TWI476347B - 照明裝置(三) - Google Patents

照明裝置(三) Download PDF

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Publication number
TWI476347B
TWI476347B TW099138567A TW99138567A TWI476347B TW I476347 B TWI476347 B TW I476347B TW 099138567 A TW099138567 A TW 099138567A TW 99138567 A TW99138567 A TW 99138567A TW I476347 B TWI476347 B TW I476347B
Authority
TW
Taiwan
Prior art keywords
heat
substrate
lighting device
light emitting
weight
Prior art date
Application number
TW099138567A
Other languages
English (en)
Chinese (zh)
Other versions
TW201124671A (en
Inventor
Kang-Seok Jin
Tae-Young Choi
Sungho Hong
Dong-Soo Kim
Original Assignee
Lg Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020090107498A external-priority patent/KR101081312B1/ko
Priority claimed from KR1020100032063A external-priority patent/KR101113610B1/ko
Application filed by Lg Innotek Co Ltd filed Critical Lg Innotek Co Ltd
Publication of TW201124671A publication Critical patent/TW201124671A/zh
Application granted granted Critical
Publication of TWI476347B publication Critical patent/TWI476347B/zh

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238Arrangement or mounting of circuit elements integrated in the light source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00Point-like light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
TW099138567A 2009-11-09 2010-11-09 照明裝置(三) TWI476347B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020090107498A KR101081312B1 (ko) 2009-11-09 2009-11-09 조명 장치
KR1020100032063A KR101113610B1 (ko) 2010-04-07 2010-04-07 조명 장치

Publications (2)

Publication Number Publication Date
TW201124671A TW201124671A (en) 2011-07-16
TWI476347B true TWI476347B (zh) 2015-03-11

Family

ID=43558077

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099138567A TWI476347B (zh) 2009-11-09 2010-11-09 照明裝置(三)

Country Status (5)

