TWI420398B - 具有微型天線的無接觸裝置 - Google Patents

具有微型天線的無接觸裝置 Download PDF

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TWI420398B
TWI420398B TW099105179A TW99105179A TWI420398B TW I420398 B TWI420398 B TW I420398B TW 099105179 A TW099105179 A TW 099105179A TW 99105179 A TW99105179 A TW 99105179A TW I420398 B TWI420398 B TW I420398B
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memory card
conductive
conductive coil
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multilayer
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TW201126422A (en
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Siva G Narendra
Prabhakar Tadepalli
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Tyfone Inc
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07784—Antenna details the antenna being of the inductive type the inductive antenna consisting of a plurality of coils stacked on top of one another
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Description

具有微型天線的無接觸裝置 【相關申請】
根據35 U.S.C 19(e)由Narendra et al.於2009年2月24日請求美國臨時申請案案號61/155,144，發明名稱「具有微型天線的無觸點裝置」，其已於此處併入參考。
本發明一般係與無接觸裝置有關，更特言之係與微型無接觸裝置有關。
第1A、1B、2A及2B圖顯示先前技術。第1A及1B圖顯示與基板平行之天線。此典型為包括無接觸技術之信用卡。第2A及2B圖顯示先前技術卡片，其被實質平行於該讀卡機加以拿持以從該讀卡機耦合磁性能量至該線圈。
在以下實施方式中，本發明之各種實施例將參照顯示之附隨圖示加以說明。這些實施例係以足夠細節加以描述以使本發明所屬技術領域中具有通常知識者實施本發明。將了解本發明之各種實施例雖然彼此不同但卻不必然相互排除。舉例來說，結合一實施例加以描述之一特定特徵、結構或特性可被實施於其他實施例中而不會偏離本發明之範圍。此外，將了解各個被揭露之實施例中個別元件的位置或配置可加以修改而不會偏離本發明之範圍。因此，以下實施方式不可被視為一限制意義，而本發明之範圍僅由適當解釋該附加申請專利範圍並伴隨該附加申請專利範圍被賦予之所有均等物範圍加以定義。在該圖示中，各圖示之類似編號係指相同或類似的功能。
第3圖顯示該先前技術天線將如何影響一記憶卡之使用。若一記憶卡320具有一環狀天線平行該基板纏繞，則該卡將如圖示平行於該讀卡機加以拿持。
