TWI479589B - Apparatus and method for treating substrate - Google Patents
Apparatus and method for treating substrate Download PDFInfo
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- TWI479589B TWI479589B TW101130971A TW101130971A TWI479589B TW I479589 B TWI479589 B TW I479589B TW 101130971 A TW101130971 A TW 101130971A TW 101130971 A TW101130971 A TW 101130971A TW I479589 B TWI479589 B TW I479589B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- Condensed Matter Physics & Semiconductors (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning By Liquid Or Steam (AREA)
Description
本發明係關於用於處理基板之設備和方法,且詳言之,係關於將處理溶液供應於正在傳送之基板上的設備和方法。The present invention relates to apparatus and methods for processing substrates, and in particular, to apparatus and methods for supplying a processing solution to a substrate being transported.
近來,資訊處理裝置已快速發展至具有各種功能和更高的運算速度。資訊處理裝置可具有顯示面板以顯示某些資訊。例如,液晶顯示器(LCD)之平板顯示面板已廣泛使用,此外,該顯示面板的尺寸和重量皆有增加的趨勢。Recently, information processing devices have rapidly developed to have various functions and higher computing speeds. The information processing device can have a display panel to display certain information. For example, a flat panel display panel of a liquid crystal display (LCD) has been widely used, and in addition, the size and weight of the display panel tend to increase.
平板顯示面板可經各種製程(例如,光微影、蝕刻和沈積製程)製造。通常,光微影可包含塗敷、曝光、顯影和清潔光致抗蝕劑層。在使光致抗蝕劑層顯影之步驟中,可於基板上供應和回收顯影溶液,接著可將清潔溶液供應於基板上。圖1為示意性地說明用於執行顯影和清潔製程之習知設備的剖視圖。參看圖1,使基板S顯影之步驟可於顯影腔室10中執行,且接著,清潔基板S之步驟可於清潔腔室20中執行。在顯影和清潔步驟期間,基板S可沿特定方向分別在腔室10和20中傳送。例如,若基板S位於顯影腔室10之水平截面A處,則可將顯影溶液供應於正在水平傳送之基板S上。之後,於顯影腔室10之角度改變區,可將基板S以傾斜狀態傳送以回收基板S上殘留之顯影溶液。Flat panel display panels can be fabricated by a variety of processes, such as photolithography, etching, and deposition processes. Typically, photolithography can include coating, exposing, developing, and cleaning the photoresist layer. In the step of developing the photoresist layer, the developing solution can be supplied and recovered on the substrate, and then the cleaning solution can be supplied onto the substrate. 1 is a cross-sectional view schematically illustrating a conventional apparatus for performing development and cleaning processes. Referring to FIG. 1, the step of developing the substrate S can be performed in the developing chamber 10, and then, the step of cleaning the substrate S can be performed in the cleaning chamber 20. During the development and cleaning steps, the substrate S can be transported in the chambers 10 and 20, respectively, in a particular direction. For example, if the substrate S is located at the horizontal section A of the developing chamber 10, the developing solution can be supplied onto the substrate S being conveyed horizontally. Thereafter, in the angle changing region of the developing chamber 10, the substrate S can be transported in an inclined state to recover the developing solution remaining on the substrate S.
然而,根據習知製程,當顯影溶液沿基板之傾斜表面流動時,基板上可能產生污點。可使用增加基板之傳送速度的方式克服該污點問題,但此方式可能導致製程失敗,如基板滑動。However, according to the conventional process, when the developing solution flows along the inclined surface of the substrate, stains may be generated on the substrate. This staining problem can be overcome by increasing the transfer speed of the substrate, but this approach can lead to process failures such as substrate slippage.
本發明概念之實施例提供將處理溶液供應於正在傳送之基板上的設備和方法。Embodiments of the inventive concept provide apparatus and methods for supplying a processing solution to a substrate being transported.
本發明概念之其他實施例提供當自正在傳送之基板回收處理溶液時防止污點產生的設備和方法。Other embodiments of the inventive concept provide apparatus and methods for preventing stain generation when recovering a processing solution from a substrate being transported.
本發明概念之其他實施例提供改良自正在傳送之基板回收處理溶液之效率的設備和方法。Other embodiments of the inventive concept provide apparatus and methods that improve the efficiency of recovering a processing solution from a substrate being transported.
本發明概念之其他實施例提供當以高速傳送基板時防止基板滑動的設備和方法。Other embodiments of the inventive concept provide an apparatus and method for preventing slippage of a substrate when the substrate is transferred at a high speed.
根據本發明概念之示範性實施例,一基板處理設備可包括:第一腔室;第二腔室,其具有內部空間,該內部空間連接至第一腔室之內部空間;基板傳送部件,其沿第一方向傳送基板;處理溶液供應部件,其提供於第一腔室中以將處理溶液供應於基板上;和清潔溶液供應單元,其提供於第二腔室中以包含將清潔溶液供應於基板上之清潔溶液供應部件。該基板傳送部件可包括:多個傳送軸,其提供於第一腔室與第二腔室中之每一者中且沿第一方向配置;和框架,其支撐該等傳送軸。該框架可包括:水平框架,其提供於第一腔室中;傳送軸,其由具有水平頂部之水平框架支撐;傾斜框架,其提供於第二腔室中;傳送軸,其由具有傾斜頂部之傾斜框架支撐;和角度改變框架,其於水平框架與傾斜框架之間提供於第二腔室中,該角度改變框架將其支撐的傳送軸之頂部自水平狀態改變至傾斜狀態。According to an exemplary embodiment of the inventive concept, a substrate processing apparatus may include: a first chamber; a second chamber having an internal space connected to an internal space of the first chamber; a substrate transfer member, Transmitting the substrate in a first direction; processing a solution supply member provided in the first chamber to supply the processing solution onto the substrate; and a cleaning solution supply unit provided in the second chamber to include supplying the cleaning solution A cleaning solution supply component on the substrate. The substrate transfer member may include a plurality of transfer shafts provided in each of the first chamber and the second chamber and disposed in a first direction, and a frame supporting the transfer shafts. The frame may include: a horizontal frame provided in the first chamber; a transfer shaft supported by the horizontal frame having the horizontal top; a tilt frame provided in the second chamber; and a transfer shaft having the inclined top The inclined frame support; and the angle changing frame are provided in the second chamber between the horizontal frame and the inclined frame, the angle changing frame changing the top of the conveying shaft supported by the frame from the horizontal state to the inclined state.
