TWI439542B - Water-soluble cutting fluid composition for silicon cutting, water-soluble cutting fluid for silicon cutting, and cutting method using water-soluble cutting fluid for silicon cutting - Google Patents

Water-soluble cutting fluid composition for silicon cutting, water-soluble cutting fluid for silicon cutting, and cutting method using water-soluble cutting fluid for silicon cutting Download PDF

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TWI439542B
TWI439542B TW098114346A TW98114346A TWI439542B TW I439542 B TWI439542 B TW I439542B TW 098114346 A TW098114346 A TW 098114346A TW 98114346 A TW98114346 A TW 98114346A TW I439542 B TWI439542 B TW I439542B
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water
cutting
cutting fluid
soluble
soluble cutting
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TW201000625A (en
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Tenejiro Yoshida
Kiyofumi Suzuki
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Palace Chemical Co Ltd
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Description

矽切削用水溶性切削液組成物、矽切削用水溶性切削液及使用該矽切削用水溶性切削液之切削方法
本發明係關於一種用於利用鋼絲鋸(Wire saw)或帶鋸(band saw)等將鑄錠(ingot)等加以切削的水溶性切削液組成物，含有該水溶性切削液組成物之水溶性切削液，及使用該水溶性切削液之切削方法。
使用鋼絲鋸或帶鋸等切削工具將鑄錠等被切削物加以切削時，為了實現切削工具與被切削物間之潤滑、摩擦熱之去除、及切削屑之清洗等，一般使用切削液。例如，使用以礦物油為主成分之非水溶性切削液(專利文獻1)。但是，此種非水溶性切削液存在下述問題：由於切削後非水溶性切削液會附著於被切削物上，因而必須使用有機溶劑等特殊清洗劑來清洗被切削物。
為了解決上述問題，亦使用可利用水清洗附著於被切削物上之切削液的水溶性切削液(專利文獻2至5)。但是，此種水溶性切削液存在下述問題：由於不含有水，因而易於著火。
為了解決上述問題，亦使用含有水之水溶性切削液(專利文獻6至8)。但是，此種水溶性切削液存在下述問題：在切削時，水會與被切削物(矽)所生成之矽微粉體反應，而產生氣體，又，水溶性切削液之黏度會發生變化。
為了解決上述問題，提出了含有過氧化氫等氧化劑之切削加工用水溶性油劑改質劑(專利文獻9)、或含有二醇醚類之水性研磨粒分散媒組成物(專利文獻10)。
專利文獻1：日本專利特開平10-110180號公報
專利文獻2：日本專利特開平10-110180號公報
