KR101606105B1 - 레이저 광원의 에너지를 제어하기 위한 조명 장치 및 방법 - Google Patents

레이저 광원의 에너지를 제어하기 위한 조명 장치 및 방법 Download PDF

Info

Publication number
KR101606105B1
KR101606105B1 KR1020107019702A KR20107019702A KR101606105B1 KR 101606105 B1 KR101606105 B1 KR 101606105B1 KR 1020107019702 A KR1020107019702 A KR 1020107019702A KR 20107019702 A KR20107019702 A KR 20107019702A KR 101606105 B1 KR101606105 B1 KR 101606105B1
Authority
KR
South Korea
Prior art keywords
energy
line
delete delete
laser beam
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020107019702A
Other languages
English (en)
Korean (ko)
Other versions
KR20100114920A (ko
Inventor
베른하르트 바이글
리차드 샌드스트롬
Original Assignee
칼 짜이스 에스엠테 게엠베하
사이머 엘엘씨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 칼 짜이스 에스엠테 게엠베하, 사이머 엘엘씨 filed Critical 칼 짜이스 에스엠테 게엠베하
Publication of KR20100114920A publication Critical patent/KR20100114920A/ko
Application granted granted Critical
Publication of KR101606105B1 publication Critical patent/KR101606105B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0927Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626Energy control of the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073Shaping the laser spot
    • B23K26/0738Shaping the laser spot into a linear shape
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment
    • B23K26/705Beam measuring device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/13Stabilisation of laser output parameters, e.g. frequency or amplitude
    • H01S3/1305Feedback control systems

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Automation & Control Theory (AREA)
  • Recrystallisation Techniques (AREA)
  • Laser Beam Processing (AREA)
KR1020107019702A 2008-02-07 2009-01-22 레이저 광원의 에너지를 제어하기 위한 조명 장치 및 방법 Active KR101606105B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/027,442 2008-02-07
US12/027,442 US8723073B2 (en) 2008-02-07 2008-02-07 Illumination apparatus and method for controlling energy of a laser source

Publications (2)

Publication Number Publication Date
KR20100114920A KR20100114920A (ko) 2010-10-26
KR101606105B1 true KR101606105B1 (ko) 2016-03-24

Family

ID=40583220

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107019702A Active KR101606105B1 (ko) 2008-02-07 2009-01-22 레이저 광원의 에너지를 제어하기 위한 조명 장치 및 방법

Country Status (7)

Country Link
US (1) US8723073B2 (enExample)
EP (1) EP2245497B1 (enExample)
JP (1) JP5425813B2 (enExample)
KR (1) KR101606105B1 (enExample)
SG (1) SG188785A1 (enExample)
TW (1) TWI481136B (enExample)
WO (1) WO2009097967A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12339464B2 (en) 2020-04-23 2025-06-24 Samsung Display Co., Ltd. Apparatus for forming line beam

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8128272B2 (en) 2005-06-07 2012-03-06 Oree, Inc. Illumination apparatus
US8272758B2 (en) 2005-06-07 2012-09-25 Oree, Inc. Illumination apparatus and methods of forming the same
US8215815B2 (en) 2005-06-07 2012-07-10 Oree, Inc. Illumination apparatus and methods of forming the same
US7907804B2 (en) 2007-12-19 2011-03-15 Oree, Inc. Elimination of stitch artifacts in a planar illumination area
US20090161369A1 (en) 2007-12-19 2009-06-25 Keren Regev Waveguide sheet and methods for manufacturing the same
WO2009109974A2 (en) 2008-03-05 2009-09-11 Oree, Advanced Illumination Solutions Inc. Illumination apparatus and methods of forming the same
US8301002B2 (en) 2008-07-10 2012-10-30 Oree, Inc. Slim waveguide coupling apparatus and method
US8297786B2 (en) 2008-07-10 2012-10-30 Oree, Inc. Slim waveguide coupling apparatus and method
JP4618360B2 (ja) * 2008-10-10 2011-01-26 ソニー株式会社 レーザアニール方法およびレーザアニール装置
US8624527B1 (en) 2009-03-27 2014-01-07 Oree, Inc. Independently controllable illumination device
US20100320904A1 (en) 2009-05-13 2010-12-23 Oree Inc. LED-Based Replacement Lamps for Incandescent Fixtures
US8727597B2 (en) 2009-06-24 2014-05-20 Oree, Inc. Illumination apparatus with high conversion efficiency and methods of forming the same
US8569187B2 (en) * 2011-06-24 2013-10-29 Applied Materials, Inc. Thermal processing apparatus
US8591072B2 (en) 2011-11-16 2013-11-26 Oree, Inc. Illumination apparatus confining light by total internal reflection and methods of forming the same
WO2014006501A1 (en) 2012-07-03 2014-01-09 Yosi Shani Planar remote phosphor illumination apparatus
KR102285121B1 (ko) * 2019-04-10 2021-08-03 고려대학교 세종산학협력단 레이저를 이용한 비정질 반도체 결정화 장치 및 그의 제어방법
DE102020130651B3 (de) * 2020-11-19 2022-05-05 Trumpf Laser- Und Systemtechnik Gmbh Vorrichtung zum Erzeugen einer definierten Laserbeleuchtung auf einer Arbeitsebene