第4圖顯示該先前技術天線將如何影響一記憶卡於插入至一行動裝置時的使用。該電磁場係垂直於該讀卡機410流動。若該記憶卡320具有平行該基板繞線之一環狀天線，則該行動裝置420將如第4圖中所示平行於該讀卡機加以拿持。為了消費者之便利，該記憶卡通常不會自該行動裝置420取出。若該行動裝置420係如第4圖所示加以拿持，則由於在該記憶卡天線及該讀卡機410之間有其他金屬區域而使該系統可能無法運作。這些其他金屬區域可能是該行動裝置內部的記憶卡固定槽以及該行動裝置之印刷電路板(PCB)金屬路徑及元件/焊錫。因此，源自該讀卡機410之電磁場可能會因為被其他金屬區域吸收而無法到達該天線之導體金屬。
第5圖顯示一微型天線在一記憶卡上的放置。記憶卡500被顯示為具有無線電頻率識別記號(RFID)標記520、RFID天線540、記憶體530以及各種其他元件。該微型天線540係由一感應裝置以至少一線圈所形成。該感應裝置如圖所示被置於該記憶卡500之外層邊緣。該記憶卡500可為任何格式，包括安全數位(SD)、小型SD(mini-SD)、微型SD(micro-SD)等等。
為了允許擷取源自該讀卡機而垂直於該讀卡機流動的電磁場，該微型天線540被置於該記憶卡500的最邊緣，因而當被插入至一行動裝置時，該微型天線540靠近該記憶卡插槽的外部邊緣。
本發明之各種實施例提供製造一感應線圈小到足以被置於該外部邊緣的方法，且該線圈之放置及定位可允許源自該讀卡機之電磁場流入該天線。
第6圖顯示一微型天線在一記憶卡上的定位。微型天線540為裝入一填充材料614中的一三維(3D)感應線圈。該感應裝置如圖示被置於該記憶卡的外部邊緣。天線540之定位係使源自讀卡機410的電磁場耦合至該天線的3D感應線圈。該記憶卡可為各種格式，包括安全數位(SD)、mini-SD、micro-SD等等。
第7圖顯示一記憶卡關於一讀卡機的定位。記憶卡500包括位於該卡片之邊緣的一微型天線。參照第5及6圖。當該天線被置於如第6圖中所示之記憶卡500之上時，該記憶卡500可如第7圖中所示被垂直於該讀卡機410加以放置。
第8圖顯示一行動裝置關於一讀卡機的定位。當第7圖之記憶卡500被插入至第8圖中的行動裝置420時，則該行動裝置420可如圖中所示加以定位。此允許該電磁場進入位於該記憶卡500之邊緣的天線而不需首先滲透該行動裝置之背後。
第9圖顯示一微型天線關於源自一讀卡機之一磁場的定位。讀卡機410射出一特定頻率如13.56MHz之電磁能量。如前所述，該微型天線包括一感應線圈612。設計該線圈612以盡量耦合源自讀卡機410的磁場。
該讀卡機線圈以及該感應線圈612可被視為一變壓器中的兩線圈。該讀卡機線圈為固定的，而設計該線圈612為該變壓器之第二線圈，其耦合源自該讀卡機線圈(主線圈)之電磁場。最大化該感應線圈612的耦合區域江將增加該讀卡機線圈與該天線線圈之間的耦合。
第10圖顯示變壓器設計。該讀卡機(該變壓器的主要線圈)被顯示係由電感L1、串列電阻RL1、串列電容C1S以及並列電容C1P所構成。該微型天線(該感應器的第二線圈)被顯示係由電感L2、串列電阻RL2以及並列電阻C2所構成。
變壓器耦合本身並不適用一確切設計程序，因有許多因素會影響耦合程度。該線圈之幾何、線圈之間的空間、使用的線心材料以及屏蔽等均對任何設計所獲取之耦合程度有一顯著影響。降低該主要及第二線圈之間的空間會增加該耦合。增加磁路的磁導性會增加該耦合。而屏蔽一變壓器會降低其負載的Q因而有增加該耦合的效果。
第11圖顯示依據本發明之各種實施例之方法的一流程圖。流程圖1100討論於設計一第二變壓器線圈供使用作為一微型天線時將考慮的參數。於1110可了解為了有效耦合，該第二變壓器線圈應緊密耦合至該讀卡機線圈，該讀卡機線圈實質共振於13.56MHz，且具有一高的Q，但因Q將限制頻寬(BW)故不會太高。