在示範性實施例中,該設備可進一步包括:處理溶液回收單元,其提供於第一腔室中以回收基板上殘留之處理溶液。該處理溶液回收單元可包括:第一支撐滾柱;加壓流體供應部件,其於基板之由第一支撐滾柱支撐的區域上噴灑加壓流體。該第一支撐滾柱可提供於傳送軸之間。在 示範性實施例中,該第一支撐滾柱可具有頂部,該頂部具有與傳送滾柱相同之垂直高度。在其他實施例中,第一支撐滾柱可具有頂部,該頂部位於高於傳送滾柱之垂直高度的垂直高度處。該第一支撐滾柱可具有圓柱形形狀和縱向方向,該縱向方向平行於傳送軸之縱向方向。該第一支撐滾柱之直徑可大於傳送軸之直徑。該處理溶液回收單元可定位於第一腔室之端部。該角度改變框架可包括:第一角度改變框架,其支撐傳送軸之一側端部;第二角度改變框架,其支撐傳送軸之另一側端部且可在垂直方向上移動。該清潔溶液供應部件可定位於角度改變框架上。該清潔溶液供應單元可進一步包括:第二支撐滾柱,其提供於傳送軸之間以具有由角度改變框架支撐之端部,且該清潔溶液供應部件可配置在基板之由第二支撐滾柱支撐之區域上噴灑清潔溶液。In an exemplary embodiment, the apparatus may further include: a processing solution recovery unit provided in the first chamber to recover the processing solution remaining on the substrate. The treatment solution recovery unit may include: a first support roller; a pressurized fluid supply member that sprays pressurized fluid on a region of the substrate supported by the first support roller. The first support roller can be provided between the transfer shafts. in In an exemplary embodiment, the first support roller can have a top having the same vertical height as the transfer roller. In other embodiments, the first support roller can have a top that is at a vertical height that is higher than the vertical height of the transfer roller. The first support roller may have a cylindrical shape and a longitudinal direction that is parallel to the longitudinal direction of the transfer shaft. The diameter of the first support roller may be greater than the diameter of the transfer shaft. The treatment solution recovery unit can be positioned at an end of the first chamber. The angle changing frame may include: a first angle changing frame that supports one side end of the conveying shaft; and a second angle changing frame that supports the other side end of the conveying shaft and is movable in a vertical direction. The cleaning solution supply member can be positioned on the angle changing frame. The cleaning solution supply unit may further include: a second support roller provided between the transfer shafts to have an end supported by the angle change frame, and the cleaning solution supply member may be disposed on the substrate by the second support roller Spray the cleaning solution over the area of the support.
根據本發明概念之示範性實施例,一基板處理設備可包括:腔室、基板傳送部件,其提供於該腔室中以包括多個傳送軸,該基板傳送部件可沿第一方向配置以沿第一方向傳送基板;和多個傳送滾柱,其每一者可提供於傳送軸中之每一者的外圓周表面上以與基板接觸;處理溶液供應部件,其提供於該腔室中以將處理溶液供應於基板上;和處理溶液回收單元,其回收基板上殘留之處理溶液。該處理溶液回收單元可包括:第一支撐滾柱,其提供於傳送軸之間;和加壓流體供應部件,其將加壓流體噴灑至基板之由第一支撐滾柱支撐的區域。According to an exemplary embodiment of the inventive concept, a substrate processing apparatus may include: a chamber, a substrate transfer member provided in the chamber to include a plurality of transfer shafts, the substrate transfer member being configurable along the first direction to a first direction conveying substrate; and a plurality of transfer rollers each of which may be provided on an outer circumferential surface of each of the transfer shafts to be in contact with the substrate; a processing solution supply member provided in the chamber The treatment solution is supplied onto the substrate; and a treatment solution recovery unit that recovers the treatment solution remaining on the substrate. The treatment solution recovery unit may include: a first support roller provided between the transfer shafts; and a pressurized fluid supply member that sprays the pressurized fluid to a region of the substrate supported by the first support roller.
在示範性實施例中,該第一支撐滾柱可具有頂部,該頂部位於與傳送滾柱大致相同之垂直高度處。該第一支撐滾柱可具有頂部,該頂部位於高於傳送滾柱之垂直高度的垂直高度處。該第一支撐滾柱可具有圓柱形形狀和縱向方 向,該縱向方向平行於傳送軸之縱向方向。該第一支撐滾柱之長度可等於或大於基板之寬度。In an exemplary embodiment, the first support roller can have a top that is located at substantially the same vertical height as the transfer roller. The first support roller can have a top that is at a vertical height that is higher than the vertical height of the transfer roller. The first support roller can have a cylindrical shape and a longitudinal direction The longitudinal direction is parallel to the longitudinal direction of the transport axis. The length of the first support roller may be equal to or greater than the width of the substrate.
根據本發明概念之示範性實施例,處理正在傳送之基板的方法包括:將處理溶液供應於基板上,該基板可於第一腔室中水平傳送;噴灑加壓流體以回收基板上殘留之處理溶液;和接著,於第二腔室中將基板之位置自水平狀態改變至傾斜狀態。According to an exemplary embodiment of the inventive concept, a method of processing a substrate being transferred includes: supplying a processing solution to a substrate, the substrate being horizontally transportable in the first chamber; and spraying the pressurized fluid to recover a residue remaining on the substrate a solution; and then, the position of the substrate is changed from a horizontal state to a tilted state in the second chamber.
在示範性實施例中,該方法可進一步包括:在基板自水平狀態改變至傾斜狀態期間,將清潔溶液供應於基板上。In an exemplary embodiment, the method may further include supplying the cleaning solution onto the substrate during the changing of the substrate from the horizontal state to the tilting state.
現在將參考示出示範性實施例之隨附圖式更詳盡地描述本發明概念之示範性實施例。然而,本發明概念之示範性實施例可以許多不同形式具體化且不應解釋為限於本文示出之實施例;確切言之,提供此等實施例以使得本揭示案全面且完整,且將向一般技藝人士充分傳達示範性實施例之概念。為明確起見,圖式之層和區域之厚度被誇示。圖式之相同參考數字表示相同元件,因此將省略對其之描述。Exemplary embodiments of the inventive concept will now be described in more detail with reference to the accompanying drawings. However, the exemplary embodiments of the present invention may be embodied in many different forms and should not be construed as being limited to the embodiments shown herein. The embodiments are provided so that the disclosure is comprehensive and complete, and The concept of an exemplary embodiment is fully conveyed by one of ordinary skill in the art. The thickness of the layers and regions of the drawings are exaggerated for clarity. The same reference numerals in the drawings denote the same elements, and thus the description thereof will be omitted.
