN102077333B (xx)
HK (1) HK1154118A1 (xx)
TW (1) TWI491451B (xx)
WO (1) WO2010001608A1 (xx)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9029740B2 (en) * 2013-01-15 2015-05-12 Nordson Corporation Air impingement heater
JP6933383B2 (ja) 2016-10-07 2021-09-15 武蔵エンジニアリング株式会社 温調装置付き液体材料吐出装置、その塗布装置および塗布方法
WO2023082170A1 (en) * 2021-11-12 2023-05-19 Illinois Tool Works Inc. Multi-pattern tooling plate
CN116504686B (zh) * 2023-06-28 2023-10-20 北京中科科美科技股份有限公司 一种基于液态均匀温控的半导体加热盘

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3436116B2 (ja) * 1998-02-06 2003-08-11 松下電器産業株式会社 電子部品共晶ボンディング用ヒートブロック
JP3399367B2 (ja) 1998-06-26 2003-04-21 松下電器産業株式会社 ワークの熱圧着装置
JP3223283B2 (ja) * 1999-09-14 2001-10-29 カシオ計算機株式会社 半導体装置の製造方法
JP3473543B2 (ja) * 2000-03-07 2003-12-08 松下電器産業株式会社 電子部品実装装置用の板状ワーク加熱装置
JP3935303B2 (ja) 2000-03-17 2007-06-20 東京エレクトロン株式会社 加熱処理装置
JP4120657B2 (ja) * 2005-05-10 2008-07-16 松下電器産業株式会社 液状物質の塗布装置および液状物質の塗布装置における基板加熱方法

Also Published As

Publication number Publication date
JP2010016252A (ja) 2010-01-21
TW201006568A (en) 2010-02-16
JP5465846B2 (ja) 2014-04-09
KR20110039300A (ko) 2011-04-15
KR101568238B1 (ko) 2015-11-20
WO2010001608A1 (ja) 2010-01-07
TWI491451B (zh) 2015-07-11
CN102077333B (zh) 2013-12-11
CN102077333A (zh) 2011-05-25

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