TWI450642B - Circuit protection device - Google Patents
Circuit protection device Download PDFInfo
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- TWI450642B TWI450642B TW097137608A TW97137608A TWI450642B TW I450642 B TWI450642 B TW I450642B TW 097137608 A TW097137608 A TW 097137608A TW 97137608 A TW97137608 A TW 97137608A TW I450642 B TWI450642 B TW I450642B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- Filters And Equalizers (AREA)
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Description
本發明是關於一種電路保護裝置,且更明確而言,是關於一種藉由層壓共同模式雜訊濾波器(common mode noise filter)及靜電放電(electro static discharge)(在下文中,稱為“ESD”)保護裝置疊層而形成為一個複合裝置的電路保護裝置。 BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a circuit protection device and, more particularly, to a common mode noise filter and an electrostatic static discharge (hereinafter, referred to as "ESD"). The protective device is laminated to form a circuit protection device of a composite device.
近來,諸如行動電話、家用電器、PC、PDA、LCD及導航儀之電子裝置已逐漸數位化且以較高速度操作。此類電子裝置對來自外界之刺激敏感,當較小的異常電壓及高頻雜訊自外界引入所述電子裝置之內部電路時,所述電子裝置之電路可能被損壞,或信號失真。 Recently, electronic devices such as mobile phones, home appliances, PCs, PDAs, LCDs, and navigators have gradually digitized and operated at higher speeds. Such electronic devices are sensitive to external stimuli, and when small abnormal voltages and high frequency noise are introduced from the outside into the internal circuits of the electronic device, the circuits of the electronic devices may be damaged or the signals may be distorted.
電路中所產生之切換電壓、電源電壓中所含有之功率雜訊、不必要的電磁信號、電磁雜訊及類似物導致此類異常電壓及雜訊。濾波器用於防止此類異常電壓及高頻雜訊被引入電路中的構件。 The switching voltage generated in the circuit, the power noise contained in the power supply voltage, unnecessary electromagnetic signals, electromagnetic noise, and the like cause such abnormal voltage and noise. Filters are used to prevent such abnormal voltages and high frequency noise from being introduced into the components of the circuit.
在一般差分信號傳輸系統中,除用於消除共同模式雜訊之共同模式雜訊濾波器之外,諸如二極體及變阻器之被動元件,應單獨地用於防止可能在輸入/輸出端子處產生之ESD。若在輸入/輸出端子處使用單獨的被動元件來解決ESD,則安裝面積變寬,製造成本增加,且產生信號失真或類似問題。 In general differential signaling systems, passive components such as diodes and varistors should be used separately to prevent possible generation at the input/output terminals, in addition to common mode noise filters for eliminating common mode noise. ESD. If a separate passive component is used at the input/output terminal to solve the ESD, the mounting area is widened, the manufacturing cost is increased, and signal distortion or the like is generated.
舉例而言,為了使用變阻器來防止ESD,將變阻器之 一端連接至輸入/輸出端子,且將變阻器之另一端連接至接地端子,從而保護電子裝置中之電子組件。然而,在電子裝置之正常操作狀態下,所述變阻器充當電容器,瞬變電壓並不施加至所述電容器。由於電容器之電容在較高頻率下改變,因此當在高頻或高速數據輸入/輸出端子或類似物處使用變阻器時,可能產生信號失真或類似問題。 For example, in order to use a varistor to prevent ESD, the varistor One end is connected to the input/output terminal, and the other end of the varistor is connected to the ground terminal to protect the electronic components in the electronic device. However, in the normal operating state of the electronic device, the varistor acts as a capacitor and a transient voltage is not applied to the capacitor. Since the capacitance of the capacitor changes at a higher frequency, when a varistor is used at a high frequency or high speed data input/output terminal or the like, signal distortion or the like may occur.
另外,藉由層壓共同模式雜訊濾波器及變阻器來製造一個矩形六面體組件。在此情況下,連接至共同模式雜訊濾波器之外部電極,形成於矩形六面體組件之第一側表面及與之相對的第二側表面上。另外,連接至變阻器之外部電極,形成於矩形六面體組件之第三側表面及與之相對的第四側表面上,從而連接至接地端子。然而,由於連接至變阻器之外部電極,形成於矩形六面體組件之側表面上,因此在共同模式雜訊濾波器及外部電極之間,產生1微微法拉或更大的寄生電容。穿過共同模式雜訊濾波器而傳輸之信號,可能由於所述寄生電容之緣故而失真。 In addition, a rectangular hexahedron assembly is fabricated by laminating a common mode noise filter and a varistor. In this case, an external electrode connected to the common mode noise filter is formed on the first side surface of the rectangular hexahedron assembly and the second side surface opposite thereto. Further, an external electrode connected to the varistor is formed on the third side surface of the rectangular hexahedron assembly and the fourth side surface opposite thereto to be connected to the ground terminal. However, since the external electrode connected to the varistor is formed on the side surface of the rectangular hexahedral component, a parasitic capacitance of 1 picofarad or larger is generated between the common mode noise filter and the external electrode. Signals transmitted through a common mode noise filter may be distorted due to the parasitic capacitance.
本發明之目的在於提供一種電路保護裝置,其中將共同模式雜訊濾波器及ESD保護裝置實施為一個複合裝置。 It is an object of the present invention to provide a circuit protection device in which a common mode noise filter and an ESD protection device are implemented as a composite device.
本發明之另一目的在於提供一種藉由層壓且壓縮共同模式雜訊濾波器及ESD保護裝置而實施為一個複合裝置的電路保護裝置,所述ESD保護裝置藉由在絕緣薄片上形成預定孔且用ESD保護材料填充所述孔而形成。 Another object of the present invention is to provide a circuit protection device implemented as a composite device by laminating and compressing a common mode noise filter and an ESD protection device, the ESD protection device forming a predetermined hole on the insulating sheet And the hole is formed by filling the hole with an ESD protection material.
本發明之又一目的在於提供一種電路保護裝置,其中連接至ESD保護裝置之外部電極形成於複合裝置之底部表面上,以連接至接地端子,從而減少寄生電容。 It is still another object of the present invention to provide a circuit protection device in which an external electrode connected to an ESD protection device is formed on a bottom surface of the composite device to be connected to a ground terminal, thereby reducing parasitic capacitance.
根據本發明之一態樣,提供一種電路保護裝置,其包含:層壓有共同模式雜訊濾波器及ESD保護裝置的層壓製品;第一外部電極及第二外部電極,其分別形成於所述層壓製品之一個側表面及另一個側表面上;以及第三外部電極,其形成於所述層壓製品之頂部表面或底部表面上。 According to an aspect of the present invention, there is provided a circuit protection device comprising: a laminate laminated with a common mode noise filter and an ESD protection device; a first external electrode and a second external electrode, respectively formed in the One side surface and the other side surface of the laminate; and a third outer electrode formed on the top or bottom surface of the laminate.
所述共同模式雜訊濾波器可包含多個薄片,選擇性地在所述多個薄片上形成暴露於外側的內部電極,線圈圖案以及填充有導電材料之孔。 The common mode noise filter may include a plurality of sheets, selectively forming internal electrodes exposed to the outside, coil patterns, and holes filled with a conductive material on the plurality of sheets.
可選擇性地進一步在所述多個薄片之每一者上形成填充有磁性材料之孔。 A hole filled with a magnetic material may be selectively formed on each of the plurality of sheets.
所述電路保護裝置可更包含形成於共同模式雜訊濾波器上及共同模式雜訊濾波器與ESD保護裝置之間的至少一個磁性薄片。 The circuit protection device may further include at least one magnetic sheet formed on the common mode noise filter and between the common mode noise filter and the ESD protection device.
ESD保護裝置可包含多個薄片,選擇性地在所述多個薄片上形成暴露於外側之內部電極、填充有導電材料之孔以及填充有ESD保護材料之孔。 The ESD protection device may include a plurality of sheets, selectively forming internal electrodes exposed to the outside, holes filled with a conductive material, and holes filled with an ESD protection material on the plurality of sheets.
ESD保護材料可由混合物形成,所述混合物為,有機材料與選自RuO2、Pt、Pd、Ag、Au、Ni、Cr及W之至少一種導電材料混合。 The ESD protective material may be formed of a mixture in which the organic material is mixed with at least one electrically conductive material selected from the group consisting of RuO 2 , Pt, Pd, Ag, Au, Ni, Cr, and W.
可藉由變阻器材料或絕緣陶瓷材料與所述混合物混合 來獲得ESD保護材料。 Mixed with the mixture by a varistor material or an insulating ceramic material To get ESD protection materials.
第一外部電極可連接至共同模式雜訊濾波器及ESD保護裝置,第二外部電極可連接至共同模式雜訊濾波器,且第三外部電極可連接至ESD保護裝置。 The first external electrode can be connected to the common mode noise filter and the ESD protection device, the second external electrode can be connected to the common mode noise filter, and the third external electrode can be connected to the ESD protection device.
第一外部電極及第二外部電極可連接至輸入/輸出端子及電路,且第三外部電極可連接至接地端子。 The first external electrode and the second external electrode may be connected to the input/output terminal and the circuit, and the third external electrode may be connected to the ground terminal.
第一外部電極可連接至在共同模式雜訊濾波器之一側處暴露的內部電極以及ESD保護裝置的內部電極,且第二外部電極可連接至在共同模式雜訊濾波器之另一側暴露的內部電極。 The first external electrode may be connected to the internal electrode exposed at one side of the common mode noise filter and the internal electrode of the ESD protection device, and the second external electrode may be connected to be exposed on the other side of the common mode noise filter Internal electrode.
第三外部電極可連接至ESD保護裝置的孔,其中所述孔填充有導電材料。 The third outer electrode can be connected to a hole of the ESD protection device, wherein the hole is filled with a conductive material.
ESD保護裝置可包含:第一薄片,所述第一薄片具有填充有ESD保護材料的多個第一孔,以及連接至所述第一孔且暴露於其外側的多個第一內部電極;第二薄片,其具有填充有導電材料的多個孔,以及連接至所述多個孔以及所述第一薄片的孔的多個內部電極;第三薄片,其具有形成於對應於第二薄片之多個孔的位置處的多個孔,其中所述孔填充有導電材料;以及第四薄片,其具有形成於對應於第三薄片之多個孔的位置處的第三外部電極,其中藉由用導電材料填充孔來形成所述第三外部電極。 The ESD protection device may include: a first sheet having a plurality of first holes filled with an ESD protection material, and a plurality of first internal electrodes connected to the first holes and exposed to an outer side thereof; a second sheet having a plurality of holes filled with a conductive material, and a plurality of internal electrodes connected to the plurality of holes and the holes of the first sheet; and a third sheet having a shape corresponding to the second sheet a plurality of holes at positions of the plurality of holes, wherein the holes are filled with a conductive material; and a fourth sheet having a third external electrode formed at a position corresponding to the plurality of holes of the third sheet, wherein The third external electrode is formed by filling a hole with a conductive material.
第一薄片可更包含:經形成與多個第一孔間隔開的多個第二孔,其中所述第二孔填充有ESD保護材料;以及多個第二內部電極,其連接至多個第二孔,且暴露於其另一 外側。 The first sheet may further include: forming a plurality of second holes spaced apart from the plurality of first holes, wherein the second holes are filled with an ESD protection material; and a plurality of second internal electrodes connected to the plurality of second Hole and exposed to the other Outside.
第四薄片可為磁性薄片。 The fourth sheet may be a magnetic sheet.
第三外部電極可包含一或多個第三外部電極。 The third external electrode may include one or more third external electrodes.
共同模式雜訊濾波器與ESD保護裝置之間的寄生電容可低於1微微法拉。 The parasitic capacitance between the common mode noise filter and the ESD protection device can be less than 1 picofarad.
根據本發明,藉由共同模式雜訊濾波器及ESD保護裝置疊層來將電路保護裝置形成為一個裝置,且將所述電路保護裝置安置於電子裝置之電路與電子裝置之輸入/輸出端子之間,使得可使用單晶片裝置來同時防止電子裝置之共同模式雜訊及ESD。因此,與使用離散裝置來防止共同模式雜訊及ESD之習知技術相比,以具有緊密組態之單晶片形式製造所述電路保護裝置,使得可防止電子裝置之尺寸增加,安裝面積可顯著減小,且可藉由使用低容量ESD保護裝置來防止輸入/輸出信號失真,從而增強電子裝置之可靠性。 According to the present invention, the circuit protection device is formed as a device by a common mode noise filter and an ESD protection device stack, and the circuit protection device is disposed at an input/output terminal of the circuit and the electronic device of the electronic device. In the meantime, a single-chip device can be used to simultaneously prevent common mode noise and ESD of the electronic device. Therefore, the circuit protection device is manufactured in a single-wafer form with a tight configuration compared to the conventional technique of using a discrete device to prevent common mode noise and ESD, so that the size of the electronic device can be prevented from increasing, and the installation area can be remarkable. It is reduced, and the reliability of the electronic device can be enhanced by using a low-capacity ESD protection device to prevent input/output signal distortion.
另外,連接至ESD保護裝置之外部電極形成於複合裝置之底部表面上,以加長共同模式雜訊濾波器與ESD保護裝置之間的距離,從而減小寄生電容。因此,可防止信號之失真,從而增強可靠性。 In addition, an external electrode connected to the ESD protection device is formed on the bottom surface of the composite device to lengthen the distance between the common mode noise filter and the ESD protection device, thereby reducing parasitic capacitance. Therefore, distortion of the signal can be prevented, thereby enhancing reliability.
為讓本發明之上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 The above described features and advantages of the present invention will be more apparent from the following description.
