EP2818579A4 - METAL MATERIAL, METHOD AND DEVICE FOR SURFACE TREATMENT - Google Patents

METAL MATERIAL, METHOD AND DEVICE FOR SURFACE TREATMENT

Info

Publication number
EP2818579A4
EP2818579A4 EP13752521.8A EP13752521A EP2818579A4 EP 2818579 A4 EP2818579 A4 EP 2818579A4 EP 13752521 A EP13752521 A EP 13752521A EP 2818579 A4 EP2818579 A4 EP 2818579A4
Authority
EP
European Patent Office
Prior art keywords
metal material
surface treatment
treatment method
metal
treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13752521.8A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP2818579A1 (en
Inventor
Masayasu Nagoshi
Kaoru Sato
Hisato Noro
Kazuhiko Baba
Seiichi Watanabe
Souki Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JFE Steel Corp
Original Assignee
JFE Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JFE Steel Corp filed Critical JFE Steel Corp
Publication of EP2818579A1 publication Critical patent/EP2818579A1/en
Publication of EP2818579A4 publication Critical patent/EP2818579A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/06—Etching of iron or steel

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • ing And Chemical Polishing (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroluminescent Light Sources (AREA)
EP13752521.8A 2012-02-24 2013-02-21 METAL MATERIAL, METHOD AND DEVICE FOR SURFACE TREATMENT Withdrawn EP2818579A4 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012038555 2012-02-24
JP2012038557 2012-02-24
JP2012038553 2012-02-24
PCT/JP2013/054413 WO2013125658A1 (ja) 2012-02-24 2013-02-21 金属材料、表面処理方法及び装置

Publications (2)

Publication Number Publication Date
EP2818579A1 EP2818579A1 (en) 2014-12-31
EP2818579A4 true EP2818579A4 (en) 2015-11-11

Family

ID=49005835

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13752521.8A Withdrawn EP2818579A4 (en) 2012-02-24 2013-02-21 METAL MATERIAL, METHOD AND DEVICE FOR SURFACE TREATMENT

Country Status (7)

Country Link
EP (1) EP2818579A4 (enExample)
JP (1) JP5817907B2 (enExample)
KR (1) KR101687462B1 (enExample)
CN (1) CN104114747A (enExample)
IN (1) IN2014KN01697A (enExample)
TW (1) TWI472424B (enExample)
WO (1) WO2013125658A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6498091B2 (ja) * 2015-09-25 2019-04-10 Ｊｘ金属株式会社 表面処理金属箔、積層体、プリント配線板、半導体パッケージ、電子機器
US11541516B2 (en) * 2019-09-25 2023-01-03 Snap-On Incorporated Fastener retention and anti-camout tool bit
CN111805022A (zh) * 2020-06-04 2020-10-23 南方科技大学 等离子体辅助电解加工方法及实施装置

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06297252A (ja) * 1993-04-09 1994-10-25 Sony Corp 微細加工方法及びその装置
JPH09241865A (ja) * 1996-03-01 1997-09-16 Kawasaki Steel Corp フィルム密着性、耐食性に優れたラミネート鋼板
WO2002015245A2 (en) * 2000-08-10 2002-02-21 Nutool, Inc. Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence
WO2002038827A1 (en) * 2000-11-08 2002-05-16 Chang, Chak, Man, Thomas Plasma electroplating
EP1598138A1 (en) * 2004-05-21 2005-11-23 Fuji Photo Film Co., Ltd. Method for providing surface texturing of aluminium sheet, substrate for lithographic plate and lithographic plate
JP2008075064A (ja) * 2006-08-21 2008-04-03 Kobe Steel Ltd 撥水性塗料および撥水金属板
EP2112670A1 (en) * 2007-02-15 2009-10-28 National University Corporation Hokkaido University Method for producing conductor fine particles
EP2133448A1 (en) * 2007-03-02 2009-12-16 The Furukawa Electric Co., Ltd. Production method and device of surface roughened copper plate, and surface roughened copper plate
JP2010287648A (ja) * 2009-06-10 2010-12-24 Seiko Epson Corp 半導体装置の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59227241A (ja) * 1983-06-09 1984-12-20 Taishi Shokuhin Kogyo Kk 乳酸発酵豆乳の製造法
JPH04136198A (ja) * 1990-09-26 1992-05-11 Nau Chem:Yugen 電気めっき方法
KR100581139B1 (ko) * 2001-03-14 2006-05-16 가부시키 가이샤 닛코 마테리알즈 파티클 발생이 적은 스퍼터링 타겟트, 배킹 플레이트 또는스퍼터링 장치 내의 기기 및 방전 가공에 의한 조화방법
JP5569259B2 (ja) * 2010-08-26 2014-08-13 Ｊｆｅスチール株式会社 表面改質された導電性材料の製造方法
CN102041540A (zh) * 2011-01-13 2011-05-04 中国科学院苏州纳米技术与纳米仿生研究所 三维渐变孔阵列纳米结构阳极氧化铝模板及其制备方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06297252A (ja) * 1993-04-09 1994-10-25 Sony Corp 微細加工方法及びその装置
JPH09241865A (ja) * 1996-03-01 1997-09-16 Kawasaki Steel Corp フィルム密着性、耐食性に優れたラミネート鋼板
WO2002015245A2 (en) * 2000-08-10 2002-02-21 Nutool, Inc. Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence
WO2002038827A1 (en) * 2000-11-08 2002-05-16 Chang, Chak, Man, Thomas Plasma electroplating
EP1598138A1 (en) * 2004-05-21 2005-11-23 Fuji Photo Film Co., Ltd. Method for providing surface texturing of aluminium sheet, substrate for lithographic plate and lithographic plate
JP2008075064A (ja) * 2006-08-21 2008-04-03 Kobe Steel Ltd 撥水性塗料および撥水金属板
EP2112670A1 (en) * 2007-02-15 2009-10-28 National University Corporation Hokkaido University Method for producing conductor fine particles
EP2133448A1 (en) * 2007-03-02 2009-12-16 The Furukawa Electric Co., Ltd. Production method and device of surface roughened copper plate, and surface roughened copper plate
JP2010287648A (ja) * 2009-06-10 2010-12-24 Seiko Epson Corp 半導体装置の製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2013125658A1 *

Also Published As

Publication number Publication date
KR101687462B1 (ko) 2016-12-16
WO2013125658A1 (ja) 2013-08-29
CN104114747A (zh) 2014-10-22
JPWO2013125658A1 (ja) 2015-07-30
IN2014KN01697A (enExample) 2015-10-23
JP5817907B2 (ja) 2015-11-18
TW201341176A (zh) 2013-10-16
KR20140112559A (ko) 2014-09-23
EP2818579A1 (en) 2014-12-31
TWI472424B (zh) 2015-02-11

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Legal Events

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AX Request for extension of the european patent

Extension state: BA ME

DAX Request for extension of the european patent (deleted)
RIC1 Information provided on ipc code assigned before grant

Ipc: C23C 26/00 20060101AFI20150702BHEP

Ipc: B23H 1/00 20060101ALI20150702BHEP

Ipc: C25D 3/02 20060101ALI20150702BHEP

Ipc: C25D 5/02 20060101ALI20150702BHEP

RA4 Supplementary search report drawn up and despatched (corrected)

Effective date: 20151009

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