專利文獻3：日本專利特開平11-286693號公報
專利文獻4：日本專利特表2002-537440號公報
專利文獻5：日本專利特開2002-80883號公報
專利文獻6：日本專利特開平10-81872號公報
專利文獻7：日本專利特開平10-259396號公報
專利文獻8：日本專利特開平11-302681號公報
專利文獻9：日本專利特開2006-182901號公報
專利文獻10：日本專利特開2007-31502號公報
然而，含有過氧化氫等氧化劑者由於過氧化氫之反應性較高，因而欠佳。又，在含有二醇醚類時，有抑制氣體產生或抑制黏度變化之效果並不足之問題。因此，本發明之目的在於提供一種可抑制著火或氣體產生而安全性較高、且黏度變化較少之水溶性切削液組成物，水溶性切削液及使用該水溶性切削液之切削方法。
為了達成以上目的，本發明人等反覆潛心研究之結果發現：藉由含有二醇、二醇醚、聚烷二醇及聚烷二醇醚之至少一種二醇類與水，除此以外含有作為第三成分的亞硝酸系氣化性防銹劑、以及胺類與亞硝酸鹽之混合物之至少一者，而可抑制著火或氣體產生而安全性較高，且可減少黏度變化。亦即，本發明係一種水溶性切削液組成物，其特徵在於含有：二醇、二醇醚、聚烷二醇及聚烷二醇醚之至少一種二醇類、與水、與亞硝酸系氣化性防銹劑、以及胺類與亞硝酸鹽之混合物之至少一者。又，本發明係一種水溶性切削液，其特徵在於含有上述水溶性切削液組成物及研磨粒。又進而，本發明係一種切削方法，其特徵在於使用上述水溶性切削液進行切削。
如以上所示，本發明可提供一種抑制著火或氣體產生而安全性較高、且黏度變化較少之水溶性切削液組成物，水溶性切削液，及使用該水溶性切削液之切削方法。
至於本發明之水溶性切削液組成物中所使用之二醇類，例如二醇可列舉乙二醇及丙二醇；二醇醚可列舉：乙二醇單甲醚、丙二醇單甲醚、乙二醇單丁醚及丙二醇單丁醚；聚烷二醇可列舉：聚乙二醇、聚丙二醇及聚氧丙烯-聚氧乙烯嵌段聚合物；聚烷二醇醚可列舉：聚乙二醇單甲醚、聚丙二醇單甲醚、聚烷二醇單甲醚、聚乙二醇單丁醚、聚丙二醇單丁醚、及聚烷二醇單丁醚。
本發明之水溶性切削液組成物中所使用之亞硝酸系氣化性防銹劑例如可列舉：亞硝酸二環己基銨、亞硝酸二異丙基銨、及亞硝酸硝基萘銨。
本發明之水溶性切削液組成物中所使用之胺類例如可列舉：甲基胺、二乙基胺、異丙基胺、丁基胺、2-乙基己基胺、癸基胺、十二烷基胺、十三烷基胺、十四烷基胺、十六烷基胺、十八烷基胺、油基胺、乙二胺、二乙三胺、己二胺、哌嗪、1-(2-胺基乙基)哌嗪、N-甲基哌嗪、環己基胺、苄基胺、乙醇胺、異丙醇胺、N-甲基二乙醇胺、N,N-二甲基乙醇胺、N-乙基二乙醇胺、N-丁基二乙醇胺、N-(β-胺基乙基)乙醇胺、N-環己基二乙醇胺、N,N,N',N'-四(2-羥基乙基)乙二胺、N,N,N',N'-四(2-羥基丙基)乙二胺、油基胺、來源於椰子油之烷基胺、來源於牛油之烷基胺、來源於硬化牛油之烷基胺、及來源於大豆油之烷基胺、以及使該等與氧化烯(alkylene oxide)進行反應而得之反應物。
本發明之水溶性切削液組成物中所使用之亞硝酸鹽例如可列舉：亞硝酸鈉、及亞硝酸鉀。
本發明之水溶性切削液組成物亦可含有添加助劑。添加助劑例如可列舉：濕潤劑、防銹劑、非鐵金屬防蝕劑、分散劑、消泡劑及增稠劑。
二醇類與水之重量比較佳為5：95~95：5。若二醇類少於上述範圍，則切削時水易於蒸發。若水蒸發，則由於乾燥而導致被切削物彼此之間貼附，因而剝離時產生裂縫，引起良率變差，並且由於被切削物上會貼附碎屑，因而亦難以清洗。若二醇類多於上述範圍，則著火之危險性變高。
至於亞硝酸系氣化性防銹劑，在水溶性切削液組成物中較佳為含有0.01~5重量%，更佳為含有0.05~1重量%。若少於上述範圍，則被切削物(矽)與水之反應的抑制效果較低，因而易於產生氣體，又，水溶性切削液之黏度變化較大。若多於上述範圍，則水溶性切削液中之研磨粒的分散性較差，水溶性切削液穩定性較低。
至於胺類及亞硝酸鹽，在水溶性切削液組成物中較佳為含有0.01~5重量%的胺類，含有0.01~5重量%的亞硝酸鹽，更佳為含有0.05~1重量%的胺類，含有0.05~1重量%的亞硝酸鹽。若少於上述範圍，則被切削物(矽)與水之反應的抑制效果較低，因而易於產生氣體，又，水溶性切削液之黏度變化較大。若多於上述範圍，則水溶性切削液中之研磨粒的分散性較差，水溶性切削液穩定性較低。
本發明之水溶性切削液中所含有之研磨粒例如可列舉：由金屬、金屬或半金屬之碳化物、金屬或半金屬之氮化物、金屬或半金屬之氧化物、金屬或半金屬之硼化物、及鑽石所構成之研磨材料。金屬或半金屬係來源於週期表之3A、4A、5A、3B、4B、5B、6B、7B或8B族者，例如可列舉：氧化鋁、碳化矽、鑽石、氧化鎂、氧化鈰、氧化鋯、膠體二氧化矽、及煙燻二氧化矽。研磨粒之平均粒徑可設為0.01μm~50μm。
本發明之水溶性切削液中較佳為含有30~70重量%之水溶性切削液、30~70重量%之研磨粒。若研磨粒少於上述範圍，則切削速度變慢，缺乏實用性。若多於上述範圍，則水溶性切削液之黏度變高，加工性能降低。
本發明之水溶性切削液可較佳地用於切削鑄錠、尤其是半導體元件之材料即矽製晶圓。該等之切削時可使用鋼絲鋸加工機或帶鋸加工機。
實施例
繼而，列舉實施例及比較例來說明本發明，但本發明並不限定於此。
實施例1至10、比較例1至7
按照表1至表4之調配量，利用通常之方法將該等成分進行混合，藉此可獲得實施例1至10之水溶性切削液組成物、及比較例1至7之切削液組成物。
實施例11至20、及比較例8至14
以重量比1：1之比例混合實施例1至10之水溶性切削液組成物、及研磨粒(綠色碳化矽# 1000)，而獲得實施例11至20之水溶性切削液。除了使用比較例1至7之切削液組成物代替實施例1至10之水溶性切削液組成物以外，以與實施例11至20相同之方式獲得比較例8至14之切削液。
(清洗試驗)
將實施例11至15之水溶性切削液、以及比較例8之切削液塗佈於單晶矽晶圓上後，利用流水加以清洗，並目視觀察清洗後之單晶矽晶圓的狀態。評價由本公司評價員進行，以可完全去除水溶性切削液等污漬(○)、去除不完全(△)、無法去除(×)的3個等級進行評價。結果示於表5。
根據表5可知，本發明之水溶性切削液在使用水進行清洗時，可自被切削物上完全去除研磨粒或水溶性切削夜，清洗容易。
(黏度及氣體產生試驗)
假設存在利用鋼絲鋸切削單晶矽之鑄錠時所混入的活性Si碎屑，而在實施例11至20之水溶性切削液、及比較例2至7之切削液中添加10 Wt%之Si粉(粒徑約5μm)，利用行星型球磨機加以粗粉碎，利用BL型旋轉黏度計測定25℃下之黏度(黏度1)。其後，放入可密封之聚乙烯袋中，進行脫氣，對在60℃下保管24小時後之Si反應氣體量進行測定。測定Si反應氣體量後，對以1200 rpm攪拌10分鍾後於25℃下之黏度進行測定(黏度2)。結果示於表6。
根據表6可知，本發明之水溶性切削液之Si反應氣體量無限少，黏度變化亦較小。又，由於含有水，因而著火之危險亦較少。

Claims (6)

  1. 一種矽切削用水溶性切削液組成物，其特徵在於含有：二醇、二醇醚、聚烷二醇及聚烷二醇醚之至少一種二醇類、水、與亞硝酸系氣化性防銹劑、以及胺類與亞硝酸鹽之混合物之至少一者。
  2. 如申請專利範圍第1項之矽切削用水溶性切削液組成物，其中該二醇類與該水之重量比為5：95~95：5。
  3. 如申請專利範圍第1或2項之矽切削用水溶性切削液組成物，其含有0.01~5重量%的該亞硝酸系氣化性防銹劑。
  4. 如申請專利範圍第1或2項之矽切削用水溶性切削液組成物，其含有0.01~5重量%的該胺類，及0.01~5重量%的該亞硝酸鹽。
  5. 一種矽切削用水溶性切削液，其特徵在於含有：申請專利範圍第1至4項中任一項之矽切削用水溶性切削液組成物及研磨粒。
  6. 一種切削方法，其特徵在於使用申請專利範圍第5項之矽切削用水溶性切削液進行切削。
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