在下文中,將參看附圖來詳細描述本發明之例示性實 施例。然而,本發明並非侷限於下文所揭露之實施例,而是可實施為不同形式。僅出於說明性目的且供熟習此項技術者全面理解本發明之範疇而提供此等實施例。在圖式中,為了清楚起見而誇示層及區域之厚度,且在說明書及圖式中,始終使用相同參考標號來表示相同元件。另外,將諸如層、區域、基板或板之元件置放於另一元件上或上方的表達方式不僅指直接將所述元件置放於所述另一元件上或上方之情況,而且指所述元件與所述另一元件之間插入有又一元件的情況。 Hereinafter, an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings. Example. However, the invention is not limited to the embodiments disclosed below, but may be embodied in different forms. These embodiments are provided for illustrative purposes only and are intended to provide a comprehensive understanding of the scope of the invention. In the drawings, the thickness of layers and regions are inferred, and the same reference numerals are used throughout the description and the drawings. In addition, the expression of an element such as a layer, region, substrate, or plate placed on or over another element refers not only to the case where the element is placed directly on or over the other element, but also A further element is inserted between the element and the other element.
圖1為繪示根據本發明之電路保護裝置的組裝狀態的俯視透視圖,圖2為繪示所述電路保護裝置之組裝狀態的仰視透視圖,圖3為所述電路保護裝置之分解透視圖,且圖4為所述電路保護裝置之等效電路圖。 1 is a top perspective view showing an assembled state of a circuit protection device according to the present invention, FIG. 2 is a bottom perspective view showing an assembled state of the circuit protection device, and FIG. 3 is an exploded perspective view of the circuit protection device. And FIG. 4 is an equivalent circuit diagram of the circuit protection device.
參看圖1、圖2及圖3,根據本發明一個實施例之電路保護裝置10包括,共同模式雜訊濾波器100及ESD保護裝置200,其藉由層壓多個薄片而組成。電路保護裝置10更包括裝設於共同模式雜訊濾波器100之頂部上的上覆蓋層300。電路保護裝置10可更包括:多個第一外部電極500(510、520、530及540),其形成於電路保護裝置10的一側,以連接至共同模式雜訊濾波器100之一側處的內部電極以及ESD保護裝置200的內部電極;多個第二外部電極600(610、620、630及640),其形成於電路保護裝置10之另一側,以連接至共同模式雜訊濾波器100之另一側處的內部電極;以及多個第三外部電極700(710、720、730 及740),其經形成於以暴露於電路保護裝置10之底部表面。此處,第三外部電極700可作為ESD保護裝置200之部分而形成。 Referring to Figures 1, 2 and 3, a circuit protection device 10 according to an embodiment of the present invention includes a common mode noise filter 100 and an ESD protection device 200 which are constructed by laminating a plurality of sheets. The circuit protection device 10 further includes an upper cover layer 300 mounted on top of the common mode noise filter 100. The circuit protection device 10 may further include: a plurality of first external electrodes 500 (510, 520, 530, and 540) formed on one side of the circuit protection device 10 to be connected to one side of the common mode noise filter 100 Internal electrodes and internal electrodes of the ESD protection device 200; a plurality of second external electrodes 600 (610, 620, 630, and 640) formed on the other side of the circuit protection device 10 to be connected to the common mode noise filter An internal electrode at the other side of 100; and a plurality of third external electrodes 700 (710, 720, 730) And 740) formed to be exposed to a bottom surface of the circuit protection device 10. Here, the third external electrode 700 may be formed as part of the ESD protection device 200.
共同模式雜訊濾波器100藉由層壓多個薄片110、120、130、140、150、160、170及180而組成,在所述薄片上,選擇性地形成內部電極、線圈圖案及孔。所述多個薄片110、120、130、140、150、160、170及180以矩形形狀形成,例如具有兩個長邊及兩個短邊。可在上覆蓋層300與第一薄片110之間提供第一絕緣薄片410及第一磁性薄片420;可在第四薄片140與第五薄片150之間提供第二磁性薄片430、第二絕緣薄片440及第三磁性薄片450;且可在第八薄片180下提供第四磁性薄片460。 The common mode noise filter 100 is composed by laminating a plurality of sheets 110, 120, 130, 140, 150, 160, 170, and 180 on which internal electrodes, coil patterns, and holes are selectively formed. The plurality of sheets 110, 120, 130, 140, 150, 160, 170, and 180 are formed in a rectangular shape, for example, having two long sides and two short sides. A first insulating sheet 410 and a first magnetic sheet 420 may be provided between the upper cover layer 300 and the first sheet 110; a second magnetic sheet 430 and a second insulating sheet may be provided between the fourth sheet 140 and the fifth sheet 150. 440 and a third magnetic sheet 450; and a fourth magnetic sheet 460 may be provided under the eighth sheet 180.
孔111及內部電極112形成於第一薄片110之頂部表面上。孔111形成於第一薄片110的中心附近。舉例而言,孔111形成於中心線上,將所述中心線界定為平行於長邊而連接相對的短邊之中心的假想線。而且,孔111形成於所述中心線上以與第一薄片110之第一短邊間隔開預定距離。舉例而言,孔111形成於中心線上自第一薄片110之第一短邊開始五分之一點處。另外,內部電極112經形成以自孔111延伸,以在第一薄片110之第一長邊的預定位置處暴露。舉例而言,內部電極112經形成以在第一長邊上自第一薄片110之第一短邊至第二短邊之八分之一點處暴露。 The hole 111 and the internal electrode 112 are formed on the top surface of the first sheet 110. The hole 111 is formed near the center of the first sheet 110. For example, the aperture 111 is formed on a centerline that defines the imaginary line that is parallel to the long side and connects the centers of the opposite short sides. Moreover, a hole 111 is formed on the center line to be spaced apart from the first short side of the first sheet 110 by a predetermined distance. For example, the hole 111 is formed on the center line at a point one-fifth from the first short side of the first sheet 110. In addition, the internal electrode 112 is formed to extend from the hole 111 to be exposed at a predetermined position of the first long side of the first sheet 110. For example, the inner electrode 112 is formed to be exposed on the first long side from the first short side of the first sheet 110 to one eighth of the second short side.
內部電極122及線圈圖案123形成於第二薄片120之 頂部表面上。內部電極122經形成以在與第一薄片110之內部電極112暴露處的第一薄片110之第一長邊相對的第二薄片120之第二長邊處暴露。舉例而言,內部電極122經形成以在第二長邊上自第一薄片120之第一短邊至第二短邊的八分之一點處暴露。意即,第二薄片120上之內部電極122相對於第一薄片110上之內部電極112而形成。線圈圖案123連接至內部電極122,且以螺旋形形狀形成以向上延伸至對應於第一薄片110之孔111的位置。第二薄片120之線圈圖案123通過第一薄片110之孔111連接至第一薄片110之內部電極112。因此,第一薄片110之內部電極112通過第一薄片110之孔111連接至第二薄片120之線圈圖案123及內部電極122。 The internal electrode 122 and the coil pattern 123 are formed on the second sheet 120 On the top surface. The inner electrode 122 is formed to be exposed at a second long side of the second sheet 120 opposite the first long side of the first sheet 110 where the inner electrode 112 of the first sheet 110 is exposed. For example, the inner electrode 122 is formed to be exposed on the second long side from the first short side of the first sheet 120 to an eighth point of the second short side. That is, the internal electrode 122 on the second sheet 120 is formed with respect to the internal electrode 112 on the first sheet 110. The coil pattern 123 is connected to the internal electrode 122, and is formed in a spiral shape to extend upward to a position corresponding to the hole 111 of the first sheet 110. The coil pattern 123 of the second sheet 120 is connected to the internal electrode 112 of the first sheet 110 through the hole 111 of the first sheet 110. Therefore, the internal electrode 112 of the first sheet 110 is connected to the coil pattern 123 and the internal electrode 122 of the second sheet 120 through the hole 111 of the first sheet 110.
內部電極132及線圈圖案133形成於第三薄片130之底部表面上。內部電極132經形成以在對應於上面形成有第二薄片120之內部電極122的第二長邊的第二長邊處暴露。舉例而言,內部電極132經形成以在第二長邊上自第三薄片130之第一短邊至第二短邊之八分之三點處暴露。線圈圖案133連接至內部電極132,且以螺旋形形狀形成以向上延伸至對應於第一薄片110之孔111的位置。 The internal electrode 132 and the coil pattern 133 are formed on the bottom surface of the third sheet 130. The internal electrode 132 is formed to be exposed at a second long side corresponding to the second long side of the internal electrode 122 on which the second sheet 120 is formed. For example, the inner electrode 132 is formed to be exposed on the second long side from the first short side of the third sheet 130 to three-eighths of the second short side. The coil pattern 133 is connected to the internal electrode 132, and is formed in a spiral shape to extend upward to a position corresponding to the hole 111 of the first sheet 110.
孔141及內部電極142形成於第四薄片140的底部表面上。孔141形成於對應於第一薄片110之孔111的區域處。意即,孔141形成於中心線上,將所述中心線界定為平行於長邊而連接相對的短邊的中心的線。舉例而言,孔141形成於中心線上自第一薄片140之第一短邊開始五分 之一點處。內部電極142經形成以自孔141延伸,以在第四薄片140之第一長邊的預定位置處暴露。舉例而言,內部電極142經形成以在第一長邊上自第四薄片140之第一短邊至第二短邊之八分之三點處暴露。意即,第四薄片140之內部電極142與對應於第三薄片130之內部電極132的位置相對而形成於第四薄片140的第一長邊上。第三薄片130之線圈圖案133通過第四薄片140之孔141連接至第四薄片140的內部電極142。因此,第四薄片140之內部電極142通過第四薄片140之孔141連接至第三薄片130之線圈圖案133及內部電極132。 The hole 141 and the inner electrode 142 are formed on the bottom surface of the fourth sheet 140. A hole 141 is formed at a region corresponding to the hole 111 of the first sheet 110. That is, the hole 141 is formed on the center line, which is defined as a line parallel to the long side and connecting the centers of the opposite short sides. For example, the hole 141 is formed on the center line and starts from the first short side of the first sheet 140. One point. The inner electrode 142 is formed to extend from the hole 141 to be exposed at a predetermined position of the first long side of the fourth sheet 140. For example, the inner electrode 142 is formed to be exposed on the first long side from the first short side of the fourth sheet 140 to three-eighths of the second short side. That is, the inner electrode 142 of the fourth sheet 140 is formed on the first long side of the fourth sheet 140 opposite to the position corresponding to the inner electrode 132 of the third sheet 130. The coil pattern 133 of the third sheet 130 is connected to the internal electrode 142 of the fourth sheet 140 through the hole 141 of the fourth sheet 140. Therefore, the internal electrode 142 of the fourth sheet 140 is connected to the coil pattern 133 and the internal electrode 132 of the third sheet 130 through the hole 141 of the fourth sheet 140.
孔151及內部電極152形成於第五薄片150的頂部表面上。孔151形成於第五薄片150的中心附近。舉例而言,孔151形成於中心線上,將中心線界定為平行於長邊而連接相對的短邊的中心的假想線。而且,孔151形成於中心線上,以與第五薄片150之第二短邊間隔開預定距離。舉例而言,孔151形成於中心線上自第一薄片150之第二短邊開始五分之一點處。另外,內部電極152經形成以自孔151延伸,以在第五薄片150之第二長邊的預定位置處暴露。舉例而言,內部電極152經形成以在第二長邊上自第五薄片150之第二短邊至第一短邊之八分之一點處暴露。 A hole 151 and an internal electrode 152 are formed on the top surface of the fifth sheet 150. A hole 151 is formed near the center of the fifth sheet 150. For example, the aperture 151 is formed on the centerline, defining the centerline as an imaginary line that is parallel to the long side and connects the centers of the opposing short sides. Moreover, a hole 151 is formed on the center line to be spaced apart from the second short side of the fifth sheet 150 by a predetermined distance. For example, the aperture 151 is formed on the centerline at a one-fifth point from the second short side of the first sheet 150. In addition, the internal electrode 152 is formed to extend from the hole 151 to be exposed at a predetermined position of the second long side of the fifth sheet 150. For example, the inner electrode 152 is formed to be exposed on the second long side from the second short side of the fifth sheet 150 to one eighth of the first short side.
內部電極162及線圈圖案163形成於第六薄片160之頂部表面上。內部電極162經形成以在與第五薄片150之內部電極152暴露處的第五薄片150之第一長邊相對的第六薄片160之第一長邊處暴露。舉例而言,內部電極162 經形成以在第一長邊上自第六薄片160之第二短邊至第一短邊之八分之一點處暴露。意即,第六薄片160上之內部電極162相對於第五薄片150上之內部電極152而形成。線圈圖案163連接至內部電極162,且以螺旋形形狀形成以向上延伸至對應於第五薄片150之孔151的位置。第六薄片160之線圈圖案163穿過第五薄片150之孔151連接至第五薄片150之內部電極152。因此,第五薄片150之內部電極152穿過第五薄片150之孔151連接至第六薄片160之線圈圖案163及內部電極162。 The inner electrode 162 and the coil pattern 163 are formed on the top surface of the sixth sheet 160. The inner electrode 162 is formed to be exposed at a first long side of the sixth sheet 160 opposite to the first long side of the fifth sheet 150 where the inner electrode 152 of the fifth sheet 150 is exposed. For example, internal electrode 162 It is formed to be exposed on the first long side from the second short side of the sixth sheet 160 to one eighth of the first short side. That is, the internal electrode 162 on the sixth sheet 160 is formed with respect to the internal electrode 152 on the fifth sheet 150. The coil pattern 163 is connected to the internal electrode 162, and is formed in a spiral shape to extend upward to a position corresponding to the hole 151 of the fifth sheet 150. The coil pattern 163 of the sixth sheet 160 is connected to the internal electrode 152 of the fifth sheet 150 through the hole 151 of the fifth sheet 150. Therefore, the internal electrode 152 of the fifth sheet 150 is connected to the coil pattern 163 and the internal electrode 162 of the sixth sheet 160 through the hole 151 of the fifth sheet 150.
內部電極172及線圈圖案173形成於第七薄片170之底部表面上。內部電極172經形成以在對應於上面形成有第六薄片160之內部電極162的第一長邊的第一長邊處暴露。舉例而言,內部電極172經形成以在第一長邊上自第七薄片170之第二短邊至第一短邊之八分之三點處暴露。線圈圖案173連接至內部電極172,且以螺旋形形狀形成以向上延伸至對應於第五薄片150之孔151的位置。 The internal electrode 172 and the coil pattern 173 are formed on the bottom surface of the seventh sheet 170. The internal electrode 172 is formed to be exposed at a first long side corresponding to the first long side of the internal electrode 162 on which the sixth sheet 160 is formed. For example, the inner electrode 172 is formed to be exposed on the first long side from the second short side of the seventh sheet 170 to three-eighths of the first short side. The coil pattern 173 is connected to the internal electrode 172, and is formed in a spiral shape to extend upward to a position corresponding to the hole 151 of the fifth sheet 150.
