ATE418157T1 - Kerbenfreies ätzen von soi-strukturen mit hohem seitenverhältnis durch verwendung eines zeitlich gemultiplexten prozesses und hf-vormodulation - Google Patents

Kerbenfreies ätzen von soi-strukturen mit hohem seitenverhältnis durch verwendung eines zeitlich gemultiplexten prozesses und hf-vormodulation

Info

Publication number
ATE418157T1
ATE418157T1 AT04817803T AT04817803T ATE418157T1 AT E418157 T1 ATE418157 T1 AT E418157T1 AT 04817803 T AT04817803 T AT 04817803T AT 04817803 T AT04817803 T AT 04817803T AT E418157 T1 ATE418157 T1 AT E418157T1
Authority
AT
Austria
Prior art keywords
modulation
notch
aspect ratio
high aspect
soi structures
Prior art date
Application number
AT04817803T
Other languages
English (en)
Inventor
Sunil Srinivasan
David Johnson
Russell Westerman
Original Assignee
Unaxis Usa Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unaxis Usa Inc filed Critical Unaxis Usa Inc
Application granted granted Critical
Publication of ATE418157T1 publication Critical patent/ATE418157T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H01L21/30655—Plasma etching; Reactive-ion etching comprising alternated and repeated etching and passivation steps, e.g. Bosch process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
    • H01L21/76283—Lateral isolation by refilling of trenches with dielectric material

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Peptides Or Proteins (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
AT04817803T 2003-10-21 2004-10-19 Kerbenfreies ätzen von soi-strukturen mit hohem seitenverhältnis durch verwendung eines zeitlich gemultiplexten prozesses und hf-vormodulation ATE418157T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US51293303P 2003-10-21 2003-10-21
US10/968,823 US20050112891A1 (en) 2003-10-21 2004-10-18 Notch-free etching of high aspect SOI structures using a time division multiplex process and RF bias modulation

Publications (1)

Publication Number Publication Date
ATE418157T1 true ATE418157T1 (de) 2009-01-15

Family

ID=34576731

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04817803T ATE418157T1 (de) 2003-10-21 2004-10-19 Kerbenfreies ätzen von soi-strukturen mit hohem seitenverhältnis durch verwendung eines zeitlich gemultiplexten prozesses und hf-vormodulation

Country Status (6)

Country Link
US (2) US20050112891A1 (de)
EP (1) EP1676302B1 (de)
JP (1) JP2007509506A (de)
AT (1) ATE418157T1 (de)
DE (1) DE602004018531D1 (de)
WO (1) WO2005045904A2 (de)

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US7737042B2 (en) * 2007-02-22 2010-06-15 Applied Materials, Inc. Pulsed-plasma system for etching semiconductor structures
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US7771606B2 (en) * 2007-02-22 2010-08-10 Applied Materials, Inc. Pulsed-plasma system with pulsed reaction gas replenish for etching semiconductors structures
JP5608157B2 (ja) * 2008-03-21 2014-10-15 アプライド マテリアルズ インコーポレイテッド 基板エッチングシステム及びプロセスの方法及び装置
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JP2011100760A (ja) * 2009-11-04 2011-05-19 Ulvac Japan Ltd エッチング方法
US8658541B2 (en) * 2010-01-15 2014-02-25 Applied Materials, Inc. Method of controlling trench microloading using plasma pulsing
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US8802545B2 (en) * 2011-03-14 2014-08-12 Plasma-Therm Llc Method and apparatus for plasma dicing a semi-conductor wafer
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US8758638B2 (en) * 2011-05-10 2014-06-24 Applied Materials, Inc. Copper oxide removal techniques
US8609548B2 (en) * 2011-06-06 2013-12-17 Lam Research Corporation Method for providing high etch rate
US20130119018A1 (en) * 2011-11-15 2013-05-16 Keren Jacobs Kanarik Hybrid pulsing plasma processing systems
US8883028B2 (en) * 2011-12-28 2014-11-11 Lam Research Corporation Mixed mode pulsing etching in plasma processing systems
GB2499816A (en) * 2012-02-29 2013-09-04 Oxford Instr Nanotechnology Tools Ltd Controlling deposition and etching in a chamber with fine time control of parameters and gas flow
JP5841917B2 (ja) 2012-08-24 2016-01-13 株式会社日立ハイテクノロジーズ プラズマ処理装置及びプラズマ処理方法
JP5967710B2 (ja) * 2012-09-28 2016-08-10 サムコ株式会社 プラズマエッチングの終点検出方法
CN103928283B (zh) * 2013-01-10 2016-06-15 中微半导体设备(上海)有限公司 一种真空处理腔室的射频脉冲功率匹配的方法及其装置
US9653316B2 (en) * 2013-02-18 2017-05-16 Tokyo Electron Limited Plasma processing method and plasma processing apparatus
JP6173086B2 (ja) * 2013-07-19 2017-08-02 キヤノン株式会社 シリコン基板のエッチング方法
US20150371889A1 (en) * 2014-06-20 2015-12-24 Applied Materials, Inc. Methods for shallow trench isolation formation in a silicon germanium layer
US9691625B2 (en) * 2015-11-04 2017-06-27 Lam Research Corporation Methods and systems for plasma etching using bi-modal process gas composition responsive to plasma power level
US10090162B2 (en) 2016-01-18 2018-10-02 Hitachi High-Technologies Corporation Plasma processing method and plasma processing device
US11295937B2 (en) * 2019-09-17 2022-04-05 Tokyo Electron Limited Broadband plasma processing systems and methods
US11170981B2 (en) * 2019-09-17 2021-11-09 Tokyo Electron Limited Broadband plasma processing systems and methods
RU2715412C1 (ru) * 2019-11-26 2020-02-28 Акционерное общество «Российская корпорация ракетно-космического приборостроения и информационных систем» (АО «Российские космические системы») Многослойная коммутационная плата СВЧ-гибридной интегральной микросхемы космического назначения и способ её получения (варианты)
US20230187174A1 (en) * 2020-09-02 2023-06-15 Hitachi High-Tech Corporation Plasma processing apparatus and plasma processing method
US11917806B2 (en) 2021-08-12 2024-02-27 Changxin Memory Technologies, Inc. Method of manufacturing semiconductor structure and semiconductor structure

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Also Published As

Publication number Publication date
US20070175856A1 (en) 2007-08-02
US20050112891A1 (en) 2005-05-26
WO2005045904A3 (en) 2005-09-09
EP1676302B1 (de) 2008-12-17
WO2005045904A2 (en) 2005-05-19
EP1676302A2 (de) 2006-07-05
DE602004018531D1 (de) 2009-01-29
JP2007509506A (ja) 2007-04-12

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