TWI419636B - 多層電路基板及半導體裝置 - Google Patents

多層電路基板及半導體裝置 Download PDF

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Publication number
TWI419636B
TWI419636B TW97101866A TW97101866A TWI419636B TW I419636 B TWI419636 B TW I419636B TW 97101866 A TW97101866 A TW 97101866A TW 97101866 A TW97101866 A TW 97101866A TW I419636 B TWI419636 B TW I419636B
Authority
TW
Taiwan
Prior art keywords
layer
resin
multilayer circuit
substrate
insulating layer
Prior art date
Application number
TW97101866A
Other languages
English (en)
Chinese (zh)
Other versions
TW200843605A (en
Inventor
Hironori Maruyama
Kensuke Nakamura
Toru Meura
Hiroshi Hirose
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of TW200843605A publication Critical patent/TW200843605A/zh
Application granted granted Critical
Publication of TWI419636B publication Critical patent/TWI419636B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
TW97101866A 2006-07-20 2008-01-18 多層電路基板及半導體裝置 TWI419636B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006197687 2006-07-20
JP2007097871 2007-04-03
JP2007188945A JP5194601B2 (ja) 2006-07-20 2007-07-20 多層回路基板及び半導体装置

Publications (2)

Publication Number Publication Date
TW200843605A TW200843605A (en) 2008-11-01
TWI419636B true TWI419636B (zh) 2013-12-11

Family

ID=40055294

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97101866A TWI419636B (zh) 2006-07-20 2008-01-18 多層電路基板及半導體裝置

Country Status (2)

Country Link
JP (1) JP5194601B2 (ja)
TW (1) TWI419636B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9049808B2 (en) 2010-08-21 2015-06-02 Ibiden Co., Ltd. Printed wiring board and a method of manufacturing a printed wiring board
JP2012231140A (ja) * 2011-04-14 2012-11-22 Sumitomo Bakelite Co Ltd 積層板、回路基板、および半導体パッケージ
JP5955102B2 (ja) * 2012-05-29 2016-07-20 京セラ株式会社 配線基板およびその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005162787A (ja) * 2003-11-28 2005-06-23 Sumitomo Bakelite Co Ltd 樹脂組成物およびそれを用いた基板
TW200710119A (en) * 2005-08-23 2007-03-16 Ngk Spark Plug Co A filler for through hole and a multi-layered circuit substrate

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001279006A (ja) * 2000-03-30 2001-10-10 Mitsubishi Gas Chem Co Inc 高比誘電率プリプレグの製造方法
JP3719093B2 (ja) * 2000-03-28 2005-11-24 松下電工株式会社 金属箔張積層板への非貫通孔の穿孔方法
JP2004123870A (ja) * 2002-10-01 2004-04-22 Sumitomo Bakelite Co Ltd プリプレグの製造方法および転写シート
JP2005038906A (ja) * 2003-07-15 2005-02-10 Dainippon Printing Co Ltd コア層を持たない薄型の配線板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005162787A (ja) * 2003-11-28 2005-06-23 Sumitomo Bakelite Co Ltd 樹脂組成物およびそれを用いた基板
TW200710119A (en) * 2005-08-23 2007-03-16 Ngk Spark Plug Co A filler for through hole and a multi-layered circuit substrate

Also Published As

Publication number Publication date
JP2008277721A (ja) 2008-11-13
TW200843605A (en) 2008-11-01
JP5194601B2 (ja) 2013-05-08

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