TWI481136B - 控制雷射源能量之照明裝置及方法 - Google Patents
控制雷射源能量之照明裝置及方法 Download PDFInfo
- Publication number
- TWI481136B TWI481136B TW098102799A TW98102799A TWI481136B TW I481136 B TWI481136 B TW I481136B TW 098102799 A TW098102799 A TW 098102799A TW 98102799 A TW98102799 A TW 98102799A TW I481136 B TWI481136 B TW I481136B
- Authority
- TW
- Taiwan
- Prior art keywords
- energy
- laser
- optical system
- laser beam
- small portion
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 49
- 230000003287 optical effect Effects 0.000 claims description 65
- 238000005286 illumination Methods 0.000 claims description 50
- 238000007493 shaping process Methods 0.000 claims description 39
- 238000003384 imaging method Methods 0.000 claims description 17
- 230000009467 reduction Effects 0.000 claims description 12
- 238000005259 measurement Methods 0.000 claims description 9
- 238000001514 detection method Methods 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 230000002441 reversible effect Effects 0.000 claims description 4
- 238000002834 transmittance Methods 0.000 claims description 4
- 238000012545 processing Methods 0.000 description 10
- 230000008901 benefit Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000007715 excimer laser crystallization Methods 0.000 description 4
- 229910052732 germanium Inorganic materials 0.000 description 4
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 238000005224 laser annealing Methods 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 230000000644 propagated effect Effects 0.000 description 3
- 238000012935 Averaging Methods 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- 230000003667 anti-reflective effect Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005499 laser crystallization Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012806 monitoring device Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0738—Shaping the laser spot into a linear shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/705—Beam measuring device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/13—Stabilisation of laser output parameters, e.g. frequency or amplitude
- H01S3/1305—Feedback control systems
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Automation & Control Theory (AREA)
- Recrystallisation Techniques (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/027,442 US8723073B2 (en) | 2008-02-07 | 2008-02-07 | Illumination apparatus and method for controlling energy of a laser source |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201008061A TW201008061A (en) | 2010-02-16 |
| TWI481136B true TWI481136B (zh) | 2015-04-11 |
Family
ID=40583220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098102799A TWI481136B (zh) | 2008-02-07 | 2009-01-23 | 控制雷射源能量之照明裝置及方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8723073B2 (enExample) |
| EP (1) | EP2245497B1 (enExample) |
| JP (1) | JP5425813B2 (enExample) |
| KR (1) | KR101606105B1 (enExample) |
| SG (1) | SG188785A1 (enExample) |
| TW (1) | TWI481136B (enExample) |
| WO (1) | WO2009097967A1 (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8128272B2 (en) | 2005-06-07 | 2012-03-06 | Oree, Inc. | Illumination apparatus |
| US8272758B2 (en) | 2005-06-07 | 2012-09-25 | Oree, Inc. | Illumination apparatus and methods of forming the same |
| US8215815B2 (en) | 2005-06-07 | 2012-07-10 | Oree, Inc. | Illumination apparatus and methods of forming the same |
| US7907804B2 (en) | 2007-12-19 | 2011-03-15 | Oree, Inc. | Elimination of stitch artifacts in a planar illumination area |
| US20090161369A1 (en) | 2007-12-19 | 2009-06-25 | Keren Regev | Waveguide sheet and methods for manufacturing the same |
| WO2009109974A2 (en) | 2008-03-05 | 2009-09-11 | Oree, Advanced Illumination Solutions Inc. | Illumination apparatus and methods of forming the same |
| US8301002B2 (en) | 2008-07-10 | 2012-10-30 | Oree, Inc. | Slim waveguide coupling apparatus and method |
| US8297786B2 (en) | 2008-07-10 | 2012-10-30 | Oree, Inc. | Slim waveguide coupling apparatus and method |
| JP4618360B2 (ja) * | 2008-10-10 | 2011-01-26 | ソニー株式会社 | レーザアニール方法およびレーザアニール装置 |
| US8624527B1 (en) | 2009-03-27 | 2014-01-07 | Oree, Inc. | Independently controllable illumination device |
| US20100320904A1 (en) | 2009-05-13 | 2010-12-23 | Oree Inc. | LED-Based Replacement Lamps for Incandescent Fixtures |
