DE602004027620D1 - Hf-pulsen eines kapazitiv gekoppelten narrow-gap-reaktors - Google Patents
Hf-pulsen eines kapazitiv gekoppelten narrow-gap-reaktorsInfo
- Publication number
- DE602004027620D1 DE602004027620D1 DE602004027620T DE602004027620T DE602004027620D1 DE 602004027620 D1 DE602004027620 D1 DE 602004027620D1 DE 602004027620 T DE602004027620 T DE 602004027620T DE 602004027620 T DE602004027620 T DE 602004027620T DE 602004027620 D1 DE602004027620 D1 DE 602004027620D1
- Authority
- DE
- Germany
- Prior art keywords
- pulses
- electrode
- process chamber
- capacitively coupled
- narrow gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 abstract 9
- 238000005530 etching Methods 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
- H01J37/32155—Frequency modulation
- H01J37/32165—Plural frequencies
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma Technology (AREA)
- Drying Of Semiconductors (AREA)
- Apparatus For Radiation Diagnosis (AREA)
- Magnetic Resonance Imaging Apparatus (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/431,030 US7976673B2 (en) | 2003-05-06 | 2003-05-06 | RF pulsing of a narrow gap capacitively coupled reactor |
PCT/US2004/013707 WO2004102638A2 (en) | 2003-05-06 | 2004-04-29 | Rf pulsing of a narrow gap capacitively coupled reactor |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602004027620D1 true DE602004027620D1 (de) | 2010-07-22 |
Family
ID=33416370
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602004027620T Expired - Lifetime DE602004027620D1 (de) | 2003-05-06 | 2004-04-29 | Hf-pulsen eines kapazitiv gekoppelten narrow-gap-reaktors |
Country Status (9)
Country | Link |
---|---|
US (2) | US7976673B2 (de) |
EP (1) | EP1620876B1 (de) |
JP (1) | JP4794449B2 (de) |
KR (2) | KR101303969B1 (de) |
CN (1) | CN1816893B (de) |
AT (1) | ATE470949T1 (de) |
DE (1) | DE602004027620D1 (de) |
TW (1) | TWI460784B (de) |
WO (1) | WO2004102638A2 (de) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6749945B2 (en) * | 2001-01-29 | 2004-06-15 | The Board Of Regents For Oklahoma State University | Advanced composite ormosil coatings |
US7887889B2 (en) * | 2001-12-14 | 2011-02-15 | 3M Innovative Properties Company | Plasma fluorination treatment of porous materials |
US7431857B2 (en) * | 2003-08-15 | 2008-10-07 | Applied Materials, Inc. | Plasma generation and control using a dual frequency RF source |
US7144521B2 (en) * | 2003-08-22 | 2006-12-05 | Lam Research Corporation | High aspect ratio etch using modulation of RF powers of various frequencies |
US7838430B2 (en) * | 2003-10-28 | 2010-11-23 | Applied Materials, Inc. | Plasma control using dual cathode frequency mixing |
US20050241762A1 (en) * | 2004-04-30 | 2005-11-03 | Applied Materials, Inc. | Alternating asymmetrical plasma generation in a process chamber |
KR20060005560A (ko) * | 2004-07-13 | 2006-01-18 | 삼성전자주식회사 | 플라즈마를 이용하는 반도체 소자 제조 장비 |
US9083392B2 (en) * | 2005-05-17 | 2015-07-14 | The Regents Of The University Of Michigan | Wireless sensing and communication utilizing RF transmissions from microdischarges |
KR100777151B1 (ko) * | 2006-03-21 | 2007-11-16 | 주식회사 디엠에스 | 하이브리드형 플라즈마 반응장치 |
