TWI438991B - Semiconductor laser device - Google Patents

Semiconductor laser device Download PDF

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Publication number
TWI438991B
TWI438991B TW099147226A TW99147226A TWI438991B TW I438991 B TWI438991 B TW I438991B TW 099147226 A TW099147226 A TW 099147226A TW 99147226 A TW99147226 A TW 99147226A TW I438991 B TWI438991 B TW I438991B
Authority
TW
Taiwan
Prior art keywords
solder
semiconductor laser
layer
frame
laser device
Prior art date
Application number
TW099147226A
Other languages
English (en)
Chinese (zh)
Other versions
TW201140971A (en
Inventor
久義浩
田中秀幸
八代正和
幸長則善
Original Assignee
三菱電機股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機股份有限公司 filed Critical 三菱電機股份有限公司
Publication of TW201140971A publication Critical patent/TW201140971A/zh
Application granted granted Critical
Publication of TWI438991B publication Critical patent/TWI438991B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector

Landscapes

  • Semiconductor Lasers (AREA)
  • Die Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW099147226A 2010-04-06 2010-12-31 Semiconductor laser device TWI438991B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010087925A JP5644160B2 (ja) 2010-04-06 2010-04-06 半導体レーザ装置

Publications (2)

Publication Number Publication Date
TW201140971A TW201140971A (en) 2011-11-16
TWI438991B true TWI438991B (zh) 2014-05-21

Family

ID=44746071

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099147226A TWI438991B (zh) 2010-04-06 2010-12-31 Semiconductor laser device

Country Status (3)

Country Link
JP (1) JP5644160B2 (enExample)
CN (1) CN102214894B (enExample)
TW (1) TWI438991B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8867582B2 (en) 2012-04-04 2014-10-21 Osram Opto Semiconductors Gmbh Laser diode assembly
DE102012102305B4 (de) * 2012-03-19 2025-07-31 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Laserdiodenvorrichtung
JP5936679B2 (ja) * 2012-03-22 2016-06-22 三菱電機株式会社 半導体装置
US9008138B2 (en) 2012-04-12 2015-04-14 Osram Opto Semiconductors Gmbh Laser diode device
DE102012103160A1 (de) 2012-04-12 2013-10-17 Osram Opto Semiconductors Gmbh Laserdiodenvorrichtung
JP2014209508A (ja) * 2013-04-16 2014-11-06 住友電気工業株式会社 はんだ付半導体デバイス、実装はんだ付半導体デバイス、はんだ付半導体デバイスの製造方法および実装方法
JP6572803B2 (ja) * 2016-03-09 2019-09-11 三菱電機株式会社 半導体レーザ装置
CN119327352A (zh) * 2024-10-17 2025-01-21 河南黄河旋风股份有限公司 合成中间带孔复合片所用组合件及其合成方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5559817A (en) * 1994-11-23 1996-09-24 Lucent Technologies Inc. Complaint layer metallization
JP3607220B2 (ja) * 2001-06-06 2005-01-05 松下電器産業株式会社 半導体レーザ装置
JP3882712B2 (ja) * 2002-08-09 2007-02-21 住友電気工業株式会社 サブマウントおよび半導体装置
JP2004327982A (ja) * 2003-04-11 2004-11-18 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP2005190520A (ja) * 2003-12-24 2005-07-14 Sankyo Seiki Mfg Co Ltd 光ヘッド装置
JP2005303169A (ja) * 2004-04-15 2005-10-27 Renesas Technology Corp 半導体装置およびその製造方法
JP2006024812A (ja) * 2004-07-09 2006-01-26 Sony Corp 半導体素子搭載のリードフレームとそれを用いた半導体装置
JP4513513B2 (ja) * 2004-11-09 2010-07-28 株式会社村田製作所 電子部品の製造方法
JP2006319109A (ja) * 2005-05-12 2006-11-24 Matsushita Electric Ind Co Ltd 半導体装置用リードフレームおよびそれを用いた半導体装置用パッケージとその製造方法
JP4740030B2 (ja) * 2005-06-08 2011-08-03 シャープ株式会社 レーザ装置の製造方法
JP5095091B2 (ja) * 2005-06-08 2012-12-12 シャープ株式会社 レーザ装置の製造方法
CN100592585C (zh) * 2006-03-28 2010-02-24 三菱电机株式会社 光学元件用组件及使用该组件的光学半导体器件

Also Published As

Publication number Publication date
TW201140971A (en) 2011-11-16
CN102214894A (zh) 2011-10-12
JP5644160B2 (ja) 2014-12-24
CN102214894B (zh) 2013-07-24
JP2011222627A (ja) 2011-11-04

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