孔181及內部電極182形成於第八薄片180的底部表面上。孔181形成於對應於第五薄片150之孔151的區域處。意即,孔181形成於中心線上,將所述中心線界定為平行於長邊而連接相對的短邊的中心的線。舉例而言,孔181形成於中心線上自第八薄片180之第二短邊開始之五分之一點處。內部電極182經形成以自孔181延伸,以在第八薄片180之第二長邊的預定位置處暴露。舉例而言,內部電極182經形成以在第二長邊上自第八薄片180之第 二短邊至第一短邊之八分之三點處暴露。意即,第八薄片180之內部電極182與對應於第七薄片170之內部電極172的位置相對而形成於第八薄片180的第二長邊上。第七薄片170之線圈圖案173穿過第八薄片180之孔181連接至第八薄片180的內部電極182。因此,第八薄片180之內部電極182穿過第八薄片180之孔181連接至第七薄片170之線圈圖案173及內部電極172。 A hole 181 and an internal electrode 182 are formed on the bottom surface of the eighth sheet 180. A hole 181 is formed at a region corresponding to the hole 151 of the fifth sheet 150. That is, the hole 181 is formed on the center line, which is defined as a line parallel to the long side and connecting the centers of the opposite short sides. For example, the aperture 181 is formed on the centerline at a fifth of the point from the second short side of the eighth sheet 180. The inner electrode 182 is formed to extend from the hole 181 to be exposed at a predetermined position of the second long side of the eighth sheet 180. For example, the inner electrode 182 is formed to be on the second long side from the eighth sheet 180 The short side is exposed to three-eighths of the first short side. That is, the inner electrode 182 of the eighth sheet 180 is formed on the second long side of the eighth sheet 180 opposite to the position corresponding to the inner electrode 172 of the seventh sheet 170. The coil pattern 173 of the seventh sheet 170 is connected to the internal electrode 182 of the eighth sheet 180 through the hole 181 of the eighth sheet 180. Therefore, the internal electrode 182 of the eighth sheet 180 is connected to the coil pattern 173 and the internal electrode 172 of the seventh sheet 170 through the hole 181 of the eighth sheet 180.
此處,孔111、141、151及181填充有導電膏。內部電極112、122、132、142、152、162、172及182以及線圈圖案123、133、163及173藉由網板印刷、濺鍍、蒸鍍或溶膠凝膠塗覆方法由導電膏形成。 Here, the holes 111, 141, 151, and 181 are filled with a conductive paste. The internal electrodes 112, 122, 132, 142, 152, 162, 172, and 182 and the coil patterns 123, 133, 163, and 173 are formed of a conductive paste by screen printing, sputtering, evaporation, or sol-gel coating methods.
設置於上覆蓋層300與第一薄片110之間的第一絕緣薄片410及第一磁性薄片420、設置於第四薄片140與第五薄片150之間的第二磁性薄片430、第二絕緣薄片440及第三磁性薄片450,以及設置於第八薄片180下之第四磁性薄片460中的每一者,可厚於選擇性地形成有孔、內部電極及線圈圖案的第一薄片至第四薄片110、120、130及140之厚度的總和,或第五薄片至第八薄片150、160、170及180之厚度的總和。 a first insulating sheet 410 and a first magnetic sheet 420 disposed between the upper cover layer 300 and the first sheet 110, and a second magnetic sheet 430 and a second insulating sheet disposed between the fourth sheet 140 and the fifth sheet 150 Each of the 440 and the third magnetic sheets 450 and the fourth magnetic sheets 460 disposed under the eighth sheet 180 may be thicker than the first sheet to the fourth layer selectively forming the holes, the internal electrodes, and the coil patterns The sum of the thicknesses of the sheets 110, 120, 130, and 140, or the sum of the thicknesses of the fifth to eighth sheets 150, 160, 170, and 180.
ESD保護裝置200藉由層壓上面選擇性地形成有內部電極及孔的第一薄片至第四薄片210、220、230及240來組成。 The ESD protection device 200 is composed by laminating the first to fourth sheets 210, 220, 230, and 240 on which the internal electrodes and the holes are selectively formed.
第一孔至第四孔211、212、213及214以及第一內部電極至第四內部電極215、216、217及218形成於第一薄 片210的頂部表面上。第一孔至第四孔211、212、213及214形成於第一薄片210的中心部分處,且彼此間隔開預定距離。第一孔至第四孔211、212、213及214經形成以具有幾微米(um)至幾百微米的寬度。舉例而言,第一孔至第四孔211、212、213及214分別形成於連接第一薄片210之相對短邊上的四分之一點的連線上的八分之一點、八分之三點、八分之五點及八分之七點處。第一內部電極至第四內部電極215、216、217及218經形成以在第一薄片210之第二長邊處暴露。第一內部電極至第四內部電極215、216、217及218以具有預定寬度之直線的形狀形成,以分別連接至第一孔至第四孔211、212、213及214。 The first to fourth holes 211, 212, 213, and 214 and the first to fourth internal electrodes 215, 216, 217, and 218 are formed in the first thin On the top surface of the sheet 210. The first to fourth holes 211, 212, 213, and 214 are formed at the central portion of the first sheet 210 and are spaced apart from each other by a predetermined distance. The first to fourth holes 211, 212, 213, and 214 are formed to have a width of several micrometers (um) to several hundred micrometers. For example, the first to fourth holes 211, 212, 213, and 214 are respectively formed at an eighth point, eight points on a line connecting the quarter points on the relatively short sides of the first sheet 210. Three points, five-eighths and seven-eighths. The first to fourth internal electrodes 215, 216, 217, and 218 are formed to be exposed at the second long side of the first sheet 210. The first to fourth inner electrodes 215, 216, 217, and 218 are formed in a shape having a straight line of a predetermined width to be connected to the first to fourth holes 211, 212, 213, and 214, respectively.
第一孔至第四孔221、222、223及224以及第一內部電極至第四內部電極225、226、227及228形成於第二薄片220的頂部表面上。第一孔至第四孔221、222、223及224分別形成於連接第二薄片220之相對短邊的中心的線上的八分之一點、八分之三點、八分之五點及八分之七點處。另外,第一內部電極至第四內部電極225、226、227及228經形成以與第二薄片220之第二長邊間隔開預定距離,以便不在第二薄片220之第二長邊處暴露。舉例而言,第一內部電極至第四內部電極225、226、227及228經形成以自對應於第一薄片210之第一孔至第四孔211、212、213及214的位置延伸,以分別連接至第一孔至第四孔221、222、223及224。此處,第一薄片210之第一孔至第四孔211、212、213及214與第二薄片220之第一孔至第 四孔221、222、223及224並非形成於相同的位置,而是經形成以彼此偏離。 The first to fourth holes 221, 222, 223, and 224 and the first to fourth internal electrodes 225, 226, 227, and 228 are formed on the top surface of the second sheet 220. The first to fourth holes 221, 222, 223, and 224 are respectively formed at one-eighth, three-eighth, five-eighth, and eight of the lines connecting the centers of the relatively short sides of the second sheet 220. At seven points. In addition, the first to fourth inner electrodes 225, 226, 227, and 228 are formed to be spaced apart from the second long side of the second sheet 220 by a predetermined distance so as not to be exposed at the second long side of the second sheet 220. For example, the first to fourth internal electrodes 225, 226, 227, and 228 are formed to extend from positions corresponding to the first to fourth holes 211, 212, 213, and 214 of the first sheet 210 to Connected to the first to fourth holes 221, 222, 223, and 224, respectively. Here, the first hole to the fourth hole 211, 212, 213 and 214 of the first sheet 210 and the first hole of the second sheet 220 to the first The four holes 221, 222, 223, and 224 are not formed at the same position, but are formed to be offset from each other.
第一孔至第四孔231、232、233及234形成於第三薄片230上。第一孔及第四孔231、232、233及234分別形成於對應於第二薄片220之第一孔至第四孔221、222、223及224的位置處。第一孔至第四孔231、232、233及234可經形成以具有相同尺寸。 The first to fourth holes 231, 232, 233, and 234 are formed on the third sheet 230. The first and fourth holes 231, 232, 233, and 234 are formed at positions corresponding to the first to fourth holes 221, 222, 223, and 224 of the second sheet 220, respectively. The first to fourth holes 231, 232, 233, and 234 may be formed to have the same size.
第一孔至第四孔241、242、243及244分別形成於第四薄片240上對應於第三薄片230之第一孔至第四孔231、232、233及234的位置處,以具有等於或大於第一孔至第四孔231、232、233及234之尺寸的尺寸。第一孔至第四孔241、242、243及244中的每一者填充有導電膏,其充當第三外部電極710、720、730及740以連接至接地端子。第四薄片240可經形成以厚於第一薄片至第三薄片210、220及230之厚度的總和。第四薄片240可由磁性材料形成。 The first to fourth holes 241, 242, 243, and 244 are respectively formed on the fourth sheet 240 at positions corresponding to the first to fourth holes 231, 232, 233, and 234 of the third sheet 230 to have equal Or a size larger than the size of the first to fourth holes 231, 232, 233, and 234. Each of the first to fourth holes 241, 242, 243, and 244 is filled with a conductive paste serving as the third external electrodes 710, 720, 730, and 740 to be connected to the ground terminal. The fourth sheet 240 may be formed to be thicker than the sum of the thicknesses of the first to third sheets 210, 220, and 230. The fourth sheet 240 may be formed of a magnetic material.
此處,第一薄片210之孔211、212、213及214填充有ESD保護材料。ESD保護材料可包含混合物,在所述混合物中,諸如聚乙烯醇(polyvinyl alcohol,PVA)或聚乙烯醇縮丁醛(polyvinyl butyral,PVB)的有機材料與RuO2、Pt、Pd、Ag、Au、Ni、Cr、W及類似物的至少一種導電材料混合。另外,可藉由進一步使諸如ZnO的變阻器材料或諸如Al2O3的絕緣陶瓷材料與所述混合物混合來獲得ESD保護材料。另外,第二薄片220之孔221、222、223及224、 第三薄片230之孔231、232、233及234以及第四薄片240之孔241、242、243及244填充有導電膏。第一薄片210之內部電極215、216、217及218以及第二薄片220之內部電極225、226、227及228,藉由網板印刷、濺鍍、蒸鍍或溶膠凝膠塗覆方法由導電膏形成。第一薄片210之第一內部電極至第四內部電極215、216、217及218,經形成以覆蓋填充有ESD保護材料的第一孔至第四孔211、212、213及214。 Here, the holes 211, 212, 213, and 214 of the first sheet 210 are filled with an ESD protection material. The ESD protective material may comprise a mixture in which an organic material such as polyvinyl alcohol (PVA) or polyvinyl butyral (PVB) is combined with RuO 2 , Pt, Pd, Ag, Au. At least one electrically conductive material of Ni, Cr, W, and the like is mixed. In addition, the ESD protection material can be obtained by further mixing a varistor material such as ZnO or an insulating ceramic material such as Al 2 O 3 with the mixture. Further, the holes 221, 222, 223, and 224 of the second sheet 220, the holes 231, 232, 233, and 234 of the third sheet 230, and the holes 241, 242, 243, and 244 of the fourth sheet 240 are filled with a conductive paste. The internal electrodes 215, 216, 217 and 218 of the first sheet 210 and the internal electrodes 225, 226, 227 and 228 of the second sheet 220 are electrically conductive by screen printing, sputtering, evaporation or sol-gel coating methods. The cream is formed. The first to fourth internal electrodes 215, 216, 217, and 218 of the first sheet 210 are formed to cover the first to fourth holes 211, 212, 213, and 214 filled with the ESD protection material.
如上文所述,在根據本發明之電路保護裝置的共同模式雜訊濾波器100中,磁性薄片420、430、440、450及460分別形成於第一薄片110上、第四薄片140與第五薄片150之間以及第八薄片180下,從而防止磁通量之洩漏。ESD保護裝置200之第三外部電極700形成於電路保護裝置10之底部表面上,以連接至暴露於電路保護裝置10之底部表面的內部電極,使得與ESD保護裝置之外部電極700形成於電路保護裝置10之側表面上的情況相比,可顯著減小寄生電容,從而增強可靠性。意即,隨著共同模式雜訊濾波器100之線圈圖案與ESD保護裝置200之外部電極之間的距離增加,寄生電容減小。在本發明中,與ESD保護裝置200之外部電極700自電路保護裝置10之一個側表面形成至另一側表面的情況相比,共同模式雜訊濾波器100之線圈圖案與ESD保護裝置200之外部電極之間的距離較長。因此,在所述電路保護裝置中,電容在使用較高頻率之輸入/輸出端子處不改變,或由電容變化導致之信號 失真不會發生。 As described above, in the common mode noise filter 100 of the circuit protection device according to the present invention, the magnetic sheets 420, 430, 440, 450, and 460 are formed on the first sheet 110, the fourth sheet 140, and the fifth, respectively. Between the sheets 150 and under the eighth sheet 180, leakage of magnetic flux is prevented. The third external electrode 700 of the ESD protection device 200 is formed on the bottom surface of the circuit protection device 10 to be connected to the internal electrode exposed to the bottom surface of the circuit protection device 10, so that the external electrode 700 of the ESD protection device is formed in the circuit protection. Compared to the case on the side surface of the device 10, the parasitic capacitance can be significantly reduced, thereby enhancing reliability. That is, as the distance between the coil pattern of the common mode noise filter 100 and the external electrodes of the ESD protection device 200 increases, the parasitic capacitance decreases. In the present invention, the coil pattern of the common mode noise filter 100 and the ESD protection device 200 are compared with the case where the external electrode 700 of the ESD protection device 200 is formed from one side surface of the circuit protection device 10 to the other side surface. The distance between the external electrodes is long. Therefore, in the circuit protection device, the capacitance does not change at the input/output terminal using the higher frequency, or the signal caused by the capacitance change Distortion does not occur.
