TWI479589B - 用於處理基板之設備及方法 - Google Patents

用於處理基板之設備及方法 Download PDF

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Publication number
TWI479589B
TWI479589B TW101130971A TW101130971A TWI479589B TW I479589 B TWI479589 B TW I479589B TW 101130971 A TW101130971 A TW 101130971A TW 101130971 A TW101130971 A TW 101130971A TW I479589 B TWI479589 B TW I479589B
Authority
TW
Taiwan
Prior art keywords
substrate
transfer
chamber
support roller
frame
Prior art date
Application number
TW101130971A
Other languages
English (en)
Chinese (zh)
Other versions
TW201316437A (zh
Inventor
Hong Goo Chung
Jin Ho Kim
Original Assignee
Semes Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semes Co Ltd filed Critical Semes Co Ltd
Publication of TW201316437A publication Critical patent/TW201316437A/zh
Application granted granted Critical
Publication of TWI479589B publication Critical patent/TWI479589B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning By Liquid Or Steam (AREA)
TW101130971A 2011-08-31 2012-08-27 用於處理基板之設備及方法 TWI479589B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20110088054 2011-08-31
KR1020110130296A KR101308136B1 (ko) 2011-08-31 2011-12-07 기판 처리 장치

Publications (2)

Publication Number Publication Date
TW201316437A TW201316437A (zh) 2013-04-16
TWI479589B true TWI479589B (zh) 2015-04-01

Family

ID=48176716

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101130971A TWI479589B (zh) 2011-08-31 2012-08-27 用於處理基板之設備及方法

Country Status (2)

Country Link
KR (1) KR101308136B1 (ko)
TW (1) TWI479589B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6289961B2 (ja) * 2014-03-27 2018-03-07 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
DE102016210883A1 (de) * 2016-06-17 2017-12-21 Singulus Technologies Ag Vorrichtung und Verfahren zur Behandlung von Substraten unter Verwendung einer Auflagerolle mit porösem Material

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1323660A (zh) * 2000-05-11 2001-11-28 东京化工机株式会社 薄板材表面处理装置
TW200503072A (en) * 2003-06-26 2005-01-16 Tokyo Ohka Kogyo Co Ltd In-line type development processing apparatus and method
KR20060045764A (ko) * 2004-04-16 2006-05-17 동경 엘렉트론 주식회사 현상처리장치 및 현상처리방법
KR20090128765A (ko) * 2008-06-11 2009-12-16 세메스 주식회사 기판 이송 장치 및 그의 사이드 롤러 구동 방법

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3727162B2 (ja) * 1998-01-12 2005-12-14 大日本スクリーン製造株式会社 付着液除去装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1323660A (zh) * 2000-05-11 2001-11-28 东京化工机株式会社 薄板材表面处理装置
TW200503072A (en) * 2003-06-26 2005-01-16 Tokyo Ohka Kogyo Co Ltd In-line type development processing apparatus and method
KR20060045764A (ko) * 2004-04-16 2006-05-17 동경 엘렉트론 주식회사 현상처리장치 및 현상처리방법
KR20090128765A (ko) * 2008-06-11 2009-12-16 세메스 주식회사 기판 이송 장치 및 그의 사이드 롤러 구동 방법

Also Published As

Publication number Publication date
TW201316437A (zh) 2013-04-16
KR101308136B1 (ko) 2013-09-12
KR20130024694A (ko) 2013-03-08

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