JP5192209B2 (ja) | 2006-10-06 | 2013-05-08 | 東京エレクトロン株式会社 | プラズマエッチング装置、プラズマエッチング方法およびコンピュータ読取可能な記憶媒体 |
JP5514413B2 (ja) * | 2007-08-17 | 2014-06-04 | 東京エレクトロン株式会社 | プラズマエッチング方法 |
US7736914B2 (en) * | 2007-11-29 | 2010-06-15 | Applied Materials, Inc. | Plasma control using dual cathode frequency mixing and controlling the level of polymer formation |
CN101736326B (zh) * | 2008-11-26 | 2011-08-10 | 中微半导体设备(上海)有限公司 | 电容耦合型等离子体处理反应器 |
JP5390846B2 (ja) | 2008-12-09 | 2014-01-15 | 東京エレクトロン株式会社 | プラズマエッチング装置及びプラズマクリーニング方法 |
US8540844B2 (en) * | 2008-12-19 | 2013-09-24 | Lam Research Corporation | Plasma confinement structures in plasma processing systems |
US8154209B2 (en) * | 2009-04-06 | 2012-04-10 | Lam Research Corporation | Modulated multi-frequency processing method |
US8659335B2 (en) | 2009-06-25 | 2014-02-25 | Mks Instruments, Inc. | Method and system for controlling radio frequency power |
US20110011534A1 (en) * | 2009-07-17 | 2011-01-20 | Rajinder Dhindsa | Apparatus for adjusting an edge ring potential during substrate processing |
KR101384341B1 (ko) * | 2010-06-10 | 2014-04-14 | 에스티에스반도체통신 주식회사 | 무선 전력과 무선 주파수 신호를 이용하는 스크린 프린팅 장치 |
US20130059448A1 (en) * | 2011-09-07 | 2013-03-07 | Lam Research Corporation | Pulsed Plasma Chamber in Dual Chamber Configuration |
US9793126B2 (en) | 2010-08-04 | 2017-10-17 | Lam Research Corporation | Ion to neutral control for wafer processing with dual plasma source reactor |
US8869742B2 (en) | 2010-08-04 | 2014-10-28 | Lam Research Corporation | Plasma processing chamber with dual axial gas injection and exhaust |
US9184028B2 (en) * | 2010-08-04 | 2015-11-10 | Lam Research Corporation | Dual plasma volume processing apparatus for neutral/ion flux control |
US9111728B2 (en) | 2011-04-11 | 2015-08-18 | Lam Research Corporation | E-beam enhanced decoupled source for semiconductor processing |
US20120258555A1 (en) * | 2011-04-11 | 2012-10-11 | Lam Research Corporation | Multi-Frequency Hollow Cathode and Systems Implementing the Same |
US8900403B2 (en) | 2011-05-10 | 2014-12-02 | Lam Research Corporation | Semiconductor processing system having multiple decoupled plasma sources |
US9039911B2 (en) | 2012-08-27 | 2015-05-26 | Lam Research Corporation | Plasma-enhanced etching in an augmented plasma processing system |
US20130119018A1 (en) * | 2011-11-15 | 2013-05-16 | Keren Jacobs Kanarik | Hybrid pulsing plasma processing systems |
US9030101B2 (en) * | 2012-02-22 | 2015-05-12 | Lam Research Corporation | Frequency enhanced impedance dependent power control for multi-frequency RF pulsing |
US9197196B2 (en) * | 2012-02-22 | 2015-11-24 | Lam Research Corporation | State-based adjustment of power and frequency |
US9114666B2 (en) * | 2012-02-22 | 2015-08-25 | Lam Research Corporation | Methods and apparatus for controlling plasma in a plasma processing system |
TWI599272B (zh) * | 2012-09-14 | 2017-09-11 | 蘭姆研究公司 | 根據三個或更多狀態之功率及頻率調整 |
US9230819B2 (en) | 2013-04-05 | 2016-01-05 | Lam Research Corporation | Internal plasma grid applications for semiconductor fabrication in context of ion-ion plasma processing |