應理解,當一元件被稱作「連接」或「耦接」至另一元件時,其可直接連接或耦接至另一元件或可能存在中間元件。相反,當一元件被稱作「直接連接」或「直接耦接」至另一元件時,則不存在中間元件。全文中相同數字指示相同元件。本文使用之術語「和/或」包含一個或多個相關聯列舉項目之任一和全部組合。用於描述元件或層間之關係的其他措辭應以類似方式解釋(如,「在......之間」對「直接在......中間」、「相鄰」對「直接相鄰」、「上」對「正上方」)。It will be understood that when an element is referred to as "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or the intermediate element. In contrast, when an element is referred to as being "directly connected" or "directly coupled" to another element, the <RTIgt; The same numbers in the text indicate the same elements. The term "and/or" used herein includes any and all combinations of one or more of the associated listed items. Other wording used to describe the relationship between elements or layers should be interpreted in a similar manner (eg, "between" and "directly in", "adjacent" to "directly" Adjacent, "upper" to "positive").
應理解,雖然本文可使用術語「第一」、「第二」等描 述各元件、組件、區域、層和/或區,但此等元件、組件、區域、層和/或區不應受此等術語限制。此等術語僅用於區別一個元件、組件、區域、層或區與另一元件、組件、區域、層或區。因此,以下論述之第一元件、組件、區域、層或區可稱為第二元件、組件、區域、層或區,而不脫離示範性實施例之教示。It should be understood that although the terms "first", "second", etc. may be used herein The various elements, components, regions, layers and/or regions are described, but such elements, components, regions, layers and/or regions are not limited by these terms. The terms are used to distinguish one element, component, region, layer or layer with another element, component, region, layer or region. Thus, a first element, component, region, layer or layer of the shoWs may be referred to as a second element, component, region, layer or region without departing from the teachings of the exemplary embodiments.
為便於描述,本文可使用空間相對術語,如「之下」、「以下」、「下」、「上方」、「上」和其類似者以描述如圖式所示之一個元件或特徵與另一(些)元件或特徵之關係。應理解,空間相對術語意欲包含裝置在使用或操作中除圖式中描繪之定向外的不同定向。例如,若圖式之裝置被翻轉,則描述為在其他元件或特徵「下」或「之下」的元件將定向為在其他元件或特徵之「上方」。因此,示範性術語「下」可包含上方和下兩個定向。裝置可不同地定向(旋轉90度或其他定向),且本文使用之空間相對描述詞會相應做出解釋。For ease of description, this document may use spatially relative terms such as "below", "below", "below", "above", "upper" and the like to describe one element or feature as shown in the figure. The relationship of one or more components or features. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the drawings. For example, elements that are described as "under" or "beneath" or "an" or "an" Thus, the exemplary term "lower" can encompass both an orientation and an orientation. The device can be oriented differently (rotated 90 degrees or other orientations) and the spatially relative descriptors used herein will be interpreted accordingly.
本文使用之術語僅用於描述特定實施例之目的且不意欲限制示範性實施例。於本文中使用時,除非上下文另行明確表明,否則單數形式「一」和「該」意欲亦包含多形式。將進一步理解,若本文使用術語「包括」、「包含」,則說明存在所述特徵、整數、步驟、操作、元件和/或部件,但不排除存在或增加一個或多個其他特徵、整數、步驟、操作、元件、部件和/或其群組。The terminology used herein is for the purpose of describing particular embodiments and is not intended to As used herein, the singular forms """ It will be further understood that the terms "comprising", "comprising" and "comprising" are used to mean the presence of the features, integers, steps, operations, components and/or components, but do not exclude the presence or addition of one or more other features, integers, Steps, operations, components, components, and/or groups thereof.
本文參考為示範性實施例之理想化實施例(和中間結構)的示意性說明的橫截面說明來描述本發明概念之示範性實施例。因此,可預期由於例如製造方法和/或公差而導致之自所說明形狀的變化。因此,本發明概念之示範性實施例不應被解釋為限於本文說明之區域之特定形狀,而應 包含由於例如製造而導致之形狀上的背離。例如,說明為矩形之植入區域在其邊緣可具有圓或彎曲特徵和/或植入濃度之梯度,而非自植入區域至非植入區域之二元改變。同樣,由植入形成之掩埋區域可導致於掩埋區域與植入發生之表面間的區域中的一些植入。因此,圖式說明之區域本質上係示意性的,且其形狀不意欲說明裝置之區域之實際形狀且不意欲限制示範性實施例之範疇。Exemplary embodiments of the inventive concept are described herein with reference to cross-section illustrations of the schematic illustrations of the idealized embodiments (and intermediate structures) of the exemplary embodiments. Thus, variations from the illustrated shapes may be contemplated as a result, for example, by the method of manufacture and/or tolerances. Therefore, exemplary embodiments of the inventive concept should not be construed as limited Contains deviations in shape due to, for example, manufacturing. For example, an implanted region illustrated as a rectangle may have rounded or curved features and/or a gradient of implant concentration at its edges rather than a binary change from the implanted region to the non-implanted region. Likewise, a buried region formed by implantation can result in some implantation in the region between the buried region and the surface where the implant occurs. The exemplification of the present invention is intended to be illustrative, and is not intended to limit the scope of the exemplary embodiments.
除非另行定義,否則本文使用之所有術語(包含技術和科學術語)之意義與熟習本發明概念之示範性實施例所屬之技術者所通常理解的意義相同。將進一步理解,除非本文明確定義,否則如常用辭典中所定義之術語應解釋為其意義與相關技術之上下文中的意義一致且不以理想化或過於正式之意義來解釋。All terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the <RTIgt; It will be further understood that the terms as defined in the commonly used dictionary should be interpreted as meanings that are consistent with the meaning in the context of the related art and are not interpreted in an idealized or overly formal sense, unless explicitly defined herein.
為簡單起見,以下描述將關於本實施例中使用了用於製造平板顯示面板之基板的實例。然而,本發明概念之示範性實施例可不限於此。例如,基板S可為用於製造半導體晶片之晶圓。此外,基板S上之顯影製程將描述為本發明概念之實施例之實例,而本發明概念之示範性實施例可不限於此。例如,以下將描述之本發明概念將適用於各製程,包含將處理溶液供應於基板S上/自基板S回收處理溶液或清潔基板S和用於執行該等製程之設備。For the sake of simplicity, the following description will be directed to an example in which a substrate for manufacturing a flat panel display panel is used in the present embodiment. However, exemplary embodiments of the inventive concept may not be limited thereto. For example, the substrate S can be a wafer for manufacturing a semiconductor wafer. Further, the developing process on the substrate S will be described as an example of an embodiment of the inventive concept, and exemplary embodiments of the inventive concept are not limited thereto. For example, the inventive concept, which will be described below, will be applicable to various processes, including supplying a processing solution onto a substrate S/recovering a processing solution or cleaning a substrate S from a substrate S, and an apparatus for performing the processes.
