TWI455949B - 烯烴樹脂、環氧樹脂、硬化性樹脂組成物及其硬化物 - Google Patents

烯烴樹脂、環氧樹脂、硬化性樹脂組成物及其硬化物 Download PDF

Info

Publication number
TWI455949B
TWI455949B TW099112114A TW99112114A TWI455949B TW I455949 B TWI455949 B TW I455949B TW 099112114 A TW099112114 A TW 099112114A TW 99112114 A TW99112114 A TW 99112114A TW I455949 B TWI455949 B TW I455949B
Authority
TW
Taiwan
Prior art keywords
epoxy resin
resin
formula
represented
olefin
Prior art date
Application number
TW099112114A
Other languages
English (en)
Chinese (zh)
Other versions
TW201040203A (en
Inventor
Masataka Nakanishi
Kenichi Kuboki
Naofusa Miyagawa
Yoshihiro Kawada
Chie Sasaki
Shizuka Aoki
Zuikan Suzuki
Masato Yarita
Hiroo Koyanagi
Original Assignee
Nippon Kayaku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Kk filed Critical Nippon Kayaku Kk
Publication of TW201040203A publication Critical patent/TW201040203A/zh
Application granted granted Critical
Publication of TWI455949B publication Critical patent/TWI455949B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/34—Epoxy compounds containing three or more epoxy groups obtained by epoxidation of an unsaturated polymer
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
    • C07C69/74—Esters of carboxylic acids having an esterified carboxyl group bound to a carbon atom of a ring other than a six-membered aromatic ring
    • C07C69/75—Esters of carboxylic acids having an esterified carboxyl group bound to a carbon atom of a ring other than a six-membered aromatic ring of acids with a six-membered ring
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D301/00—Preparation of oxiranes
    • C07D301/02—Synthesis of the oxirane ring
    • C07D301/03—Synthesis of the oxirane ring by oxidation of unsaturated compounds, or of mixtures of unsaturated and saturated compounds
    • C07D301/12—Synthesis of the oxirane ring by oxidation of unsaturated compounds, or of mixtures of unsaturated and saturated compounds with hydrogen peroxide or inorganic peroxides or peracids
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/38—Compounds containing oxirane rings with hydrocarbon radicals, substituted by carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals
    • C07D303/40—Compounds containing oxirane rings with hydrocarbon radicals, substituted by carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals by ester radicals
    • C07D303/44—Esterified with oxirane-containing hydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C2601/00—Systems containing only non-condensed rings
    • C07C2601/12—Systems containing only non-condensed rings with a six-membered ring
    • C07C2601/16—Systems containing only non-condensed rings with a six-membered ring the ring being unsaturated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Epoxy Compounds (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
TW099112114A 2009-04-17 2010-04-16 烯烴樹脂、環氧樹脂、硬化性樹脂組成物及其硬化物 TWI455949B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009100638 2009-04-17

Publications (2)

Publication Number Publication Date
TW201040203A TW201040203A (en) 2010-11-16
TWI455949B true TWI455949B (zh) 2014-10-11

Family

ID=42982617

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099112114A TWI455949B (zh) 2009-04-17 2010-04-16 烯烴樹脂、環氧樹脂、硬化性樹脂組成物及其硬化物

Country Status (5)

Country Link
JP (1) JP5559154B2 (ja)
KR (1) KR20120026035A (ja)
CN (1) CN102395555B (ja)
TW (1) TWI455949B (ja)
WO (1) WO2010119960A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5404514B2 (ja) * 2010-04-19 2014-02-05 日本化薬株式会社 エポキシ樹脂の製造法、エポキシ樹脂、および硬化性樹脂組成物
JP5843584B2 (ja) * 2011-11-29 2016-01-13 昭和電工株式会社 多価グリシジル化合物の製造方法
EP2786122B1 (en) * 2011-12-02 2022-06-08 Senseair AB Epoxy molded gas cell for optical measurement and method of forming
JP6240069B2 (ja) * 2012-06-07 2017-11-29 日本化薬株式会社 エポキシ樹脂組成物、およびその硬化物、並びに、硬化性樹脂組成物
CN103289326B (zh) * 2013-06-28 2015-10-07 山东科技大学 用于灌封料的无卤阻燃环氧树脂组合物
WO2016119848A1 (en) * 2015-01-29 2016-08-04 Henkel Ag & Co. Kgaa Method for the preparation of cycloaliphatic epoxy resins
KR102204653B1 (ko) * 2016-11-07 2021-01-19 쇼와 덴코 가부시키가이샤 다가 글리시딜 화합물의 제조 방법
CN108649113A (zh) * 2018-04-28 2018-10-12 上海应用技术大学 一种提高led良品率的新型应用工艺
KR20210036119A (ko) * 2019-09-25 2021-04-02 주식회사 케이씨씨 분체도료 조성물

