TWI460784B - 在晶圓上提供一層電漿蝕刻的設備 - Google Patents

在晶圓上提供一層電漿蝕刻的設備 Download PDF

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Publication number
TWI460784B
TWI460784B TW093112507A TW93112507A TWI460784B TW I460784 B TWI460784 B TW I460784B TW 093112507 A TW093112507 A TW 093112507A TW 93112507 A TW93112507 A TW 93112507A TW I460784 B TWI460784 B TW I460784B
Authority
TW
Taiwan
Prior art keywords
electrode
power source
frequency
modulation
wafer
Prior art date
Application number
TW093112507A
Other languages
English (en)
Chinese (zh)
Other versions
TW200504870A (en
Inventor
Peter Loewenhardt
Mukund Srinivasan
Andreas Fischer
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of TW200504870A publication Critical patent/TW200504870A/zh
Application granted granted Critical
Publication of TWI460784B publication Critical patent/TWI460784B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
    • H01J37/32155—Frequency modulation
    • H01J37/32165—Plural frequencies

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
  • ing And Chemical Polishing (AREA)
  • Apparatus For Radiation Diagnosis (AREA)
  • Magnetic Resonance Imaging Apparatus (AREA)
TW093112507A 2003-05-06 2004-05-04 在晶圓上提供一層電漿蝕刻的設備 TWI460784B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/431,030 US7976673B2 (en) 2003-05-06 2003-05-06 RF pulsing of a narrow gap capacitively coupled reactor

Publications (2)

Publication Number Publication Date
TW200504870A TW200504870A (en) 2005-02-01
TWI460784B true TWI460784B (zh) 2014-11-11

Family

ID=33416370

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093112507A TWI460784B (zh) 2003-05-06 2004-05-04 在晶圓上提供一層電漿蝕刻的設備

Country Status (9)

Country Link
US (2) US7976673B2 (enExample)
EP (1) EP1620876B1 (enExample)
JP (1) JP4794449B2 (enExample)
KR (2) KR101303969B1 (enExample)
CN (1) CN1816893B (enExample)
AT (1) ATE470949T1 (enExample)
DE (1) DE602004027620D1 (enExample)
TW (1) TWI460784B (enExample)
WO (1) WO2004102638A2 (enExample)

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US20050241762A1 (en) * 2004-04-30 2005-11-03 Applied Materials, Inc. Alternating asymmetrical plasma generation in a process chamber
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US9083392B2 (en) * 2005-05-17 2015-07-14 The Regents Of The University Of Michigan Wireless sensing and communication utilizing RF transmissions from microdischarges
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JP5192209B2 (ja) 2006-10-06 2013-05-08 東京エレクトロン株式会社 プラズマエッチング装置、プラズマエッチング方法およびコンピュータ読取可能な記憶媒体
JP5514413B2 (ja) 2007-08-17 2014-06-04 東京エレクトロン株式会社 プラズマエッチング方法
US7736914B2 (en) * 2007-11-29 2010-06-15 Applied Materials, Inc. Plasma control using dual cathode frequency mixing and controlling the level of polymer formation
CN101736326B (zh) * 2008-11-26 2011-08-10 中微半导体设备(上海)有限公司 电容耦合型等离子体处理反应器
JP5390846B2 (ja) 2008-12-09 2014-01-15 東京エレクトロン株式会社 プラズマエッチング装置及びプラズマクリーニング方法
US8540844B2 (en) * 2008-12-19 2013-09-24 Lam Research Corporation Plasma confinement structures in plasma processing systems
US8154209B2 (en) * 2009-04-06 2012-04-10 Lam Research Corporation Modulated multi-frequency processing method
US8659335B2 (en) 2009-06-25 2014-02-25 Mks Instruments, Inc. Method and system for controlling radio frequency power
US20110011534A1 (en) * 2009-07-17 2011-01-20 Rajinder Dhindsa Apparatus for adjusting an edge ring potential during substrate processing
KR101384341B1 (ko) * 2010-06-10 2014-04-14 에스티에스반도체통신 주식회사 무선 전력과 무선 주파수 신호를 이용하는 스크린 프린팅 장치
US9793126B2 (en) 2010-08-04 2017-10-17 Lam Research Corporation Ion to neutral control for wafer processing with dual plasma source reactor
US9184028B2 (en) * 2010-08-04 2015-11-10 Lam Research Corporation Dual plasma volume processing apparatus for neutral/ion flux control
US20130059448A1 (en) * 2011-09-07 2013-03-07 Lam Research Corporation Pulsed Plasma Chamber in Dual Chamber Configuration
US8869742B2 (en) 2010-08-04 2014-10-28 Lam Research Corporation Plasma processing chamber with dual axial gas injection and exhaust
US20120258555A1 (en) * 2011-04-11 2012-10-11 Lam Research Corporation Multi-Frequency Hollow Cathode and Systems Implementing the Same
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US8900403B2 (en) 2011-05-10 2014-12-02 Lam Research Corporation Semiconductor processing system having multiple decoupled plasma sources
US9039911B2 (en) 2012-08-27 2015-05-26 Lam Research Corporation Plasma-enhanced etching in an augmented plasma processing system
US20130119018A1 (en) * 2011-11-15 2013-05-16 Keren Jacobs Kanarik Hybrid pulsing plasma processing systems
US9030101B2 (en) * 2012-02-22 2015-05-12 Lam Research Corporation Frequency enhanced impedance dependent power control for multi-frequency RF pulsing
US9114666B2 (en) * 2012-02-22 2015-08-25 Lam Research Corporation Methods and apparatus for controlling plasma in a plasma processing system
US9197196B2 (en) * 2012-02-22 2015-11-24 Lam Research Corporation State-based adjustment of power and frequency
TWI599272B (zh) * 2012-09-14 2017-09-11 蘭姆研究公司 根據三個或更多狀態之功率及頻率調整
US9230819B2 (en) 2013-04-05 2016-01-05 Lam Research Corporation Internal plasma grid applications for semiconductor fabrication in context of ion-ion plasma processing
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Also Published As

Publication number Publication date
WO2004102638A2 (en) 2004-11-25
ATE470949T1 (de) 2010-06-15
JP2007501530A (ja) 2007-01-25
JP4794449B2 (ja) 2011-10-19
TW200504870A (en) 2005-02-01
EP1620876B1 (en) 2010-06-09
US7976673B2 (en) 2011-07-12
CN1816893A (zh) 2006-08-09
KR20120098951A (ko) 2012-09-05
EP1620876A2 (en) 2006-02-01
KR20060013386A (ko) 2006-02-09
WO2004102638A3 (en) 2005-07-28
CN1816893B (zh) 2012-09-19
KR101303969B1 (ko) 2013-09-03
US20040221958A1 (en) 2004-11-11
US20110263130A1 (en) 2011-10-27
US8337713B2 (en) 2012-12-25
DE602004027620D1 (de) 2010-07-22

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