圖2為說明根據本發明概念之示範性實施例之基板處理設備的剖視圖。參看圖2,基板處理設備1000可配置於基板上執行顯影製程。基板處理設備1000可包含:顯影腔室100、清潔腔室200、基板傳送部件300、處理溶液供應部件400、處理溶液回收單元500和清潔溶液供應單元600。2 is a cross-sectional view illustrating a substrate processing apparatus in accordance with an exemplary embodiment of the inventive concept. Referring to FIG. 2, the substrate processing apparatus 1000 may be disposed on a substrate to perform a development process. The substrate processing apparatus 1000 may include a developing chamber 100, a cleaning chamber 200, a substrate conveying member 300, a processing solution supply part 400, a processing solution recovery unit 500, and a cleaning solution supply unit 600.
顯影腔室100和清潔腔室200中之每一者可提供將執行處理基板S之製程的空間。例如,可於顯影腔室100中 執行使基板S顯影之製程,且可於清潔腔室200中執行清潔基板S之製程。在示範性實施例中,顯影腔室100和清潔腔室200可於沿第一方向12配置成列。顯影腔室100和清潔腔室200可配置成具有大致相同之形狀或結構。顯影腔室100和清潔腔室200中之每一者可具有類似長方體之形狀。顯影腔室100和清潔腔室200中之每一者可包含:入口102或202,其用於將基板S裝載於其中;和出口104或204,其用於從其中卸載基板S。顯影腔室100之出口104可提供成面向清潔腔室200之入口202。此外,顯影腔室100和清潔腔室200可以其內部空間彼此連接之方式提供。Each of the developing chamber 100 and the cleaning chamber 200 may provide a space in which the process of processing the substrate S will be performed. For example, in the developing chamber 100 A process of developing the substrate S is performed, and a process of cleaning the substrate S can be performed in the cleaning chamber 200. In an exemplary embodiment, the development chamber 100 and the cleaning chamber 200 may be arranged in a row in a first direction 12 . The developing chamber 100 and the cleaning chamber 200 may be configured to have substantially the same shape or structure. Each of the developing chamber 100 and the cleaning chamber 200 may have a shape resembling a rectangular parallelepiped. Each of the developing chamber 100 and the cleaning chamber 200 may include an inlet 102 or 202 for loading the substrate S therein, and an outlet 104 or 204 for unloading the substrate S therefrom. The outlet 104 of the development chamber 100 can be provided to face the inlet 202 of the cleaning chamber 200. Further, the developing chamber 100 and the cleaning chamber 200 may be provided in such a manner that their internal spaces are connected to each other.
基板傳送部件300可配置成沿第一方向12運送基板S。基板傳送部件300中之至少一者可提供於顯影腔室100和清潔腔室200中。基板傳送部件300中之每一者可包含傳送軸330、傳送滾柱320、框架340和導向滾柱350。在示範性實施例中,可於基板傳送部件300中提供多個傳送軸330。每個傳送軸330可配置成具有垂直於第一方向12之縱向方向(例如,沿第二方向14)。傳送軸330可配置成沿第一方向12相互平行。傳送軸330可相互隔開。傳送軸330可提供成具有垂直位置,該等垂直位置可對應於八口102與202和出口104與204之位置。The substrate transfer component 300 can be configured to transport the substrate S in the first direction 12 . At least one of the substrate transfer members 300 may be provided in the developing chamber 100 and the cleaning chamber 200. Each of the substrate transfer members 300 may include a transfer shaft 330, a transfer roller 320, a frame 340, and a guide roller 350. In an exemplary embodiment, a plurality of transfer shafts 330 may be provided in the substrate transfer unit 300. Each of the transfer shafts 330 can be configured to have a longitudinal direction that is perpendicular to the first direction 12 (eg, along the second direction 14). The transfer shafts 330 can be configured to be parallel to each other in the first direction 12. The transfer shafts 330 can be spaced apart from one another. The transfer shaft 330 can be provided with a vertical position that can correspond to the position of the eight ports 102 and 202 and the outlets 104 and 204.
可為傳送軸330配備傳送滾柱320以支撐基板S之底表面。在示範性實施例中,可為每個傳送軸330配備多個傳送滾柱320。每個傳送滾柱320可具有提供於其中心軸線處之孔,且傳送軸330可強制性地插入傳送滾柱320之孔中。傳送滾柱320可隨傳送軸330旋轉。The transfer shaft 330 may be provided with transfer rollers 320 to support the bottom surface of the substrate S. In an exemplary embodiment, each of the transfer shafts 330 may be provided with a plurality of transfer rollers 320. Each of the transfer rollers 320 may have a hole provided at a central axis thereof, and the transfer shaft 330 may be forcibly inserted into a hole of the transfer roller 320. The transfer roller 320 is rotatable with the transfer shaft 330.
框架340可支撐傳送軸330,且以可旋轉傳送軸330之方式配置。例如,可於傳送軸330之兩側提供一對框架340以支撐傳送軸330之兩個端部。框架340可包含水平框架 342、傾斜框架346和角度改變框架344。水平框架342可提供於顯影腔室100中。可以使得傳送軸330之兩端具有相同垂直高度之方式提供水平框架342。The frame 340 can support the transfer shaft 330 and be configured in a rotatable transfer shaft 330. For example, a pair of frames 340 may be provided on both sides of the transfer shaft 330 to support both ends of the transfer shaft 330. Frame 340 can include a horizontal frame 342. The tilt frame 346 and the angle changing frame 344. A horizontal frame 342 may be provided in the developing chamber 100. The horizontal frame 342 can be provided in such a manner that both ends of the transfer shaft 330 have the same vertical height.
可以使得傳送軸330之兩端具有彼此不同的垂直高度之方式提供傾斜框架346。傾斜框架346可提供於清潔腔室200中。可以使得傳送軸330之一個端部與由水平框架342支撐之傳送軸330的端部具有相同垂直高度的方式提供傾斜框架346。此外,可以使得傳送軸330之另一端部所處之垂直高度高於由水平框架342支撐之傳送軸330的垂直高度的方式提供傾斜框架346。例如,傳送軸330可配置成具有相對地面約5°之角度。The inclined frame 346 may be provided in such a manner that both ends of the transfer shaft 330 have different vertical heights from each other. A tilt frame 346 can be provided in the cleaning chamber 200. The inclined frame 346 may be provided in such a manner that one end of the transfer shaft 330 has the same vertical height as the end of the transfer shaft 330 supported by the horizontal frame 342. Further, the inclined frame 346 may be provided in such a manner that the other end portion of the conveying shaft 330 is positioned at a higher vertical height than the conveying shaft 330 supported by the horizontal frame 342. For example, the transfer shaft 330 can be configured to have an angle of about 5[deg.] with respect to the ground.