US9245761B2 (en) | 2013-04-05 | 2016-01-26 | Lam Research Corporation | Internal plasma grid for semiconductor fabrication |
US9017526B2 (en) | 2013-07-08 | 2015-04-28 | Lam Research Corporation | Ion beam etching system |
US9147581B2 (en) | 2013-07-11 | 2015-09-29 | Lam Research Corporation | Dual chamber plasma etcher with ion accelerator |
US9875873B2 (en) * | 2014-08-08 | 2018-01-23 | Shimadzu Corporation | Particle charger |
EP3038132B1 (de) * | 2014-12-22 | 2020-03-11 | IMEC vzw | Verfahren und Vorrichtung zur Echtzeitüberwachung der Plasmaätzgleichmäßigkeit |
JP2018038988A (ja) * | 2016-09-09 | 2018-03-15 | 株式会社島津製作所 | 粒子濃縮装置 |
EP3711081B1 (de) * | 2017-11-17 | 2024-06-19 | AES Global Holdings, Pte. Ltd. | Räumliche und zeitliche steuerung einer ionenvorspannung für die plasmabearbeitung |
Family Cites Families (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FI62692C (fi) * | 1981-05-20 | 1983-02-10 | Valmet Oy | Pappersmaskinspress med bred presszon |
US4500563A (en) * | 1982-12-15 | 1985-02-19 | Pacific Western Systems, Inc. | Independently variably controlled pulsed R.F. plasma chemical vapor processing |
KR890004881B1 (ko) | 1983-10-19 | 1989-11-30 | 가부시기가이샤 히다찌세이사꾸쇼 | 플라즈마 처리 방법 및 그 장치 |
US4585516A (en) * | 1985-03-04 | 1986-04-29 | Tegal Corporation | Variable duty cycle, multiple frequency, plasma reactor |
US5755886A (en) * | 1986-12-19 | 1998-05-26 | Applied Materials, Inc. | Apparatus for preventing deposition gases from contacting a selected region of a substrate during deposition processing |
DE3733135C1 (de) | 1987-10-01 | 1988-09-22 | Leybold Ag | Vorrichtung zum Beschichten oder AEtzen mittels eines Plasmas |
EP0395415B1 (de) * | 1989-04-27 | 1995-03-15 | Fujitsu Limited | Gerät und Verfahren zur Bearbeitung einer Halbleitervorrichtung unter Verwendung eines durch Mikrowellen erzeugten Plasmas |
US4889588A (en) * | 1989-05-01 | 1989-12-26 | Tegal Corporation | Plasma etch isotropy control |
KR100324792B1 (ko) * | 1993-03-31 | 2002-06-20 | 히가시 데쓰로 | 플라즈마처리장치 |
JPH07131671A (ja) * | 1993-10-28 | 1995-05-19 | Matsushita Electric Ind Co Ltd | ダイナミックフォーカス用増幅回路 |
US5468341A (en) * | 1993-12-28 | 1995-11-21 | Nec Corporation | Plasma-etching method and apparatus therefor |
US5565036A (en) * | 1994-01-19 | 1996-10-15 | Tel America, Inc. | Apparatus and method for igniting plasma in a process module |
JP3093572B2 (ja) * | 1994-07-07 | 2000-10-03 | 株式会社半導体エネルギー研究所 | ドライエッチング方法 |
US5683538A (en) * | 1994-12-23 | 1997-11-04 | International Business Machines Corporation | Control of etch selectivity |
US5614060A (en) * | 1995-03-23 | 1997-03-25 | Applied Materials, Inc. | Process and apparatus for etching metal in integrated circuit structure with high selectivity to photoresist and good metal etch residue removal |
US5534751A (en) * | 1995-07-10 | 1996-07-09 | Lam Research Corporation | Plasma etching apparatus utilizing plasma confinement |
JPH09120957A (ja) | 1995-08-23 | 1997-05-06 | Fujitsu Ltd | プラズマ装置及びプラズマ処理方法 |
US5983828A (en) | 1995-10-13 | 1999-11-16 | Mattson Technology, Inc. | Apparatus and method for pulsed plasma processing of a semiconductor substrate |