如上文所述,在根據本發明實施例之實施為共同模式雜訊濾波器100與ESD保護裝置200之複合裝置的電路保護裝置10中,第一外部電極500及第二外部電極600連接至系統及雙通道輸入/輸出端子(其在電子裝置中使用),且第三外部電極700連接至接地端子,使得電路保護裝置可移除共同模式雜訊,且允許引入至輸入/輸出端子中的靜電流入接地端子中,如圖4之等效電路中所示。 As described above, in the circuit protection device 10 implemented as a composite device of the common mode noise filter 100 and the ESD protection device 200 according to an embodiment of the present invention, the first external electrode 500 and the second external electrode 600 are connected to the system. And a dual channel input/output terminal (which is used in an electronic device), and the third external electrode 700 is connected to the ground terminal, so that the circuit protection device can remove the common mode noise and allow static electricity introduced into the input/output terminal Flow into the ground terminal as shown in the equivalent circuit of Figure 4.
意即,共同模式雜訊濾波器100充當電感器以防止共同模式雜訊。若高於預定值之不合需要的電壓施加至電路保護裝置10的兩端,則在ESD保護材料之導電微粒之間產生放電,且電流流入接地端子中,從而減小對應的電路保護裝置10之兩端之間的電壓差。此時,由於電路保護裝置10之兩端並非彼此電連接,因此輸入信號無失真地按原樣傳輸至輸入/輸出端子。意即,即使在產生靜電時,亦藉由對應的保護電路裝置將對應的靜電放電至接地端子,使得電路保護裝置10保護所述電路,且允許系統所接收到及所傳輸的信號維持原樣。 That is, the common mode noise filter 100 acts as an inductor to prevent common mode noise. If an undesired voltage higher than a predetermined value is applied to both ends of the circuit protection device 10, a discharge is generated between the conductive particles of the ESD protection material, and a current flows into the ground terminal, thereby reducing the corresponding circuit protection device 10. The voltage difference between the two ends. At this time, since both ends of the circuit protection device 10 are not electrically connected to each other, the input signal is transmitted to the input/output terminal as it is without distortion. That is, even when static electricity is generated, the corresponding electrostatic discharge is discharged to the ground terminal by the corresponding protection circuit device, so that the circuit protection device 10 protects the circuit and allows the signal received and transmitted by the system to remain intact.
另外,可使用一個電路保護裝置來防止穿過許多通道輸入的共同模式雜訊及ESD(儘管通道之數目增加),使得電路保護裝置之數目可減小,且因此,電子裝置之尺寸可減小。 In addition, a circuit protection device can be used to prevent common mode noise and ESD input through many channels (although the number of channels is increased), so that the number of circuit protection devices can be reduced, and thus, the size of the electronic device can be reduced. .
此外,由於共同模式雜訊濾波器100與ESD保護裝置200之間的寄生電容可顯著減小,因此可防止穿過共同模 式雜訊濾波器100傳輸之信號的失真,從而增強可靠性。 In addition, since the parasitic capacitance between the common mode noise filter 100 and the ESD protection device 200 can be significantly reduced, it is prevented from passing through the common mode. The distortion of the signal transmitted by the noise filter 100 enhances reliability.
在下文中,將參看圖5描述根據本發明之實施例的製造藉由層壓共同模式雜訊濾波器及ESD保護裝置而形成之前述電路保護裝置的方法。 Hereinafter, a method of manufacturing the aforementioned circuit protection device formed by laminating a common mode noise filter and an ESD protection device according to an embodiment of the present invention will be described with reference to FIG.
S110:製備其中混合有非磁性材料的多個矩形薄片以及其中混合有磁性材料的多個矩形薄片。為了形成其中混合有非磁性材料之薄片,藉由使熱膨脹係數類似於肥粒鐵(ferrite)之熱膨脹係數的非磁性材料(包含基於B2O3-SiO2之玻璃、基於Al2O3-SiO2之玻璃及其它陶瓷材料)與包含Al2O3、玻璃粉及類似物的組合物混合,且用諸如乙醇之溶劑對所述混合物進行球磨研磨持續24小時,來製備原料粉末。而且,為了形成其中混合有磁性材料之薄片,藉由使諸如肥粒鐵、基於Ni之材料、基於Ni-Zn之材料及基於Ni-Zn-Cu之材料與包含Al2O3、玻璃粉及類似物的組合物混合,且用諸如乙醇之溶劑對所述混合物進行球磨研磨持續24小時,來製備原料粉末。接著,藉由量測相對於原料粉末約為6重量百分比之有機黏合劑作為添加劑、將所述有機黏合劑溶解於基於甲苯/乙醇的溶劑中、將所述添加劑輸入至原料粉末中,且使用小球研磨機來研磨及混合原料粉末與添加劑持續24個小時,來製備漿料。其後,製造具有所需厚度的薄片,例如藉由刮漿刀方法或類似方法。 S110: preparing a plurality of rectangular sheets in which a non-magnetic material is mixed and a plurality of rectangular sheets in which a magnetic material is mixed. In order to form a sheet in which a non-magnetic material is mixed, a non-magnetic material (including a glass based on B 2 O 3 -SiO 2 , based on Al 2 O 3 -) having a coefficient of thermal expansion similar to that of ferrite iron (including B 2 O 3 -SiO 2 - The SiO 2 glass and other ceramic materials are mixed with a composition containing Al 2 O 3 , glass frit, and the like, and the mixture is subjected to ball milling for 24 hours with a solvent such as ethanol to prepare a raw material powder. Moreover, in order to form a sheet in which a magnetic material is mixed, by using, for example, ferrite iron, a material based on Ni, a material based on Ni-Zn, and a material based on Ni-Zn-Cu, and containing Al 2 O 3 , glass frit and The composition of the analog is mixed, and the mixture is subjected to ball milling with a solvent such as ethanol for 24 hours to prepare a raw material powder. Next, by measuring about 6 weight percent of the organic binder relative to the raw material powder as an additive, dissolving the organic binder in a solvent based on toluene/ethanol, inputting the additive into the raw material powder, and using A pellet mill was used to grind and mix the raw material powder with the additive for 24 hours to prepare a slurry. Thereafter, a sheet having a desired thickness is produced, for example, by a doctor blade method or the like.
S120:在選自混合有非磁性材料之薄片的預定區域處形成孔。意即,孔111、141、151及181分別形成於共同模式雜訊濾波器100之第一薄片110、第四薄片140、第五 薄片150及第八薄片180上,且多個孔形成於ESD保護裝置200之第一薄片至第四薄片210、220、230及240上。使用雷射或機械打孔方法來以若干微米(um)之尺寸來形成此等孔。 S120: forming a hole at a predetermined region selected from a sheet mixed with a non-magnetic material. That is, the holes 111, 141, 151, and 181 are formed in the first sheet 110, the fourth sheet 140, and the fifth of the common mode noise filter 100, respectively. On the sheet 150 and the eighth sheet 180, a plurality of holes are formed in the first to fourth sheets 210, 220, 230, and 240 of the ESD protection device 200. These holes are formed in a number of micrometers (um) using a laser or mechanical perforation method.
S130:分別形成於用於共同模式雜訊濾波器100之第一薄片110、第四薄片140、第五薄片150及第八薄片180上的孔111、141、151及181,以及形成於用於ESD保護裝置200之第二薄片至第四薄片220、230及240上的孔填充有諸如Pd、Ag/Pd或Ag的導電膏。形成於用於ESD保護裝置200之第一薄片210上之孔填充有ESD保護材料。ESD保護材料可由某一材料形成,在所述材料中含有諸如聚乙烯醇(PVA)或聚乙烯醇縮丁醛(PVB)的有機材料與諸如RuO2、Pt、Pd、Ag、Au、Ni、Cr、W及類似物的至少一種導電材料混合。同時,可藉由進一步使用諸如ZnO之變阻器材料或諸如Al2O3之絕緣陶瓷材料與所述混合物混合來獲得ESD保護材料。或者,可使用各種ESD保護材料。 S130: holes 111, 141, 151, and 181 respectively formed on the first sheet 110, the fourth sheet 140, the fifth sheet 150, and the eighth sheet 180 for the common mode noise filter 100, and are formed for The holes on the second to fourth sheets 220, 230, and 240 of the ESD protection device 200 are filled with a conductive paste such as Pd, Ag/Pd, or Ag. The holes formed in the first sheet 210 for the ESD protection device 200 are filled with an ESD protection material. The ESD protective material may be formed of a material containing an organic material such as polyvinyl alcohol (PVA) or polyvinyl butyral (PVB) and such as RuO 2 , Pt, Pd, Ag, Au, Ni, At least one electrically conductive material of Cr, W, and the like is mixed. Meanwhile, the ESD protection material can be obtained by further mixing with the mixture using a varistor material such as ZnO or an insulating ceramic material such as Al 2 O 3 . Alternatively, various ESD protection materials can be used.
S140:在經選擇以構成共同模式雜訊濾波器100的薄片上形成內部電極及線圈圖案,且在經選擇以構成ESD保護裝置200的薄片上形成內部電極。意即,為了構成共同模式雜訊濾波器100,內部電極形成於第一薄片110、第四薄片140、第五薄片150及第八薄片180上,且內部電極及線圈圖案形成於第二薄片120、第三薄片130、第六薄片160及第七薄片170上。為了構成ESD保護裝置200,內 部電極形成於第一薄片210及第二薄片220上。此等內部電極及線圈圖案藉由網板印刷方法或類似方法印刷有諸如Pd、Ag/Pd或Ag的導電膏。 S140: Forming internal electrodes and coil patterns on the sheets selected to form the common mode noise filter 100, and forming internal electrodes on the sheets selected to constitute the ESD protection device 200. That is, in order to form the common mode noise filter 100, internal electrodes are formed on the first sheet 110, the fourth sheet 140, the fifth sheet 150, and the eighth sheet 180, and internal electrodes and coil patterns are formed on the second sheet 120. On the third sheet 130, the sixth sheet 160, and the seventh sheet 170. In order to constitute the ESD protection device 200, The partial electrodes are formed on the first sheet 210 and the second sheet 220. These internal electrodes and coil patterns are printed with a conductive paste such as Pd, Ag/Pd or Ag by a screen printing method or the like.
S150:藉由以下方式來製造矩形六面體層壓製品:層壓磁性薄片、絕緣薄片以及上面形成有預定內部電極、線圈圖案及孔的薄片;在200至700千克力/平方公分的壓力下壓縮經層壓之薄片;且接著將層壓製品切割成具有所需尺寸之單位晶片。 S150: manufacturing a rectangular hexahedron laminate by laminating a magnetic sheet, an insulating sheet, and a sheet having predetermined internal electrodes, coil patterns and holes formed thereon; compressing at a pressure of 200 to 700 kgf/cm 2 The laminated sheet; and then the laminate is cut into unit wafers of the desired size.
S160:隨後,在230℃至350℃的溫度下在爐中燒製所述薄片層壓製品,持續20至40個小時,以移除黏合劑組份,且接著在700℃至900℃的溫度下燒結,持續20至40個小時。 S160: Subsequently, the sheet laminate is fired in an oven at a temperature of 230 ° C to 350 ° C for 20 to 40 hours to remove the binder component, and then at a temperature of 700 ° C to 900 ° C Sintering for 20 to 40 hours.
S170:在爐中燒結的薄片層壓製品的一個外表面及另一外表面上形成第一外部電極500及第二外部電極600,且接著在600℃至800℃的溫度下燒結第一外部電極500及第二外部電極600,持續30分鐘至2個小時,從而完成根據本發明實施例之電路保護裝置。此處,第一外部電極500經形成以連接至共同模式雜訊濾波器100之內部電極122、132、152及182以及ESD保護裝置200的內部電極215、216、217及218。第二外部電極600經形成以連接至共同模式雜訊濾波器100之內部電極121、124、152及172。另外,填充ESD保護裝置200之第四薄片240的孔用的導電材料可用於第三外部電極700。或者,可進一步在所述導電材料上形成外部電極。 S170: forming a first external electrode 500 and a second external electrode 600 on one outer surface and the other outer surface of the sheet laminate sintered in the furnace, and then sintering the first external electrode at a temperature of 600 ° C to 800 ° C The 500 and the second external electrode 600 last for 30 minutes to 2 hours to complete the circuit protection device according to an embodiment of the present invention. Here, the first external electrode 500 is formed to be connected to the internal electrodes 122, 132, 152, and 182 of the common mode noise filter 100 and the internal electrodes 215, 216, 217, and 218 of the ESD protection device 200. The second external electrode 600 is formed to be connected to the internal electrodes 121, 124, 152, and 172 of the common mode noise filter 100. In addition, a conductive material for filling the holes of the fourth sheet 240 of the ESD protection device 200 can be used for the third external electrode 700. Alternatively, an external electrode may be further formed on the conductive material.
圖6為根據本發明之電路保護裝置之共同模式雜訊濾波器的第一修改方案的分解透視圖。 Figure 6 is an exploded perspective view showing a first modification of the common mode noise filter of the circuit protection device according to the present invention.
參看圖6,藉由層壓上面選擇性地形成有內部電極、線圈圖案及孔的第一薄片至第三薄片110、120及130,來組態共同模式雜訊濾波器100。磁性薄片用於第一薄片至第三薄片110、120及130。 Referring to Fig. 6, the common mode noise filter 100 is configured by laminating the first to third sheets 110, 120, and 130 on which the internal electrodes, the coil patterns, and the holes are selectively formed. Magnetic sheets are used for the first to third sheets 110, 120, and 130.