角度改變框架344可經配置以改變傳送軸之角度。圖3為說明提供於圖2之清潔腔室中的基板傳送部件的透視圖。參看圖3,角度改變框架344可支撐傳送軸330之兩端,且配置成能實現傳送軸330之傾斜。角度改變框架344可提供於清潔腔室200中。角度改變框架344可經配置以改變傳送軸330之角度,使得基板S可經由水平框架342支撐之傳送軸330傳送至由傾斜框架346支撐之傳送軸330。角度改變框架344可包含第一角度改變框架344a和第二角度改變框架344b。第一角度改變框架344a可經配置以支撐傳送軸330之端部。第一角度改變框架344a可提供成具有與水平框架342相同之垂直高度。第二角度改變框架344b可支撐傳送軸330之另一端部。第二角度改變框架344b可以使其可定位於水平或傾斜位置之方式而藉由驅動部件(未圖示)垂直移動。此處,水平位置可為第二角度改變框架344b與水平框架342具有相同垂直高度之位置。傾斜位置可為第二角度改變框架344b之垂直高度高於水平框架342之垂直高度的位置。The angle change frame 344 can be configured to change the angle of the transfer axis. 3 is a perspective view illustrating a substrate transfer member provided in the cleaning chamber of FIG. 2. Referring to FIG. 3, the angle changing frame 344 can support both ends of the transfer shaft 330 and is configured to enable tilting of the transfer shaft 330. An angle change frame 344 can be provided in the cleaning chamber 200. The angle change frame 344 can be configured to change the angle of the transfer shaft 330 such that the substrate S can be transferred to the transfer shaft 330 supported by the tilt frame 346 via the transfer shaft 330 supported by the horizontal frame 342. The angle change frame 344 can include a first angle change frame 344a and a second angle change frame 344b. The first angle change frame 344a can be configured to support the end of the transfer shaft 330. The first angle change frame 344a can be provided to have the same vertical height as the horizontal frame 342. The second angle changing frame 344b can support the other end of the transfer shaft 330. The second angular change frame 344b can be vertically moved by a drive member (not shown) such that it can be positioned in a horizontal or inclined position. Here, the horizontal position may be a position where the second angle changing frame 344b has the same vertical height as the horizontal frame 342. The tilted position may be a position at which the second angle changes the vertical height of the frame 344b to be higher than the vertical height of the horizontal frame 342.
基板S可由導向滾柱350導向,使得基板S可沿第一方向12運送。導向滾柱350可經配置以支撐基板S之一側。導向滾柱350可提供於顯影腔室100和清潔腔室200中之每一者中。導向滾柱350可提供於傳送軸330之間。提供於顯影腔室100中之導向滾柱350可經配置以支撐基板S之兩側。提供於清潔腔室200中之導向滾柱350可經配置以支撐基板S之一側。提供於清潔腔室200中之導向滾柱350可安置為接近傳送軸330之另一端部。The substrate S can be guided by the guide rollers 350 such that the substrate S can be transported in the first direction 12. The guide roller 350 can be configured to support one side of the substrate S. Guide rollers 350 may be provided in each of the developing chamber 100 and the cleaning chamber 200. Guide rollers 350 may be provided between the transfer shafts 330. The guide rollers 350 provided in the developing chamber 100 may be configured to support both sides of the substrate S. The guide roller 350 provided in the cleaning chamber 200 may be configured to support one side of the substrate S. A guide roller 350 provided in the cleaning chamber 200 may be disposed adjacent to the other end of the transfer shaft 330.
再次參看圖2,處理溶液供應部件400可經配置以將處理溶液供應於基板S上。處理溶液供應部件400可提供於顯影腔室100中。處理溶液供應部件400可安置於傳送軸330上以將處理溶液供應於待朝向第一方向12傳送之基板S上。在示範性實施例中,處理溶液可為顯影溶液。處理溶液供應部件400可包含本體和噴嘴。本體可為類似桿之形狀,其縱向方向朝向第二方向14。在示範性實施例中,本體之縱向方向可提供為平行於傳送軸330。本體之長度可等於或大於基板S之寬度。本體可包含沿第二方向14於其底表面上形成之多個孔。可向該等孔分別配備噴嘴。Referring again to FIG. 2, the processing solution supply component 400 can be configured to supply a processing solution to the substrate S. The treatment solution supply part 400 may be provided in the development chamber 100. The processing solution supply part 400 may be disposed on the transfer shaft 330 to supply the processing solution onto the substrate S to be conveyed toward the first direction 12. In an exemplary embodiment, the treatment solution may be a development solution. The treatment solution supply part 400 may include a body and a nozzle. The body may be in the shape of a rod with its longitudinal direction facing the second direction 14. In an exemplary embodiment, the longitudinal direction of the body may be provided parallel to the transfer axis 330. The length of the body may be equal to or greater than the width of the substrate S. The body can include a plurality of apertures formed in a second direction 14 on a bottom surface thereof. A nozzle can be provided to each of the holes.
處理溶液回收單元500可經配置以回收基板S上殘留之處理溶液。處理溶液回收單元500可提供於顯影腔室100中。處理溶液回收單元500可安置於接近顯影腔室100之出口104之區域處。處理溶液回收單元500可包含加壓流體供應部件510和第一支撐滾柱530。加壓流體供應部件510可經配置以於基板S上噴灑加壓流體和回收處理溶液。加壓流體可為例如大氣氣體或惰性氣體。加壓流體供應部件510可提供於傳送軸330上。加壓流體供應部件510可包含本體和噴嘴。該本體可為類似桿之形狀,其縱向方向朝向第二方向14。本體之長度可等於或大於基板S之寬 度。該本體可包含沿第二方向14於其底表面上形成之多個孔。可向該等孔分別配備噴嘴。每個噴嘴之噴射孔可朝向向下傾斜方向,使得出自噴嘴之溶液可遠離顯影腔室100之出口104而噴灑。加壓流體供應部件510可以使得處理溶液可朝向與基板之傳送方向相反之方向流動的方式噴灑加壓流體。The treatment solution recovery unit 500 can be configured to recover the treatment solution remaining on the substrate S. The treatment solution recovery unit 500 may be provided in the development chamber 100. The treatment solution recovery unit 500 may be disposed at an area close to the outlet 104 of the development chamber 100. The treatment solution recovery unit 500 may include a pressurized fluid supply part 510 and a first support roller 530. The pressurized fluid supply component 510 can be configured to spray a pressurized fluid and recover a processing solution onto the substrate S. The pressurized fluid can be, for example, an atmospheric gas or an inert gas. The pressurized fluid supply member 510 can be provided on the transfer shaft 330. The pressurized fluid supply component 510 can include a body and a nozzle. The body may be in the shape of a rod with its longitudinal direction facing the second direction 14. The length of the body may be equal to or greater than the width of the substrate S degree. The body can include a plurality of apertures formed in a second direction 14 on a bottom surface thereof. A nozzle can be provided to each of the holes. The injection holes of each nozzle may be inclined downwardly so that the solution from the nozzles can be sprayed away from the outlet 104 of the development chamber 100. The pressurized fluid supply member 510 can cause the treatment solution to spray the pressurized fluid in a manner to flow in a direction opposite to the direction in which the substrate is conveyed.
