TWI481136B - 控制雷射源能量之照明裝置及方法 - Google Patents

控制雷射源能量之照明裝置及方法 Download PDF

Info

Publication number
TWI481136B
TWI481136B TW098102799A TW98102799A TWI481136B TW I481136 B TWI481136 B TW I481136B TW 098102799 A TW098102799 A TW 098102799A TW 98102799 A TW98102799 A TW 98102799A TW I481136 B TWI481136 B TW I481136B
Authority
TW
Taiwan
Prior art keywords
energy
laser
optical system
laser beam
small portion
Prior art date
Application number
TW098102799A
Other languages
English (en)
Chinese (zh)
Other versions
TW201008061A (en
Inventor
Bernhard Weigl
Richard Sandstrom
Original Assignee
Zeiss Carl Laser Optics Gmbh
Cymer Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zeiss Carl Laser Optics Gmbh, Cymer Inc filed Critical Zeiss Carl Laser Optics Gmbh
Publication of TW201008061A publication Critical patent/TW201008061A/zh
Application granted granted Critical
Publication of TWI481136B publication Critical patent/TWI481136B/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0738—Shaping the laser spot into a linear shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/705—Beam measuring devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/13—Stabilisation of laser output parameters, e.g. frequency or amplitude
    • H01S3/1305—Feedback control systems

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Automation & Control Theory (AREA)
  • Recrystallisation Techniques (AREA)
  • Laser Beam Processing (AREA)
TW098102799A 2008-02-07 2009-01-23 控制雷射源能量之照明裝置及方法 TWI481136B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/027,442 US8723073B2 (en) 2008-02-07 2008-02-07 Illumination apparatus and method for controlling energy of a laser source

Publications (2)

Publication Number Publication Date
TW201008061A TW201008061A (en) 2010-02-16
TWI481136B true TWI481136B (zh) 2015-04-11

Family

ID=40583220

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098102799A TWI481136B (zh) 2008-02-07 2009-01-23 控制雷射源能量之照明裝置及方法

Country Status (7)

Country Link
US (1) US8723073B2 (enExample)
EP (1) EP2245497B1 (enExample)
JP (1) JP5425813B2 (enExample)
KR (1) KR101606105B1 (enExample)
SG (1) SG188785A1 (enExample)
TW (1) TWI481136B (enExample)
WO (1) WO2009097967A1 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8272758B2 (en) 2005-06-07 2012-09-25 Oree, Inc. Illumination apparatus and methods of forming the same
US8215815B2 (en) 2005-06-07 2012-07-10 Oree, Inc. Illumination apparatus and methods of forming the same
WO2006131924A2 (en) 2005-06-07 2006-12-14 Oree, Advanced Illumination Solutions Inc. Illumination apparatus
US8172447B2 (en) 2007-12-19 2012-05-08 Oree, Inc. Discrete lighting elements and planar assembly thereof
US20090161369A1 (en) * 2007-12-19 2009-06-25 Keren Regev Waveguide sheet and methods for manufacturing the same
EP2260341A2 (en) 2008-03-05 2010-12-15 Oree, Advanced Illumination Solutions INC. Illumination apparatus and methods of forming the same
US8301002B2 (en) 2008-07-10 2012-10-30 Oree, Inc. Slim waveguide coupling apparatus and method
US8297786B2 (en) 2008-07-10 2012-10-30 Oree, Inc. Slim waveguide coupling apparatus and method
JP4618360B2 (ja) * 2008-10-10 2011-01-26 ソニー株式会社 レーザアニール方法およびレーザアニール装置
US8624527B1 (en) 2009-03-27 2014-01-07 Oree, Inc. Independently controllable illumination device
US8328406B2 (en) 2009-05-13 2012-12-11 Oree, Inc. Low-profile illumination device
WO2010150202A2 (en) 2009-06-24 2010-12-29 Oree, Advanced Illumination Solutions Inc. Illumination apparatus with high conversion efficiency and methods of forming the same
US20120325784A1 (en) * 2011-06-24 2012-12-27 Applied Materials, Inc. Novel thermal processing apparatus
US8591072B2 (en) 2011-11-16 2013-11-26 Oree, Inc. Illumination apparatus confining light by total internal reflection and methods of forming the same
US9857519B2 (en) 2012-07-03 2018-01-02 Oree Advanced Illumination Solutions Ltd. Planar remote phosphor illumination apparatus
KR102285121B1 (ko) * 2019-04-10 2021-08-03 고려대학교 세종산학협력단 레이저를 이용한 비정질 반도체 결정화 장치 및 그의 제어방법
KR20210131510A (ko) 2020-04-23 2021-11-03 삼성디스플레이 주식회사 라인 빔 형성 장치
DE102020130651B3 (de) * 2020-11-19 2022-05-05 Trumpf Laser- Und Systemtechnik Gmbh Vorrichtung zum Erzeugen einer definierten Laserbeleuchtung auf einer Arbeitsebene