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003258349A (ja) 2002-03-04 2003-09-12 Toshiba Corp レーザ加工方法、その装置および薄膜加工方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5331466A (en) * 1991-04-23 1994-07-19 Lions Eye Institute Of Western Australia Inc. Method and apparatus for homogenizing a collimated light beam
DE4220705C2 (de) * 1992-06-24 2003-03-13 Lambda Physik Ag Vorrichtung zum Aufteilen eines Lichtstrahles in homogene Teilstrahlen
US5609780A (en) * 1994-11-14 1997-03-11 International Business Machines, Corporation Laser system
JPH08247790A (ja) * 1995-03-10 1996-09-27 Sefuto Kenkyusho:Kk 位置検出装置
DE19520187C1 (de) * 1995-06-01 1996-09-12 Microlas Lasersystem Gmbh Optik zum Herstellen einer scharfen Beleuchtungslinie aus einem Laserstrahl
US5880461A (en) * 1996-06-12 1999-03-09 The Regents Of The University Of California Low noise optical position sensor
JPH11283933A (ja) * 1998-01-29 1999-10-15 Toshiba Corp レ―ザ照射装置,非単結晶半導体膜の製造方法及び液晶表示装置の製造方法
JP2000202673A (ja) * 2000-01-01 2000-07-25 Semiconductor Energy Lab Co Ltd レ―ザ―照射装置
AU2002230592A1 (en) * 2000-10-27 2002-05-06 Molecular Devices Corporation Light detection device
US7061959B2 (en) * 2001-04-18 2006-06-13 Tcz Gmbh Laser thin film poly-silicon annealing system
US7009140B2 (en) * 2001-04-18 2006-03-07 Cymer, Inc. Laser thin film poly-silicon annealing optical system
JP2003053578A (ja) * 2001-08-15 2003-02-26 Sumitomo Heavy Ind Ltd レーザビームのプロファイル調整方法及び装置
US7180918B2 (en) * 2003-05-16 2007-02-20 Metal Improvement Company, Llc Self-seeded single-frequency solid-state ring laser and system using same
JP4567984B2 (ja) * 2004-01-30 2010-10-27 株式会社 日立ディスプレイズ 平面表示装置の製造装置
JP2005294493A (ja) * 2004-03-31 2005-10-20 Toshiba Corp レーザプロセスおよびレーザアニール装置
JP2006049606A (ja) * 2004-08-05 2006-02-16 Sumitomo Heavy Ind Ltd レーザ加工装置
US7422988B2 (en) * 2004-11-12 2008-09-09 Applied Materials, Inc. Rapid detection of imminent failure in laser thermal processing of a substrate
KR20070090246A (ko) 2004-12-22 2007-09-05 칼 짜이스 레이저 옵틱스 게엠베하 선형 빔을 형성하기 위한 광 조명 시스템

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003258349A (ja) 2002-03-04 2003-09-12 Toshiba Corp レーザ加工方法、その装置および薄膜加工方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12339464B2 (en) 2020-04-23 2025-06-24 Samsung Display Co., Ltd. Apparatus for forming line beam

Also Published As

Publication number Publication date
TW201008061A (en) 2010-02-16
EP2245497A1 (en) 2010-11-03
KR20100114920A (ko) 2010-10-26
WO2009097967A1 (en) 2009-08-13
SG188785A1 (en) 2013-04-30
TWI481136B (zh) 2015-04-11
JP2011510820A (ja) 2011-04-07
US20090201955A1 (en) 2009-08-13
EP2245497B1 (en) 2016-12-14
JP5425813B2 (ja) 2014-02-26
US8723073B2 (en) 2014-05-13

