TWI472424B - A metal material, a surface treatment method of a metal material, a method of manufacturing a water repellent material using a metal material as a substrate, and a manufacturing apparatus for a metal material - Google Patents

A metal material, a surface treatment method of a metal material, a method of manufacturing a water repellent material using a metal material as a substrate, and a manufacturing apparatus for a metal material Download PDF

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Publication number
TWI472424B
TWI472424B TW102106374A TW102106374A TWI472424B TW I472424 B TWI472424 B TW I472424B TW 102106374 A TW102106374 A TW 102106374A TW 102106374 A TW102106374 A TW 102106374A TW I472424 B TWI472424 B TW I472424B
Authority
TW
Taiwan
Prior art keywords
metal material
substrate
cathode electrode
treated
anode electrode
Prior art date
Application number
TW102106374A
Other languages
English (en)
Chinese (zh)
Other versions
TW201341176A (zh
Inventor
Masayasu Nagoshi
Kaoru Sato
Hisato Noro
Kazuhiko Baba
Seiichi Watanabe
Souki Yoshida
Original Assignee
Jfe Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jfe Steel Corp filed Critical Jfe Steel Corp
Publication of TW201341176A publication Critical patent/TW201341176A/zh
Application granted granted Critical
Publication of TWI472424B publication Critical patent/TWI472424B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/06—Etching of iron or steel

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • ing And Chemical Polishing (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroluminescent Light Sources (AREA)
TW102106374A 2012-02-24 2013-02-23 A metal material, a surface treatment method of a metal material, a method of manufacturing a water repellent material using a metal material as a substrate, and a manufacturing apparatus for a metal material TWI472424B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012038555 2012-02-24
JP2012038557 2012-02-24
JP2012038553 2012-02-24

Publications (2)

Publication Number Publication Date
TW201341176A TW201341176A (zh) 2013-10-16
TWI472424B true TWI472424B (zh) 2015-02-11

Family

ID=49005835

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102106374A TWI472424B (zh) 2012-02-24 2013-02-23 A metal material, a surface treatment method of a metal material, a method of manufacturing a water repellent material using a metal material as a substrate, and a manufacturing apparatus for a metal material

Country Status (7)

Country Link
EP (1) EP2818579A4 (enExample)
JP (1) JP5817907B2 (enExample)
KR (1) KR101687462B1 (enExample)
CN (1) CN104114747A (enExample)
IN (1) IN2014KN01697A (enExample)
TW (1) TWI472424B (enExample)
WO (1) WO2013125658A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6498091B2 (ja) * 2015-09-25 2019-04-10 Ｊｘ金属株式会社 表面処理金属箔、積層体、プリント配線板、半導体パッケージ、電子機器
US11541516B2 (en) * 2019-09-25 2023-01-03 Snap-On Incorporated Fastener retention and anti-camout tool bit
CN111805022A (zh) * 2020-06-04 2020-10-23 南方科技大学 等离子体辅助电解加工方法及实施装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09241865A (ja) * 1996-03-01 1997-09-16 Kawasaki Steel Corp フィルム密着性、耐食性に優れたラミネート鋼板

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59227241A (ja) * 1983-06-09 1984-12-20 Taishi Shokuhin Kogyo Kk 乳酸発酵豆乳の製造法
JPH04136198A (ja) * 1990-09-26 1992-05-11 Nau Chem:Yugen 電気めっき方法
JPH06297252A (ja) * 1993-04-09 1994-10-25 Sony Corp 微細加工方法及びその装置
JP2004521186A (ja) * 2000-08-10 2004-07-15 ナトゥール・インコーポレイテッド 外的影響を用いて加工物の頂部表面とキャビティ表面上に付着する添加物の間に差を作り出すめっき方法および装置
AUPR129900A0 (en) * 2000-11-08 2000-11-30 Chang, Chak Man Thomas Plasma electroplating
KR100581139B1 (ko) * 2001-03-14 2006-05-16 가부시키 가이샤 닛코 마테리알즈 파티클 발생이 적은 스퍼터링 타겟트, 배킹 플레이트 또는스퍼터링 장치 내의 기기 및 방전 가공에 의한 조화방법
JP2005329451A (ja) * 2004-05-21 2005-12-02 Fuji Photo Film Co Ltd アルミニウム板の表面加工方法及び平版印刷版用支持体並びに平版印刷版
JP5010966B2 (ja) * 2006-08-21 2012-08-29 株式会社神戸製鋼所 撥水性塗料および撥水金属板
EP2112670B1 (en) * 2007-02-15 2018-04-18 Kankyou Engineering Co., Ltd. Method for producing conductor fine particles
US8815072B2 (en) * 2007-03-02 2014-08-26 Furukawa Electric Co., Ltd. Method for producing a surface roughened copper plate
JP2010287648A (ja) * 2009-06-10 2010-12-24 Seiko Epson Corp 半導体装置の製造方法
JP5569259B2 (ja) * 2010-08-26 2014-08-13 Ｊｆｅスチール株式会社 表面改質された導電性材料の製造方法
CN102041540A (zh) * 2011-01-13 2011-05-04 中国科学院苏州纳米技术与纳米仿生研究所 三维渐变孔阵列纳米结构阳极氧化铝模板及其制备方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09241865A (ja) * 1996-03-01 1997-09-16 Kawasaki Steel Corp フィルム密着性、耐食性に優れたラミネート鋼板

Also Published As

Publication number Publication date
KR101687462B1 (ko) 2016-12-16
WO2013125658A1 (ja) 2013-08-29
CN104114747A (zh) 2014-10-22
JPWO2013125658A1 (ja) 2015-07-30
IN2014KN01697A (enExample) 2015-10-23
JP5817907B2 (ja) 2015-11-18
TW201341176A (zh) 2013-10-16
KR20140112559A (ko) 2014-09-23
EP2818579A4 (en) 2015-11-11
EP2818579A1 (en) 2014-12-31

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MM4A Annulment or lapse of patent due to non-payment of fees