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11283933A (ja) * 1998-01-29 1999-10-15 Toshiba Corp レ―ザ照射装置，非単結晶半導体膜の製造方法及び液晶表示装置の製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5331466A (en) * 1991-04-23 1994-07-19 Lions Eye Institute Of Western Australia Inc. Method and apparatus for homogenizing a collimated light beam
DE4220705C2 (de) * 1992-06-24 2003-03-13 Lambda Physik Ag Vorrichtung zum Aufteilen eines Lichtstrahles in homogene Teilstrahlen
US5609780A (en) * 1994-11-14 1997-03-11 International Business Machines, Corporation Laser system
JPH08247790A (ja) * 1995-03-10 1996-09-27 Sefuto Kenkyusho:Kk 位置検出装置
DE19520187C1 (de) * 1995-06-01 1996-09-12 Microlas Lasersystem Gmbh Optik zum Herstellen einer scharfen Beleuchtungslinie aus einem Laserstrahl
US5880461A (en) * 1996-06-12 1999-03-09 The Regents Of The University Of California Low noise optical position sensor
JP2000202673A (ja) * 2000-01-01 2000-07-25 Semiconductor Energy Lab Co Ltd レ―ザ―照射装置
AU2002230592A1 (en) * 2000-10-27 2002-05-06 Molecular Devices Corporation Light detection device
US7061959B2 (en) * 2001-04-18 2006-06-13 Tcz Gmbh Laser thin film poly-silicon annealing system
US7009140B2 (en) * 2001-04-18 2006-03-07 Cymer, Inc. Laser thin film poly-silicon annealing optical system
JP2003053578A (ja) * 2001-08-15 2003-02-26 Sumitomo Heavy Ind Ltd レーザビームのプロファイル調整方法及び装置
JP2003258349A (ja) 2002-03-04 2003-09-12 Toshiba Corp レーザ加工方法、その装置および薄膜加工方法
US7180918B2 (en) * 2003-05-16 2007-02-20 Metal Improvement Company, Llc Self-seeded single-frequency solid-state ring laser and system using same
JP4567984B2 (ja) * 2004-01-30 2010-10-27 株式会社 日立ディスプレイズ 平面表示装置の製造装置
JP2005294493A (ja) * 2004-03-31 2005-10-20 Toshiba Corp レーザプロセスおよびレーザアニール装置
JP2006049606A (ja) * 2004-08-05 2006-02-16 Sumitomo Heavy Ind Ltd レーザ加工装置
US7422988B2 (en) * 2004-11-12 2008-09-09 Applied Materials, Inc. Rapid detection of imminent failure in laser thermal processing of a substrate
KR20070090246A (ko) * 2004-12-22 2007-09-05 칼 짜이스 레이저 옵틱스 게엠베하 선형 빔을 형성하기 위한 광 조명 시스템

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11283933A (ja) * 1998-01-29 1999-10-15 Toshiba Corp レ―ザ照射装置，非単結晶半導体膜の製造方法及び液晶表示装置の製造方法

Also Published As

Publication number Publication date
SG188785A1 (en) 2013-04-30
US20090201955A1 (en) 2009-08-13
JP5425813B2 (ja) 2014-02-26
WO2009097967A1 (en) 2009-08-13
KR20100114920A (ko) 2010-10-26
US8723073B2 (en) 2014-05-13
EP2245497B1 (en) 2016-12-14
JP2011510820A (ja) 2011-04-07
EP2245497A1 (en) 2010-11-03
TW201008061A (en) 2010-02-16
KR101606105B1 (ko) 2016-03-24

Similar Documents

Publication Publication Date Title
JP5425813B2 (ja) レーザ光源のエネルギを制御するための照射装置及び方法
JP5105903B2 (ja) レーザアニール装置及びアニール方法
JP6275240B2 (ja) １９３ｎｍレーザ及び１９３ｎｍレーザを用いた検査システム
CN102508365B (zh) 一种光束漂移实时自动校正补偿的方法和装置
US20180231373A1 (en) Projectors of structured light
CN110411348A (zh) 一种激光光斑焦点的自动化检测与定位装置及方法
CN113008849B (zh) 紫外-近红外宽波段微区光致发光光谱测试装置
JP2014525141A5 (enExample)
TW200818323A (en) Dynamic surface annealing using addressable laser array with pyrometry feedback
JP5916755B2 (ja) 干渉格子を試料上に形成するための装置
US8045184B2 (en) Making method of sample for evaluation of laser irradiation position and making apparatus thereof and evaluation method of stability of laser irradiation position and evaluation apparatus thereof
KR20060043822A (ko) 레이저 결정화장치 및 레이저 결정화방법
KR102904602B1 (ko) 레이저 처리 장치 및 레이저 광 모니터 방법
KR20130018125A (ko) 시간-평균 라인 이미지를 형성하는 시스템 및 방법
US20120242985A1 (en) Pattern inspection apparatus and pattern inspection method
CN117388664B (zh) 一种半导体晶圆少子寿命成像系统与方法
JP2006278491A (ja) 照射装置
US7375360B2 (en) Light device of arranging thin film inspection sensor array, and method and apparatus for arranging sensor array using the same
KR20130077415A (ko) 레이저 어닐링 장치 및 레이저 어닐링 방법
CN100433245C (zh) 激光结晶设备及激光结晶方法
KR20190005862A (ko) 플랫 패널 디스플레이에 대한 섬유 레이저 어닐링된 다결정질 실리콘 막의 형태학적 특징을 측정하는 공정 및 시스템
JP5286512B2 (ja) レーザアニール方法及びレーザアニール装置
US20050205779A1 (en) Scanning systems and methods with time delay sensing
JP3281857B2 (ja) 燃焼器内の温度分布計測装置
US20080105825A1 (en) Laser scanning apparatus and method using diffractive optical elements