TWI479590B - 用於絲網印刷之短熱力曲線爐 - Google Patents
用於絲網印刷之短熱力曲線爐 Download PDFInfo
- Publication number
- TWI479590B TWI479590B TW098118947A TW98118947A TWI479590B TW I479590 B TWI479590 B TW I479590B TW 098118947 A TW098118947 A TW 098118947A TW 98118947 A TW98118947 A TW 98118947A TW I479590 B TWI479590 B TW I479590B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- gas
- heat exchange
- processing
- chamber
- Prior art date
Links
- 238000007650 screen-printing Methods 0.000 title claims description 27
- 239000000758 substrate Substances 0.000 claims description 178
- 238000012545 processing Methods 0.000 claims description 77
- 238000010438 heat treatment Methods 0.000 claims description 67
- 239000000463 material Substances 0.000 claims description 66
- 238000001035 drying Methods 0.000 claims description 47
- 238000000034 method Methods 0.000 claims description 34
- 238000012546 transfer Methods 0.000 claims description 31
- 239000012530 fluid Substances 0.000 claims description 24
- 230000008569 process Effects 0.000 claims description 20
- 238000000151 deposition Methods 0.000 claims description 17
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 10
- 229910052732 germanium Inorganic materials 0.000 claims description 9
- 238000010521 absorption reaction Methods 0.000 claims description 6
- 238000005286 illumination Methods 0.000 claims description 6
- 238000004891 communication Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 14
- 238000007639 printing Methods 0.000 description 13
- 230000032258 transport Effects 0.000 description 11
- 230000008021 deposition Effects 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 230000015654 memory Effects 0.000 description 6
- 230000033001 locomotion Effects 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 230000003134 recirculating effect Effects 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000000356 contaminant Substances 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 238000005265 energy consumption Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000011195 cermet Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 235000019504 cigarettes Nutrition 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 239000005315 stained glass Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- RBNWAMSGVWEHFP-UHFFFAOYSA-N trans-p-Menthane-1,8-diol Chemical compound CC(C)(O)C1CCC(C)(O)CC1 RBNWAMSGVWEHFP-UHFFFAOYSA-N 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
- 239000011364 vaporized material Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Drying Of Solid Materials (AREA)
- Supply, Installation And Extraction Of Printed Sheets Or Plates (AREA)
- Screen Printers (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ITUD20080135 ITUD20080135A1 (it) | 2008-06-11 | 2008-06-11 | Forno a basso profilo termico per stampa serigrafica |
| ITUD20080154 ITUD20080154A1 (it) | 2008-06-27 | 2008-06-27 | Forno a basso profilo termico per stampa serigrafica |
| US12/240,955 US20090308860A1 (en) | 2008-06-11 | 2008-09-29 | Short thermal profile oven useful for screen printing |
| US12/273,442 US20090311439A1 (en) | 2008-06-11 | 2008-11-18 | Short Thermal Profile Oven Useful For Screen Printing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201009990A TW201009990A (en) | 2010-03-01 |
| TWI479590B true TWI479590B (zh) | 2015-04-01 |
Family
ID=41151966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098118947A TWI479590B (zh) | 2008-06-11 | 2009-06-06 | 用於絲網印刷之短熱力曲線爐 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US20090308860A1 (cg-RX-API-DMAC7.html) |
| EP (1) | EP2301064B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP2011526734A (cg-RX-API-DMAC7.html) |
| KR (1) | KR20110030564A (cg-RX-API-DMAC7.html) |
| CN (2) | CN102057462B (cg-RX-API-DMAC7.html) |
| TW (1) | TWI479590B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2009150070A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101321604B (zh) * | 2005-12-06 | 2011-09-14 | 武藏高科技有限公司 | 加工装置及加工方法 |
| US10442226B2 (en) | 2008-06-13 | 2019-10-15 | Kateeva, Inc. | Gas enclosure assembly and system |
| US9048344B2 (en) | 2008-06-13 | 2015-06-02 | Kateeva, Inc. | Gas enclosure assembly and system |
| US10434804B2 (en) | 2008-06-13 | 2019-10-08 | Kateeva, Inc. | Low particle gas enclosure systems and methods |
| US12064979B2 (en) | 2008-06-13 | 2024-08-20 | Kateeva, Inc. | Low-particle gas enclosure systems and methods |