多個傳送軸330可沿第一方向12相互隔開地提供。由於基板S之重量或體積的增加,基板S可能下垂於基板傳送部件300之間。結果,基板S可能具有沿第一方向12之不平坦的頂表面。如圖4和圖5所示,自基板S之凹陷頂表面回收處理溶液可能有困難。A plurality of transfer shafts 330 can be provided spaced apart from one another in the first direction 12. Due to an increase in the weight or volume of the substrate S, the substrate S may hang down between the substrate transfer members 300. As a result, the substrate S may have an uneven top surface along the first direction 12. As shown in FIGS. 4 and 5, it may be difficult to recover the treatment solution from the recessed top surface of the substrate S.
甚至在基板S之由傳送滾柱320支撐之部分,基板S亦可能下垂於傳送滾柱320之間。例如,基板S可具有沿第二方向之不平坦的頂表面。Even in the portion of the substrate S supported by the transfer roller 320, the substrate S may hang down between the transfer rollers 320. For example, the substrate S may have an uneven top surface in the second direction.
第一支撐滾柱530可以使得基板S之將被供應加壓流體之部分可具有平坦輪廓之方式支撐基板S。第一支撐滾柱530可以使得基板S之將被供應加壓流體之頂表面可為平坦的方式支撐基板S之底表面。圖6為說明圖2之第一支撐滾柱的前視圖。參看圖6,第一支撐滾柱可形成為具有圓柱形形狀。第一支撐滾柱530可提供為具有平行於第二方向14之縱向方向。第一支撐滾柱530可提供於傳送軸330之間。可定位第一支撐滾柱530以支撐基板S之將被噴灑加壓流體之區域。第一支撐滾柱530之頂部可位於等於或略高於傳送滾柱320之垂直高度的垂直高度處。例如,第一支撐滾柱530和傳送滾柱320可具有由相同材料形成之外圓周表面。The first support roller 530 may support the substrate S such that the portion of the substrate S to be supplied with the pressurized fluid may have a flat profile. The first support roller 530 may support the bottom surface of the substrate S in such a manner that the top surface of the substrate S to be supplied with the pressurized fluid may be flat. Figure 6 is a front elevational view showing the first support roller of Figure 2; Referring to FIG. 6, the first support roller may be formed to have a cylindrical shape. The first support roller 530 can be provided to have a longitudinal direction that is parallel to the second direction 14. The first support roller 530 can be provided between the transfer shafts 330. The first support roller 530 can be positioned to support the area of the substrate S where the pressurized fluid will be sprayed. The top of the first support roller 530 can be located at a vertical height equal to or slightly above the vertical height of the transfer roller 320. For example, the first support roller 530 and the transfer roller 320 may have an outer circumferential surface formed of the same material.
再次參看圖2,清潔溶液供應單元600可經配置以清潔基板S。清潔溶液供應單元600可提供於清潔腔室200中。 清潔溶液供應單元600可提供為接近於清潔腔室200之入口202。清潔溶液供應單元600可包含清潔溶液供應部件610。清潔溶液供應部件610可經配置以於裝載入清潔腔室200中之基板S上噴灑清潔溶液。例如,清潔溶液可為去離子水。清潔溶液供應部件610可定位於由角度改變框架344支撐之傳送軸330上。清潔溶液供應部件610可包含本體和噴嘴。該本體可為類似桿之形狀,其縱向方向朝向第二方向14。本體之長度可等於或大於基板S之寬度。該本體可包含沿第二方向14於其底表面上形成之多個孔。可向該等孔分別配備噴嘴。在示範性實施例中,可以使得清潔溶液供應部件610之本體的縱向方向平行於在其下提供之傳送軸330之縱向方向的方式來提供清潔溶液供應部件610之本體。若傳送軸330之角度改變,則亦可調整清潔溶液供應部件610之本體之角度以補償該改變。Referring again to FIG. 2, the cleaning solution supply unit 600 can be configured to clean the substrate S. The cleaning solution supply unit 600 may be provided in the cleaning chamber 200. The cleaning solution supply unit 600 may be provided to be close to the inlet 202 of the cleaning chamber 200. The cleaning solution supply unit 600 may include a cleaning solution supply part 610. The cleaning solution supply component 610 can be configured to spray a cleaning solution onto the substrate S loaded into the cleaning chamber 200. For example, the cleaning solution can be deionized water. The cleaning solution supply member 610 can be positioned on the transfer shaft 330 supported by the angle changing frame 344. The cleaning solution supply part 610 can include a body and a nozzle. The body may be in the shape of a rod with its longitudinal direction facing the second direction 14. The length of the body may be equal to or greater than the width of the substrate S. The body can include a plurality of apertures formed in a second direction 14 on a bottom surface thereof. A nozzle can be provided to each of the holes. In an exemplary embodiment, the body of the cleaning solution supply member 610 may be provided in such a manner that the longitudinal direction of the body of the cleaning solution supply member 610 is parallel to the longitudinal direction of the conveying shaft 330 provided thereunder. If the angle of the transfer shaft 330 is changed, the angle of the body of the cleaning solution supply member 610 can also be adjusted to compensate for the change.
在其他實施例中,清潔溶液供應部件610之本體可配置成具有固定縱向方向(例如,平行於水平方向)。In other embodiments, the body of the cleaning solution supply component 610 can be configured to have a fixed longitudinal direction (eg, parallel to the horizontal direction).