孔111及116、內部電極112及117以及線圈圖案113及118形成於第一薄片110上。孔111及116分別形成於第一薄片110之中心附近的預定區域中,以彼此間隔開預定距離。孔111及116填充有導電膏。可分別藉由延伸線圈圖案113及118來形成內部電極112及117。內部電極112及117分別在第一薄片110之第一長邊中的預定位置處暴露,以彼此間隔開預定距離。線圈圖案113及118以螺旋形形狀形成,以分別自內部電極112及117延伸至孔111及116。線圈圖案113及118經形成以彼此間隔開,以便不彼此重疊。 The holes 111 and 116, the internal electrodes 112 and 117, and the coil patterns 113 and 118 are formed on the first sheet 110. The holes 111 and 116 are respectively formed in predetermined regions near the center of the first sheet 110 to be spaced apart from each other by a predetermined distance. The holes 111 and 116 are filled with a conductive paste. The internal electrodes 112 and 117 can be formed by extending the coil patterns 113 and 118, respectively. The internal electrodes 112 and 117 are respectively exposed at predetermined positions in the first long side of the first sheet 110 to be spaced apart from each other by a predetermined distance. The coil patterns 113 and 118 are formed in a spiral shape to extend from the inner electrodes 112 and 117 to the holes 111 and 116, respectively. The coil patterns 113 and 118 are formed to be spaced apart from each other so as not to overlap each other.
孔121、124、126及129;內部電極122及127以及線圈圖案123及128形成於第二薄片120上。孔121形成於第二薄片120之對應於第一薄片110之孔111的預定位置處,且孔124經形成以與孔121間隔開預定距離。孔126形成於第二薄片120之對應於第一薄片110之孔116的預定位置處,且孔129經形成以與孔126間隔開預定距離。可分別藉由延伸線圈圖案123及128來形成內部電極122及127。內部電極122及127經形成以在第二薄片120之 第一長邊中的預定位置處部分地暴露,以彼此間隔開預定距離。線圈圖案123以螺旋形形狀形成,以自內部電極122延伸至孔124,且線圈圖案128以螺旋形形狀形成以自內部電極127延伸至孔129。線圈圖案123及128經形成以彼此間隔開,以便不彼此重疊。 The holes 121, 124, 126, and 129; the internal electrodes 122 and 127, and the coil patterns 123 and 128 are formed on the second sheet 120. The hole 121 is formed at a predetermined position of the second sheet 120 corresponding to the hole 111 of the first sheet 110, and the hole 124 is formed to be spaced apart from the hole 121 by a predetermined distance. A hole 126 is formed at a predetermined position of the second sheet 120 corresponding to the hole 116 of the first sheet 110, and the hole 129 is formed to be spaced apart from the hole 126 by a predetermined distance. The internal electrodes 122 and 127 can be formed by extending the coil patterns 123 and 128, respectively. Internal electrodes 122 and 127 are formed to be in the second sheet 120 The predetermined positions in the first long sides are partially exposed to be spaced apart from each other by a predetermined distance. The coil pattern 123 is formed in a spiral shape to extend from the internal electrode 122 to the hole 124, and the coil pattern 128 is formed in a spiral shape to extend from the internal electrode 127 to the hole 129. The coil patterns 123 and 128 are formed to be spaced apart from each other so as not to overlap each other.
內部電極131、132、133及134形成於第三薄片130上。內部電極131、132、133及134經形成以延伸至第三薄片130之第二長邊,所述第二長邊與第三薄片130之第一長邊相對,所述第一長邊對應於第一薄片110及第二薄片120之內部電極112、117、122及127暴露處的第一長邊。內部電極131以直線形狀形成,以自第三薄片130之對應於孔111及121之預定位置延伸,以在第三薄片130之第二長邊處暴露,且內部電極132以直線形狀形成,以在第三薄片130之對應於孔124之預定位置延伸,以在第三薄片130之第二長邊處暴露。內部電極133以直線形狀形成,以自第三薄片130之對應於孔116及126之預定位置延伸,以在第三薄片130之第二長邊處暴露,且內部電極134以直線形狀形成,以在第三薄片130之對應於孔129之預定位置延伸,以在第三薄片130之第二長邊處暴露。 Internal electrodes 131, 132, 133, and 134 are formed on the third sheet 130. The internal electrodes 131, 132, 133 and 134 are formed to extend to a second long side of the third sheet 130, the second long side being opposite the first long side of the third sheet 130, the first long side corresponding to The first long sides of the inner electrodes 112, 117, 122, and 127 of the first sheet 110 and the second sheet 120 are exposed. The internal electrode 131 is formed in a linear shape to extend from a predetermined position of the third sheet 130 corresponding to the holes 111 and 121 to be exposed at the second long side of the third sheet 130, and the internal electrode 132 is formed in a linear shape to A predetermined position corresponding to the hole 124 of the third sheet 130 is extended to be exposed at the second long side of the third sheet 130. The internal electrode 133 is formed in a linear shape to extend from a predetermined position of the third sheet 130 corresponding to the holes 116 and 126 to be exposed at the second long side of the third sheet 130, and the internal electrode 134 is formed in a linear shape to The third sheet 130 extends at a predetermined position corresponding to the hole 129 to be exposed at the second long side of the third sheet 130.
內部電極及線圈圖案之每一者藉由網板印刷、濺鍍、蒸鍍或溶膠凝膠塗覆方法由導電膏形成。孔填充有導電膏。線圈圖案113穿過孔111及121連接至內部電極131,且線圈圖案123穿過孔124連接至內部電極132。線圈圖案118穿過孔116及126連接至內部電極133,且線圈圖 案128穿過孔129連接至內部電極134。 Each of the internal electrode and the coil pattern is formed of a conductive paste by screen printing, sputtering, evaporation, or sol-gel coating. The holes are filled with a conductive paste. The coil pattern 113 is connected to the internal electrode 131 through the holes 111 and 121, and the coil pattern 123 is connected to the internal electrode 132 through the hole 124. The coil pattern 118 is connected to the internal electrode 133 through the holes 116 and 126, and the coil pattern Case 128 is coupled to internal electrode 134 through aperture 129.
同時,磁性薄片可分別提供於第一薄片110上及第三薄片130下。 At the same time, magnetic sheets may be provided on the first sheet 110 and under the third sheet 130, respectively.
如上文所述,根據本發明第一修改方案之電路保護裝置的共同模式雜訊濾波器100是使用磁性薄片來製造,且有線圈圖案及內部電極形成於磁性薄片上。因此,共同模式雜訊濾波器100經製造以使得線圈形成於第一薄片110之頂部表面及底部表面上。由於磁性薄片分別形成於第一薄片110之頂部表面及底部表面上,所以可防止磁通量之洩漏。因此,因為使用磁性薄片,所以不必形成單獨的磁芯。因此,可簡化共同模式雜訊濾波器之結構及製造過程。 As described above, the common mode noise filter 100 of the circuit protection device according to the first modification of the present invention is manufactured using a magnetic sheet, and a coil pattern and internal electrodes are formed on the magnetic sheet. Accordingly, the common mode noise filter 100 is fabricated such that the coils are formed on the top and bottom surfaces of the first sheet 110. Since the magnetic sheets are respectively formed on the top surface and the bottom surface of the first sheet 110, the leakage of the magnetic flux can be prevented. Therefore, since a magnetic sheet is used, it is not necessary to form a separate magnetic core. Therefore, the structure and manufacturing process of the common mode noise filter can be simplified.
圖7為根據本發明之電路保護裝置之共同模式雜訊濾波器的第二修改方案的分解透視圖。 Figure 7 is an exploded perspective view showing a second modification of the common mode noise filter of the circuit protection device according to the present invention.
藉由層壓上面選擇性地形成有內部電極、線圈圖案、填充有磁性膏的孔以及填充有導電膏的孔的多個薄片110、120、130及140,來組態共同模式雜訊濾波器100。 The common mode noise filter is configured by laminating a plurality of sheets 110, 120, 130, and 140 on which the internal electrodes, the coil patterns, the holes filled with the magnetic paste, and the holes filled with the conductive paste are selectively formed. 100.
孔110a及110b形成於預定位置處,較佳在第一薄片110上之中心區域中,以彼此間隔開。孔110a及110b填充有磁性膏。磁性膏包含肥粒鐵、基於Ni之材料、基於Ni-Zn之材料以及基於Ni-Zn-Cu之材料及類似材料。 The holes 110a and 110b are formed at predetermined positions, preferably in a central region on the first sheet 110, spaced apart from each other. The holes 110a and 110b are filled with a magnetic paste. The magnetic paste contains ferrite iron, a material based on Ni, a material based on Ni-Zn, and a material based on Ni-Zn-Cu and the like.
多個孔120a、120b、121及126;多個內部電極122及127以及多個線圈圖案123及128形成於第二薄片120上。孔120a及120b形成於第二薄片120上對應於形成於第一薄片110上之孔110a及110b的中心區域中。孔120a 及120b填充有磁性膏。孔121及126經形成以分別與孔120a及120b間隔開預定距離。孔121及126填充有導電膏。內部電極122及127經分別自線圈圖案123及128延伸形成。內部電極122及127經形成以在第二薄片120之第一長邊中的預定位置處暴露,且彼此間隔開。線圈圖案123及128以螺旋形形狀形成,以分別自內部電極122及127延伸至孔121及126。線圈圖案123及128彼此間隔開,以便不彼此重疊。 A plurality of holes 120a, 120b, 121, and 126; a plurality of internal electrodes 122 and 127 and a plurality of coil patterns 123 and 128 are formed on the second sheet 120. The holes 120a and 120b are formed in the central portion of the second sheet 120 corresponding to the holes 110a and 110b formed on the first sheet 110. Hole 120a And 120b is filled with a magnetic paste. The holes 121 and 126 are formed to be spaced apart from the holes 120a and 120b by a predetermined distance, respectively. The holes 121 and 126 are filled with a conductive paste. The internal electrodes 122 and 127 are formed by extending from the coil patterns 123 and 128, respectively. The internal electrodes 122 and 127 are formed to be exposed at predetermined positions in the first long side of the second sheet 120, and are spaced apart from each other. The coil patterns 123 and 128 are formed in a spiral shape to extend from the internal electrodes 122 and 127 to the holes 121 and 126, respectively. The coil patterns 123 and 128 are spaced apart from each other so as not to overlap each other.
多個孔130a、130b、131、134、136及139;多個內部電極132及137以及多個線圈圖案133及138形成於第三薄片130上。孔130a及130b形成於第三薄片130上分別上對應於形成於第一薄片110及第二薄片120上之孔110a及110b以及孔120a及120b的中心區域中。孔130a及130b填充有磁性膏。孔131及134與孔130a間隔開預定距離,以相對於孔130a對稱。孔131及134填充有導電膏。孔136及139與孔130b間隔開預定距離,以相對於孔130b對稱。孔136及139填充有導電膏。明顯地,孔130a、130b、131、134、136及139彼此間隔開預定距離。內部電極132及137經分別自線圈圖案133及138延伸形成。內部電極132及137經形成以在第三薄片130之第一長邊中的預定位置處暴露,同時彼此間隔開預定距離。線圈圖案133及138以螺旋形形狀形成,以分別自內部電極132及137延伸至孔134及139。線圈圖案133及138彼此間隔開,以便不彼此重疊。 A plurality of holes 130a, 130b, 131, 134, 136, and 139; a plurality of internal electrodes 132 and 137 and a plurality of coil patterns 133 and 138 are formed on the third sheet 130. The holes 130a and 130b are formed in the third sheet 130 corresponding to the central regions of the holes 110a and 110b and the holes 120a and 120b formed on the first sheet 110 and the second sheet 120, respectively. The holes 130a and 130b are filled with a magnetic paste. The holes 131 and 134 are spaced apart from the holes 130a by a predetermined distance to be symmetrical with respect to the holes 130a. The holes 131 and 134 are filled with a conductive paste. The holes 136 and 139 are spaced apart from the holes 130b by a predetermined distance to be symmetrical with respect to the holes 130b. The holes 136 and 139 are filled with a conductive paste. Obviously, the holes 130a, 130b, 131, 134, 136, and 139 are spaced apart from each other by a predetermined distance. The internal electrodes 132 and 137 are formed to extend from the coil patterns 133 and 138, respectively. The internal electrodes 132 and 137 are formed to be exposed at predetermined positions in the first long side of the third sheet 130 while being spaced apart from each other by a predetermined distance. The coil patterns 133 and 138 are formed in a spiral shape to extend from the inner electrodes 132 and 137 to the holes 134 and 139, respectively. The coil patterns 133 and 138 are spaced apart from each other so as not to overlap each other.
多個內部電極141、142、143及144以及多個孔140a及140b形成於第四薄片140上。孔140a及140b形成於第四薄片140之分別對應於形成於第一薄片至第三薄片110、120及130上的孔110a及110b、孔120a及120b以及孔130a及130b的中心區域中。孔140a及140b填充有諸如肥粒鐵、基於Ni之材料、基於Ni-Zn之材料以及基於Ni-Zn-Cu之材料及類似材料的磁性膏。多個內部電極141、142、143及144經形成以延伸至第四薄片140之第二長邊,所述第二長邊與第四薄片140之第一長邊相對,所述第一長邊對應於第二薄片120及第三薄片130之內部電極122及127以及內部電極132及137分別暴露處的第一長邊。內部電極141以直線形狀形成,以自第四薄片140之對應於孔121及131之預定位置延伸,以在第四薄片140之第二長邊處暴露。內部電極142經形成以自第四薄片140之對應於孔134之預定位置延伸,以在第四薄片140之第二長邊處暴露,且內部電極143以直線形狀形成,以自第四薄片140之對應於孔126及136之預定位置延伸,以在第四薄片140之第二長邊處暴露。內部電極144經形成以在第四薄片140之對應於孔139之預定位置延伸,以在第四薄片140之第二長邊處暴露。 A plurality of internal electrodes 141, 142, 143, and 144 and a plurality of holes 140a and 140b are formed on the fourth sheet 140. The holes 140a and 140b are formed in the central regions of the fourth sheet 140 corresponding to the holes 110a and 110b, the holes 120a and 120b, and the holes 130a and 130b formed in the first to third sheets 110, 120 and 130, respectively. The holes 140a and 140b are filled with a magnetic paste such as ferrite iron, a material based on Ni, a material based on Ni-Zn, and a material based on Ni-Zn-Cu and the like. A plurality of internal electrodes 141, 142, 143 and 144 are formed to extend to a second long side of the fourth sheet 140, the second long side being opposite the first long side of the fourth sheet 140, the first long side Corresponding to the first long sides of the inner electrodes 122 and 127 of the second sheet 120 and the third sheet 130 and the inner electrodes 132 and 137 respectively exposed. The inner electrode 141 is formed in a linear shape to extend from a predetermined position of the fourth sheet 140 corresponding to the holes 121 and 131 to be exposed at the second long side of the fourth sheet 140. The inner electrode 142 is formed to extend from a predetermined position of the fourth sheet 140 corresponding to the hole 134 to be exposed at the second long side of the fourth sheet 140, and the inner electrode 143 is formed in a linear shape from the fourth sheet 140 The predetermined positions corresponding to the holes 126 and 136 extend to be exposed at the second long side of the fourth sheet 140. The inner electrode 144 is formed to extend at a predetermined position of the fourth sheet 140 corresponding to the hole 139 to be exposed at the second long side of the fourth sheet 140.