US6902683B1 (en) * | 1996-03-01 | 2005-06-07 | Hitachi, Ltd. | Plasma processing apparatus and plasma processing method |
KR970064327A (ko) * | 1996-02-27 | 1997-09-12 | 모리시다 요이치 | 고주파 전력 인가장치, 플라즈마 발생장치, 플라즈마 처리장치, 고주파 전력 인가방법, 플라즈마 발생방법 및 플라즈마 처리방법 |
TW335517B (en) * | 1996-03-01 | 1998-07-01 | Hitachi Ltd | Apparatus and method for processing plasma |
JP3663392B2 (ja) | 1996-03-01 | 2005-06-22 | 株式会社日立製作所 | プラズマエッチング処理装置 |
JPH09330913A (ja) | 1996-06-12 | 1997-12-22 | Matsushita Electric Ind Co Ltd | プラズマ発生方法及びプラズマ発生装置 |
JP3220383B2 (ja) * | 1996-07-23 | 2001-10-22 | 東京エレクトロン株式会社 | プラズマ処理装置及びその方法 |
US6214162B1 (en) * | 1996-09-27 | 2001-04-10 | Tokyo Electron Limited | Plasma processing apparatus |
JP3220394B2 (ja) * | 1996-09-27 | 2001-10-22 | 東京エレクトロン株式会社 | プラズマ処理装置 |
JP4114972B2 (ja) * | 1997-05-27 | 2008-07-09 | キヤノンアネルバ株式会社 | 基板処理装置 |
JP3629705B2 (ja) | 1997-06-06 | 2005-03-16 | 東京エレクトロン株式会社 | プラズマ処理装置 |
US6008130A (en) * | 1997-08-14 | 1999-12-28 | Vlsi Technology, Inc. | Polymer adhesive plasma confinement ring |
JPH11219938A (ja) | 1998-02-02 | 1999-08-10 | Matsushita Electron Corp | プラズマエッチング方法 |
US6093332A (en) * | 1998-02-04 | 2000-07-25 | Lam Research Corporation | Methods for reducing mask erosion during plasma etching |
JP2000031128A (ja) | 1998-05-06 | 2000-01-28 | Mitsubishi Electric Corp | エッチング処理装置及びエッチング処理方法、並びに半導体装置の製造方法及び半導体装置 |
US6073577A (en) * | 1998-06-30 | 2000-06-13 | Lam Research Corporation | Electrode for plasma processes and method for manufacture and use thereof |
JP4578651B2 (ja) | 1999-09-13 | 2010-11-10 | 東京エレクトロン株式会社 | プラズマ処理方法およびプラズマ処理装置、プラズマエッチング方法 |
JP2001110798A (ja) * | 1999-10-04 | 2001-04-20 | Ulvac Japan Ltd | プラズマcvd装置及び薄膜製造方法 |
US6363882B1 (en) | 1999-12-30 | 2002-04-02 | Lam Research Corporation | Lower electrode design for higher uniformity |
JP3792999B2 (ja) * | 2000-06-28 | 2006-07-05 | 株式会社東芝 | プラズマ処理装置 |
US6726804B2 (en) * | 2001-01-22 | 2004-04-27 | Liang-Guo Wang | RF power delivery for plasma processing using modulated power signal |
US6777344B2 (en) * | 2001-02-12 | 2004-08-17 | Lam Research Corporation | Post-etch photoresist strip with O2 and NH3 for organosilicate glass low-K dielectric etch applications |
US6777037B2 (en) * | 2001-02-21 | 2004-08-17 | Hitachi, Ltd. | Plasma processing method and apparatus |
US6770166B1 (en) | 2001-06-29 | 2004-08-03 | Lam Research Corp. | Apparatus and method for radio frequency de-coupling and bias voltage control in a plasma reactor |
-
2003
- 2003-05-06 US US10/431,030 patent/US7976673B2/en not_active Expired - Fee Related
-
2004
- 2004-04-29 WO PCT/US2004/013707 patent/WO2004102638A2/en active Application Filing
- 2004-04-29 EP EP04751199A patent/EP1620876B1/de not_active Expired - Lifetime
- 2004-04-29 JP JP2006532543A patent/JP4794449B2/ja not_active Expired - Fee Related
- 2004-04-29 CN CN2004800191395A patent/CN1816893B/zh not_active Expired - Fee Related
- 2004-04-29 KR KR1020127020117A patent/KR101303969B1/ko active IP Right Grant
- 2004-04-29 AT AT04751199T patent/ATE470949T1/de not_active IP Right Cessation
- 2004-04-29 DE DE602004027620T patent/DE602004027620D1/de not_active Expired - Lifetime