在其他實施例中,圖7之清潔溶液供應單元600可進一步包含第二支撐滾柱630。可提供第二支撐滾柱630以支撐基板S之底表面,使得基板S之頂表面在將被供應清潔溶液之區域處可為平坦的。第二支撐滾柱630可具有圓柱形形狀。可以使得第二支撐滾柱630之縱向方向朝向第二方向的方式來提供第二支撐滾柱630。第二支撐滾柱630可提供於傳送軸330之間。第二支撐滾柱630可提供成具有頂部,該頂部定位於與第一支撐滾柱530相同之高度處。第二支撐滾柱630之兩端可配備於角度改變框架344上,使得第二支撐滾柱630可類似於傳送軸330而傾斜。In other embodiments, the cleaning solution supply unit 600 of FIG. 7 may further include a second support roller 630. A second support roller 630 may be provided to support the bottom surface of the substrate S such that the top surface of the substrate S may be flat at the area where the cleaning solution is to be supplied. The second support roller 630 may have a cylindrical shape. The second support roller 630 may be provided in such a manner that the longitudinal direction of the second support roller 630 faces the second direction. A second support roller 630 can be provided between the transfer shafts 330. The second support roller 630 can be provided with a top that is positioned at the same height as the first support roller 530. Both ends of the second support roller 630 may be provided on the angle change frame 344 such that the second support roller 630 may be inclined similar to the transfer shaft 330.
以下將描述使用基板處理設備1000傳送基板S之方法。若將基板S裝載入顯影腔室100中,則基板S可由基 板傳送部件300朝向第一方向12傳送。在傳送基板S期間,基板S之頂表面可維持水平。此外,在傳送基板S期間,可將處理溶液供應於基板S上,且可自基板S之頂表面回收殘留處理溶液。基板S可自顯影腔室100之出口104卸載,且同時被裝載入清潔腔室200中。在傳送基板S期間,基板S可逐步自水平狀態傾斜成傾斜狀態。在傾斜地傳送基板S期間,可將清潔溶液供應於基板S上。在完成供應清潔溶液之後,可以傾斜狀態傳送基板S。基板S上殘留之清潔溶液可沿基板S之傾角向下流動且被回收。A method of transferring the substrate S using the substrate processing apparatus 1000 will be described below. If the substrate S is loaded into the developing chamber 100, the substrate S may be based on The board transport member 300 is transported toward the first direction 12. The top surface of the substrate S can be maintained horizontal during the transfer of the substrate S. Further, during the transfer of the substrate S, the processing solution may be supplied onto the substrate S, and the residual processing solution may be recovered from the top surface of the substrate S. The substrate S can be unloaded from the outlet 104 of the developing chamber 100 and simultaneously loaded into the cleaning chamber 200. During the transfer of the substrate S, the substrate S may be gradually tilted from the horizontal state to the inclined state. The cleaning solution may be supplied onto the substrate S during the oblique transfer of the substrate S. After the supply of the cleaning solution is completed, the substrate S can be transferred in an inclined state. The cleaning solution remaining on the substrate S can flow downward along the inclination angle of the substrate S and be recovered.
接下來將描述使用基板處理設備1000之顯影和清潔方法。若在曝光製程之後將基板S裝載入顯影腔室100中,則可將處理溶液供應於基板S上。在傳送基板S期間,加壓流體供應部件510可於基板S之由第一支撐滾柱530支撐之部分上噴灑加壓流體。基板S上殘留之處理溶液可被加壓流體吹走,且於與第一方向12相反之側被回收。基板S可經由第一支撐滾柱530裝載入清潔腔室200中。清潔溶液供應單元600可於正在清潔腔室200中傳送之基板S上噴灑清潔溶液。在此階段,基板S可自水平狀態改變至傾斜狀態,且接著朝第一方向傳送。基板S上殘留之清潔流體可沿基板S之傾角向下流動。Next, a developing and cleaning method using the substrate processing apparatus 1000 will be described. If the substrate S is loaded into the developing chamber 100 after the exposure process, the processing solution can be supplied onto the substrate S. The pressurized fluid supply member 510 may spray pressurized fluid on a portion of the substrate S supported by the first support roller 530 during the transfer of the substrate S. The treatment solution remaining on the substrate S can be blown away by the pressurized fluid and recovered on the side opposite to the first direction 12. The substrate S can be loaded into the cleaning chamber 200 via the first support roller 530. The cleaning solution supply unit 600 can spray the cleaning solution on the substrate S being conveyed in the cleaning chamber 200. At this stage, the substrate S can be changed from the horizontal state to the tilted state, and then transferred in the first direction. The cleaning fluid remaining on the substrate S can flow downward along the inclination angle of the substrate S.
在其他實施例中,可定位圖8之第一支撐滾柱530a以支撐基板S之將被供應來自處理溶液供應部件400之處理溶液的部分。第一支撐滾柱530a可以使得可將處理溶液均勻地供應於基板S上之方式支撐基板S。In other embodiments, the first support roller 530a of FIG. 8 can be positioned to support a portion of the substrate S that will be supplied with processing solution from the processing solution supply component 400. The first support roller 530a may support the substrate S in such a manner that the processing solution can be uniformly supplied onto the substrate S.
根據本發明概念之示範性實施例,提供將處理溶液供應於正在傳送之基板上的設備和方法。In accordance with an exemplary embodiment of the inventive concept, an apparatus and method for supplying a processing solution to a substrate being transferred is provided.
根據本發明概念之其他實施例,當自正在傳送之基板回收處理溶液時防止污點產生係可能的。According to other embodiments of the inventive concept, it is possible to prevent stain generation when recovering the treatment solution from the substrate being transported.
根據本發明概念之其他實施例,改良自正在傳送之基板回收處理溶液之效率係可能的。According to other embodiments of the inventive concept, it is possible to improve the efficiency of recovering the treatment solution from the substrate being transported.
根據本發明概念之其他實施例,即使以高速傳送基板時,防止基板滑動亦係可能的。According to other embodiments of the inventive concept, it is possible to prevent the substrate from slipping even when the substrate is transported at a high speed.
