JP2014022629A5 - - Google Patents
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- Publication number
- JP2014022629A5 JP2014022629A5 JP2012161304A JP2012161304A JP2014022629A5 JP 2014022629 A5 JP2014022629 A5 JP 2014022629A5 JP 2012161304 A JP2012161304 A JP 2012161304A JP 2012161304 A JP2012161304 A JP 2012161304A JP 2014022629 A5 JP2014022629 A5 JP 2014022629A5
- Authority
- JP
- Japan
- Prior art keywords
- capillary
- heater
- bonding apparatus
- insulating material
- heat insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 claims description 16
- 239000011810 insulating material Substances 0.000 claims description 10
- 230000013011 mating Effects 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 2
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012161304A JP5793473B2 (ja) | 2012-07-20 | 2012-07-20 | ボンディング装置用ヒータ及びその冷却方法 |
| TW104117385A TW201535635A (zh) | 2012-07-20 | 2013-02-25 | 接合裝置用加熱器及其冷卻方法 |
| TW102106499A TWI489598B (zh) | 2012-07-20 | 2013-02-25 | A heater for a bonding device and a cooling method thereof |
| KR1020157017088A KR20150082673A (ko) | 2012-07-20 | 2013-04-11 | 본딩 장치용 히터 및 그 냉각 방법 |
| PCT/JP2013/060908 WO2014013764A1 (ja) | 2012-07-20 | 2013-04-11 | ボンディング装置用ヒータ及びその冷却方法 |
| CN201380014787.0A CN104520980B (zh) | 2012-07-20 | 2013-04-11 | 接合装置用加热器及其冷却方法 |
| KR1020147024142A KR101559741B1 (ko) | 2012-07-20 | 2013-04-11 | 본딩 장치용 히터 및 그 냉각 방법 |
| SG11201500238RA SG11201500238RA (en) | 2012-07-20 | 2013-04-11 | Heater for bonding apparatus and method of cooling the same |
| US14/597,635 US10350692B2 (en) | 2012-07-20 | 2015-01-15 | Heater for bonding apparatus and method of cooling the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012161304A JP5793473B2 (ja) | 2012-07-20 | 2012-07-20 | ボンディング装置用ヒータ及びその冷却方法 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015050779A Division JP2015109485A (ja) | 2015-03-13 | 2015-03-13 | ボンディング装置用ヒータ及びその冷却方法 |
| JP2015127628A Division JP6149241B2 (ja) | 2015-06-25 | 2015-06-25 | ボンディング装置用ヒータ及びその冷却方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014022629A JP2014022629A (ja) | 2014-02-03 |
| JP2014022629A5 true JP2014022629A5 (cg-RX-API-DMAC7.html) | 2014-10-23 |
| JP5793473B2 JP5793473B2 (ja) | 2015-10-14 |
Family
ID=49948601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012161304A Active JP5793473B2 (ja) | 2012-07-20 | 2012-07-20 | ボンディング装置用ヒータ及びその冷却方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10350692B2 (cg-RX-API-DMAC7.html) |
| JP (1) | JP5793473B2 (cg-RX-API-DMAC7.html) |
| KR (2) | KR20150082673A (cg-RX-API-DMAC7.html) |
| CN (1) | CN104520980B (cg-RX-API-DMAC7.html) |
| SG (1) | SG11201500238RA (cg-RX-API-DMAC7.html) |
| TW (2) | TWI489598B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2014013764A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9093549B2 (en) * | 2013-07-02 | 2015-07-28 | Kulicke And Soffa Industries, Inc. | Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same |
| US9659902B2 (en) * | 2014-02-28 | 2017-05-23 | Kulicke And Soffa Industries, Inc. | Thermocompression bonding systems and methods of operating the same |
| JP6176542B2 (ja) * | 2015-04-22 | 2017-08-09 | パナソニックＩｐマネジメント株式会社 | 電子部品ボンディングヘッド |
| JP6529865B2 (ja) * | 2015-08-31 | 2019-06-12 | 株式会社イチネンジコー | ヒータ |
| JP6457905B2 (ja) * | 2015-08-31 | 2019-01-23 | 株式会社イチネンジコー | ヒータ |