於1120可了解耦合與表面區域密切相關，而電感與匝數量密切相關。於1130可了解對於任何特定電感值而言，可藉由調整一外部電容的數值而達成調整共振。
於1140選擇該表面區域以最大化耦合，選擇該線圈中的匝數以定義該電感，而選擇導線的寬度/長度以增加Q。
第12-14圖顯示微型天線。第12及13圖顯示適合使用作為一記憶卡之一外部邊緣之一微型天線的一感應元件。該側視圖為使用時暴露於該磁場的方向。第12圖定義『A』為總長度，『B』為總高度，而『C』為總深度。第12圖亦定義『D』為耦合該線圈至該記憶卡之感應終端區域的長度。當使用於一SD格式時的示範尺寸為A=10.4mm、B=0.7mm、C=2mm及D=0.5mm。這些尺寸僅被提供作為範例，且本發明之各種實施例並不如此受限。舉例來說，用於一micro-SD卡的一感應元件一般會具有較小尺寸。
第14圖顯示進入該感應元件之側視圖的磁場。第14圖亦定義該電磁場耦合表面區域1410。當被裝設於一電路板上時，該電磁場耦合表面區域係實質垂直於該電路板。
該天線的機械結構佔據之三維為長度A、高度B及深度C。該結構包括金屬1420以供形成該線圈以及一填充材料1430以佔據剩餘空間。該填充材料1430可為金屬材料或陶瓷材料的一複合物。用於該3D線圈的金屬繞線係佔據描繪該天線之長度及高度的週長以形成一匝。額外的匝係藉由重複沿著該深度描繪之週長所完成，其於鄰接的匝之間具有歐姆連接以建立一連續的矩形線圈如一矩形彈簧。
該電磁場耦合表面區域1410為沿著形成該週長描邊之兩維度的表面區域。此區域從一外部表面(例如讀卡機410)耦合該電磁場至該3D天線線圈而感應電壓及電流於該3D天線線圈中。
在某些實施例中，天線540被置於該記憶卡500中因而該線圈之長度配合當該記憶卡被插入至一主機裝置時其將具有之外部邊緣。該記憶卡之內部邊緣係於將具有該電子連接器以供該記憶卡匯流排連接至該記憶卡插槽之處。
在某些實施例中，定位天線540而使得該記憶卡被插入至一主機裝置時該電磁場耦合表面區域1410係與該主機裝置之外部表面平行。此定位將使源自該外部來源的入射支配電磁場與該電磁場耦合表面區域成90度。此定位組合該配置將使該電磁場耦合表面區域最為接近該主機的外部表面，藉以最大化該3D線圈中由於一外部電磁場來源的感應電壓及電流。
第15圖顯示感應線圈的尺寸。如該上視圖中所示，一單一天線可包括數個平行的線圈。在第15圖之範例中包括M=6之線圈，其中各線圈之N=5.5匝，然而M及N可採用任何數值。該導體長度為2(Ai+Bi+2w)(N-0.5)+Ai，其中Ai及Bi為該線圈之內部尺寸，而w為該導體之寬度。如該側視圖所示，該有效耦合表面面積於f及w保持為小以最大化Bi時會被增加。
第16圖顯示依據本發明之各種實施例之設計處理方法的一流程圖。於1610提供該手動繞線及讀取距離測量。於1620選擇該耦合表面區域、匝數以及導線的寬度/長度。參見第11圖。
於1630給予該尺寸A、B、C及D。這些數值受限於 該記憶卡的形狀係數。於1632最大化Ai及Bi以最大化耦合。現在回頭參照第15圖，該圖顯示該電磁場耦合表面區域會隨Ai及Bi增加而增加。
於1634，M被用於盡可能增加Q(降低該DC電阻)。此對應至增加平行線圈的數量M。參照第15圖。於1636選擇N以達到所需電感，考量到增加的匝數N將增加直流電阻並降低Q。
於1638測量該讀取距離。可修改各種參數並於一重複處理中量測該讀取距離。於1650定案各種參數以達到一最終設計。可定案該直流電阻、該電感、該材料以及該尺寸A、B、C及D。在該印刷電路板上的外部電容(參見第10圖之C2)亦可於給定該電感及所需之13.56MHz共振時加以定案。