雖然已特定示出和描述本發明概念之示範性實施例,但一般技藝人士將理解,可於其中做出形式和細節上之變化而不脫離附屬申請專利範圍之精神和範疇。While the exemplary embodiments of the present invention have been shown and described, the embodiments of the invention
A‧‧‧水平截面A‧‧‧ horizontal section
S‧‧‧基板S‧‧‧Substrate
10‧‧‧顯影腔室10‧‧‧Development chamber
12‧‧‧第一方向12‧‧‧First direction
14‧‧‧第二方向14‧‧‧second direction
20‧‧‧清潔腔室20‧‧‧Clean chamber
100‧‧‧顯影腔室100‧‧‧Development chamber
102‧‧‧入口102‧‧‧ entrance
104‧‧‧出口104‧‧‧Export
200‧‧‧清潔腔室200‧‧‧Clean chamber
202‧‧‧入口202‧‧‧ entrance
204‧‧‧出口204‧‧‧Export
300‧‧‧基板傳送部件300‧‧‧Substrate transfer parts
320‧‧‧傳送滾柱320‧‧‧Transfer roller
330‧‧‧傳送軸330‧‧‧Transport axis
340‧‧‧框架340‧‧‧Frame
342‧‧‧水平框架342‧‧‧ horizontal frame
344‧‧‧角度改變框架344‧‧‧ Angle Change Framework
344a‧‧‧第一角度改變框架344a‧‧‧First angle change frame
344b‧‧‧第二角度改變框架344b‧‧‧ second angle change framework
346‧‧‧傾斜框架346‧‧‧ tilt frame
350‧‧‧導向滾柱350‧‧‧ Guide roller
400‧‧‧處理溶液供應部件400‧‧‧Processing solution supply parts
500‧‧‧處理溶液回收單元500‧‧‧Processing solution recovery unit
510‧‧‧加壓流體供應部件510‧‧‧Pressure fluid supply parts
530‧‧‧第一支撐滾柱530‧‧‧First support roller
530a‧‧‧第一支撐滾柱530a‧‧‧First support roller
600‧‧‧清潔溶液供應單元600‧‧‧Clean solution supply unit
610‧‧‧清潔溶液供應部件610‧‧‧Clean solution supply parts
630‧‧‧第二支撐滾柱630‧‧‧second support roller
根據以下結合隨附圖式之簡要描述將更清晰地理解示範性實施例。圖1至圖8表示本文描述之非限制性、示範性實施例。The exemplary embodiments will be more clearly understood from the following description of the accompanying drawings. 1 through 8 illustrate non-limiting, exemplary embodiments described herein.
圖1為示意性地說明用於執行顯影和清潔製程之習知設備的剖視圖。1 is a cross-sectional view schematically illustrating a conventional apparatus for performing development and cleaning processes.
圖2為說明根據本發明概念之示範性實施例之基板處理設備的剖視圖。2 is a cross-sectional view illustrating a substrate processing apparatus in accordance with an exemplary embodiment of the inventive concept.
圖3為說明提供於圖2之清潔腔室中的基板傳送部件的透視圖。3 is a perspective view illustrating a substrate transfer member provided in the cleaning chamber of FIG. 2.
圖4為說明當圖2之基板處理設備不具有第一支撐滾柱時可能發生之技術問題的透視圖。4 is a perspective view illustrating a technical problem that may occur when the substrate processing apparatus of FIG. 2 does not have the first support roller.
圖5為說明當圖2之基板處理設備不具有第一支撐滾柱時可能發生之技術問題的剖視圖。Figure 5 is a cross-sectional view illustrating a technical problem that may occur when the substrate processing apparatus of Figure 2 does not have a first support roller.
圖6為說明圖2之第一支撐滾柱的前視圖。Figure 6 is a front elevational view showing the first support roller of Figure 2;
圖7為說明根據本發明概念之其他示範性實施例之基板處理設備的剖視圖。FIG. 7 is a cross-sectional view illustrating a substrate processing apparatus in accordance with other exemplary embodiments of the inventive concept.
圖8為說明根據本發明概念之其他示範性實施例之基板處理設備的剖視圖。FIG. 8 is a cross-sectional view illustrating a substrate processing apparatus in accordance with other exemplary embodiments of the inventive concept.
應注意,此等圖式意欲說明於某些示範性實施例中使用之方法、結構和/或材料的一般特徵和補充以下提供之文 字描述。然而,此等圖式並非按比例繪製,且可能未反映任一給定實施例之準確的結構或效能特徵,且不應解釋為界定或限制示範性實施例包含之數值或性質之範圍。例如,為明確起見,分子、層、區域和/或結構元件之相對厚度和位置可能被減小或誇示。各圖式中類似或相同之參考數字之使用意欲表明存在類似或相同之元件或特徵。It should be noted that these figures are intended to illustrate the general features of the methods, structures, and/or materials used in certain exemplary embodiments and supplement the text provided below. Word description. However, the drawings are not to scale, and may not reflect the precise structural or performance features of any given embodiments, and should not be construed as limiting or limiting the scope of the values or properties included in the exemplary embodiments. For example, the relative thickness and location of the molecules, layers, regions and/or structural elements may be reduced or exaggerated for clarity. The use of similar or identical reference numerals in the various figures is intended to indicate that there are similar or identical elements or features.
100‧‧‧顯影腔室100‧‧‧Development chamber
102‧‧‧入口102‧‧‧ entrance
104‧‧‧出口104‧‧‧Export
200‧‧‧清潔腔室200‧‧‧Clean chamber
202‧‧‧入口202‧‧‧ entrance
204‧‧‧出口204‧‧‧Export
300‧‧‧基板傳送部件300‧‧‧Substrate transfer parts
320‧‧‧傳送滾柱320‧‧‧Transfer roller
330‧‧‧傳送軸330‧‧‧Transport axis
340‧‧‧框架340‧‧‧Frame
342‧‧‧水平框架342‧‧‧ horizontal frame
344‧‧‧角度改變框架344‧‧‧ Angle Change Framework
346‧‧‧傾斜框架346‧‧‧ tilt frame
400‧‧‧處理溶液供應部件400‧‧‧Processing solution supply parts
500‧‧‧處理溶液回收單元500‧‧‧Processing solution recovery unit
510‧‧‧加壓流體供應部件510‧‧‧Pressure fluid supply parts
530‧‧‧第一支撐滾柱530‧‧‧First support roller
600‧‧‧清潔溶液供應單元600‧‧‧Clean solution supply unit
610‧‧‧清潔溶液供應部件610‧‧‧Clean solution supply parts
630‧‧‧第二支撐滾柱630‧‧‧second support roller
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KR20060045764A (en) * | 2004-04-16 | 2006-05-17 | 동경 엘렉트론 주식회사 | Developing processing apparatus and developing processing method |
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CN1323660A (en) * | 2000-05-11 | 2001-11-28 | 东京化工机株式会社 | Sheat meterial surface treatment device |
TW200503072A (en) * | 2003-06-26 | 2005-01-16 | Tokyo Ohka Kogyo Co Ltd | In-line type development processing apparatus and method |
KR20060045764A (en) * | 2004-04-16 | 2006-05-17 | 동경 엘렉트론 주식회사 | Developing processing apparatus and developing processing method |
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