IN2014KN01697A - - Google Patents
Info
- Publication number
- IN2014KN01697A IN2014KN01697A IN1697KON2014A IN2014KN01697A IN 2014KN01697 A IN2014KN01697 A IN 2014KN01697A IN 1697KON2014 A IN1697KON2014 A IN 1697KON2014A IN 2014KN01697 A IN2014KN01697 A IN 2014KN01697A
- Authority
- IN
- India
- Prior art keywords
- metal material
- base
- material base
- average
- protrusions
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/06—Etching of iron or steel
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- ing And Chemical Polishing (AREA)
- Electroluminescent Light Sources (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
22A metal material is provided with a metal material base (2) and a reforming layer formed on the surface of the metal material base (2) wherein the reforming layer has an average of three or more protrusions (3) in a 10 µm range the protrusions protruding from the surface of the metal material base (2) and having an average diameter of 1 µm or less when viewed from a direction that is perpendicular to the surface of the metal material base (2). Preferably the reforming layer is provided with an average of one or more of the following protrusions in a 10 µm range that is a protrusion provided with a base part protruding from the surface of the metal material base (2) and a tip part formed on the end of the base part and having a constricted structure in which the outer diameter of the base part is smaller than the outer diameter of the tip part and an average diameter of 1 µm or less when viewed from a direction that is perpendicular to the surface of the metal material base (2). As a consequence it is possible to provide a metal material exhibiting new features such as hydrophilic property and light emitting property.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012038555 | 2012-02-24 | ||
JP2012038557 | 2012-02-24 | ||
JP2012038553 | 2012-02-24 | ||
PCT/JP2013/054413 WO2013125658A1 (en) | 2012-02-24 | 2013-02-21 | Metal material, and surface treatment method and device |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2014KN01697A true IN2014KN01697A (en) | 2015-10-23 |
Family
ID=49005835
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN1697KON2014 IN2014KN01697A (en) | 2012-02-24 | 2013-02-21 |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP2818579A4 (en) |
JP (1) | JP5817907B2 (en) |
KR (1) | KR101687462B1 (en) |
CN (1) | CN104114747A (en) |
IN (1) | IN2014KN01697A (en) |
TW (1) | TWI472424B (en) |
WO (1) | WO2013125658A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6498091B2 (en) * | 2015-09-25 | 2019-04-10 | Jx金属株式会社 | Surface-treated metal foil, laminate, printed wiring board, semiconductor package, electronic equipment |
US11541516B2 (en) * | 2019-09-25 | 2023-01-03 | Snap-On Incorporated | Fastener retention and anti-camout tool bit |
CN111805022A (en) * | 2020-06-04 | 2020-10-23 | 南方科技大学 | Plasma-assisted electrolytic machining method and device for implementing same |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59227241A (en) * | 1983-06-09 | 1984-12-20 | Taishi Shokuhin Kogyo Kk | Preparation of lactified soya milk |
JPH04136198A (en) * | 1990-09-26 | 1992-05-11 | Nau Chem:Yugen | Method of electroplating |
JPH06297252A (en) * | 1993-04-09 | 1994-10-25 | Sony Corp | Fine work method and device therefor |
JPH09241865A (en) * | 1996-03-01 | 1997-09-16 | Kawasaki Steel Corp | Laminated steel sheet excellent in film adhesion and corrosion resistance |
AU8119601A (en) * | 2000-08-10 | 2002-02-25 | Nutool Inc | Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence |
AUPR129900A0 (en) * | 2000-11-08 | 2000-11-30 | Chang, Chak Man Thomas | Plasma electroplating |
KR100581139B1 (en) * | 2001-03-14 | 2006-05-16 | 가부시키 가이샤 닛코 마테리알즈 | Sputtering target, baking plate or apparatus inside sputtering device producing few particles, and roughening method by electrical discharge machining |
JP2005329451A (en) * | 2004-05-21 | 2005-12-02 | Fuji Photo Film Co Ltd | Method for working surface of aluminum plate, base material for lithographic printing plate and lithographic printing plate |
JP5010966B2 (en) * | 2006-08-21 | 2012-08-29 | 株式会社神戸製鋼所 | Water repellent paint and water repellent metal plate |
US8343253B2 (en) * | 2007-02-15 | 2013-01-01 | Kankyou Engineering Co., Ltd. | Method for producing conductor fine particles |
CN101622380B (en) | 2007-03-02 | 2012-05-30 | 古河电气工业株式会社 | Production method and device of surface roughened copper plate, and surface roughened copper plate |
JP2010287648A (en) * | 2009-06-10 | 2010-12-24 | Seiko Epson Corp | Method for manufacturing semiconductor device |
JP5569259B2 (en) * | 2010-08-26 | 2014-08-13 | Jfeスチール株式会社 | Method for producing surface-modified conductive material |
CN102041540A (en) * | 2011-01-13 | 2011-05-04 | 中国科学院苏州纳米技术与纳米仿生研究所 | Anodic aluminum oxide template with three-dimensional gradual-changed hole array nanostructure and preparation method of anodic aluminum oxide template |
-
2013
- 2013-02-21 KR KR1020147022776A patent/KR101687462B1/en active IP Right Grant
- 2013-02-21 IN IN1697KON2014 patent/IN2014KN01697A/en unknown
- 2013-02-21 WO PCT/JP2013/054413 patent/WO2013125658A1/en active Application Filing
- 2013-02-21 JP JP2014500933A patent/JP5817907B2/en active Active
- 2013-02-21 CN CN201380009686.4A patent/CN104114747A/en active Pending
- 2013-02-21 EP EP13752521.8A patent/EP2818579A4/en not_active Withdrawn
- 2013-02-23 TW TW102106374A patent/TWI472424B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW201341176A (en) | 2013-10-16 |
WO2013125658A1 (en) | 2013-08-29 |
TWI472424B (en) | 2015-02-11 |
EP2818579A4 (en) | 2015-11-11 |
JP5817907B2 (en) | 2015-11-18 |
CN104114747A (en) | 2014-10-22 |
EP2818579A1 (en) | 2014-12-31 |
KR20140112559A (en) | 2014-09-23 |
JPWO2013125658A1 (en) | 2015-07-30 |
KR101687462B1 (en) | 2016-12-16 |
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