- 2004-04-29 KR KR1020057021083A patent/KR20060013386A/ko active Application Filing
- 2004-05-04 TW TW093112507A patent/TWI460784B/zh active
-
2011
- 2011-07-07 US US13/177,627 patent/US8337713B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US20110263130A1 (en) | 2011-10-27 |
KR101303969B1 (ko) | 2013-09-03 |
EP1620876B1 (de) | 2010-06-09 |
TW200504870A (en) | 2005-02-01 |
TWI460784B (zh) | 2014-11-11 |
KR20060013386A (ko) | 2006-02-09 |
US20040221958A1 (en) | 2004-11-11 |
US7976673B2 (en) | 2011-07-12 |
JP4794449B2 (ja) | 2011-10-19 |
JP2007501530A (ja) | 2007-01-25 |
EP1620876A2 (de) | 2006-02-01 |
KR20120098951A (ko) | 2012-09-05 |
WO2004102638A3 (en) | 2005-07-28 |
CN1816893A (zh) | 2006-08-09 |
WO2004102638A2 (en) | 2004-11-25 |
CN1816893B (zh) | 2012-09-19 |
ATE470949T1 (de) | 2010-06-15 |
US8337713B2 (en) | 2012-12-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE602004027620D1 (de) | Hf-pulsen eines kapazitiv gekoppelten narrow-gap-reaktors | |
TW200515507A (en) | Plasma control using dual cathode frequency mixing | |
SG130195A1 (en) | High aspect ratio etch using modulation of rf powers of various frequencies | |
TW200508659A (en) | An interference display cell and fabrication method thereof | |
DK0691539T3 (da) | Fremgangsmåde ved fremstilling af amperometriske elektroder | |
TW200717616A (en) | Semiconductor substrate process using a low temperature-deposited carbon-containing hard mask | |
AU2002222328A1 (en) | Method and apparatus for plasma skin resurfacing | |
ATE458273T1 (de) | Verfahren zur ätzung eines substrats | |
ATE418157T1 (de) | Kerbenfreies ätzen von soi-strukturen mit hohem seitenverhältnis durch verwendung eines zeitlich gemultiplexten prozesses und hf-vormodulation | |
WO2006026110A3 (en) | Yttria insulator ring for use inside a plasma chamber | |
TW200624601A (en) | Methods and apparatus for tuning a set of plasma processing steps | |
WO2004099875A3 (en) | Etching of chromium layers on photomasks utilizing high density plasma and low frequency rf bias | |
ATE244453T1 (de) | Verfahren zur verminderung der erosion einer maske während eines plasmaätzens | |
DE602005022221D1 (de) | Impedanzanpassung eines kapazitiv gekoppelten hf-plasmareaktors mit eignung für grossflächige substrate | |
WO2003049169A1 (en) | Plasma etching method and plasma etching device | |
DE69740130D1 (de) | Plasma-ätzreaktor und verfahren zum ätzen eines wafers | |
ATE269586T1 (de) | Reaktor zur radiofrequenz betriebenen plasma- aktivierten chemischen dampfabscheidung und verfahren | |
TW200507039A (en) | Plasma generation and control using a dual frequency RF source | |
WO2010005930A3 (en) | Capacitively-coupled electrostatic (cce) probe arrangement for detecting strike step in a plasma processing chamber and methods thereof | |
TW200520089A (en) | Etch with ramping | |
TW200509194A (en) | Plasma chamber having multiple RF source frequencies | |
TW200721265A (en) | Silicon dot forming method and silicon dot forming apparatus | |
MY137776A (en) | Method and apparatus to detect and decode information | |
TW200511372A (en) | Apparatus having edge frame and method of using the same | |
JP2016105489A (ja) | プラズマ処理方法 |