IN2014KN01697A - - Google Patents
Info
- Publication number
- IN2014KN01697A IN2014KN01697A IN1697KON2014A IN2014KN01697A IN 2014KN01697 A IN2014KN01697 A IN 2014KN01697A IN 1697KON2014 A IN1697KON2014 A IN 1697KON2014A IN 2014KN01697 A IN2014KN01697 A IN 2014KN01697A
- Authority
- IN
- India
- Prior art keywords
- metal material
- base
- material base
- average
- protrusions
- Prior art date
Links
- 239000007769 metal material Substances 0.000 abstract 8
- 238000002407 reforming Methods 0.000 abstract 3
- 230000001747 exhibiting effect Effects 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/06—Etching of iron or steel
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Engineering & Computer Science (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- ing And Chemical Polishing (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Electrolytic Production Of Metals (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012038555 | 2012-02-24 | ||
| JP2012038557 | 2012-02-24 | ||
| JP2012038553 | 2012-02-24 | ||
| PCT/JP2013/054413 WO2013125658A1 (ja) | 2012-02-24 | 2013-02-21 | 金属材料、表面処理方法及び装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN2014KN01697A true IN2014KN01697A (enExample) | 2015-10-23 |
Family
ID=49005835
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN1697KON2014 IN2014KN01697A (enExample) | 2012-02-24 | 2013-02-21 |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP2818579A4 (enExample) |
| JP (1) | JP5817907B2 (enExample) |
| KR (1) | KR101687462B1 (enExample) |
| CN (1) | CN104114747A (enExample) |
| IN (1) | IN2014KN01697A (enExample) |
| TW (1) | TWI472424B (enExample) |
| WO (1) | WO2013125658A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6498091B2 (ja) * | 2015-09-25 | 2019-04-10 | Jx金属株式会社 | 表面処理金属箔、積層体、プリント配線板、半導体パッケージ、電子機器 |
| US11541516B2 (en) * | 2019-09-25 | 2023-01-03 | Snap-On Incorporated | Fastener retention and anti-camout tool bit |
| CN111805022A (zh) * | 2020-06-04 | 2020-10-23 | 南方科技大学 | 等离子体辅助电解加工方法及实施装置 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59227241A (ja) * | 1983-06-09 | 1984-12-20 | Taishi Shokuhin Kogyo Kk | 乳酸発酵豆乳の製造法 |
| JPH04136198A (ja) * | 1990-09-26 | 1992-05-11 | Nau Chem:Yugen | 電気めっき方法 |
| JPH06297252A (ja) * | 1993-04-09 | 1994-10-25 | Sony Corp | 微細加工方法及びその装置 |
| JPH09241865A (ja) * | 1996-03-01 | 1997-09-16 | Kawasaki Steel Corp | フィルム密着性、耐食性に優れたラミネート鋼板 |
| JP2004521186A (ja) * | 2000-08-10 | 2004-07-15 | ナトゥール・インコーポレイテッド | 外的影響を用いて加工物の頂部表面とキャビティ表面上に付着する添加物の間に差を作り出すめっき方法および装置 |
| AUPR129900A0 (en) * | 2000-11-08 | 2000-11-30 | Chang, Chak Man Thomas | Plasma electroplating |
| KR100581139B1 (ko) * | 2001-03-14 | 2006-05-16 | 가부시키 가이샤 닛코 마테리알즈 | 파티클 발생이 적은 스퍼터링 타겟트, 배킹 플레이트 또는스퍼터링 장치 내의 기기 및 방전 가공에 의한 조화방법 |
| JP2005329451A (ja) * | 2004-05-21 | 2005-12-02 | Fuji Photo Film Co Ltd | アルミニウム板の表面加工方法及び平版印刷版用支持体並びに平版印刷版 |
| JP5010966B2 (ja) * | 2006-08-21 | 2012-08-29 | 株式会社神戸製鋼所 | 撥水性塗料および撥水金属板 |
| EP2112670B1 (en) * | 2007-02-15 | 2018-04-18 | Kankyou Engineering Co., Ltd. | Method for producing conductor fine particles |
| US8815072B2 (en) * | 2007-03-02 | 2014-08-26 | Furukawa Electric Co., Ltd. | Method for producing a surface roughened copper plate |
| JP2010287648A (ja) * | 2009-06-10 | 2010-12-24 | Seiko Epson Corp | 半導体装置の製造方法 |
| JP5569259B2 (ja) * | 2010-08-26 | 2014-08-13 | Jfeスチール株式会社 | 表面改質された導電性材料の製造方法 |
| CN102041540A (zh) * | 2011-01-13 | 2011-05-04 | 中国科学院苏州纳米技术与纳米仿生研究所 | 三维渐变孔阵列纳米结构阳极氧化铝模板及其制备方法 |
-
2013
- 2013-02-21 KR KR1020147022776A patent/KR101687462B1/ko not_active Expired - Fee Related
- 2013-02-21 CN CN201380009686.4A patent/CN104114747A/zh active Pending
- 2013-02-21 WO PCT/JP2013/054413 patent/WO2013125658A1/ja not_active Ceased
- 2013-02-21 IN IN1697KON2014 patent/IN2014KN01697A/en unknown
- 2013-02-21 JP JP2014500933A patent/JP5817907B2/ja active Active
- 2013-02-21 EP EP13752521.8A patent/EP2818579A4/en not_active Withdrawn
- 2013-02-23 TW TW102106374A patent/TWI472424B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR101687462B1 (ko) | 2016-12-16 |
| WO2013125658A1 (ja) | 2013-08-29 |
| CN104114747A (zh) | 2014-10-22 |
| JPWO2013125658A1 (ja) | 2015-07-30 |
| JP5817907B2 (ja) | 2015-11-18 |
| TW201341176A (zh) | 2013-10-16 |
| KR20140112559A (ko) | 2014-09-23 |
| EP2818579A4 (en) | 2015-11-11 |
| EP2818579A1 (en) | 2014-12-31 |
| TWI472424B (zh) | 2015-02-11 |
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