TWI426973B - Droplet discharge device and method - Google Patents

Droplet discharge device and method Download PDF

Info

Publication number
TWI426973B
TWI426973B TW097108004A TW97108004A TWI426973B TW I426973 B TWI426973 B TW I426973B TW 097108004 A TW097108004 A TW 097108004A TW 97108004 A TW97108004 A TW 97108004A TW I426973 B TWI426973 B TW I426973B
Authority
TW
Taiwan
Prior art keywords
plunger
liquid
liquid droplet
liquid material
chamber
Prior art date
Application number
TW097108004A
Other languages
English (en)
Chinese (zh)
Other versions
TW200918229A (en
Inventor
Kazumasa Ikushima
Original Assignee
Musashi Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Musashi Engineering Inc filed Critical Musashi Engineering Inc
Publication of TW200918229A publication Critical patent/TW200918229A/zh
Application granted granted Critical
Publication of TWI426973B publication Critical patent/TWI426973B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04586—Control methods or devices therefor, e.g. driver circuits, control circuits controlling heads of a type not covered by groups B41J2/04575 - B41J2/04585, or of an undefined type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04588—Control methods or devices therefor, e.g. driver circuits, control circuits using a specific waveform
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2002/041—Electromagnetic transducer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/05—Heads having a valve
TW097108004A 2007-03-08 2008-03-07 Droplet discharge device and method TWI426973B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007057963 2007-03-08

Publications (2)

Publication Number Publication Date
TW200918229A TW200918229A (en) 2009-05-01
TWI426973B true TWI426973B (zh) 2014-02-21

Family

ID=39737994

Family Applications (4)

Application Number Title Priority Date Filing Date
TW106115292A TWI631997B (zh) 2007-03-08 2008-03-07 Droplet discharge device and method
TW103102252A TWI537084B (zh) 2007-03-08 2008-03-07 Droplet discharge device and method
TW105112592A TWI590904B (zh) 2007-03-08 2008-03-07 Droplet discharge device and its adjustment method
TW097108004A TWI426973B (zh) 2007-03-08 2008-03-07 Droplet discharge device and method

Family Applications Before (3)

Application Number Title Priority Date Filing Date
TW106115292A TWI631997B (zh) 2007-03-08 2008-03-07 Droplet discharge device and method
TW103102252A TWI537084B (zh) 2007-03-08 2008-03-07 Droplet discharge device and method
TW105112592A TWI590904B (zh) 2007-03-08 2008-03-07 Droplet discharge device and its adjustment method

Country Status (6)