Country Link
US (1) US8115369B2 (enExample)
EP (1) EP2320138B1 (enExample)
JP (1) JP5663273B2 (enExample)
CN (2) CN104595764B (enExample)
TW (1) TWI476347B (enExample)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8272762B2 (en) * 2010-09-28 2012-09-25 Lighting Science Group Corporation LED luminaire
US10267506B2 (en) 2010-11-22 2019-04-23 Cree, Inc. Solid state lighting apparatuses with non-uniformly spaced emitters for improved heat distribution, system having the same, and methods having the same
US11101408B2 (en) 2011-02-07 2021-08-24 Creeled, Inc. Components and methods for light emitting diode (LED) lighting
US9127816B2 (en) * 2011-01-19 2015-09-08 GE Lighting Solutions, LLC LED light engine/heat sink assembly
US20120248961A1 (en) * 2011-03-29 2012-10-04 Chicony Power Technology Co., Ltd. Led bulb with heat dissipater
JP5870258B2 (ja) * 2011-05-20 2016-02-24 パナソニックIpマネジメント株式会社 電球形ランプ及び照明装置
KR101827975B1 (ko) * 2011-10-10 2018-03-29 엘지이노텍 주식회사 발광소자
DE112011106000T5 (de) * 2011-12-21 2014-09-11 Intel Corporation Thermomanagement für Leuchtdioden
CN103206690B (zh) * 2012-01-11 2018-03-06 欧司朗股份有限公司 发光装置、以及具有该发光装置的灯具
US9786825B2 (en) * 2012-02-07 2017-10-10 Cree, Inc. Ceramic-based light emitting diode (LED) devices, components, and methods
US9806246B2 (en) 2012-02-07 2017-10-31 Cree, Inc. Ceramic-based light emitting diode (LED) devices, components, and methods
JP5828098B2 (ja) * 2012-02-28 2015-12-02 パナソニックIpマネジメント株式会社 ランプ
JP2013182776A (ja) * 2012-03-01 2013-09-12 Toshiba Lighting & Technology Corp 照明装置
KR101349513B1 (ko) * 2012-03-20 2014-01-09 엘지이노텍 주식회사 조명장치 및 이를 포함하는 조명 제어 시스템
US9538590B2 (en) 2012-03-30 2017-01-03 Cree, Inc. Solid state lighting apparatuses, systems, and related methods
CN103423624A (zh) * 2012-05-23 2013-12-04 欧司朗股份有限公司 照明装置
TWI481799B (zh) * 2012-06-19 2015-04-21 Taiwan Fu Hsing Ind Co Ltd 燈具結構
US9004722B2 (en) 2012-07-31 2015-04-14 Qualcomm Mems Technologies, Inc. Low-profile LED heat management system
WO2014027387A1 (ja) * 2012-08-11 2014-02-20 株式会社ティーネットジャパン Led照明器具
FR2994788B1 (fr) * 2012-08-27 2016-09-16 Valeo Vision Dispositif d'éclairage et/ou de signalisation pour véhicule comprenant un module d'éclairage avec un dispositif de commande maintenu de manière amovible
TWM449238U (zh) * 2012-09-14 2013-03-21 Coselig Technology Corp 具有散熱結構的照明燈具
TW201425811A (zh) * 2012-12-20 2014-07-01 Chang Wah Electromaterials Inc 具有空氣通道之固態照明燈
JP6191813B2 (ja) * 2013-02-13 2017-09-06 パナソニックIpマネジメント株式会社 照明用光源及び照明装置
CN103216803B (zh) * 2013-04-03 2014-08-06 大连三维传热技术有限公司 Led球泡灯
CN104329649A (zh) 2013-07-22 2015-02-04 欧司朗有限公司 照明装置
EP2857744A1 (en) * 2013-10-07 2015-04-08 Hella KGaA Hueck & Co LED light module and lighting system
WO2015057556A1 (en) * 2013-10-15 2015-04-23 LIFI Labs, Inc. Lighting assembly
WO2015064181A1 (ja) * 2013-10-28 2015-05-07 シチズンホールディングス株式会社 Ledランプ
EP3069575B1 (en) 2013-11-14 2018-09-26 Lifi Labs Inc. Resettable lighting system and method
US9198262B1 (en) 2014-05-22 2015-11-24 LIFI Labs, Inc. Directional lighting system and method
US11455884B2 (en) 2014-09-02 2022-09-27 LIFI Labs, Inc. Lighting system
TWI505456B (zh) 2013-11-22 2015-10-21 弘凱光電(深圳)有限公司 Led承載座模組及led發光裝置
EP3146254B1 (en) 2014-05-22 2020-04-22 Lifi Labs Inc. Directional lighting system and method
JP6483828B2 (ja) * 2014-08-19 2019-03-13 ケイアイ グリッド カンパニー リミテッド Ledランプ
US9648448B2 (en) 2014-09-02 2017-05-09 LIFI Labs, Inc. Power outlet and method of use
US9826581B2 (en) 2014-12-05 2017-11-21 Cree, Inc. Voltage configurable solid state lighting apparatuses, systems, and related methods
US20160238233A1 (en) * 2015-02-13 2016-08-18 Eclairage Contraste M.L. Inc. Modular light fixture
US10982815B2 (en) * 2016-04-21 2021-04-20 Lg Innotek Co., Ltd. Lighting device and LED circuit board with a center opening with a protrusion
US10440794B2 (en) 2016-11-02 2019-10-08 LIFI Labs, Inc. Lighting system and method
CN109307170A (zh) * 2017-07-26 2019-02-05 通用电气照明解决方案有限公司 Led灯
US12492789B1 (en) * 2025-04-18 2025-12-09 Zhiguo FENG Charging emergency light bulb

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW422783B (en) * 1997-07-28 2001-02-21 Parker Hannifin Corp Thermally conductive interface, method of attaching a heat-generating source to a thermal dissipation member using the interface, and electrical assembly formed by such method
TW200406449A (en) * 2002-08-07 2004-05-01 Dow Corning Toray Silicone Thermoconductive filler, thermoconductive silicone elastomer composition, and semiconductor device
US20060227558A1 (en) * 2005-04-08 2006-10-12 Toshiba Lighting & Technology Corporation Lamp having outer shell to radiate heat of light source
TWM362926U (en) * 2008-12-29 2009-08-11 Cooler Master Co Ltd LED lamp component