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0479166A1 (en) * 1990-09-28 1992-04-08 Union Carbide Chemicals And Plastics Company, Inc. Transesterification process for preparation of cycloaliphatic epoxides
JP2006052187A (ja) * 2004-08-16 2006-02-23 Daicel Chem Ind Ltd 脂環式オレフィン化合物および脂環式エポキシ化合物の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05213919A (ja) * 1992-02-04 1993-08-24 Tosoh Corp 脂環式オレフィンのエポキシ化法
US5767150A (en) * 1997-04-10 1998-06-16 Sartomer Company Cycloaliphatic epoxide compounds
EP1133533B1 (en) * 1998-11-23 2004-07-14 Sun Chemical Corporation Energy curable gravure and ink jet inks incorporating grafted pigments

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0479166A1 (en) * 1990-09-28 1992-04-08 Union Carbide Chemicals And Plastics Company, Inc. Transesterification process for preparation of cycloaliphatic epoxides
JP2006052187A (ja) * 2004-08-16 2006-02-23 Daicel Chem Ind Ltd 脂環式オレフィン化合物および脂環式エポキシ化合物の製造方法

Also Published As

Publication number Publication date
WO2010119960A1 (ja) 2010-10-21
CN102395555A (zh) 2012-03-28
TW201040203A (en) 2010-11-16
CN102395555B (zh) 2015-01-21
KR20120026035A (ko) 2012-03-16
JP5559154B2 (ja) 2014-07-23
JPWO2010119960A1 (ja) 2012-10-22

Similar Documents

Publication Publication Date Title
TWI455949B (zh) 烯烴樹脂、環氧樹脂、硬化性樹脂組成物及其硬化物
MY162601A (en) Curable epoxy resin composition
IN2014DN08701A (ja)
WO2013025303A3 (en) Curable resin compositions
WO2017188448A1 (ja) 硬化樹脂用組成物及びその硬化物
MY171727A (en) Curable polysilsesquioxane compound, method for producing same, curable composition, cured product, and method for using curable composition or the like
EP2557103A4 (en) EPOXY COMPOUND, CURABLE COMPOSITION, AND CURED PRODUCT THEREOF
SG179001A1 (en) Adhesive film, multilayer circuit board, electronic component and semiconductor device
WO2009037862A1 (ja) 包接錯体を含有する半導体封止用エポキシ樹脂組成物
MY169102A (en) Epoxy resin composition and cured product thereof and curable resin composition
WO2011059633A3 (en) Polyoxazolidone resins
WO2009137444A3 (en) Cure accelerators for anaerobic curable compositions
ATE509053T1 (de) Dimethylformamidfreie formulierungen mit dicyanadiamid als härtemittel für wärmehärtende epoxidharze
WO2009137455A3 (en) Cure accelerators for anaerobic curable compositions
JP2014509678A5 (ja)
DE602008006681D1 (de) Elektronische Verpackung
WO2010042261A8 (en) Process for producing phenol
ATE444979T1 (de) Härter für epoxidharze
JP2012504177A5 (ja)
WO2013032739A3 (en) Epoxybenzyl-terminated poly(arylene ether)s, method for preparation thereof, and curable compositions comprising same
BR112013024223A2 (pt) composto de poliéter, agente de cura usando o composto de poliéter, e método de produção do composto de poliéter
EP2292678A4 (en) CARBOXYL GROUP-CONTAINING RESIN, CURABLE COMPOSITION CONTAINING RESIN CONTAINING CARBOXYL GROUP, AND CURED PRODUCT OF THE SAME
TW200745194A (en) Epoxy resin hardener and epoxy resin composition
EP2450361A4 (en) ORGANOMETALLIC COMPOUNDS AND METHOD FOR THE PRODUCTION THEREOF
ATE547450T1 (de) Bei niedrigen temperaturen härtbare epoxidzusammensetzungen, die phenolisch blockierte harnstoff-härter enthalten

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees