TWI448488B - 聚醯亞胺前驅體樹脂溶液 - Google Patents
聚醯亞胺前驅體樹脂溶液 Download PDFInfo
- Publication number
- TWI448488B TWI448488B TW100141247A TW100141247A TWI448488B TW I448488 B TWI448488 B TW I448488B TW 100141247 A TW100141247 A TW 100141247A TW 100141247 A TW100141247 A TW 100141247A TW I448488 B TWI448488 B TW I448488B
- Authority
- TW
- Taiwan
- Prior art keywords
- precursor resin
- solution
- formula
- following formula
- polyimide
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010254141A JP5165047B2 (ja) | 2010-11-12 | 2010-11-12 | ポリイミド前駆体樹脂溶液 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201226446A TW201226446A (en) | 2012-07-01 |
TWI448488B true TWI448488B (zh) | 2014-08-11 |
Family
ID=46268636
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100141247A TWI448488B (zh) | 2010-11-12 | 2011-11-11 | 聚醯亞胺前驅體樹脂溶液 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5165047B2 (ko) |
KR (1) | KR101351362B1 (ko) |
CN (1) | CN102532541B (ko) |
TW (1) | TWI448488B (ko) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101995916B1 (ko) * | 2012-07-19 | 2019-07-03 | 삼성전자주식회사 | 폴리이미드 전구체 조성물, 이를 사용하여 제조된 성형품 및 상기 성형품을 포함하는 디스플레이 장치 |
TWI488887B (zh) | 2013-02-08 | 2015-06-21 | 長興材料工業股份有限公司 | 聚醯亞胺,由此形成之塗料組合物及其用途 |
CN107406675B (zh) * | 2015-03-31 | 2020-11-06 | 日产化学工业株式会社 | 剥离层形成用组合物和剥离层 |
TWI703188B (zh) * | 2017-12-29 | 2020-09-01 | 財團法人工業技術研究院 | 聚醯亞胺混成材料、其前驅液及其製法 |
US10995237B2 (en) | 2017-12-29 | 2021-05-04 | Industrial Technology Research Institute | Polyimide hybrid material, precursor solution and manufacture method thereof |
CN112778522A (zh) * | 2019-11-07 | 2021-05-11 | 住友化学株式会社 | 聚酰胺酰亚胺树脂、光学膜及柔性显示装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03140328A (ja) * | 1989-10-27 | 1991-06-14 | Chisso Corp | 高接着性ポリアミド酸及びその硬化物の各製造法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4014834A (en) | 1975-02-04 | 1977-03-29 | E. I. Du Pont De Nemours And Company | Aqueous solutions of polyamide acids which can be precursors of polyimide polymers |
JP3021979B2 (ja) | 1991-08-28 | 2000-03-15 | ユニチカ株式会社 | ポリイミド前駆体溶液、その製造方法、それから得られる成形体及び被覆物 |
EP0811648B1 (en) * | 1996-06-07 | 1999-12-22 | Unitika Limited | Polyimide precursor solution, process for the production thereof and process for producing a film or coating therefrom |
KR100820221B1 (ko) | 2000-06-16 | 2008-04-07 | 유니티카 가부시끼가이샤 | 플렉시블프린트 배선판용 기판의 제조방법 및플렉시블프린트 배선판용 기판 |
JP2009280661A (ja) * | 2008-05-20 | 2009-12-03 | Kaneka Corp | 新規なポリイミド前駆体組成物、その利用及びそれらの製造方法 |
JP2010001412A (ja) * | 2008-06-20 | 2010-01-07 | Mitsui Chemicals Inc | ポリイミド前駆体溶液及びその製造方法、並びに該ポリイミド前駆体溶液を用いて製造したポリイミドフィルム、接着用フィルム、および金属ポリイミド積層体 |
-
2010
- 2010-11-12 JP JP2010254141A patent/JP5165047B2/ja active Active
-
2011
- 2011-11-10 CN CN201110355803.5A patent/CN102532541B/zh active Active
- 2011-11-11 KR KR1020110117447A patent/KR101351362B1/ko active IP Right Grant
- 2011-11-11 TW TW100141247A patent/TWI448488B/zh active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03140328A (ja) * | 1989-10-27 | 1991-06-14 | Chisso Corp | 高接着性ポリアミド酸及びその硬化物の各製造法 |
Also Published As
Publication number | Publication date |
---|---|
TW201226446A (en) | 2012-07-01 |
JP5165047B2 (ja) | 2013-03-21 |
KR20120051591A (ko) | 2012-05-22 |
KR101351362B1 (ko) | 2014-01-14 |
JP2012102296A (ja) | 2012-05-31 |
CN102532541B (zh) | 2014-12-10 |
CN102532541A (zh) | 2012-07-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7469383B2 (ja) | 金属張積層板及び回路基板 | |
TWI780040B (zh) | 聚醯亞胺樹脂前驅物 | |
JP4709326B1 (ja) | ポリイミド樹脂用組成物、及び該ポリイミド樹脂用組成物からなるポリイミド樹脂 | |
JP6517399B2 (ja) | ポリイミド樹脂前駆体 | |
TWI448488B (zh) | 聚醯亞胺前驅體樹脂溶液 | |
JP2024040228A (ja) | 金属張積層板の製造方法 | |
TW202027980A (zh) | 覆金屬積層板、電路基板、多層電路基板及其製造方法 | |
JP2020056011A (ja) | 樹脂フィルム、カバーレイフィルム、回路基板、樹脂付銅箔、金属張積層板、多層回路基板、ポリイミド及び接着剤樹脂組成物 | |
KR20210122142A (ko) | 수지 필름, 금속 피복 적층판 및 회로 기판 | |
JP5573573B2 (ja) | 樹脂組成物、プリプレグ、樹脂付き金属箔、接着フィルム及び金属箔張り積層板 | |
JP2021161387A (ja) | ポリイミド、架橋ポリイミド、接着剤フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板、回路基板及び多層回路基板 | |
KR20210084275A (ko) | 금속 피복 적층판 및 회로 기판 | |
JP2021070824A (ja) | ポリイミド組成物、樹脂フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板及び回路基板 | |
JP2021141108A (ja) | 接着剤、接着シート及びフレキシブル銅張積層板 | |
JP7120870B2 (ja) | ポリイミドフィルムの製造方法及び金属張積層板の製造方法 | |
CN110871606B (zh) | 覆金属层叠板、粘接片、粘接性聚酰亚胺树脂组合物及电路基板 | |
WO2021085329A1 (ja) | 樹脂組成物、樹脂フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板及び回路基板 | |
JP2002265918A (ja) | 絶縁接着剤 | |
JP2023150791A (ja) | 金属張積層板の製造方法及び回路基板の製造方法 | |
KR20220136925A (ko) | 수지필름, 적층체, 커버레이 필름, 수지를 구비한 동박, 금속박적층판, 회로기판 및 다층회로기판 | |
JP2024000978A (ja) | 金属張積層板、回路基板、電子デバイス及び電子機器 | |
JP2022158993A (ja) | ボンドプライ、これを用いる回路基板及びストリップライン | |
JP2020072197A (ja) | 回路基板及び多層回路基板 |