| JP6836317B2 (ja) * | 2015-10-16 | 2021-02-24 | 東レエンジニアリング株式会社 | ボンディングヘッドおよび実装装置 |
| SG11201811522QA (en) * | 2016-03-24 | 2019-01-30 | Shinkawa Kk | Bonding apparatus |
| CN107825011A (zh) * | 2017-11-10 | 2018-03-23 | 普尔思（苏州）无线通讯产品有限公司 | 一种能够控制温度的焊接系统 |
| JP6680930B2 (ja) * | 2019-05-15 | 2020-04-15 | 株式会社イチネンジコー | ヒータ |
| TWI834007B (zh) * | 2019-11-19 | 2024-03-01 | 日商新川股份有限公司 | 半導體裝置的製造裝置及製造方法 |
| KR102604789B1 (ko) * | 2020-11-30 | 2023-11-21 | 세메스 주식회사 | 히터 조립체 및 이를 포함하는 본딩 헤드 |
| KR102866414B1 (ko) * | 2020-12-28 | 2025-09-29 | 가부시키가이샤 신가와 | 실장 헤드 |
| TWI791287B (zh) * | 2021-09-16 | 2023-02-01 | 日商新川股份有限公司 | 封裝裝置以及封裝方法 |
| TWI876430B (zh) * | 2023-07-19 | 2025-03-11 | 日月光半導體製造股份有限公司 | 熱壓組件 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5592363A (en) | 1992-09-30 | 1997-01-07 | Hitachi, Ltd. | Electronic apparatus |
| US5453641A (en) * | 1992-12-16 | 1995-09-26 | Sdl, Inc. | Waste heat removal system |
| JP3255871B2 (ja) * | 1997-03-31 | 2002-02-12 | 住友大阪セメント株式会社 | パルスヒーター及び半導体チップ実装ボードの製法 |
| JPH11204994A (ja) | 1998-01-14 | 1999-07-30 | Hitachi Ltd | 素子搭載装置 |
| JP2000277567A (ja) * | 1999-03-25 | 2000-10-06 | Ngk Insulators Ltd | ボンディング用ヒータ |
| US6414271B2 (en) | 2000-05-25 | 2002-07-02 | Kyocera Corporation | Contact heating device |
| JP2002016091A (ja) | 2000-06-29 | 2002-01-18 | Kyocera Corp | 接触加熱装置 |
| JP2002076102A (ja) * | 2000-08-31 | 2002-03-15 | Ibiden Co Ltd | セラミック基板 |
| JP3801966B2 (ja) * | 2002-07-31 | 2006-07-26 | 京セラ株式会社 | 加熱装置 |
| US20070125526A1 (en) | 2005-12-02 | 2007-06-07 | Matsushita Electric Industrial Co., Ltd. | Cooling device for electronic components |
| JP2007180505A (ja) | 2005-12-02 | 2007-07-12 | Matsushita Electric Ind Co Ltd | 電子部品の冷却装置 |
| US20070131659A1 (en) | 2005-12-09 | 2007-06-14 | Durocher Kevin M | Method of making an electronic device cooling system |
| JP4640170B2 (ja) * | 2005-12-28 | 2011-03-02 | 株式会社豊田自動織機 | 半田付け方法及び半導体モジュールの製造方法並びに半田付け装置 |
| JP2007242724A (ja) * | 2006-03-06 | 2007-09-20 | Seiko Epson Corp | マイクロチャンネル構造体、マイクロチャンネル構造体の製造方法及び電子機器 |
| JP2007329306A (ja) * | 2006-06-08 | 2007-12-20 | Matsushita Electric Ind Co Ltd | 熱圧着装置 |
| WO2010131317A1 (ja) * | 2009-05-11 | 2010-11-18 | トヨタ自動車株式会社 | 熱交換器、半導体装置、及び、これらの製造方法 |
| US8637794B2 (en) * | 2009-10-21 | 2014-01-28 | Lam Research Corporation | Heating plate with planar heating zones for semiconductor processing |
| JP4808283B1 (ja) * | 2010-06-30 | 2011-11-02 | 株式会社新川 | 電子部品実装装置及び電子部品実装方法 |
| US8633423B2 (en) * | 2010-10-14 | 2014-01-21 | Applied Materials, Inc. | Methods and apparatus for controlling substrate temperature in a process chamber |
| US9434029B2 (en) * | 2011-12-20 | 2016-09-06 | Intel Corporation | High performance transient uniform cooling solution for thermal compression bonding process |
-
2012
- 2012-07-20 JP JP2012161304A patent/JP5793473B2/ja active Active
-
2013
- 2013-02-25 TW TW102106499A patent/TWI489598B/zh active
- 2013-02-25 TW TW104117385A patent/TW201535635A/zh unknown
- 2013-04-11 CN CN201380014787.0A patent/CN104520980B/zh active Active
- 2013-04-11 SG SG11201500238RA patent/SG11201500238RA/en unknown
- 2013-04-11 WO PCT/JP2013/060908 patent/WO2014013764A1/ja not_active Ceased
- 2013-04-11 KR KR1020157017088A patent/KR20150082673A/ko not_active Ceased
- 2013-04-11 KR KR1020147024142A patent/KR101559741B1/ko active Active
-
2015
- 2015-01-15 US US14/597,635 patent/US10350692B2/en active Active