Country Link
JP (4) JP5271254B2 (ja)
KR (3) KR101600432B1 (ja)
CN (1) CN101646502B (ja)
HK (1) HK1140720A1 (ja)
TW (4) TWI631997B (ja)
WO (1) WO2008108097A1 (ja)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010022881A (ja) * 2007-03-30 2010-02-04 Musashi Eng Co Ltd 液材吐出装置および液材吐出方法
JP5465936B2 (ja) * 2009-07-01 2014-04-09 武蔵エンジニアリング株式会社 液体材料吐出方法、装置およびプログラム
JP2011224436A (ja) * 2010-04-16 2011-11-10 Alps Electric Co Ltd 吐出装置及び吐出方法
KR101869089B1 (ko) * 2011-01-04 2018-06-19 주식회사 탑 엔지니어링 점성물질 젯팅 장치
JP5806868B2 (ja) * 2011-07-11 2015-11-10 武蔵エンジニアリング株式会社 液滴吐出装置および方法
JP5986727B2 (ja) 2011-10-07 2016-09-06 武蔵エンジニアリング株式会社 液体材料の吐出装置および方法
WO2013118669A1 (ja) 2012-02-06 2013-08-15 武蔵エンジニアリング株式会社 液体材料の吐出装置および吐出方法
JP5971018B2 (ja) * 2012-08-06 2016-08-17 富士通株式会社 塗布ノズル、塗布装置、及び塗布方法
DE102013110402A1 (de) * 2013-09-20 2015-03-26 Smart Pac Gmbh Technology Services Anordnung und Verfahren zum reproduzierbaren Aufbringen kleiner Flüssigkeitsmengen
JP6180283B2 (ja) * 2013-11-06 2017-08-16 武蔵エンジニアリング株式会社 液体材料吐出装置および方法
KR101512766B1 (ko) * 2013-11-14 2015-04-16 한형수 솔더 페이스트 토출 장치
KR20160122198A (ko) * 2014-02-14 2016-10-21 노드슨 코포레이션 분사 디스펜서, 및 유체 물질의 액적을 분사하기 위한 방법
WO2015137271A1 (ja) * 2014-03-10 2015-09-17 武蔵エンジニアリング株式会社 塗布装置および塗布方法
WO2015178239A1 (ja) * 2014-05-20 2015-11-26 エンジニアリングシステム株式会社 微量液体流出方法および微量液体ディスペンサ
JP5802347B1 (ja) * 2014-05-20 2015-10-28 エンジニアリングシステム株式会社 微量液体滴下方法および微量液体ディスペンサ
JP6582238B2 (ja) * 2016-01-18 2019-10-02 パナソニックＩｐマネジメント株式会社 液体吐出装置
JP6842152B2 (ja) * 2016-05-31 2021-03-17 武蔵エンジニアリング株式会社 液体材料吐出装置、その塗布装置および塗布方法
CN106076693A (zh) * 2016-07-15 2016-11-09 苏州锡友微连电子科技有限公司 一种锡膏喷射阀
JP6772725B2 (ja) * 2016-09-29 2020-10-21 セイコーエプソン株式会社 流体吐出装置および流体を吐出する方法
US11173562B2 (en) 2017-04-14 2021-11-16 Illinois Tool Works Inc. Solder paste feeding assembly and method
MY200719A (en) 2017-05-31 2024-01-12 Musashi Eng Inc Liquid material application method and device for implementing said method
IT201700067828A1 (it) * 2017-06-19 2018-12-19 Kromia S R L Macchina di smaltatura per supporti ceramici.
JP6892686B2 (ja) * 2017-12-27 2021-06-23 株式会社日本スペリア社 はんだ塗布装置用ノズル
AT522763B1 (de) * 2019-12-05 2021-01-15 Metallconcept Gmbh Druckkopf
KR102446597B1 (ko) * 2020-11-17 2022-09-23 주식회사 엠아이티 고정밀 솔더링 장치 및 이의 제어방법
JP7066229B2 (ja) * 2021-01-06 2022-05-13 武蔵エンジニアリング株式会社 液体材料吐出装置、その塗布装置および塗布方法
TWI775477B (zh) * 2021-06-07 2022-08-21 萬潤科技股份有限公司 液室機構及液材擠出裝置
CN114405764B (zh) * 2022-02-23 2022-11-29 无锡冰平自动化技术有限公司 一种阀座型腔开合行程相同的注胶管体

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5747102A (en) * 1995-11-16 1998-05-05 Nordson Corporation Method and apparatus for dispensing small amounts of liquid material
JP2005014513A (ja) * 2003-06-27 2005-01-20 Seiko Epson Corp 液滴吐出ヘッド、ノズル孔位置検出方法および液滴吐出装置
TWI231774B (en) * 2001-10-17 2005-05-01 Musashi Engineering Inc Delivering method and apparatus of liquid material
TWI253959B (en) * 2001-03-27 2006-05-01 Musashi Engineering Inc Method of ejecting liquid droplets and apparatus for ejecting liquid droplets in fixed amount
JP2007000832A (ja) * 2005-06-27 2007-01-11 Canon Inc 液体吐出方法及び液体吐出装置