| US8727597B2 (en) | 2009-06-24 | 2014-05-20 | Oree, Inc. | Illumination apparatus with high conversion efficiency and methods of forming the same |
| US8569187B2 (en) * | 2011-06-24 | 2013-10-29 | Applied Materials, Inc. | Thermal processing apparatus |
| US8591072B2 (en) | 2011-11-16 | 2013-11-26 | Oree, Inc. | Illumination apparatus confining light by total internal reflection and methods of forming the same |
| WO2014006501A1 (en) | 2012-07-03 | 2014-01-09 | Yosi Shani | Planar remote phosphor illumination apparatus |
| KR102285121B1 (ko) * | 2019-04-10 | 2021-08-03 | 고려대학교 세종산학협력단 | 레이저를 이용한 비정질 반도체 결정화 장치 및 그의 제어방법 |
| KR20210131510A (ko) | 2020-04-23 | 2021-11-03 | 삼성디스플레이 주식회사 | 라인 빔 형성 장치 |
| DE102020130651B3 (de) * | 2020-11-19 | 2022-05-05 | Trumpf Laser- Und Systemtechnik Gmbh | Vorrichtung zum Erzeugen einer definierten Laserbeleuchtung auf einer Arbeitsebene |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11283933A (ja) * | 1998-01-29 | 1999-10-15 | Toshiba Corp | レ―ザ照射装置，非単結晶半導体膜の製造方法及び液晶表示装置の製造方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5331466A (en) * | 1991-04-23 | 1994-07-19 | Lions Eye Institute Of Western Australia Inc. | Method and apparatus for homogenizing a collimated light beam |
| DE4220705C2 (de) * | 1992-06-24 | 2003-03-13 | Lambda Physik Ag | Vorrichtung zum Aufteilen eines Lichtstrahles in homogene Teilstrahlen |
| US5609780A (en) * | 1994-11-14 | 1997-03-11 | International Business Machines, Corporation | Laser system |
| JPH08247790A (ja) * | 1995-03-10 | 1996-09-27 | Sefuto Kenkyusho:Kk | 位置検出装置 |
| DE19520187C1 (de) * | 1995-06-01 | 1996-09-12 | Microlas Lasersystem Gmbh | Optik zum Herstellen einer scharfen Beleuchtungslinie aus einem Laserstrahl |
| US5880461A (en) * | 1996-06-12 | 1999-03-09 | The Regents Of The University Of California | Low noise optical position sensor |
| JP2000202673A (ja) * | 2000-01-01 | 2000-07-25 | Semiconductor Energy Lab Co Ltd | レ―ザ―照射装置 |
| AU2002230592A1 (en) * | 2000-10-27 | 2002-05-06 | Molecular Devices Corporation | Light detection device |
| US7061959B2 (en) * | 2001-04-18 | 2006-06-13 | Tcz Gmbh | Laser thin film poly-silicon annealing system |
| US7009140B2 (en) * | 2001-04-18 | 2006-03-07 | Cymer, Inc. | Laser thin film poly-silicon annealing optical system |
| JP2003053578A (ja) * | 2001-08-15 | 2003-02-26 | Sumitomo Heavy Ind Ltd | レーザビームのプロファイル調整方法及び装置 |
| JP2003258349A (ja) | 2002-03-04 | 2003-09-12 | Toshiba Corp | レーザ加工方法、その装置および薄膜加工方法 |
| US7180918B2 (en) * | 2003-05-16 | 2007-02-20 | Metal Improvement Company, Llc | Self-seeded single-frequency solid-state ring laser and system using same |
| JP4567984B2 (ja) * | 2004-01-30 | 2010-10-27 | 株式会社 日立ディスプレイズ | 平面表示装置の製造装置 |
| JP2005294493A (ja) * | 2004-03-31 | 2005-10-20 | Toshiba Corp | レーザプロセスおよびレーザアニール装置 |
| JP2006049606A (ja) * | 2004-08-05 | 2006-02-16 | Sumitomo Heavy Ind Ltd | レーザ加工装置 |
| US7422988B2 (en) * | 2004-11-12 | 2008-09-09 | Applied Materials, Inc. | Rapid detection of imminent failure in laser thermal processing of a substrate |
| KR20070090246A (ko) | 2004-12-22 | 2007-09-05 | 칼 짜이스 레이저 옵틱스 게엠베하 | 선형 빔을 형성하기 위한 광 조명 시스템 |
-
2008
- 2008-02-07 US US12/027,442 patent/US8723073B2/en active Active
-
2009
- 2009-01-22 JP JP2010545377A patent/JP5425813B2/ja active Active
- 2009-01-22 SG SG2013010152A patent/SG188785A1/en unknown
- 2009-01-22 EP EP09709143.3A patent/EP2245497B1/en not_active Not-in-force
- 2009-01-22 WO PCT/EP2009/000365 patent/WO2009097967A1/en not_active Ceased
- 2009-01-22 KR KR1020107019702A patent/KR101606105B1/ko active Active
- 2009-01-23 TW TW098102799A patent/TWI481136B/zh active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11283933A (ja) * | 1998-01-29 | 1999-10-15 | Toshiba Corp | レ―ザ照射装置，非単結晶半導体膜の製造方法及び液晶表示装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201008061A (en) | 2010-02-16 |
| KR101606105B1 (ko) | 2016-03-24 |
| EP2245497A1 (en) | 2010-11-03 |
| KR20100114920A (ko) | 2010-10-26 |
| WO2009097967A1 (en) | 2009-08-13 |
| SG188785A1 (en) | 2013-04-30 |
| JP2011510820A (ja) | 2011-04-07 |
| US20090201955A1 (en) | 2009-08-13 |
| EP2245497B1 (en) | 2016-12-14 |
| JP5425813B2 (ja) | 2014-02-26 |
| US8723073B2 (en) | 2014-05-13 |
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