TWI489598B - A heater for a bonding device and a cooling method thereof - Google Patents

A heater for a bonding device and a cooling method thereof Download PDF

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Publication number
TWI489598B
TWI489598B TW102106499A TW102106499A TWI489598B TW I489598 B TWI489598 B TW I489598B TW 102106499 A TW102106499 A TW 102106499A TW 102106499 A TW102106499 A TW 102106499A TW I489598 B TWI489598 B TW I489598B
Authority
TW
Taiwan
Prior art keywords
capillary
heater
cooling
insulating material
heat insulating
Prior art date
Application number
TW102106499A
Other languages
English (en)
Chinese (zh)
Other versions
TW201405731A (zh
Inventor
瀬山耕平
千田恭弘
角谷修
Original Assignee
新川股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新川股份有限公司 filed Critical 新川股份有限公司
Publication of TW201405731A publication Critical patent/TW201405731A/zh
Application granted granted Critical
Publication of TWI489598B publication Critical patent/TWI489598B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B23K3/047—Heating appliances electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/085—Cooling, heat sink or heat shielding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/755—Cooling means
    • H01L2224/75502—Cooling means in the upper part of the bonding apparatus, e.g. in the bonding head

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Resistance Heating (AREA)
TW102106499A 2012-07-20 2013-02-25 A heater for a bonding device and a cooling method thereof TWI489598B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012161304A JP5793473B2 (ja) 2012-07-20 2012-07-20 ボンディング装置用ヒータ及びその冷却方法

Publications (2)

Publication Number Publication Date
TW201405731A TW201405731A (zh) 2014-02-01
TWI489598B true TWI489598B (zh) 2015-06-21

Family

ID=49948601

Family Applications (2)

Application Number Title Priority Date Filing Date
TW102106499A TWI489598B (zh) 2012-07-20 2013-02-25 A heater for a bonding device and a cooling method thereof
TW104117385A TW201535635A (zh) 2012-07-20 2013-02-25 接合裝置用加熱器及其冷卻方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW104117385A TW201535635A (zh) 2012-07-20 2013-02-25 接合裝置用加熱器及其冷卻方法

Country Status (7)

Country Link
US (1) US10350692B2 (cg-RX-API-DMAC7.html)
JP (1) JP5793473B2 (cg-RX-API-DMAC7.html)
KR (2) KR20150082673A (cg-RX-API-DMAC7.html)
CN (1) CN104520980B (cg-RX-API-DMAC7.html)
SG (1) SG11201500238RA (cg-RX-API-DMAC7.html)
TW (2) TWI489598B (cg-RX-API-DMAC7.html)
WO (1) WO2014013764A1 (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI834007B (zh) * 2019-11-19 2024-03-01 日商新川股份有限公司 半導體裝置的製造裝置及製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9093549B2 (en) * 2013-07-02 2015-07-28 Kulicke And Soffa Industries, Inc. Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
US9659902B2 (en) * 2014-02-28 2017-05-23 Kulicke And Soffa Industries, Inc. Thermocompression bonding systems and methods of operating the same
JP6176542B2 (ja) * 2015-04-22 2017-08-09 パナソニックＩｐマネジメント株式会社 電子部品ボンディングヘッド
JP6529865B2 (ja) * 2015-08-31 2019-06-12 株式会社イチネンジコー ヒータ
JP6457905B2 (ja) * 2015-08-31 2019-01-23 株式会社イチネンジコー ヒータ
JP6836317B2 (ja) * 2015-10-16 2021-02-24 東レエンジニアリング株式会社 ボンディングヘッドおよび実装装置
SG11201811522QA (en) * 2016-03-24 2019-01-30 Shinkawa Kk Bonding apparatus
CN107825011A (zh) * 2017-11-10 2018-03-23 普尔思（苏州）无线通讯产品有限公司 一种能够控制温度的焊接系统
JP6680930B2 (ja) * 2019-05-15 2020-04-15 株式会社イチネンジコー ヒータ
KR102604789B1 (ko) * 2020-11-30 2023-11-21 세메스 주식회사 히터 조립체 및 이를 포함하는 본딩 헤드
KR102866414B1 (ko) * 2020-12-28 2025-09-29 가부시키가이샤 신가와 실장 헤드
TWI791287B (zh) * 2021-09-16 2023-02-01 日商新川股份有限公司 封裝裝置以及封裝方法
TWI876430B (zh) * 2023-07-19 2025-03-11 日月光半導體製造股份有限公司 熱壓組件

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CN1988763A (zh) * 2005-12-09 2007-06-27 通用电气公司 制造电子设备冷却系统的方法
JP2007329306A (ja) * 2006-06-08 2007-12-20 Matsushita Electric Ind Co Ltd 熱圧着装置

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US5453641A (en) * 1992-12-16 1995-09-26 Sdl, Inc. Waste heat removal system
JP3255871B2 (ja) * 1997-03-31 2002-02-12 住友大阪セメント株式会社 パルスヒーター及び半導体チップ実装ボードの製法
JPH11204994A (ja) 1998-01-14 1999-07-30 Hitachi Ltd 素子搭載装置
JP2000277567A (ja) * 1999-03-25 2000-10-06 Ngk Insulators Ltd ボンディング用ヒータ
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CN1988763A (zh) * 2005-12-09 2007-06-27 通用电气公司 制造电子设备冷却系统的方法
JP2007329306A (ja) * 2006-06-08 2007-12-20 Matsushita Electric Ind Co Ltd 熱圧着装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI834007B (zh) * 2019-11-19 2024-03-01 日商新川股份有限公司 半導體裝置的製造裝置及製造方法
US12176317B2 (en) 2019-11-19 2024-12-24 Shinkawa Ltd. Semiconductor device manufacturing device and manufacturing method

Also Published As

Publication number Publication date
CN104520980B (zh) 2017-07-07
SG11201500238RA (en) 2015-03-30
WO2014013764A1 (ja) 2014-01-23
KR101559741B1 (ko) 2015-10-13
CN104520980A (zh) 2015-04-15
TW201535635A (zh) 2015-09-16
US20150183040A1 (en) 2015-07-02
KR20150082673A (ko) 2015-07-15
JP2014022629A (ja) 2014-02-03
US10350692B2 (en) 2019-07-16
TW201405731A (zh) 2014-02-01
KR20140128380A (ko) 2014-11-05
JP5793473B2 (ja) 2015-10-14

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