CN102214894B - 半导体激光器装置及其制造方法 - Google Patents

半导体激光器装置及其制造方法 Download PDF

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Publication number
CN102214894B
CN102214894B CN201110083417.5A CN201110083417A CN102214894B CN 102214894 B CN102214894 B CN 102214894B CN 201110083417 A CN201110083417 A CN 201110083417A CN 102214894 B CN102214894 B CN 102214894B
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CN
China
Prior art keywords
semiconductor laser
solder
frame
layer
laser device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201110083417.5A
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English (en)
Chinese (zh)
Other versions
CN102214894A (zh
Inventor
久义浩
田中秀幸
八代正和
幸长则善
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of CN102214894A publication Critical patent/CN102214894A/zh
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Publication of CN102214894B publication Critical patent/CN102214894B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector

Landscapes

  • Semiconductor Lasers (AREA)
  • Die Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CN201110083417.5A 2010-04-06 2011-04-02 半导体激光器装置及其制造方法 Expired - Fee Related CN102214894B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010087925A JP5644160B2 (ja) 2010-04-06 2010-04-06 半導体レーザ装置
JP2010-087925 2010-04-06

Publications (2)

Publication Number Publication Date
CN102214894A CN102214894A (zh) 2011-10-12
CN102214894B true CN102214894B (zh) 2013-07-24

Family

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CN201110083417.5A Expired - Fee Related CN102214894B (zh) 2010-04-06 2011-04-02 半导体激光器装置及其制造方法

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Country Link
JP (1) JP5644160B2 (enExample)
CN (1) CN102214894B (enExample)
TW (1) TWI438991B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8867582B2 (en) 2012-04-04 2014-10-21 Osram Opto Semiconductors Gmbh Laser diode assembly
DE102012102305B4 (de) * 2012-03-19 2025-07-31 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Laserdiodenvorrichtung
US9236316B2 (en) * 2012-03-22 2016-01-12 Mitsubishi Electric Corporation Semiconductor device and method for manufacturing the same
DE102012103160A1 (de) 2012-04-12 2013-10-17 Osram Opto Semiconductors Gmbh Laserdiodenvorrichtung
US9008138B2 (en) 2012-04-12 2015-04-14 Osram Opto Semiconductors Gmbh Laser diode device
JP2014209508A (ja) * 2013-04-16 2014-11-06 住友電気工業株式会社 はんだ付半導体デバイス、実装はんだ付半導体デバイス、はんだ付半導体デバイスの製造方法および実装方法
JP6572803B2 (ja) * 2016-03-09 2019-09-11 三菱電機株式会社 半導体レーザ装置
CN119327352A (zh) * 2024-10-17 2025-01-21 河南黄河旋风股份有限公司 合成中间带孔复合片所用组合件及其合成方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1719676A (zh) * 2004-07-09 2006-01-11 索尼株式会社 搭载半导体元件的引线框架和使用该引线框架的半导体器件
CN101068064A (zh) * 2006-03-28 2007-11-07 三菱电机株式会社 光学元件用组件及使用该组件的光学半导体器件
CN101242077A (zh) * 2005-06-08 2008-08-13 夏普株式会社 制造激光器件的方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5559817A (en) * 1994-11-23 1996-09-24 Lucent Technologies Inc. Complaint layer metallization
JP3607220B2 (ja) * 2001-06-06 2005-01-05 松下電器産業株式会社 半導体レーザ装置
JP3882712B2 (ja) * 2002-08-09 2007-02-21 住友電気工業株式会社 サブマウントおよび半導体装置
JP2004327982A (ja) * 2003-04-11 2004-11-18 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP2005190520A (ja) * 2003-12-24 2005-07-14 Sankyo Seiki Mfg Co Ltd 光ヘッド装置
JP2005303169A (ja) * 2004-04-15 2005-10-27 Renesas Technology Corp 半導体装置およびその製造方法
JP4513513B2 (ja) * 2004-11-09 2010-07-28 株式会社村田製作所 電子部品の製造方法
JP2006319109A (ja) * 2005-05-12 2006-11-24 Matsushita Electric Ind Co Ltd 半導体装置用リードフレームおよびそれを用いた半導体装置用パッケージとその製造方法
JP4740030B2 (ja) * 2005-06-08 2011-08-03 シャープ株式会社 レーザ装置の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1719676A (zh) * 2004-07-09 2006-01-11 索尼株式会社 搭载半导体元件的引线框架和使用该引线框架的半导体器件
CN101242077A (zh) * 2005-06-08 2008-08-13 夏普株式会社 制造激光器件的方法
CN101068064A (zh) * 2006-03-28 2007-11-07 三菱电机株式会社 光学元件用组件及使用该组件的光学半导体器件

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2002-368323A 2002.12.20

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Publication number Publication date
JP2011222627A (ja) 2011-11-04
JP5644160B2 (ja) 2014-12-24
CN102214894A (zh) 2011-10-12
TW201140971A (en) 2011-11-16
TWI438991B (zh) 2014-05-21

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Granted publication date: 20130724

Termination date: 20160402