Similar Documents

Publication Publication Date Title
KR101606105B1 (ko) 레이저 광원의 에너지를 제어하기 위한 조명 장치 및 방법
US6958470B2 (en) Scanning microscope with a detector and light source for exciting an energy state in a specimen and module for a scanning microscope
US20160144571A1 (en) Calibration Device and Calibration Method for an Apparatus for Producing an Object in Layers
US7499185B2 (en) Measuring device for workpiece held on chuck table
WO2012126659A1 (de) Messvorrichtung und messgerät zur mehrdimensionalen vermessung eines zielobjektes
JP2014525141A5 (enExample)
CN113008849B (zh) 紫外-近红外宽波段微区光致发光光谱测试装置
US8339613B2 (en) Making method of sample for evaluation of laser irradiation position and making apparatus thereof and evaluation method of stability of laser irradiation position and evaluation apparatus thereof
JP2008211136A (ja) レーザアニール装置及びアニール方法
US7394063B2 (en) Microscope for investigating the lifetime of excited states in a sample
CN113960015A (zh) 一种基于飞秒等离子体光栅的多脉冲诱导光谱方法以及装置
JP2008119716A (ja) レーザ加工装置およびレーザ加工装置における焦点維持方法
JP2017519222A (ja) ビーム誘導光学系から誘導される光線を分析するためのシステム及び方法
KR101930741B1 (ko) 레이저 어닐링 장치 및 레이저 어닐링 방법
US7375360B2 (en) Light device of arranging thin film inspection sensor array, and method and apparatus for arranging sensor array using the same
KR20180104913A (ko) 레이저 어닐링 장치 및 레이저 어닐링 방법
KR102143187B1 (ko) 레이저 가공 장치 및 이를 이용한 레이저 가공 방법
DE10353901A1 (de) Verfahren und Vorrichtung zur Bildung eines Substrats für Halbleiter oder dergleichen
CN120043460B (zh) 基于高分辨光谱的亚气氛激光焊接熔深在线检测系统及其检测方法
EP4589357A1 (en) Optical device, optical machining device, microscope device, and scanning method
US20050205779A1 (en) Scanning systems and methods with time delay sensing
TWI900227B (zh) 用於雷射加工的定位調整系統及其操作方法
JP3483723B2 (ja) レーザ加工装置
CN121113994A (zh) 一种基于飞秒激光-等离子体协同激发的检测方法及装备
WO2017037199A1 (en) A calibration device for two- or multi-photon absorption events and a method for calibrating a laser-scanning microscope

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20100903

Patent event code: PA01051R01D

Comment text: International Patent Application

AMND Amendment
PG1501 Laying open of application
A201 Request for examination
AMND Amendment
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20140121

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20141128

Patent event code: PE09021S01D

AMND Amendment
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20150528

Patent event code: PE09021S01D

AMND Amendment
E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20151127

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20150528

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

Patent event date: 20141128

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

AMND Amendment
J201 Request for trial against refusal decision
PJ0201 Trial against decision of rejection

Patent event date: 20151218

Comment text: Request for Trial against Decision on Refusal

Patent event code: PJ02012R01D

Patent event date: 20151127

Comment text: Decision to Refuse Application

Patent event code: PJ02011S01I

Appeal kind category: Appeal against decision to decline refusal

Appeal identifier: 2015101007521

Request date: 20151218

PB0901 Examination by re-examination before a trial

Comment text: Amendment to Specification, etc.

Patent event date: 20151218

Patent event code: PB09011R02I

Comment text: Request for Trial against Decision on Refusal

Patent event date: 20151218

Patent event code: PB09011R01I

Comment text: Amendment to Specification, etc.

Patent event date: 20150827

Patent event code: PB09011R02I

Comment text: Amendment to Specification, etc.

Patent event date: 20150123

Patent event code: PB09011R02I

Comment text: Amendment to Specification, etc.

Patent event date: 20140121

Patent event code: PB09011R02I

Comment text: Amendment to Specification, etc.

Patent event date: 20100917

Patent event code: PB09011R02I

B701 Decision to grant
PB0701 Decision of registration after re-examination before a trial

Patent event date: 20160127

Comment text: Decision to Grant Registration

Patent event code: PB07012S01D

Patent event date: 20160119

Comment text: Transfer of Trial File for Re-examination before a Trial

Patent event code: PB07011S01I

N231 Notification of change of applicant
PN2301 Change of applicant

Patent event date: 20160229

Comment text: Notification of Change of Applicant

Patent event code: PN23011R01D

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20160318

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20160318

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20210308

Start annual number: 6

End annual number: 6

PR1001 Payment of annual fee

Payment date: 20220310

Start annual number: 7

End annual number: 7

PR1001 Payment of annual fee

Payment date: 20230308

Start annual number: 8

End annual number: 8

PR1001 Payment of annual fee

Payment date: 20240305

Start annual number: 9

End annual number: 9