多個內部電極112、117、122、127、132及137以及多個線圈圖案212、217、223及227藉由網板印刷、濺鍍、蒸鍍或溶膠凝膠塗覆方法由導電膏形成。孔110a、110b、120a、120b、130a、130b、140a及140b中的每一者填充 有磁性膏,且多個孔121、126、131、134、136及139中的每一者填充有導電膏。因此,線圈圖案123穿過孔121及131連接至內部電極141,且線圈圖案133穿過孔134連接至內部電極142。線圈圖案128穿過孔126及136連接至內部電極143,且線圈圖案138穿過孔139連接至內部電極144。因此,形成具有分別纏繞在磁極周圍之線圈的雙螺線管型共同模式雜訊濾波器。 The plurality of internal electrodes 112, 117, 122, 127, 132, and 137 and the plurality of coil patterns 212, 217, 223, and 227 are formed of a conductive paste by screen printing, sputtering, evaporation, or sol-gel coating. Each of the holes 110a, 110b, 120a, 120b, 130a, 130b, 140a, and 140b is filled There is a magnetic paste, and each of the plurality of holes 121, 126, 131, 134, 136, and 139 is filled with a conductive paste. Therefore, the coil pattern 123 is connected to the internal electrode 141 through the holes 121 and 131, and the coil pattern 133 is connected to the internal electrode 142 through the hole 134. The coil pattern 128 is connected to the internal electrode 143 through the holes 126 and 136, and the coil pattern 138 is connected to the internal electrode 144 through the hole 139. Therefore, a double solenoid type common mode noise filter having coils wound around the magnetic poles is formed.
同時,磁性薄片可分別提供於第一薄片110及第四薄片140之頂部表面及底部表面上。 Meanwhile, magnetic sheets may be provided on the top and bottom surfaces of the first sheet 110 and the fourth sheet 140, respectively.
如上文所述,將根據本發明之第二修改方案之共同模式雜訊濾波器製造成螺線管型,其中由導電圖案形成之線圈纏繞在由磁性膏製成的磁芯周圍,用所述磁性膏填充垂直鑽穿多個經層壓的薄片的孔。 As described above, the common mode noise filter according to the second modification of the present invention is manufactured in a solenoid type in which a coil formed of a conductive pattern is wound around a magnetic core made of a magnetic paste, The magnetic paste fills the holes that are drilled vertically through the plurality of laminated sheets.
圖8為根據本發明之電路保護裝置之ESD保護裝置的第一修改方案的分解透視圖,且圖9為繪示根據本發明之電路保護裝置的第一修改方案的經組裝狀態的仰視透視圖。 Figure 8 is an exploded perspective view showing a first modification of the ESD protection device of the circuit protection device according to the present invention, and Figure 9 is a bottom perspective view showing the assembled state of the circuit protection device according to the present invention. .
藉由將其上面選擇性地形成有內部電極及孔的第一薄片至第四薄片210、220、230及240層壓,來組態ESD保護裝置200。由於第一薄片210、第二薄片220及第三薄230之組態與圖3所描述之組態相同,因此將省略對其之描述。 The ESD protection device 200 is configured by laminating the first to fourth sheets 210, 220, 230, and 240 on which the internal electrodes and the holes are selectively formed. Since the configurations of the first sheet 210, the second sheet 220, and the third sheet 230 are the same as those described in FIG. 3, the description thereof will be omitted.
第一剖開部分245及第二剖開部分246形成於第四薄片240上,以彼此間隔開。第一剖開部分245形成於對應 於第三薄片230之第一孔231及第二孔232之區域中,使得第一孔231及第二孔232穿過第一剖開部分245而暴露。第二剖開部分246形成於對應於第三薄片230之第三孔233及第四孔234的區域中,使得第三孔233及第四孔234穿過第二剖開部分246而暴露。每一剖開部分245或246填充有導電膏,導電膏充當連接至接地端子的第三外部電極710或720。 The first split portion 245 and the second split portion 246 are formed on the fourth sheet 240 to be spaced apart from each other. The first split portion 245 is formed in correspondence In a region of the first hole 231 and the second hole 232 of the third sheet 230, the first hole 231 and the second hole 232 are exposed through the first split portion 245. The second cut-away portion 246 is formed in a region corresponding to the third hole 233 and the fourth hole 234 of the third sheet 230 such that the third hole 233 and the fourth hole 234 are exposed through the second split portion 246. Each of the cut-away portions 245 or 246 is filled with a conductive paste, and the conductive paste serves as a third external electrode 710 or 720 connected to the ground terminal.
電路保護裝置之經組裝狀態的俯視透視圖與圖1中所示相同,且該電路保護裝置之經組裝狀態之仰視透視圖如圖9中繪示。 A top perspective view of the assembled state of the circuit protection device is the same as that shown in FIG. 1, and a bottom perspective view of the assembled state of the circuit protection device is shown in FIG.
圖10為根據本發明之電路保護裝置之ESD保護裝置的第二修改方案的分解透視圖,且圖11為繪示根據本發明之第二修改方案之電路保護裝置的經組裝狀態的仰視透視圖。 Figure 10 is an exploded perspective view showing a second modification of the ESD protection device of the circuit protection device according to the present invention, and Figure 11 is a bottom perspective view showing the assembled state of the circuit protection device according to the second modification of the present invention. .
藉由將其上面選擇性地形成有內部電極及孔的第一薄片至第四薄片210、220、230及240層壓,來組態ESD保護裝置200。由於第一薄片210、第二薄片220及第三薄230之組態與圖3所描述之組態相同,因此將省略對其之描述。 The ESD protection device 200 is configured by laminating the first to fourth sheets 210, 220, 230, and 240 on which the internal electrodes and the holes are selectively formed. Since the configurations of the first sheet 210, the second sheet 220, and the third sheet 230 are the same as those described in FIG. 3, the description thereof will be omitted.
一個剖開部分245形成於第四薄片240上。剖開部分245形成於對應於第三薄片230之第一孔至第四孔231、232、233及234的區域中,使得第一孔至第四孔231、232、233及234穿過剖開部分245而暴露。剖開部分填充有導電膏,導電膏充當連接至接地端子的第三外部電極700。 A split portion 245 is formed on the fourth sheet 240. The cut-away portion 245 is formed in a region corresponding to the first to fourth holes 231, 232, 233, and 234 of the third sheet 230 such that the first to fourth holes 231, 232, 233, and 234 are cut through Part 245 is exposed. The cut-away portion is filled with a conductive paste, and the conductive paste serves as a third external electrode 700 connected to the ground terminal.
電路保護裝置之經組裝狀態的俯視透視圖與圖1中所示相同,且該電路保護裝置之經組裝狀態之仰視透視圖如圖11中繪示。 A top perspective view of the assembled state of the circuit protection device is the same as that shown in FIG. 1, and a bottom perspective view of the assembled state of the circuit protection device is shown in FIG.
圖12為根據本發明之電路保護裝置之ESD保護裝置的第三修改方案的分解透視圖。 Figure 12 is an exploded perspective view showing a third modification of the ESD protection device of the circuit protection device according to the present invention.
藉由將其上面選擇性地形成有內部電極及孔的第一薄片至第四薄片210、220、230及240層壓,來組態ESD保護裝置200。由於第三薄片230及第四薄片240之組態與本發明之實施例中所描述之組態相同,所以將省略對其之描述。將如下描述第一薄片210及第二薄片220之組態。 The ESD protection device 200 is configured by laminating the first to fourth sheets 210, 220, 230, and 240 on which the internal electrodes and the holes are selectively formed. Since the configurations of the third sheet 230 and the fourth sheet 240 are the same as those described in the embodiment of the present invention, the description thereof will be omitted. The configuration of the first sheet 210 and the second sheet 220 will be described as follows.
於第一薄片210之頂部表面上形成第一孔至第四孔211a、212a、213a及214a;第五孔至第八孔211b、212b、213b及214b;第一內部電極至第四內部電極215a、216a、217a及218a以及第五內部電極至第八內部電極215b、216b、217b及218b。第一孔至第四孔211a、212a、213a及214a經形成以與第一薄片210之第二長邊間隔開預定距離。第五孔至第八孔211b、212b、213b及214b經形成以與第一薄片210之第一長邊間隔開預定距離。第一內部電極至第四內部電極215a、216a、217a及218a在第一薄片210之第二長邊處暴露,且連接至第一孔至第四孔211a、212a、213a及214a,同時彼此間隔開。第五內部電極至第八內部電極215b、216b、217b及218b在第一薄片210之第一長邊處暴露,且連接至第五孔至第八孔211b、212b、213b及214b,同時彼此間隔開。第一孔至第四孔211a、 212a、213a及214a以及第五孔至第八孔211b、212b、213b及214b形成於彼此相對的位置處。舉例而言,第一孔至第四孔211a、212a、213a及214a分別形成於直線上的八分之一點、八分之三點、八分之五點及八分之七點處,所述直線為藉由連接相對的短邊上自第一薄片210之第二長邊至第一長邊的四分之一點而形成。第五孔至第八孔211b、212b、213b及214b相對於第一孔至第四孔211a、212a、213a及214a而形成,以彼此間隔開第一短邊之長度的二分之一。第一內部電極至第四內部電極215a、216a、217a及218a經形成以在第一薄片210之第二長邊處暴露。第一內部電極至第四內部電極215a、216a、217a及218a中之每一者,以具有預定寬度之直線形狀形成,以連接至第一孔至第四孔211a、212a、213a及214a中的每一者。第五內部電極至第八內部電極215b、216b、217b及218b經形成以在第一薄片210之第一長邊處暴露。第五內部電極至第八內部電極215b、216b、217b及218b中之每一者,以具有預定寬度之直線形狀形成,以連接至第五孔至第八孔211b、212b、213b及214b中之每一者。 First to fourth holes 211a, 212a, 213a, and 214a are formed on the top surface of the first sheet 210; fifth to eighth holes 211b, 212b, 213b, and 214b; first to fourth internal electrodes 215a 216a, 217a, and 218a and fifth to eighth internal electrodes 215b, 216b, 217b, and 218b. The first to fourth holes 211a, 212a, 213a, and 214a are formed to be spaced apart from the second long side of the first sheet 210 by a predetermined distance. The fifth to eighth holes 211b, 212b, 213b, and 214b are formed to be spaced apart from the first long side of the first sheet 210 by a predetermined distance. The first to fourth inner electrodes 215a, 216a, 217a, and 218a are exposed at the second long side of the first sheet 210, and are connected to the first to fourth holes 211a, 212a, 213a, and 214a while being spaced apart from each other open. The fifth to eighth inner electrodes 215b, 216b, 217b, and 218b are exposed at the first long side of the first sheet 210, and are connected to the fifth to eighth holes 211b, 212b, 213b, and 214b while being spaced apart from each other open. First to fourth holes 211a, 212a, 213a, and 214a and fifth to eighth holes 211b, 212b, 213b, and 214b are formed at positions opposing each other. For example, the first to fourth holes 211a, 212a, 213a, and 214a are respectively formed at one-eighth, three-eighth, five-eighth, and seven-eighth of the line on the straight line. The straight line is formed by connecting the opposite long sides from the second long side of the first sheet 210 to a quarter point of the first long side. The fifth to eighth holes 211b, 212b, 213b, and 214b are formed with respect to the first to fourth holes 211a, 212a, 213a, and 214a to be spaced apart from each other by one-half of the length of the first short side. The first to fourth internal electrodes 215a, 216a, 217a, and 218a are formed to be exposed at the second long side of the first sheet 210. Each of the first to fourth inner electrodes 215a, 216a, 217a, and 218a is formed in a linear shape having a predetermined width to be connected to the first to fourth holes 211a, 212a, 213a, and 214a Each. The fifth to eighth inner electrodes 215b, 216b, 217b, and 218b are formed to be exposed at the first long side of the first sheet 210. Each of the fifth to eighth inner electrodes 215b, 216b, 217b, and 218b is formed in a linear shape having a predetermined width to be connected to the fifth to eighth holes 211b, 212b, 213b, and 214b. Each.
第一孔至第四孔221、222、223及224以及第一至內部電極第四內部電極225、226、227及228形成於第二薄片220之頂部表面上。第一孔至第四孔221、222、223及224分別形成於直線上的八分之一點、八分之三點、八分之五點及八分之七點處,該直線為由連接第二薄片220之相對短邊的中心點來形成。第一內部電極至第四內部電極 225、226、227及228與第二薄片220之第一長邊及第二長邊間隔開預定距離,以便不在第二薄片220之第一長邊及第二長邊處暴露。第一內部電極至第四內部電極225、226、227及228中之每一者,以具有預定寬度之直線形狀形成,使得其一側分別連接至第一孔至第四孔211a、212a、213a及214a中,且其另一側分別連接至第五孔至第八孔211b、212b、213b及214b。舉例而言,第一內部電極至第四內部電極225、226、227及228經形成以分別經過第一孔至第四孔221、222、223及224,自對應於第一薄片210之第一孔至第四孔211a、212a、213a及214a之位置,延伸至對應於第一薄片210之第五孔至第八孔211b、212b、213b及214b之位置。 The first to fourth holes 221, 222, 223, and 224 and the first to inner electrode fourth inner electrodes 225, 226, 227, and 228 are formed on the top surface of the second sheet 220. The first to fourth holes 221, 222, 223 and 224 are respectively formed at one-eighth point, three-eighth point, five-eighth point and seven-eighth point on the straight line, and the straight line is connected by The center point of the opposite short side of the second sheet 220 is formed. First to fourth internal electrodes 225, 226, 227, and 228 are spaced apart from the first long side and the second long side of the second sheet 220 by a predetermined distance so as not to be exposed at the first long side and the second long side of the second sheet 220. Each of the first to fourth inner electrodes 225, 226, 227, and 228 is formed in a linear shape having a predetermined width such that one side thereof is connected to the first to fourth holes 211a, 212a, 213a, respectively. And 214a, and the other side thereof is connected to the fifth to eighth holes 211b, 212b, 213b, and 214b, respectively. For example, the first to fourth internal electrodes 225, 226, 227, and 228 are formed to pass through the first to fourth holes 221, 222, 223, and 224, respectively, from the first corresponding to the first sheet 210. The positions of the holes to the fourth holes 211a, 212a, 213a, and 214a extend to positions corresponding to the fifth to eighth holes 211b, 212b, 213b, and 214b of the first sheet 210.