第17及18圖顯示依據本發明之各種實施例的感應元件層。各分層包括導電材料及絕緣材料。第17圖顯示形成一表面黏著感應元件的一傳統方法。每一層包括一導電迴圈，而該分層於堆疊時會形成多重導電迴圈。該最小尺寸w(第15圖)受限於處理需求。該電感被黏著於該電路板上之『側邊』以顯露該電磁場耦合表面區域於該卡片之外部邊緣。在這些實施例中，該分層係垂直於該電路板。第18圖顯示一增進的製造方法。每一分層僅形成一導電迴圈的一部分。舉例來說，現在參照第19圖，該底層1970包括具有軌跡終端(trace ends)的軌跡。中間層1920、1930、1940、1950及1960包括穿越 軌跡，其位於用以電性接觸位於該較低層上之軌跡終端的位置，而上層1910至少具有一對準的導電表面軌跡以電性接觸該導電的穿越軌跡以形成具有至少一匝的一導電線圈。位於分層1910及1970上的軌跡可位於該基板的任一側。
在某些實施例中，該感應元件包括磁性材料，因而一電磁核心係形成於該導電線圈之中。再者，於某些實施例中，該感應元件包括位於該導電線圈外部的磁性材料。
第20-23圖顯示依據本發明之各種實施例之感應元件的剖面圖。第21及23圖顯示使用位於相同平面之分層作為該電磁場耦合表面區域所做成的感應元件。第21及22圖顯示使用垂直於該電磁場耦合表面區域之分層所做成的感應元件。注意該軌跡之寬度w在第21及22圖中較小，藉以增加該有效的電磁場耦合表面區域。於第22及23圖中藉由延伸該導電軌跡至該裝置之終端而進一步被增加該有效的電磁場耦合表面區域。
雖然已結合特定實施例描述本發明，但將了解可採用修改及變化而不會偏離本發明之範圍，如本發明所屬技術領域中具有通常知識者可輕易了解者。此修改及變化將被視為位於本發明及附加申請專利範圍之範圍中。
320．．．記憶卡
310,410,610．．．讀卡機
420．．．行動裝置
500．．．記憶卡
520．．．無線電頻率識別記號(RFID)記號
530．．．記憶體
540．．．RFID天線
550．．．記憶體
612．．．線圈
614,1430．．．填充材料
1100．．．流程圖
1410．．．電磁場耦合表面區域
1420．．．金屬
1110,1120,1130,1140,1610,1620,1630,1632,1634,1636,1638,1650．．．步驟
1910．．．上層
1920,1930,1940,1950．．．中間層
1970．．．底層
第1A、1B、2A及2B圖顯示先前技術之無接觸卡片以及其使用；
第3圖顯示該先前技術天線將如何影響一記憶卡的使用；
第4圖顯示該先前技術天線將如何影響一記憶卡被插入至一行動裝置時的使用；
第5圖顯示一微型天線在一記憶卡上的放置；
第6圖顯示一微型天線在一記憶卡上的定位；
第7圖顯示一記憶卡關於一讀卡機的定位；
第8圖顯示一行動裝置相對於一讀卡機的定位；
第9圖顯示一微型天線相對於一讀卡機所發射之一磁場的定位；
第10圖顯示一變壓器的設計；
第11圖顯示依據本發明之各種實施例之方法的一流程圖；
第12-14圖顯示微型天線；
第15圖顯示感應線圈的尺寸；
第16圖顯示依據本發明之各種實施例之方法的一流程圖；
第17及18圖顯示依據本發明之各種實施例的感應元件層；
第19圖顯示一感應元件的分層；及
第20-23圖顯示依據本發明之各種實施例之感應元件的剖面圖。
500．．．記憶卡
520．．．無線電頻率識別記號(RFID)記號
530．．．記憶體
540．．．RFID天線

Claims (21)

  1. 一感應元件，該感應元件包含：一底部表面；及複數個與該底部表面實質平行的分層，該等複數個分層包括導電材料及電性絕緣材料之一組合(combination)，因而當彼此結合時，該等複數個分層形成一導電線圈，該導電線圈具有複數個匝，且該導電線圈具有與該底部表面實質垂直的一電磁場耦合表面區域。
  2. 如申請專利範圍第1項所述之感應元件，更包含：該底部表面上的結合區域。