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56146768A (en) * 1980-04-18 1981-11-14 Ricoh Co Ltd Ink jet recording system
JPH0725254Y2 (ja) * 1988-02-12 1995-06-07 株式会社ニレコ 電磁駆動型直動式ニードル弁
JPH02102053A (ja) * 1988-10-11 1990-04-13 Seiko Epson Corp インクジェットヘッド
EP0912253B1 (en) * 1996-07-26 2003-04-02 Bio-Dot, Inc. Dispensing apparatus having improved dynamic range
JP2001113212A (ja) * 1999-10-20 2001-04-24 Noiberuku Kk 液体吐出装置
JP2002021715A (ja) * 2000-07-10 2002-01-23 Matsushita Electric Ind Co Ltd 流体供給装置及び流体供給方法
JP4225461B2 (ja) * 2001-10-17 2009-02-18 武蔵エンジニアリング株式会社 液材の吐出方法およびその装置
US7018477B2 (en) * 2002-01-15 2006-03-28 Engel Harold J Dispensing system with a piston position sensor and fluid scanner
SE0202247D0 (sv) * 2002-07-18 2002-07-18 Mydata Automation Ab Jetting device and method at a jetting device
JP4241016B2 (ja) * 2002-11-29 2009-03-18 パナソニック株式会社 塗布装置及び塗布方法
KR200305065Y1 (ko) * 2002-12-05 2003-02-19 최병준 액체 충진기
JP4255701B2 (ja) * 2003-01-27 2009-04-15 武蔵エンジニアリング株式会社 液材の吐出方法およびその装置
JP2004261803A (ja) * 2003-02-14 2004-09-24 Matsushita Electric Ind Co Ltd 流体吐出方法及び流体吐出装置
US7470447B2 (en) * 2003-02-14 2008-12-30 Panasonic Corporation Method and device for discharging fluid
US20050001869A1 (en) * 2003-05-23 2005-01-06 Nordson Corporation Viscous material noncontact jetting system
DE10343575B4 (de) * 2003-09-18 2006-06-29 Hilti Ag Auspressgerät mit Dosiervorrichtung
JP4647229B2 (ja) * 2004-04-06 2011-03-09 武蔵エンジニアリング株式会社 液体材料の吐出装置
US7070066B2 (en) * 2004-04-08 2006-07-04 Nordson Corporation Liquid dispensing valve and method with improved stroke length calibration and fluid fittings
JP2007056804A (ja) * 2005-08-25 2007-03-08 Asahi Sunac Corp 送液ポンプ、フィルタハウジング、バルブ、スプレーノズル、及びこれらを備えたスプレー装置
JP2010022881A (ja) * 2007-03-30 2010-02-04 Musashi Eng Co Ltd 液材吐出装置および液材吐出方法
JP4618739B2 (ja) * 2007-10-01 2011-01-26 武蔵エンジニアリング株式会社 液材の吐出方法およびその装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5747102A (en) * 1995-11-16 1998-05-05 Nordson Corporation Method and apparatus for dispensing small amounts of liquid material
TWI253959B (en) * 2001-03-27 2006-05-01 Musashi Engineering Inc Method of ejecting liquid droplets and apparatus for ejecting liquid droplets in fixed amount
TWI231774B (en) * 2001-10-17 2005-05-01 Musashi Engineering Inc Delivering method and apparatus of liquid material
JP2005014513A (ja) * 2003-06-27 2005-01-20 Seiko Epson Corp 液滴吐出ヘッド、ノズル孔位置検出方法および液滴吐出装置
JP2007000832A (ja) * 2005-06-27 2007-01-11 Canon Inc 液体吐出方法及び液体吐出装置

Also Published As

Publication number Publication date
KR101600432B1 (ko) 2016-03-08
HK1140720A1 (en) 2010-10-22
KR20150029008A (ko) 2015-03-17
JP5990290B2 (ja) 2016-09-14
JP2015134347A (ja) 2015-07-27
JPWO2008108097A1 (ja) 2010-06-10
KR20140077222A (ko) 2014-06-23
JP5684853B2 (ja) 2015-03-18
TW201642983A (zh) 2016-12-16
KR101499597B1 (ko) 2015-03-06
TW200918229A (en) 2009-05-01
CN101646502B (zh) 2013-02-20
KR20090119770A (ko) 2009-11-19
TWI537084B (zh) 2016-06-11
TW201733685A (zh) 2017-10-01
JP2017006916A (ja) 2017-01-12
CN101646502A (zh) 2010-02-10
KR101521902B1 (ko) 2015-05-20
JP6312758B2 (ja) 2018-04-18
JP5271254B2 (ja) 2013-08-21
JP2013208613A (ja) 2013-10-10
WO2008108097A1 (ja) 2008-09-12
TWI631997B (zh) 2018-08-11
TWI590904B (zh) 2017-07-11
TW201427788A (zh) 2014-07-16

Similar Documents

Publication Publication Date Title
TWI426973B (zh) Droplet discharge device and method
JP6708383B2 (ja) 粘性材料の小ビードを吐出する装置及び方法
EP1795270B1 (en) Device for discharging fixed quantity of liquid
KR101715089B1 (ko) 액체 재료 토출 방법 및 장치
JP4643021B2 (ja) フィードバック制御を含む粘性材料分配システム及び方法
WO2013051697A1 (ja) 液体材料の吐出装置および方法
EP3727787A1 (en) Foam-in-bag systems and components thereof
JP7437118B2 (ja) 改善された押し出し方法および関連の装置
EP1649938B1 (en) Liquid drop regulating method, liquid drop discharging method, and liquid drop discharging device
KR20050036839A (ko) 액재의 토출방법 및 그 장치
CN103062437A (zh) 流路切换阀及使用了该阀的流动性材料的排出控制装置
JP2008036543A (ja) ノズル装置
JP2000317352A (ja) 液体定量装置用のノズル
JP2018058007A (ja) 流体吐出装置
JP4870800B2 (ja) 液体定量吐出装置用のノズル
JP5863742B2 (ja) 薬液供給装置
JP2005021893A (ja) 液体定量装置用のノズル
JPH06239316A (ja) 散薬自動分包機