此處,第一薄片210之孔211a、212a、213a、214a、211b、212b、213b及214b填充有ESD保護材料。ESD保護材料可包含混合物,所述混合物為,諸如聚乙烯醇(PVA)或聚乙烯醇縮丁醛(PVB)的有機材料與RuO2、Pt、Pd、Ag、Au、Ni、Cr、W及類似物的至少一種導電材料混合。另外,可進一步使用諸如ZnO之變阻器材料或諸如Al2O3之絕緣陶瓷材料與所述混合物混合,來獲得ESD保護材料。另外,第二薄片220之孔221、222、223及224填充有導電膏,且第一薄片210之內部電極215a、216a、217a、218a、215b、216b、217b及218b以及第二薄片220之內部電極225、226、227及228藉由網板印刷、濺鍍、蒸鍍或溶膠凝膠塗覆方法由導電膏形成。 Here, the holes 211a, 212a, 213a, 214a, 211b, 212b, 213b, and 214b of the first sheet 210 are filled with an ESD protection material. The ESD protective material may comprise a mixture of organic materials such as polyvinyl alcohol (PVA) or polyvinyl butyral (PVB) with RuO 2 , Pt, Pd, Ag, Au, Ni, Cr, W and At least one electrically conductive material of the analog is mixed. In addition, an ESD protection material may be further obtained by mixing a varistor material such as ZnO or an insulating ceramic material such as Al 2 O 3 with the mixture. In addition, the holes 221, 222, 223 and 224 of the second sheet 220 are filled with a conductive paste, and the internal electrodes 215a, 216a, 217a, 218a, 215b, 216b, 217b and 218b of the first sheet 210 and the inside of the second sheet 220 are filled. The electrodes 225, 226, 227, and 228 are formed of a conductive paste by screen printing, sputtering, evaporation, or sol-gel coating methods.
圖13為根據本發明之電路保護裝置之ESD保護裝置的第四修改方案的分解視圖。第一薄片210及第二薄片220之組態與圖12描述之第三修改方案之組態相同,且第三薄片230及第四薄片240之組態與圖8描述之第一修改方案之組態相同。 Figure 13 is an exploded view of a fourth modification of the ESD protection device of the circuit protection device according to the present invention. The configuration of the first sheet 210 and the second sheet 220 is the same as that of the third modification described in FIG. 12, and the configuration of the third sheet 230 and the fourth sheet 240 is the same as the group of the first modification described in FIG. The state is the same.
圖14為根據本發明之電路保護裝置之ESD保護裝置的第五修改方案的分解視圖。第一薄片210及第二薄片220之組態與圖12描述之第三修改方案之組態相同,且第三薄片230及第四薄片240之組態與圖10描述之第一修改方案之組態相同。 Figure 14 is an exploded view of a fifth modification of the ESD protection device of the circuit protection device according to the present invention. The configuration of the first sheet 210 and the second sheet 220 is the same as that of the third modification described in FIG. 12, and the configuration of the third sheet 230 and the fourth sheet 240 is the same as that of the first modification described in FIG. The state is the same.
圖15為根據本發明之電路保護裝置之ESD保護裝置的第六修改方案的分解視圖。兩個剖開部分221a及222a以及兩個剖開部分231a及232a分別形成於第二薄片220及第三薄片230上。意即,儘管在第二修改方案中,多個孔(例如,四個孔)形成於第二薄片220及第三薄片230之每一者上,但在第六修改方案中,剖開部分221a及222a以及剖開部分231a及232a分別形成於第二薄片220及第三薄片230中對應於形成於第四薄片240上之剖開部分245及246的位置處。此處,形成於第二薄片220上之剖開部分221a及222a以及形成於第三薄片230上之剖開部分231a及232a可經形成以具有小於形成於第四薄片240上之剖開部分245及246的尺寸。第六修改方案不僅可在第二修改方案中使用,而且可用作形成於本發明中所描述之ESD保護裝置的第二薄片及第三薄片上的孔的組態。 Figure 15 is an exploded view of a sixth modification of the ESD protection device of the circuit protection device according to the present invention. Two split portions 221a and 222a and two split portions 231a and 232a are formed on the second sheet 220 and the third sheet 230, respectively. That is, although in the second modification, a plurality of holes (for example, four holes) are formed on each of the second sheet 220 and the third sheet 230, in the sixth modification, the section 221a is cut away. And 222a and the cut-away portions 231a and 232a are formed at positions corresponding to the cut-away portions 245 and 246 formed on the fourth sheet 240, respectively, in the second sheet 220 and the third sheet 230. Here, the cut-away portions 221a and 222a formed on the second sheet 220 and the cut-away portions 231a and 232a formed on the third sheet 230 may be formed to have a smaller than the cut-away portion 245 formed on the fourth sheet 240. And the size of 246. The sixth modification can be used not only in the second modification but also as a configuration of the holes formed in the second and third sheets of the ESD protection device described in the present invention.
圖16為根據本發明之電路保護裝置之ESD保護裝置的第七修改方案的分解視圖。剖開部分221a及231a分別形成於第二薄片220及第三薄片230上。意即,儘管在第二修改方案中,多個孔(例如,四個孔)形成於第二薄片220及第三薄片230之每一者上,但在第七修改方案中,第二薄片220之剖開部分221a及第三薄片230之剖開部分231a形成於對應於形成於第四薄片240上之剖開部分245的位置中。此處,形成於第二薄片220上之剖開部分221a及形成於第三薄片230上之剖開部分231a可經形成以具有小於形成於第四薄片240上之剖開部分245的尺寸。第七修改方案不僅可在第二修改方案中使用,而且可用作形成於本發明中所描述之ESD保護裝置的第二薄片及第三薄片上的孔的組態。 Figure 16 is an exploded perspective view showing a seventh modification of the ESD protection device of the circuit protection device according to the present invention. The cut-away portions 221a and 231a are formed on the second sheet 220 and the third sheet 230, respectively. That is, although in the second modification, a plurality of holes (for example, four holes) are formed on each of the second sheet 220 and the third sheet 230, in the seventh modification, the second sheet 220 The cut-away portion 221a and the cut-away portion 231a of the third sheet 230 are formed in positions corresponding to the cut-away portions 245 formed on the fourth sheet 240. Here, the cut-away portion 221a formed on the second sheet 220 and the cut-away portion 231a formed on the third sheet 230 may be formed to have a size smaller than the cut-away portion 245 formed on the fourth sheet 240. The seventh modification can be used not only in the second modification but also as a configuration of the holes formed in the second and third sheets of the ESD protection device described in the present invention.
圖17為根據本發明之電路保護裝置之ESD保護裝置的第八修改方案的分解視圖。第一薄片210之孔211、212、213及214形成於第一薄片210之中心部分中。孔211、212、213及214填充有ESD保護材料。內部電極215、216、217及218經形成以覆蓋填充有ESD保護材料的孔211、212、213及214。相應地,孔221、222、223及224分別形成於第二薄片220中對應於第一薄片210之孔211、212、213及214的位置處。先前實施例中所描述之內部電極不形成於第二薄片220上。 Figure 17 is an exploded perspective view showing an eighth modification of the ESD protection device of the circuit protection device according to the present invention. The holes 211, 212, 213, and 214 of the first sheet 210 are formed in the central portion of the first sheet 210. The holes 211, 212, 213 and 214 are filled with an ESD protection material. Internal electrodes 215, 216, 217, and 218 are formed to cover the holes 211, 212, 213, and 214 filled with the ESD protection material. Accordingly, the holes 221, 222, 223, and 224 are respectively formed at positions of the second sheet 220 corresponding to the holes 211, 212, 213, and 214 of the first sheet 210. The internal electrodes described in the previous embodiments are not formed on the second sheet 220.
圖18為繪示寄生電容視根據本發明之電路保護裝置之第三外部電極之形狀而變化的曲線圖,其中在本發明之 情況下,以及在外部電極連接至形成於其側表面上之ESD保護裝置的習知電路保護裝置的情況下,量測寄生電容之變化。此處,“A”指示當外部電極形成於習知電路保護裝置之側表面上時的寄生電容;“B”指示當四個第三外部電極形成於電路保護裝置的底部表面上(如圖2中所示)時的寄生電容。“C”指示當兩個第三外部電極形成於電路保護裝置的底部表面上(如圖9中所示)時的寄生電容,且“D”指示當單個第三外部電極形成於電路保護裝置之底部表面上(如圖11中所示)時的寄生電容。量測共同模式雜訊濾波器與第三外部電極之間所產生之寄生電容。隨著共同模式雜訊濾波器之線圈圖案與第三外部電極之間的距離越來越長且重疊面積越來越窄,寄生電容減小。如自所述曲線圖可看出,在習知電路保護裝置中,寄生電容為1微微法拉或更大。在此情況下,穿過共同雜訊濾波器而轉移之信號可能發生失真。然而,在本發明中,所有情況下之寄生電容均為0.8微微法拉或更小,但隨著第三外部電極之數目增加,寄生電容降低。 18 is a graph showing the variation of the parasitic capacitance according to the shape of the third external electrode of the circuit protection device according to the present invention, wherein the present invention In the case, and in the case where the external electrode is connected to a conventional circuit protection device of an ESD protection device formed on the side surface thereof, the variation of the parasitic capacitance is measured. Here, "A" indicates a parasitic capacitance when an external electrode is formed on a side surface of a conventional circuit protection device; "B" indicates when four third external electrodes are formed on a bottom surface of the circuit protection device (FIG. 2) Parasitic capacitance when shown in ). "C" indicates a parasitic capacitance when two third external electrodes are formed on the bottom surface of the circuit protection device (as shown in FIG. 9), and "D" indicates when a single third external electrode is formed in the circuit protection device Parasitic capacitance on the bottom surface (as shown in Figure 11). The parasitic capacitance generated between the common mode noise filter and the third external electrode is measured. As the distance between the coil pattern of the common mode noise filter and the third external electrode becomes longer and the overlapping area becomes narrower, the parasitic capacitance decreases. As can be seen from the graph, in conventional circuit protection devices, the parasitic capacitance is 1 picofarad or greater. In this case, the signal that is transferred through the common noise filter may be distorted. However, in the present invention, the parasitic capacitance in all cases is 0.8 picofarad or less, but as the number of the third external electrodes increases, the parasitic capacitance decreases.
由於寄生電容低於1微微法拉,具體而言為0.8微微法拉或更小,因此電容在使用較高頻率之輸入/輸出端子處不改變,且因此,信號不會發生失真。因此,可增強電路之可靠性。 Since the parasitic capacitance is less than 1 picofarad, specifically 0.8 picofarad or less, the capacitance does not change at the input/output terminals using higher frequencies, and therefore, the signal does not become distorted. Therefore, the reliability of the circuit can be enhanced.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,故本 發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. this The scope of the invention is defined by the scope of the appended claims.
