TW200503072A - In-line type development processing apparatus and method - Google Patents

In-line type development processing apparatus and method

Info

Publication number
TW200503072A
TW200503072A TW093118666A TW93118666A TW200503072A TW 200503072 A TW200503072 A TW 200503072A TW 093118666 A TW093118666 A TW 093118666A TW 93118666 A TW93118666 A TW 93118666A TW 200503072 A TW200503072 A TW 200503072A
Authority
TW
Taiwan
Prior art keywords
development
substrate
recycling
liquid
processing
Prior art date
Application number
TW093118666A
Other languages
Chinese (zh)
Inventor
Futoshi Shimai
Shigeru Kawata
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200503072A publication Critical patent/TW200503072A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

The subject of the present invention is to provide an in-line type development processing apparatus without increasing the conveyor length and without generating non-uniform development easily. The solution of the present invention comprises: forming the substrate W with exposed photoresist film on the surface by supplying the development liquid on the surface of the photoresist film within the development supply portion 2 under the conveying state for the development chemical reaction; next, recycling the development liquid in the development liquid recycling portion 4, cleaning and recycling the cleaning liquid in the recycling portion 6; finally, transporting to the drying portion 8. In the series of development processing, when the substrate is sent to the downstream processing portion, for the example as shown in FIG. 2, when the processing portion is the development liquid recycling portion 4, the small rollers 10a, which is in the standby portion 3 in front of the processing portion, rotates in the clockwise and counter-clockwise directions repetitively so as to reciprocally move the substrate W. Thus, the back of the substrate W will frequently move with the contact portion to the small rollers 10a, but not stop at a position, so as to make the temperature distribution uniform on the substrate.
TW093118666A 2003-06-26 2004-06-25 In-line type development processing apparatus and method TW200503072A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003183014A JP4043410B2 (en) 2003-06-26 2003-06-26 In-line development processor

Publications (1)

Publication Number Publication Date
TW200503072A true TW200503072A (en) 2005-01-16

Family

ID=34183236

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093118666A TW200503072A (en) 2003-06-26 2004-06-25 In-line type development processing apparatus and method

Country Status (4)

Country Link
JP (1) JP4043410B2 (en)
KR (1) KR20050001373A (en)
CN (1) CN100405544C (en)
TW (1) TW200503072A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI479589B (en) * 2011-08-31 2015-04-01 Semes Co Ltd Apparatus and method for treating substrate

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102969259B (en) * 2011-08-31 2016-05-18 细美事有限公司 The device for the treatment of substrate
CN102445840A (en) * 2011-11-29 2012-05-09 上海华力微电子有限公司 Coating and developing device
CN104347352B (en) * 2013-07-31 2018-05-29 细美事有限公司 A kind of substrate board treatment and substrate processing method using same
CN106542859A (en) * 2016-09-22 2017-03-29 山东润金农林科技有限公司 A kind of preparation method of apple cultivation with the fowl dung fermentation fertilizer of high utilization rate of fertilizer

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2812143B2 (en) * 1993-06-15 1998-10-22 ノーリツ鋼機株式会社 Photosensitive material alignment device
JP3245813B2 (en) * 1996-11-27 2002-01-15 東京エレクトロン株式会社 Coating film forming equipment
JPH10288840A (en) * 1997-04-17 1998-10-27 Mitsubishi Paper Mills Ltd Development processing method for planographic printing plate
JPH11191545A (en) * 1997-12-26 1999-07-13 Sony Corp Cleaning method and cleaning device
JP2001271188A (en) * 2000-03-24 2001-10-02 Ses Co Ltd Substrate treatment apparatus
JP4568419B2 (en) * 2000-11-02 2010-10-27 株式会社ブリヂストン OA roller manufacturing method
TWI226077B (en) * 2001-07-05 2005-01-01 Tokyo Electron Ltd Liquid processing apparatus and liquid processing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI479589B (en) * 2011-08-31 2015-04-01 Semes Co Ltd Apparatus and method for treating substrate

Also Published As

Publication number Publication date
JP4043410B2 (en) 2008-02-06
CN100405544C (en) 2008-07-23
CN1577738A (en) 2005-02-09
KR20050001373A (en) 2005-01-06
JP2005019720A (en) 2005-01-20

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