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5785418A (en) * 1996-06-27 1998-07-28 Hochstein; Peter A. Thermally protected LED array
JP2002025331A (ja) * 2000-07-05 2002-01-25 Odelic Co Ltd 照明器具
JP4587636B2 (ja) * 2002-11-08 2010-11-24 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物
CN2731263Y (zh) * 2004-10-18 2005-10-05 张国祥 一种led灯泡
JP4569465B2 (ja) * 2005-04-08 2010-10-27 東芝ライテック株式会社 ランプ
US7226189B2 (en) * 2005-04-15 2007-06-05 Taiwan Oasis Technology Co., Ltd. Light emitting diode illumination apparatus
JP2006310057A (ja) * 2005-04-27 2006-11-09 Arumo Technos Kk Led照明灯及びled点灯制御回路
CN100388516C (zh) * 2005-06-07 2008-05-14 友达光电股份有限公司 光源模块
CN2876552Y (zh) * 2005-09-16 2007-03-07 林志泽 Led灯具罩体散热结构
JP5209910B2 (ja) * 2005-09-20 2013-06-12 パナソニック株式会社 Led照明器具
JP2007119589A (ja) * 2005-10-27 2007-05-17 Momentive Performance Materials Japan Kk 熱伝導性シリコーンゴム組成物
US7625103B2 (en) * 2006-04-21 2009-12-01 Cree, Inc. Multiple thermal path packaging for solid state light emitting apparatus and associated assembling methods
WO2007139195A1 (ja) * 2006-05-31 2007-12-06 Denki Kagaku Kogyo Kabushiki Kaisha Led光源ユニット
US8047686B2 (en) * 2006-09-01 2011-11-01 Dahm Jonathan S Multiple light-emitting element heat pipe assembly
JP4840185B2 (ja) 2007-02-17 2011-12-21 日亜化学工業株式会社 照明装置
KR100898817B1 (ko) 2007-03-30 2009-05-22 한국광기술원 열 방출이 가능한 발광 다이오드 전구
WO2008123670A1 (en) * 2007-04-10 2008-10-16 Fawoo Technology Co., Ltd. Heat dissipating led lighting apparatus without fan
US7699515B2 (en) * 2007-09-07 2010-04-20 Nexxus Lighting, Inc. LED lighting system
JPWO2009044716A1 (ja) * 2007-10-01 2011-02-10 株式会社光波 発光装置
KR20090046120A (ko) 2007-11-05 2009-05-11 현대자동차주식회사 엘이디를 이용한 조명장치
JP2009158872A (ja) * 2007-12-27 2009-07-16 Toshiba Lighting & Technology Corp 照明装置
CN101471337B (zh) * 2007-12-28 2012-03-14 富士迈半导体精密工业(上海)有限公司 具良好散热性能的光源模组
KR100945090B1 (ko) 2007-12-28 2010-03-05 김용갑 엘이디 램프 모듈과 이를 이용한 램프 조립체
JP2009205017A (ja) * 2008-02-29 2009-09-10 Ricoh Co Ltd 定着装置およびそれを用いた画像形成装置
KR20090095903A (ko) 2008-03-06 2009-09-10 화우테크놀러지 주식회사 소형 무팬(無 Fan) 엘이디 조명기구
KR200451042Y1 (ko) 2008-03-18 2010-11-19 팬 짓 인터내셔날 인크 열 대류와 열 전도 효과를 가진 led 조명 장치 및 방열 조립체
CN101561126B (zh) * 2008-04-18 2012-09-19 富准精密工业(深圳)有限公司 照明装置
KR20090119287A (ko) 2008-05-15 2009-11-19 김찬희 램프 조립체
DE102008031786B4 (de) * 2008-07-04 2012-11-08 Osram Ag LED-Modul mit einem Kühlkörper
CN201269511Y (zh) * 2008-10-15 2009-07-08 何少凡 改进散热结构的led灯具
KR20090066262A (ko) 2009-06-03 2009-06-23 최재민 엘이디를 사용한 전등

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW422783B (en) * 1997-07-28 2001-02-21 Parker Hannifin Corp Thermally conductive interface, method of attaching a heat-generating source to a thermal dissipation member using the interface, and electrical assembly formed by such method
TW200406449A (en) * 2002-08-07 2004-05-01 Dow Corning Toray Silicone Thermoconductive filler, thermoconductive silicone elastomer composition, and semiconductor device
US20060227558A1 (en) * 2005-04-08 2006-10-12 Toshiba Lighting & Technology Corporation Lamp having outer shell to radiate heat of light source
TWM362926U (en) * 2008-12-29 2009-08-11 Cooler Master Co Ltd LED lamp component

Also Published As

Publication number Publication date
EP2320138A3 (en) 2012-04-18
EP2320138B1 (en) 2013-07-03
CN102095098B (zh) 2015-02-18
US8115369B2 (en) 2012-02-14
JP2011100736A (ja) 2011-05-19
TW201124671A (en) 2011-07-16
EP2320138A2 (en) 2011-05-11
CN104595764B (zh) 2017-06-23
CN102095098A (zh) 2011-06-15
US20110109216A1 (en) 2011-05-12
CN104595764A (zh) 2015-05-06
JP5663273B2 (ja) 2015-02-04

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