  3. 如申請專利範圍第1項所述之感應元件，其中該多個分層包括磁性材料，該磁性材料形成一磁性核心於該導電線圈中。
  4. 一種多層感應耦合元件，該多層感應耦合元件包含：一下層，該下層含有具有軌跡終端之至少一導電平面軌跡；至少一中間層，該至少一中間層具有導電穿越軌跡，該等導電穿越軌跡之位置係用以電性接觸該下層上的該等軌跡終端；及 一上層，該上層具有至少一對準之導電平面軌跡以電性接觸該等導電穿越軌跡以形成具有複數個匝的一導電線圈。
  5. 如申請專利範圍第4項所述之多層感應耦合元件，其中該至少一中間層包含：磁性材料，該磁性材料位於該等穿越軌跡之間。
  6. 如申請專利範圍第4項所述之多層感應耦合元件，其中該下層包括：置於該等軌跡終端之上的磁性材料。
  7. 如申請專利範圍第4項所述之多層感應耦合元件，更包含：位於該下層之下的一底部層，該底部層包括磁性材料置於該下層中至少一導電軌跡之下。
  8. 一電子裝置，包含：一電路板，該電路板具有一記憶卡插槽介面；一無接觸通信裝置，該無接觸通信裝置附著於該電路板，該無接觸通信裝置具有一天線埠；及一感應元件，該感應元件附著於該電路板且與該天線埠電性耦合，該感應元件具有一導電線圈，該導電線圈具有與該電路板實質垂直的一電磁場耦合表面區域，其中該感應元件包含一多層表面黏著電感。
  9. 如申請專利範圍第8項所述之電子裝置，其中該多層表面黏著電感係以實質與該電路板平行之分層(layers)所形成。
  10. 如申請專利範圍第8項所述之電子裝置，其中該多層表面黏著電感係以實質與該電路板垂直之分層所形成。
  11. 如申請專利範圍第8項所述之電子裝置，其中該記憶卡插槽介面包含一安全數位(SD)相容介面。
  12. 如申請專利範圍第8項所述之電子裝置，其中該記憶卡插槽介面包含一微型安全數位(microSD)相容介面。
  13. 如申請專利範圍第8項所述之電子裝置，其中該記憶卡插槽介面包含一小型安全數位(miniSD)相容介面。
  14. 一種無接觸裝置，該無接觸裝置包含：一記憶卡相容基板，該記憶卡相容基板具有至少一表面、一內部邊緣以及與該內部邊緣相對的一外部邊緣；電子接點，該等電子接點位於該至少一表面上且沿著該內部邊緣放置；以及 一導電線圈，該導電線圈沿著該外部邊緣放置，該導電線圈具有與該至少一平面實質垂直的一電磁場耦合表面區域。
  15. 如申請專利範圍第14項所述之無接觸裝置，其中：該至少一表面包括彼此實質平行的一頂部表面以及一底部表面；以及該等電子接點係位於該頂部表面上，及該導電線圈係位於該頂部表面上。
  16. 如申請專利範圍第14項所述之無接觸裝置，其中：該至少一表面包括彼此實質平行的一頂部表面以及一底部表面；以及該等電子接點係位於該頂部表面上，而該導電線圈係位於該底部表面上。
  17. 如申請專利範圍第14項所述之無接觸裝置，其中該導電線圈包含一多層表面黏著電感。
  18. 如申請專利範圍第17項所述之無接觸裝置，其中該多層表面黏著電感係以實質平行於該至少一表面的層所形成。
  19. 如申請專利範圍第17項所述之無接觸裝置，其中該 多層表面黏著電感係以實質垂直於該至少一表面的層所形成。
  20. 一種無接觸裝置，該無接觸裝置包含：一記憶卡相容基板，該記憶卡相容基板具有至少一表面、一內部邊緣以及相對於該內部邊緣的一外部邊緣；電子接點，該等電子接點位於該至少一表面上且沿著該內部邊緣放置；以及一三維導電線圈，該三維導電線圈沿著該外部邊緣放置，其中該三維導電線圈具有與該記憶卡之至少一表面實質垂直的一電磁場耦合表面區域。
  21. 如申請專利範圍第20項所述之無接觸裝置，其中該裝置具有一微型安全數位(microSD)形狀係數。
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