TWI450642B - 電路保護裝置 - Google Patents
電路保護裝置 Download PDFInfo
- Publication number
- TWI450642B TWI450642B TW097137608A TW97137608A TWI450642B TW I450642 B TWI450642 B TW I450642B TW 097137608 A TW097137608 A TW 097137608A TW 97137608 A TW97137608 A TW 97137608A TW I450642 B TWI450642 B TW I450642B
- Authority
- TW
- Taiwan
- Prior art keywords
- sheet
- protection device
- holes
- hole
- circuit protection
- Prior art date
Links
- 239000000463 material Substances 0.000 claims description 40
- 230000003071 parasitic effect Effects 0.000 claims description 23
- 239000004020 conductor Substances 0.000 claims description 19
- 239000000203 mixture Substances 0.000 claims description 14
- 239000000696 magnetic material Substances 0.000 claims description 9
- 229910052763 palladium Inorganic materials 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 229910010293 ceramic material Inorganic materials 0.000 claims description 6
- 229910052804 chromium Inorganic materials 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 239000011368 organic material Substances 0.000 claims description 5
- 229910052697 platinum Inorganic materials 0.000 claims description 5
- 229910052721 tungsten Inorganic materials 0.000 claims description 5
- 230000004048 modification Effects 0.000 description 38
- 238000012986 modification Methods 0.000 description 38
- 238000010030 laminating Methods 0.000 description 12
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- 239000004372 Polyvinyl alcohol Substances 0.000 description 6
- 239000002131 composite material Substances 0.000 description 6
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 6
- 229920002451 polyvinyl alcohol Polymers 0.000 description 6
- 238000007650 screen-printing Methods 0.000 description 6
- 238000000576 coating method Methods 0.000 description 5
- 230000008020 evaporation Effects 0.000 description 5
- 238000001704 evaporation Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 229910000859 α-Fe Inorganic materials 0.000 description 4
- 229910018605 Ni—Zn Inorganic materials 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229910007565 Zn—Cu Inorganic materials 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 229910052789 astatine Inorganic materials 0.000 description 2
- 238000000498 ball milling Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Landscapes
- Power Engineering (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Coils Or Transformers For Communication (AREA)
- Filters And Equalizers (AREA)
- Emergency Protection Circuit Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070098846A KR100920220B1 (ko) | 2007-10-01 | 2007-10-01 | 회로 보호 소자 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200934305A TW200934305A (en) | 2009-08-01 |
TWI450642B true TWI450642B (zh) | 2014-08-21 |
Family
ID=40526808
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097137608A TWI450642B (zh) | 2007-10-01 | 2008-09-30 | 電路保護裝置 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR100920220B1 (ko) |
TW (1) | TWI450642B (ko) |
WO (1) | WO2009045008A2 (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010007443A1 (de) * | 2010-02-10 | 2011-08-11 | Epcos Ag, 81669 | Keramisches Vielschichtbauelement |
CN103077937B (zh) * | 2012-12-30 | 2015-06-03 | 深圳中科系统集成技术有限公司 | 单路静电释放保护器件的加工方法 |
KR101825695B1 (ko) | 2016-05-16 | 2018-02-05 | 주식회사 모다이노칩 | 회로 보호 소자 |
KR101825696B1 (ko) * | 2016-07-01 | 2018-02-05 | 주식회사 모다이노칩 | 칩 부품 및 그 제조 방법 |
KR102537426B1 (ko) * | 2019-10-11 | 2023-05-26 | 주식회사 아모텍 | 적층형 공통 모드 필터 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5570010A (en) * | 1992-05-20 | 1996-10-29 | The Furukawa Electric Co., Ltd. | Method and apparatus for identifying objects using compound signal and a detector employing an electrical static coupling technique |
US5990417A (en) * | 1993-06-07 | 1999-11-23 | Nippon Telegraph And Telephone Corporation | Electromagnetic noise absorbing material and electromagnetic noise filter |
US20010015676A1 (en) * | 2000-02-21 | 2001-08-23 | Kumiko Takikawa | Wireless communication system |
TW200515841A (en) * | 2003-10-31 | 2005-05-01 | Tokyo Electron Ltd | Electrostatic chuck, plasma processing apparatus, and plasma processing method |
TWM279030U (en) * | 2005-06-23 | 2005-10-21 | Walsin Technology Corp | A micro common-mode signal filter capable of protection against static electricity |
TWM284140U (en) * | 2005-05-11 | 2005-12-21 | Mag Layers Scient Technics Co | Filter of a chip having a shield used to avoid electromagnetic interference and static charge |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2584469Y2 (ja) * | 1991-07-08 | 1998-11-05 | 株式会社村田製作所 | バリスタ機能付のノイズフィルタ |
JP2767014B2 (ja) * | 1992-04-22 | 1998-06-18 | 株式会社村田製作所 | ノイズフィルタ |
JP3204085B2 (ja) * | 1996-04-24 | 2001-09-04 | 株式会社村田製作所 | 積層型ノイズフィルタ |
JP4736526B2 (ja) | 2005-05-11 | 2011-07-27 | パナソニック株式会社 | コモンモードノイズフィルタ |
-
2007
- 2007-10-01 KR KR1020070098846A patent/KR100920220B1/ko active IP Right Grant
-
2008
- 2008-09-16 WO PCT/KR2008/005456 patent/WO2009045008A2/en active Application Filing
- 2008-09-30 TW TW097137608A patent/TWI450642B/zh active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5570010A (en) * | 1992-05-20 | 1996-10-29 | The Furukawa Electric Co., Ltd. | Method and apparatus for identifying objects using compound signal and a detector employing an electrical static coupling technique |
US5990417A (en) * | 1993-06-07 | 1999-11-23 | Nippon Telegraph And Telephone Corporation | Electromagnetic noise absorbing material and electromagnetic noise filter |
US20010015676A1 (en) * | 2000-02-21 | 2001-08-23 | Kumiko Takikawa | Wireless communication system |
TW200515841A (en) * | 2003-10-31 | 2005-05-01 | Tokyo Electron Ltd | Electrostatic chuck, plasma processing apparatus, and plasma processing method |
TWM284140U (en) * | 2005-05-11 | 2005-12-21 | Mag Layers Scient Technics Co | Filter of a chip having a shield used to avoid electromagnetic interference and static charge |
TWM279030U (en) * | 2005-06-23 | 2005-10-21 | Walsin Technology Corp | A micro common-mode signal filter capable of protection against static electricity |
Also Published As
Publication number | Publication date |
---|---|
KR100920220B1 (ko) | 2009-10-05 |
WO2009045008A2 (en) | 2009-04-09 |
KR20090033690A (ko) | 2009-04-06 |
WO2009045008A3 (en) | 2009-05-22 |
TW200934305A (en) | 2009-08-01 |
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