CN101471337B - 具良好散热性能的光源模组 - Google Patents
具良好散热性能的光源模组 Download PDFInfo
- Publication number
- CN101471337B CN101471337B CN2007102035081A CN200710203508A CN101471337B CN 101471337 B CN101471337 B CN 101471337B CN 2007102035081 A CN2007102035081 A CN 2007102035081A CN 200710203508 A CN200710203508 A CN 200710203508A CN 101471337 B CN101471337 B CN 101471337B
- Authority
- CN
- China
- Prior art keywords
- insulating substrate
- heat conductive
- conductive insulating
- light source
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/645—Heat extraction or cooling elements the elements being electrically controlled, e.g. Peltier elements
Abstract
Description
Claims (7)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007102035081A CN101471337B (zh) | 2007-12-28 | 2007-12-28 | 具良好散热性能的光源模组 |
US12/275,339 US20090167134A1 (en) | 2007-12-28 | 2008-11-21 | Light source module with high heat-dissipation efficiency |
EP08253850A EP2075838A2 (en) | 2007-12-28 | 2008-12-01 | Light source module with high heat dissipation efficiency |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007102035081A CN101471337B (zh) | 2007-12-28 | 2007-12-28 | 具良好散热性能的光源模组 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101471337A CN101471337A (zh) | 2009-07-01 |
CN101471337B true CN101471337B (zh) | 2012-03-14 |
Family
ID=40456795
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007102035081A Expired - Fee Related CN101471337B (zh) | 2007-12-28 | 2007-12-28 | 具良好散热性能的光源模组 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20090167134A1 (zh) |
EP (1) | EP2075838A2 (zh) |
CN (1) | CN101471337B (zh) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005060040A1 (de) * | 2005-12-15 | 2007-06-21 | BSH Bosch und Siemens Hausgeräte GmbH | Schaltungsanordnung für ein Peltiermodul |
US20100127299A1 (en) * | 2008-11-25 | 2010-05-27 | Cooper Technologies Company | Actively Cooled LED Lighting System and Method for Making the Same |
US8471443B2 (en) | 2009-11-09 | 2013-06-25 | Lg Innotek Co., Ltd. | Lighting device |
US8115369B2 (en) * | 2009-11-09 | 2012-02-14 | Lg Innotek Co., Ltd. | Lighting device |
US8829771B2 (en) | 2009-11-09 | 2014-09-09 | Lg Innotek Co., Ltd. | Lighting device |
DE102010012078A1 (de) | 2010-03-11 | 2011-09-15 | Technische Universität Ilmenau | Verfahren und Anordnung zur Stabilisierung des von einer Halbleiterlichtquelle emittierten Lichtes |
CN102544301B (zh) * | 2010-12-16 | 2014-05-07 | 中芯国际集成电路制造(北京)有限公司 | Led封装结构 |
US20120291454A1 (en) * | 2011-05-20 | 2012-11-22 | Baker Hughes Incorporated | Thermoelectric Devices Using Sintered Bonding |
GB2497283A (en) * | 2011-12-02 | 2013-06-12 | Tzu-Yu Liao | Method for assembling LEDs to a ceramic heat conductive member |
CN103398358B (zh) * | 2013-06-25 | 2015-10-21 | 陈志明 | 一种低光衰大功率led路灯及其制作方法 |
CN105098045B (zh) * | 2014-05-16 | 2018-02-13 | 华为技术有限公司 | 温控结构 |
US10211122B2 (en) * | 2014-12-26 | 2019-02-19 | Mitsubishi Electric Corporation | Semiconductor module including a case and base board |
CN110246818A (zh) * | 2016-01-29 | 2019-09-17 | 台达电子工业股份有限公司 | 致冷晶片散热模组 |
CN106960840A (zh) * | 2017-05-16 | 2017-07-18 | 苏州晶品新材料股份有限公司 | 一种可调色温的led光源 |
CN108922869A (zh) * | 2018-07-13 | 2018-11-30 | 广东格斯泰气密元件有限公司 | 一种带tec-氮化铝-金属三元结构的smd封装基座 |
CN111076104A (zh) * | 2019-11-28 | 2020-04-28 | 中国科学院宁波材料技术与工程研究所 | 一种制冷荧光模组及激光照明系统 |
CN115863379A (zh) * | 2022-12-19 | 2023-03-28 | 惠科股份有限公司 | 显示装置及其制作方法 |
CN116761493B (zh) * | 2023-08-24 | 2023-11-21 | 深圳基本半导体有限公司 | 一种tec封装结构及电路结构 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2504569Y (zh) * | 2001-11-07 | 2002-08-07 | 王彬 | 分体式热电制冷器 |
CN1766406A (zh) * | 2004-10-25 | 2006-05-03 | 盟立光能科技股份有限公司 | 发光二极管灯组 |
CN101106169A (zh) * | 2006-03-22 | 2008-01-16 | 财团法人工业技术研究院 | 发光二极管封装结构及其制作方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5040381A (en) * | 1990-04-19 | 1991-08-20 | Prime Computer, Inc. | Apparatus for cooling circuits |
JPH10178216A (ja) * | 1996-12-18 | 1998-06-30 | Seru Appl Kk | 熱電素子及び熱電冷却装置 |
JP2006234362A (ja) * | 2005-02-28 | 2006-09-07 | Komatsu Electronics Inc | 熱交換器及び熱交換器の製造方法 |
US7586125B2 (en) * | 2006-02-20 | 2009-09-08 | Industrial Technology Research Institute | Light emitting diode package structure and fabricating method thereof |
-
2007
- 2007-12-28 CN CN2007102035081A patent/CN101471337B/zh not_active Expired - Fee Related
-
2008
- 2008-11-21 US US12/275,339 patent/US20090167134A1/en not_active Abandoned
- 2008-12-01 EP EP08253850A patent/EP2075838A2/en not_active Withdrawn
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2504569Y (zh) * | 2001-11-07 | 2002-08-07 | 王彬 | 分体式热电制冷器 |
CN1766406A (zh) * | 2004-10-25 | 2006-05-03 | 盟立光能科技股份有限公司 | 发光二极管灯组 |
CN101106169A (zh) * | 2006-03-22 | 2008-01-16 | 财团法人工业技术研究院 | 发光二极管封装结构及其制作方法 |
Also Published As
Publication number | Publication date |
---|---|
US20090167134A1 (en) | 2009-07-02 |
EP2075838A2 (en) | 2009-07-01 |
CN101471337A (zh) | 2009-07-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 201600 Shanghai City, Songjiang District Songjiang Industrial Zone West science and Technology Industrial Park No. 500 Wen Ji Lu Patentee after: Foxsemicon Semiconductor Precision (Shanghai) Inc. Patentee after: Foxsemicon Integrated Technology Inc. Address before: 201600 Shanghai City, Songjiang District Songjiang Industrial Zone West science and Technology Industrial Park No. 500 Wen Ji Lu Patentee before: Foxsemicon Semiconductor Precision (Shanghai) Inc. Patentee before: Foxsemicon Integrated Technology Inc. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120314 Termination date: 20131228 |