10‧‧‧電路保護裝置 10‧‧‧Circuit protection device
100‧‧‧共同模式雜訊濾波器 100‧‧‧Common mode noise filter
110‧‧‧薄片 110‧‧‧Sheet
110a‧‧‧孔 110a‧‧ hole
110b‧‧‧孔 110b‧‧‧ hole
111‧‧‧孔 111‧‧‧ hole
112‧‧‧內部電極 112‧‧‧Internal electrodes
113‧‧‧線圈圖案 113‧‧‧ coil pattern
116‧‧‧孔 116‧‧‧ hole
117‧‧‧內部電極 117‧‧‧Internal electrodes
118‧‧‧線圈圖案 118‧‧‧ coil pattern
120‧‧‧薄片 120‧‧‧Sheet
120a‧‧‧孔 120a‧‧ hole
120b‧‧‧孔 120b‧‧‧ hole
121‧‧‧孔 121‧‧‧ hole
122‧‧‧內部電極 122‧‧‧Internal electrodes
123‧‧‧線圈圖案 123‧‧‧ coil pattern
124‧‧‧內部電極 124‧‧‧Internal electrodes
126‧‧‧孔 126‧‧‧ hole
127‧‧‧內部電極 127‧‧‧Internal electrodes
128‧‧‧線圈圖案 128‧‧‧ coil pattern
129‧‧‧孔 129‧‧‧ hole
130‧‧‧薄片 130‧‧‧Sheet
130a‧‧‧孔 130a‧‧ hole
130b‧‧‧孔 130b‧‧‧ hole
131‧‧‧孔 131‧‧‧ hole
132‧‧‧內部電極 132‧‧‧Internal electrodes
133‧‧‧線圈圖案 133‧‧‧ coil pattern
134‧‧‧孔 134‧‧‧ hole
136‧‧‧孔 136‧‧‧ hole
137‧‧‧內部電極 137‧‧‧Internal electrodes
138‧‧‧線圈圖案 138‧‧‧ coil pattern
139‧‧‧孔 139‧‧‧ hole
140‧‧‧薄片 140‧‧‧Sheet
140a‧‧‧孔 140a‧‧ hole
140b‧‧‧孔 140b‧‧‧ hole
141‧‧‧孔 141‧‧‧ hole
142‧‧‧內部電極 142‧‧‧Internal electrodes
143‧‧‧內部電極 143‧‧‧Internal electrodes
144‧‧‧內部電極 144‧‧‧Internal electrodes
150‧‧‧薄片 150‧‧‧Sheet
151‧‧‧孔 151‧‧‧ hole
152‧‧‧內部電極 152‧‧‧Internal electrodes
160‧‧‧薄片 160‧‧‧Sheet
162‧‧‧內部電極 162‧‧‧Internal electrodes
163‧‧‧線圈圖案 163‧‧‧ coil pattern
170‧‧‧薄片 170‧‧‧Sheet
172‧‧‧內部電極 172‧‧‧Internal electrodes
173‧‧‧線圈圖案 173‧‧‧ coil pattern
180‧‧‧薄片 180‧‧‧Sheet
181‧‧‧孔 181‧‧‧ hole
182‧‧‧內部電極 182‧‧‧Internal electrodes
200‧‧‧靜電放電保護裝置 200‧‧‧Electrostatic discharge protection device
210‧‧‧第一薄片 210‧‧‧ first sheet
211‧‧‧第一孔 211‧‧‧ first hole
211a‧‧‧第一孔 211a‧‧‧ first hole
211b‧‧‧第五孔 211b‧‧‧ fifth hole
212‧‧‧第二孔 212‧‧‧second hole
212a‧‧‧第二孔 212a‧‧‧second hole
212b‧‧‧第六孔 212b‧‧‧ sixth hole
213‧‧‧第三孔 213‧‧‧ third hole
213a‧‧‧第三孔 213a‧‧‧ third hole
213b‧‧‧第七孔 213b‧‧‧ seventh hole
214‧‧‧第四孔 214‧‧‧ fourth hole
214a‧‧‧第四孔 214a‧‧‧ fourth hole
214b‧‧‧第八孔 214b‧‧‧8th hole
215‧‧‧第一內部電極 215‧‧‧First internal electrode
215a‧‧‧第一內部電極 215a‧‧‧First internal electrode
215b‧‧‧第五內部電極 215b‧‧‧ fifth internal electrode
216‧‧‧第二內部電極 216‧‧‧Second internal electrode
216a‧‧‧第二內部電極 216a‧‧‧Second internal electrode
216b‧‧‧第六內部電極 216b‧‧‧ sixth internal electrode
217‧‧‧第三內部電極 217‧‧‧ Third internal electrode
217a‧‧‧第三內部電極 217a‧‧‧3rd internal electrode
217b‧‧‧第七內部電極 217b‧‧‧ seventh internal electrode
218‧‧‧第四內部電極 218‧‧‧fourth internal electrode
218a‧‧‧第四內部電極 218a‧‧‧fourth internal electrode
218b‧‧‧第八內部電極 218b‧‧‧8th internal electrode
220‧‧‧第二薄片 220‧‧‧Second sheet
221‧‧‧第一孔 221‧‧‧ first hole
221a‧‧‧剖開部分 221a‧‧‧ Cutaway
222‧‧‧第二孔 222‧‧‧ second hole
222a‧‧‧剖開部分 222a‧‧‧ Cutaway
223‧‧‧第三孔 223‧‧‧ third hole
224‧‧‧第四孔 224‧‧‧ fourth hole
225‧‧‧第一內部電極 225‧‧‧First internal electrode
226‧‧‧第二內部電極 226‧‧‧Second internal electrode
227‧‧‧第三內部電極 227‧‧‧ Third internal electrode
228‧‧‧第四內部電極 228‧‧‧fourth internal electrode
230‧‧‧第三薄片 230‧‧‧ third sheet
231‧‧‧第一孔 231‧‧‧ first hole
231a‧‧‧剖開部分 231a‧‧‧ Cutaway
232‧‧‧第二孔 232‧‧‧second hole
233‧‧‧第三孔 233‧‧‧ third hole
234‧‧‧第四孔 234‧‧‧ fourth hole
240‧‧‧第四薄片 240‧‧‧fourth sheet
241‧‧‧第一孔 241‧‧‧ first hole
242‧‧‧第二孔 242‧‧‧ second hole
243‧‧‧第三孔 243‧‧‧ third hole
244‧‧‧第四孔 244‧‧‧ fourth hole
245‧‧‧第一剖開部分 245‧‧‧ first section
246‧‧‧第二剖開部分 246‧‧‧Second section
300‧‧‧上覆蓋層 300‧‧‧Upper cover
410‧‧‧第一絕緣薄片 410‧‧‧First insulating sheet
420‧‧‧第一磁性薄片 420‧‧‧First magnetic sheet
430‧‧‧第二磁性薄片 430‧‧‧Second magnetic sheet
440‧‧‧第二絕緣薄片 440‧‧‧Second insulation sheet
450‧‧‧第三磁性薄片 450‧‧‧ Third magnetic sheet
460‧‧‧第四磁性薄片 460‧‧‧fourth magnetic sheet
500‧‧‧第一外部電極 500‧‧‧First external electrode
510‧‧‧第一外部電極 510‧‧‧First external electrode
520‧‧‧第一外部電極 520‧‧‧First external electrode
530‧‧‧第一外部電極 530‧‧‧First external electrode
540‧‧‧第一外部電極 540‧‧‧First external electrode
600‧‧‧第二外部電極 600‧‧‧Second external electrode
610‧‧‧第二外部電極 610‧‧‧Second external electrode
620‧‧‧第二外部電極 620‧‧‧Second external electrode
630‧‧‧第二外部電極 630‧‧‧Second external electrode
640‧‧‧第二外部電極 640‧‧‧Second external electrode
700‧‧‧第三外部電極 700‧‧‧ Third external electrode
710‧‧‧第三外部電極 710‧‧‧ Third external electrode
720‧‧‧第三外部電極 720‧‧‧ Third external electrode
730‧‧‧第三外部電極 730‧‧‧ Third external electrode
740‧‧‧第三外部電極 740‧‧‧ Third external electrode
A、B、C、D‧‧‧寄生電容 A, B, C, D‧‧‧ parasitic capacitance
S110~S170‧‧‧步驟 S110~S170‧‧‧Steps
圖1是繪示根據本發明之經組裝的電路保護裝置之俯視透視圖。 1 is a top perspective view of an assembled circuit protection device in accordance with the present invention.
圖2是繪示根據本發明之電路保護裝置之經組裝狀態的仰視透視圖。 2 is a bottom perspective view showing the assembled state of the circuit protection device in accordance with the present invention.
圖3是根據本發明之電路保護裝置的分解透視圖。 Figure 3 is an exploded perspective view of the circuit protection device in accordance with the present invention.
圖4是根據本發明之電路保護裝置的等效電路圖。 4 is an equivalent circuit diagram of a circuit protection device in accordance with the present invention.
圖5是說明製造根據本發明之電路保護裝置的方法的流程圖。 Figure 5 is a flow chart illustrating a method of fabricating a circuit protection device in accordance with the present invention.
圖6是根據本發明之電路保護裝置之共同模式雜訊濾波器之第一修改方案的分解透視圖。 Figure 6 is an exploded perspective view of a first modification of the common mode noise filter of the circuit protection device in accordance with the present invention.
圖7是根據本發明之電路保護裝置之共同模式雜訊濾波器之第二修改方案的分解透視圖。 Figure 7 is an exploded perspective view of a second modification of the common mode noise filter of the circuit protection device in accordance with the present invention.
圖8是根據本發明之電路保護裝置之ESD保護裝置之第一修改方案的分解透視圖。 Figure 8 is an exploded perspective view showing a first modification of the ESD protection device of the circuit protection device according to the present invention.
圖9是繪示根據本發明之電路保護裝置之ESD保護裝置的第一修改方案的經組裝狀態的仰視透視圖。 Figure 9 is a bottom perspective view showing the assembled state of the first modification of the ESD protection device of the circuit protection device according to the present invention.
圖10是根據本發明之電路保護裝置之ESD保護裝置的第二修改方案的分解透視圖。 Figure 10 is an exploded perspective view showing a second modification of the ESD protection device of the circuit protection device according to the present invention.
圖11是繪示根據本發明之電路保護裝置之ESD保護裝置的第二修改方案的經組裝狀態的仰視透視圖。 Figure 11 is a bottom perspective view showing an assembled state of a second modification of the ESD protection device of the circuit protection device according to the present invention.
圖12是根據本發明之電路保護裝置的ESD保護裝置的第三修改方案的分解透視圖。 Figure 12 is an exploded perspective view showing a third modification of the ESD protection device of the circuit protection device according to the present invention.
圖13是根據本發明之電路保護裝置之ESD保護裝置 的第四修改方案的分解透視圖。 Figure 13 is an ESD protection device for a circuit protection device according to the present invention An exploded perspective view of the fourth modification.
圖14是根據本發明之電路保護裝置之ESD保護裝置的第五修改方案的分解透視圖。 Figure 14 is an exploded perspective view showing a fifth modification of the ESD protection device of the circuit protection device according to the present invention.
圖15是根據本發明之電路保護裝置之ESD保護裝置的第六修改方案的分解透視圖。 Figure 15 is an exploded perspective view showing a sixth modification of the ESD protection device of the circuit protection device according to the present invention.
圖16是根據本發明之電路保護裝置之ESD保護裝置的第七修改方案的分解透視圖。 Figure 16 is an exploded perspective view showing a seventh modification of the ESD protection device of the circuit protection device according to the present invention.
圖17是根據本發明之電路保護裝置之ESD保護裝置的第八修改方案的分解透視圖。 Figure 17 is an exploded perspective view showing an eighth modification of the ESD protection device of the circuit protection device according to the present invention.
圖18是繪示寄生電容視根據本發明之電路保護裝置之第三外部電極之形狀而變化的曲線圖。 Figure 18 is a graph showing changes in parasitic capacitance depending on the shape of the third external electrode of the circuit protection device according to the present invention.
100‧‧‧共同模式雜訊濾波器 100‧‧‧Common mode noise filter
200‧‧‧靜電放電保護裝置 200‧‧‧Electrostatic discharge protection device
300‧‧‧上覆蓋層 300‧‧‧Upper cover
500‧‧‧第一外部電極 500‧‧‧First external electrode
510‧‧‧第一外部電極 510‧‧‧First external electrode
520‧‧‧第一外部電極 520‧‧‧First external electrode
530‧‧‧第一外部電極 530‧‧‧First external electrode
540‧‧‧第一外部電極 540‧‧‧First external electrode
600‧‧‧第二外部電極 600‧‧‧Second external electrode
610‧‧‧第二外部電極 610‧‧‧Second external electrode
620‧‧‧第二外部電極 620‧‧‧Second external electrode
630‧‧‧第二外部電極 630‧‧‧Second external electrode
640‧‧‧第二外部電極 640‧‧‧Second external electrode
700‧‧‧第三外部電極 700‧‧‧ Third external electrode
710‧‧‧第三外部電極 710‧‧‧ Third external electrode
720‧‧‧第三外部電極 720‧‧‧ Third external electrode
730‧‧‧第三外部電極 730‧‧‧ Third external electrode
740‧‧‧第三外部電極 740‧‧‧ Third external electrode
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5570010A (en) * | 1992-05-20 | 1996-10-29 | The Furukawa Electric Co., Ltd. | Method and apparatus for identifying objects using compound signal and a detector employing an electrical static coupling technique |
US5990417A (en) * | 1993-06-07 | 1999-11-23 | Nippon Telegraph And Telephone Corporation | Electromagnetic noise absorbing material and electromagnetic noise filter |
US20010015676A1 (en) * | 2000-02-21 | 2001-08-23 | Kumiko Takikawa | Wireless communication system |
TW200515841A (en) * | 2003-10-31 | 2005-05-01 | Tokyo Electron Ltd | Electrostatic chuck, plasma processing apparatus, and plasma processing method |
TWM279030U (en) * | 2005-06-23 | 2005-10-21 | Walsin Technology Corp | A micro common-mode signal filter capable of protection against static electricity |
TWM284140U (en) * | 2005-05-11 | 2005-12-21 | Mag Layers Scient Technics Co | Filter of a chip having a shield used to avoid electromagnetic interference and static charge |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2584469Y2 (en) * | 1991-07-08 | 1998-11-05 | 株式会社村田製作所 | Noise filter with varistor function |
JP2767014B2 (en) * | 1992-04-22 | 1998-06-18 | 株式会社村田製作所 | Noise filter |
JP3204085B2 (en) * | 1996-04-24 | 2001-09-04 | 株式会社村田製作所 | Stacked noise filter |
JP4736526B2 (en) | 2005-05-11 | 2011-07-27 | パナソニック株式会社 | Common mode noise filter |
-
2007
- 2007-10-01 KR KR1020070098846A patent/KR100920220B1/en active IP Right Grant
-
2008
- 2008-09-16 WO PCT/KR2008/005456 patent/WO2009045008A2/en active Application Filing
- 2008-09-30 TW TW097137608A patent/TWI450642B/en active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5570010A (en) * | 1992-05-20 | 1996-10-29 | The Furukawa Electric Co., Ltd. | Method and apparatus for identifying objects using compound signal and a detector employing an electrical static coupling technique |
US5990417A (en) * | 1993-06-07 | 1999-11-23 | Nippon Telegraph And Telephone Corporation | Electromagnetic noise absorbing material and electromagnetic noise filter |
US20010015676A1 (en) * | 2000-02-21 | 2001-08-23 | Kumiko Takikawa | Wireless communication system |
TW200515841A (en) * | 2003-10-31 | 2005-05-01 | Tokyo Electron Ltd | Electrostatic chuck, plasma processing apparatus, and plasma processing method |
TWM284140U (en) * | 2005-05-11 | 2005-12-21 | Mag Layers Scient Technics Co | Filter of a chip having a shield used to avoid electromagnetic interference and static charge |
TWM279030U (en) * | 2005-06-23 | 2005-10-21 | Walsin Technology Corp | A micro common-mode signal filter capable of protection against static electricity |
Also Published As
Publication number | Publication date |
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WO2009045008A3 (en) | 2009-05-22 |
WO2009045008A2 (en) | 2009-04-09 |
KR100920220B1 (en) | 2009-10-05 |
TW200934305A (en) | 2009-08-01 |
KR20090033690A (en) | 2009-04-06 |
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