| US12018857B2 (en) | 2008-06-13 | 2024-06-25 | Kateeva, Inc. | Gas enclosure assembly and system |
| WO2011110231A1 (en) * | 2010-03-12 | 2011-09-15 | Q-Cells Se | Method and in-line production system for the production of solar cells |
| US20120060758A1 (en) * | 2011-03-24 | 2012-03-15 | Primestar Solar, Inc. | Dynamic system for variable heating or cooling of linearly conveyed substrates |
| US9589817B2 (en) * | 2011-04-15 | 2017-03-07 | Illinois Tool Works Inc. | Dryer |
| KR101828361B1 (ko) * | 2012-11-30 | 2018-02-12 | 카티바, 인크. | 산업용 프린팅 시스템의 유지 방법 |
| CN111490185A (zh) | 2013-12-26 | 2020-08-04 | 科迪华公司 | 电子装置的热加工 |
| KR102458181B1 (ko) | 2014-01-21 | 2022-10-21 | 카티바, 인크. | 전자 장치 인캡슐레이션을 위한 기기 및 기술 |
| KR102691361B1 (ko) | 2014-04-30 | 2024-08-05 | 카티바, 인크. | 가스 쿠션 장비 및 기판 코팅 기술 |
| US10676847B2 (en) | 2014-11-07 | 2020-06-09 | Illinois Tool Works Inc. | Discharge nozzle plate for center-to-ends fiber oxidation oven |
| US10458710B2 (en) | 2014-11-07 | 2019-10-29 | Illinois Tool Works Inc. | Supply plenum for center-to-ends fiber oxidation oven |
| CN104441956B (zh) * | 2014-12-10 | 2017-05-24 | 苏州互强工业设备有限公司 | 一种丝印烘干线 |
| CN104527218B (zh) * | 2014-12-24 | 2016-01-13 | 庄统壹 | 一种网版印刷机及利用该网版印刷机印刷的工艺方法 |
| CN108604619A (zh) * | 2016-02-22 | 2018-09-28 | 应用材料意大利有限公司 | 用于处理太阳能电池基板的设备、用于处理太阳能电池基板的系统和用于处理太阳能电池基板的方法 |
| GB2562503A (en) * | 2017-05-16 | 2018-11-21 | Asm Assembly Systems Singapore Pte Ltd | Workpiece transfer and printing |
| WO2019081041A1 (en) * | 2017-10-27 | 2019-05-02 | Applied Materials Italia S.R.L. | CONFIGURED APPARATUS FOR DETERMINING A STATE OF A DEPOSITION ARRANGEMENT, A SYSTEM FOR MANUFACTURING A SOLAR CELL, AND A METHOD FOR DETERMINING A STATUS OF A DEPOSIT ARRANGEMENT |
| CN110534611A (zh) * | 2018-05-25 | 2019-12-03 | 米亚索乐装备集成（福建）有限公司 | 一种用于片状电池的加热设备 |
| DE102018210558A1 (de) * | 2018-06-28 | 2019-02-28 | Heidelberger Druckmaschinen Ag | Druckvorrichtung mit einem Planarmotorsystem |
| KR102088778B1 (ko) * | 2018-08-07 | 2020-03-13 | 김영택 | 수용성 잉크를 이용한 인쇄기의 열 건조장치 |
| EP3725522B1 (de) * | 2019-04-18 | 2023-12-20 | Exentis Knowledge GmbH | Vorrichtung und verfahren zur herstellung von dreidimensionalen siebdruckwerkstücken |
| PT3725523T (pt) | 2019-04-18 | 2024-05-02 | Exentis Knowledge Gmbh | Dispositivo e método para a produção de peças serigrafadas tridimensionais |
| ES2978787T3 (es) * | 2019-04-18 | 2024-09-20 | Exentis Knowledge Gmbh | Dispositivo y procedimiento para la fabricación de piezas de trabajo de serigrafía tridimensionales |
| PT3725526T (pt) | 2019-04-18 | 2024-10-02 | Exentis Knowledge Gmbh | Processo para a produção de peças serografadas tridimensionais |
| CN111186211B (zh) * | 2020-02-04 | 2021-06-04 | 北部湾大学 | 一种用于陶瓷花纸印刷机的油墨干燥装置 |
| CN114801452A (zh) * | 2021-01-18 | 2022-07-29 | 博泽精密科技(苏州)有限公司 | 一种印刷机械自动上料机构 |
| CN215305176U (zh) * | 2021-06-15 | 2021-12-28 | 江门市新会恒隆家居创新用品有限公司 | 多士炉 |
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| US5467912A (en) * | 1992-11-27 | 1995-11-21 | Hitachi Techno Engineering Co., Ltd. | Reflow soldering apparatus for soldering electronic parts to circuit substrate |
| JP2004181483A (ja) * | 2002-12-03 | 2004-07-02 | Senju Metal Ind Co Ltd | リフロー炉 |
| US20080032018A1 (en) * | 2006-05-19 | 2008-02-07 | Russell Garniss | Combination Conveyor Oven |
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-
2009
- 2009-05-29 CN CN2009801225813A patent/CN102057462B/zh not_active Expired - Fee Related
- 2009-05-29 JP JP2011512930A patent/JP2011526734A/ja active Pending
- 2009-05-29 CN CN2013101388946A patent/CN103227127A/zh active Pending
- 2009-05-29 KR KR1020117000750A patent/KR20110030564A/ko not_active Abandoned
- 2009-05-29 EP EP09761633.8A patent/EP2301064B1/en not_active Not-in-force
- 2009-05-29 WO PCT/EP2009/056663 patent/WO2009150070A1/en not_active Ceased
- 2009-06-06 TW TW098118947A patent/TWI479590B/zh not_active IP Right Cessation
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Also Published As
| Publication number | Publication date |
|---|---|
| CN102057462A (zh) | 2011-05-11 |
| EP2301064A1 (en) | 2011-03-30 |
| CN102057462B (zh) | 2013-05-15 |
| KR20110030564A (ko) | 2011-03-23 |
| JP2011526734A (ja) | 2011-10-13 |
| TW201009990A (en) | 2010-03-01 |
| US20090308860A1 (en) | 2009-12-17 |
| EP2301064B1 (en) | 2018-08-29 |
| WO2009150070A1 (en) | 2009-12-17 |
| US20090311439A1 (en) | 2009-12-17 |
| CN103227127A (zh) | 2013-07-31 |
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